CN113133305B - Reflow soldering equipment and reflow soldering method with plasma generating device - Google Patents
Reflow soldering equipment and reflow soldering method with plasma generating device Download PDFInfo
- Publication number
- CN113133305B CN113133305B CN202110617062.7A CN202110617062A CN113133305B CN 113133305 B CN113133305 B CN 113133305B CN 202110617062 A CN202110617062 A CN 202110617062A CN 113133305 B CN113133305 B CN 113133305B
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- reflow soldering
- gas
- plasma generating
- generating device
- vacuum cavity
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- 238000005476 soldering Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 54
- 239000011261 inert gas Substances 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000004907 flux Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 210000002381 plasma Anatomy 0.000 description 56
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Abstract
The application provides reflow soldering equipment and a reflow soldering method provided with a plasma generating device, and relates to the technical field of circuit board manufacturing. The reflow soldering equipment comprises a vacuum cavity, a heating device and a plasma generating device. The plasma generating device is arranged in the vacuum cavity, the vacuum cavity is filled with gas capable of being excited by the plasma generating device, the vacuum cavity can accommodate a product to be processed, the plasma generating device is arranged on two sides of the product to be processed, and the heating device is connected with the vacuum cavity and is used for carrying out reflow soldering processing on the product after the oxide film is removed. The reflow soldering equipment is matched with a corresponding reflow soldering method, plasma gas is excited in the vacuum cavity, oxide of the circuit board and components is removed by utilizing the reducibility of the plasma gas, then the reflow soldering is carried out through hot air circulation heating of the heating device, the reflow soldering without soldering flux is realized, the cavity rate of soldering tin is reduced through the vacuum effect of the vacuum cavity, and the product quality after the reflow soldering is ensured.
Description
Technical Field
The application relates to the technical field of circuit board manufacturing, in particular to reflow soldering equipment provided with a plasma generating device and a reflow soldering method.
Background
Solder paste with soldering flux is often used in reflow soldering of a circuit board, the soldering flux is heated to a certain temperature to remove oxide films on the surfaces of the circuit board and components, and then the soldering flux is melted to realize connection of the components and the circuit board. The use of scaling powder can bring two problems, one is that the volatilization of scaling powder can lead to the inside void ratio of soldering tin higher, influences the electrical property and the intensity of connection, and another is that scaling powder can remain on the surface of a circuit board, and most circuit boards can clear away the residue through modes such as washing, but to the circuit board that has sensor, high-accuracy device, can't further wash. It is therefore important to develop a circuit board reflow soldering technique that does not require flux.
Disclosure of Invention
The application aims to provide a reflow soldering device provided with a plasma generating device, which can solve the problem that the existing reflow soldering needs to rely on soldering flux.
Another object of the present application is to provide a reflow soldering method using the above-described reflow soldering apparatus equipped with a plasma generating device, which can achieve reflow soldering without the aid of flux.
Embodiments of the present application are implemented as follows:
an embodiment of the present application provides a reflow soldering apparatus equipped with a plasma generating device, including: a vacuum chamber, a heating device and a plasma generating device; the plasma generating device is arranged in the vacuum cavity, the vacuum cavity is filled with gas capable of being excited by the plasma generating device to generate plasma, the vacuum cavity can accommodate products to be processed, the plasma generating device is arranged on two sides of the products to be processed and is used for removing oxide films of the products to be processed, and the heating device is connected with the vacuum cavity and is used for carrying out reflow soldering processing on the products after the oxide films are removed.
In addition, the reflow soldering apparatus provided with the plasma generating device according to the embodiment of the present application may further have the following additional technical features: in an alternative embodiment of the present application, the plasma generating device includes a high voltage electrode, a ground electrode, and a plasma power source, the high voltage electrode and the ground electrode being disposed on left and right sides of a product to be processed, respectively, and electrically connected to the plasma power source.
In an alternative embodiment of the application, the plasma power supply is a radio frequency power supply, providing a radio frequency signal of 10MHz-100MHz to the high voltage electrode and the ground electrode.
In an alternative embodiment of the application, a material rack is arranged in the vacuum cavity, the material rack comprises a plurality of support columns, and part or all of the support columns jointly support a product to be processed.
In an alternative embodiment of the present application, the gas is an inert gas or a mixture of an inert gas and a reducing gas; when the gas is the mixed gas, the reducing gas accounts for 1-20% of the mixed gas.
In an alternative embodiment of the application, the heating device comprises a heating cavity and a heating element, wherein the heating cavity is communicated with the vacuum cavity and can transmit hot air heated by the heating element into the vacuum cavity so as to perform reflow soldering through hot air circulation heating.
In an alternative embodiment of the application, the reflow soldering apparatus equipped with plasma generating means further comprises cooling means for reducing the temperature within the vacuum chamber.
