JPH0964596A - Circuit board mounting electronic device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect electronic devices and a board against damage by making a recess or protrusion in the board on the periphery of joint of an electronic device, arranging a brazing material at the recess or protrusion and jointing the electronic device to the board through the brazing material. SOLUTION: A circuit pattern 13 is formed on the upper surface of a board 1 and a pair of recesses 2 are made through the circuit pattern 13 and then a brazing material 4 is set in each recess 2. A plug-in part 15 is projected from the lower surface of the brazing material 4 which is secured to the board 1 and connected with the circuit pattern 13 when the part 15 is plugged into the recess 2 and secured in place. An electronic device 5 is jointed onto the brazing material 4 and an electrode part 14 is provided over the entire circumference thereof while being jointed to the brazing material 4. This structure protects the electronic device 5 and the board 1 against damage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board provided with electric parts such as capacitors, resistors and diodes mounted on a board formed of a printed circuit board and a method for manufacturing the same. More specifically, the present invention relates to a circuit board provided with a chip component and a method for joining the chip component, where the electrical component is a chip component.

[0002]

2. Description of the Related Art Conventionally, various methods have been adopted for joining surface mounting type electric components such as capacitors, resistors and diodes to the surface of a substrate formed of a printed circuit board or the like. Japanese Patent Laid-Open No. 60-16349
The following method is disclosed in Japanese Patent Laid-Open No.

First, the first method is shown in FIG.
As shown in (b), a solder paste 54 is applied to the circuit pattern 13 such as a land provided on the upper surface of the substrate 1 by screen printing or the like, and the solder paste 54 and the electrode portion 14 of the electric component 5 are brought into contact with each other. The electric component 5 is placed on the solder paste 54, and the electrode portion 14 and the solder paste 54 are irradiated with the laser 6 to be heated to melt the solder paste 54. Thereafter, the irradiation of the laser 6 is stopped and the solder 6 is soldered. By curing the paste 54, the electric component 5 is attached to the substrate 1.
It is designed to be joined to.

The second method is shown in FIG.
As shown in (d), a circuit 55 for laser irradiation is provided on the circuit pattern 13 such as a land provided on the upper surface of the substrate 1, and a solder paste 54 is applied to the circuit pattern 13 by screen printing or the like. The electric part 5 is placed on the solder paste 54 so that the electrode part 14 of the electric part 5 and the electric part 5 are brought into contact with each other, and the laser irradiation circuit 55 is irradiated with the laser 6 to heat the circuit pattern 13. By transmitting the solder paste 54, the solder paste 54 is melted, and thereafter, the irradiation of the laser 6 is stopped and the solder paste 54 is cured, so that the electric component 5 is bonded to the substrate 1.

[0005]

However, in the first and second methods, since the solder paste 54 is applied by printing, the application position of the solder paste 54 is at the circuit pattern 13.
There is a problem in that the printing may be performed in a misaligned manner, and the solder paste 54 may be displaced, so that the bonding position of the electric component 5 placed on the solder paste 54 is displaced. Further, in the first and second methods, since the solder pattern 54 and the electrode portion 14 of the electric component 5 are heated by irradiating the laser 6 in the atmosphere, the solder pattern 54 and the electrode portion 14 are prevented from being oxidized. Since flux is required, there has been a problem that cleaning is required to remove the flux after joining the electric components 5.

Further, in the first method, the laser 6 is directly applied to the electrode portion 14 of the electric component 5, so that
The electric component 5 may be heated and damaged. Further, since the solder paste 54 contains the flux and the laser 6 is directly applied to the solder paste 54 as described above, the flux and the solvent in the solder paste 54 are rapidly evaporated and the solder and the flux are scattered. However, there is a problem in that the circuit patterns 13 that are not electrically connected are electrically connected by the scattered solder, and a soldering failure is likely to occur.

Further, in the second method, since the laser 6 is applied to the laser irradiation circuit 55, the substrate 1 is heated via the laser irradiation circuit 55 and is affected by this heat. However, there is a problem that the substrate 1 may be damaged such as warped or warped. The present invention has been made in view of the above points, and it is possible to prevent the occurrence of damage to the electrical components and the substrate, without causing solder defects, and further to prevent the joint position of the electrical components from shifting. In addition, it is an object of the present invention to provide a method for joining an electric component to a substrate that does not require cleaning for removing flux and a circuit board provided with the electric component.

[0008]

A circuit board provided with an electric component according to claim 1 of the present invention includes a circuit pattern 13, and at least one of a concave portion 2 and a convex portion 3 is provided around a joint portion of the electric component. The substrate 1 on which the recess is formed, and the concave portion 2 or the convex portion 3
It is characterized in that it comprises a brazing material 4 disposed on the substrate 1, and an electric component 5 joined to the substrate 1 by the brazing material 4.

According to a second aspect of the present invention, there is provided a method for manufacturing a circuit board having an electric component, wherein when manufacturing a circuit board having the electric component 5 on the board 1, a concave portion 2 and a convex portion 3 are formed on the substrate 1. At least one of which is formed and a brazing material 4 is provided on the concave portion 2 or the convex portion 3, the electric component 5 is brought into contact with the brazing material 4, and the brazing material 4 is irradiated with a beam 6 to melt the brazing material 4 The electric component 5 is joined to the substrate 1 at 4.

A circuit board provided with an electric component according to claim 3 of the present invention is a board 1 provided with a circuit pattern 13.
And the substrate 1 through the metal fitting 7 coated with the brazing material 4.
It is characterized by comprising an electric component 5 to be joined to. According to a fourth aspect of the present invention, there is provided a method for manufacturing a circuit board having an electric component, wherein when manufacturing a circuit board having the electric component 5 on the board 1, a metal fitting 7 coated with a brazing material 4 is provided on the board 1. It is characterized in that the brazing material 4 is brought into contact with the electric component 5 and the brazing material 4 is irradiated with a beam 6 to melt the brazing material 4 to bond the electric component 5 to the substrate 1 with the brazing material 4. is there.

According to a fifth aspect of the present invention, in addition to the structure of the first aspect, the brazing material 4 is provided in the concave portion 2 or the convex portion 3.
It is characterized in that a metal fitting 7 coated with is provided and an electric component 5 joined to the substrate 1 through the metal fitting 7. The invention according to claim 6 of the present invention is characterized in that, in addition to the configuration of claim 2, a metal fitting 7 coated with a brazing material 4 is provided in the concave portion 2 or the convex portion 3.

In addition to the structure of claim 6, the invention of claim 7 of the present invention is characterized in that the beam 6 is emitted while the electric component 5 is held by the metal fitting 7.
Further, the invention according to claim 8