In an alternative embodiment of the application, the reflow soldering apparatus equipped with the plasma generating device includes a vacuum pump by which the vacuum cavity is evacuated.
In an alternative embodiment of the application, the reflow soldering apparatus equipped with the plasma generating device further comprises a pressure controller and a vacuum gauge, wherein the pressure controller can adjust the air inlet and/or air exhaust speed in the vacuum cavity according to the vacuum gauge so as to maintain a preset vacuum degree.
An embodiment of the present application provides a reflow soldering method using the reflow soldering apparatus equipped with the plasma generating device described in any one of the above, the method comprising: vacuumizing the vacuum cavity and filling first gas to a first rated pressure;
starting the plasma generating device to excite plasma; closing the plasma generating device and continuously filling the first gas to the second rated pressure; starting a heating device and enabling the temperature in the vacuum cavity to rise to be above the melting point of soldering tin; after the soldering tin is melted, the vacuum cavity is further pumped to remove second gas in the soldering tin; charging the first gas to the second rated pressure and cooling.
The beneficial effects of the application are as follows: the reflow soldering equipment provided with the plasma generating device is matched with a corresponding reflow soldering method, plasma gas is excited in the vacuum cavity, oxide of the circuit board and components is removed by utilizing the reducibility of the plasma gas, then reflow soldering is carried out through hot air circulation heating of the heating device, reflow soldering without soldering flux is realized, the cavity rate of soldering tin is reduced through the vacuum effect of the vacuum cavity, and the product quality after reflow soldering is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a reflow soldering apparatus equipped with a plasma generating device according to an embodiment of the present application;
FIG. 2 is an isometric view of a part of a reflow apparatus equipped with a plasma generating device;
fig. 3 is a schematic view of a reflow soldering apparatus equipped with a plasma generating device provided with a cooling device.
Icon: 1-a vacuum cavity; 2-a heating chamber; 21-a heating element; 3-high voltage electrode; 4-a ground electrode; 5-material rack; 51-a roller; 6-a circuit board; 7-a vacuum pump; 8-inert gas; 9-a temperature measurement probe; 10-a plasma power supply; 12-opening and closing a door; 13-a viewing window; 14-a cooling device; 15-a pressure controller; 16-vacuum gauge.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship in which the inventive product is conventionally put in use, are merely for convenience of describing the present application and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the present application, unless expressly stated or limited otherwise, a first feature may include first and second features directly contacting each other, either above or below a second feature, or through additional features contacting each other, rather than directly contacting each other. Moreover, the first feature being above, over, and on the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being below, beneath, and beneath the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is less level than the second feature.
Examples
Referring to fig. 1, an embodiment of the present application provides a reflow apparatus equipped with a plasma generating device, including: a vacuum chamber 1, a heating device and a plasma generating device.
The plasma generating device is arranged in the vacuum cavity 1, the vacuum cavity 1 is filled with gas capable of being excited by the plasma generating device, the vacuum cavity 1 can accommodate a product to be processed, the plasma generating device is arranged on two sides of the product to be processed and is used for removing an oxide film of the product to be processed, and the heating device is connected with the vacuum cavity 1 and is used for carrying out reflow soldering processing on the product after the oxide film is removed.
Wherein, the reflow soldering equipment provided with the plasma generating device comprises a vacuum pump 7, and the vacuum cavity 1 is vacuumized through the vacuum pump 7.
The vacuum chamber 1 may be a square chamber, a spherical chamber, or a cylindrical chamber. Referring to fig. 2, in this embodiment, a square cavity is provided with a door 12 and an observation window 13. The inner space of the vacuum chamber 1 can accommodate a product to be processed.
Further, a material rack 5 is disposed in the vacuum chamber 1 in this embodiment, where the material rack 5 includes a plurality of support columns, and part or all of the support columns support the product to be processed together. In the present embodiment, 4 support posts are employed, and the 4 support posts may be formed to support four corners of the circuit board 6. It will be appreciated that when the circuit board 6 has different profiles, a different number of support posts may be provided for the circuit boards 6 of different profiles.
It will be appreciated that a plurality of support columns may be provided in advance according to the external dimensions of the circuit board 6 which is often processed, and one circuit board 6 may be supported by several of the support columns together, and when another circuit board 6 is replaced by another circuit board 6, the support columns may be supported together by other support columns together, and of course, all the support columns may be supported together. Different circuit boards 6 are arranged in different ways, so long as the support can be ensured and the gas flow is not affected.
In addition, the support columns can be connected with each other, and the roller 51 is arranged at the bottom of the support column, so that the circuit board 6 can be conveniently driven to enter and exit the vacuum cavity 1 together. Alternatively, a plurality of slots may be provided in the vacuum chamber 1 in advance, and the circuit board 6 may be placed after the bracket post is inserted and fixed. Furthermore, the positions of the slots can be set according to the external dimensions of the circuit board 6 to be processed, and when one circuit board 6 is to be processed, only a corresponding number of support columns can be inserted, so that on one hand, the universality of the support columns is improved, on the other hand, the unnecessary use of the support columns can be reduced, and the influence on the gas flow is further avoided.
In addition, the support post of the embodiment can support multiple layers of circuit boards 6, so that more circuit boards 6 can be processed at one time, and the productivity of products is improved.
With continued reference to fig. 1, in the present embodiment, the plasma generating apparatus includes a high voltage electrode 3, a ground electrode 4, and a plasma power source 10, the high voltage electrode 3 and the ground electrode 4 being disposed on left and right sides of a product to be processed and electrically connected to the plasma power source 10.
The embodiment further includes a pressure controller 15 and a vacuum gauge 16, where the pressure controller 15 can adjust the air intake and/or air exhaust speed in the vacuum cavity 1 according to the vacuum gauge 16 to maintain a preset vacuum degree, and when plasma is excited, the vacuum degree is maintained, so as to avoid affecting the stability of the plasma.
In detail, the surfaces of the high-voltage electrode 3 and the ground electrode 4 in the embodiment are provided with oxide films or insulating coatings so as to avoid electric arcs generated by the metal components of the high-voltage electrode 3, the ground electrode 4 and the circuit board 6, and further avoid damage to the components.
It should be noted that the high voltage electrode 3 and the ground electrode 4 of the present embodiment are placed on the stand and the product to be processed is placed between the high voltage electrode 3 and the ground electrode 4. Thus, the circuit board 6 does not need to be placed vertically. The vertically placed circuit board 6 is disadvantageous for accurate flow after the solder is melted because the solder flows downward under the force of gravity, resulting in defects.
In detail, the plasma power supply 10 of this embodiment is a radio frequency power supply, and supplies radio frequency signals of 10MHz to 100MHz to the high voltage electrode 3 and the ground electrode 4. Of course, the range of radio frequency signals is by way of example and not limitation, only radio frequency signals of this range may be employed.
The position of the plasma power supply 10 in fig. 1 is merely illustrative, and it is not limited to be construed that the plasma power supply is necessarily disposed outside the vacuum chamber 1, and it is also conceivable that the plasma power supply is disposed inside the vacuum chamber 1.
The gas that can excite the plasma by the plasma generating device is the inert gas 8 or a mixture of the inert gas 8 and the reducing gas. A gas source is shown in fig. 1.
When the gas is mixed gas, the reducing gas accounts for 1-20% of the mixed gas.
In detail, the inert gas 8 may be nitrogen, argon, helium, or the like. The mixed reducing gas can be hydrogen and CF 4 Or SF (sulfur hexafluoride) 6 Etc.
When the gas is the inert gas 8, a mixture of plural inert gases 8 may be used, and the use of only one kind is not limited.
Referring to fig. 1 or 3, the heating device of the present embodiment includes a heating cavity 2 and a heating element 21, where the heating cavity 2 is communicated with the vacuum cavity 1 and is capable of transferring hot air heated by the heating element 21 into the vacuum cavity 1 for reflow soldering by hot air circulation heating.
A temperature probe 9 is provided in the vacuum chamber 1 to confirm the temperature condition in the vacuum chamber 1.
Referring to fig. 3, optionally, the reflow soldering apparatus equipped with the plasma generating device further includes a cooling device 14, and the cooling device 14 is used to reduce the temperature in the vacuum chamber 1. For example, the temperature in the vacuum chamber 1 can be rapidly cooled by air circulation.
Based on the reflow soldering apparatus equipped with the plasma generating device, an embodiment of the present application provides a reflow soldering method including: vacuumizing the vacuum cavity 1 and filling first gas to a first rated pressure; starting a plasma generating device to excite plasma; closing the plasma generating device and continuously filling the first gas to the second rated pressure; starting a heating device and increasing the temperature in the vacuum cavity 1 to be above the melting point of soldering tin; after the soldering tin is melted, the vacuum cavity 1 is further pumped to remove the second gas in the soldering tin; the first gas is charged to a second nominal pressure and cooled.
The first gas is the inert gas 8 or a mixture of the inert gas 8 and the reducing gas. The second gas may be the same as the first gas in its entire composition, or may be a gas containing an impurity gas in the solder, and it is important to discharge the gas in the solder, not the composition thereof. By exhausting the gas in the soldering tin, the cavity rate of the soldering tin can be reduced, and the product quality can be improved.
The first rated pressure may be 200Pa or other pressure values, and an operator may select or test a suitable pressure value as the first rated pressure of the different circuit boards 6 according to the processing requirement. Accordingly, the second rated pressure in this embodiment is the standard atmospheric pressure, and other pressure values may be set when different pressure values are required, and the standard atmospheric pressure used in this embodiment is merely illustrative.
The principle of this embodiment is:
by evacuating and filling the inert gas 8, a plasma is generated, these gases do not cause oxidation phenomena, and even a reducing gas such as hydrogen can be added, the reduction of the metal oxide film is improved, and thus the wetting of the solder to the circuit board 6 is enhanced. Meanwhile, the vacuum can be further pumped after the solder is melted, so that gas in the solder can escape to reduce the void ratio.
In addition, the embodiment utilizes hot air for reflow, improves the temperature uniformity and can realize uniform heating of the multilayer circuit board. In addition, the material rack 5 of the embodiment is designed into 4 support columns, and the periphery of the circuit board 6 is not blocked, so that the flow of hot air is satisfied, and the temperature is more uniform. Meanwhile, the generation and the flow of the plasmas are convenient, and the uniform treatment of the circuit board 6 is realized.
In summary, the reflow soldering device with the plasma generating device of the present application is matched with a corresponding reflow soldering method, plasma gas is excited in the vacuum cavity 1 to remove oxides of the circuit board 6 and components by utilizing the reducibility of the plasma gas, and then reflow soldering is performed by hot air circulation heating of the heating device, so that reflow soldering without soldering flux is realized, and the cavity rate of soldering tin is reduced by the vacuum effect of the vacuum cavity 1, so that the quality of the product after reflow soldering is ensured.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (4)
1. A reflow soldering apparatus equipped with a plasma generating device, comprising: a vacuum chamber, a heating device and a plasma generating device;
the plasma generating device is arranged in the vacuum cavity, the vacuum cavity is filled with gas capable of being excited by the plasma generating device, the vacuum cavity can accommodate products to be processed, the plasma generating device is arranged on two sides of the products to be processed and is used for removing oxide films of the products to be processed, and the heating device is connected with the vacuum cavity and is used for carrying out reflow soldering processing on the products from which the oxide films are removed;
the plasma generating device comprises a high-voltage electrode, a grounding electrode and a plasma power supply, wherein the high-voltage electrode and the grounding electrode are respectively arranged on the left side and the right side of a product to be processed and are electrically connected with the plasma power supply;
a material rack is arranged in the vacuum cavity, and comprises a plurality of support columns, wherein part or all of the support columns jointly support a product to be processed;
the heating device comprises a heating cavity and a heating element, wherein the heating cavity is communicated with the vacuum cavity and can transmit hot air heated by the heating element into the vacuum cavity so as to perform reflow soldering through hot air circulation heating;
the gas is inert gas or mixed gas of inert gas and reducing gas;
when the gas is the mixed gas, reducing gas accounts for 1% -20% of the mixed gas;
the reflow soldering apparatus equipped with the plasma generating device further comprises a cooling device for reducing the temperature in the vacuum cavity;
the reflow soldering equipment with the plasma generating device further comprises a pressure controller and a vacuum gauge, wherein the pressure controller can adjust the air inlet and/or air exhaust speed in the vacuum cavity according to the vacuum gauge so as to maintain the preset vacuum degree.
2. The reflow soldering apparatus of claim 1, wherein the plasma power source is a radio frequency power source, and provides a radio frequency signal of 10mhz to 100mhz to the high voltage electrode and the ground electrode.
3. The plasma-generating-device-equipped reflow soldering apparatus in accordance with claim 1, wherein the plasma-generating-device-equipped reflow soldering apparatus includes a vacuum pump through which the vacuum chamber is evacuated.
4. A reflow soldering method, wherein the reflow soldering apparatus equipped with the plasma generating apparatus according to any one of claims 1 to 3 is used, the method comprising:
vacuumizing the vacuum cavity and filling first gas to a first rated pressure;
starting the plasma generating device to excite plasma;
closing the plasma generating device and continuously filling the first gas to the second rated pressure;
starting a heating device and enabling the temperature in the vacuum cavity to rise to be above the melting point of soldering tin;
after the soldering tin is melted, the vacuum cavity is further pumped to remove second gas in the soldering tin;
charging the first gas to the second rated pressure and cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110617062.7A CN113133305B (en) | 2021-06-03 | 2021-06-03 | Reflow soldering equipment and reflow soldering method with plasma generating device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110617062.7A CN113133305B (en) | 2021-06-03 | 2021-06-03 | Reflow soldering equipment and reflow soldering method with plasma generating device |
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| CN113133305A CN113133305A (en) | 2021-07-16 |
| CN113133305B true CN113133305B (en) | 2023-11-10 |
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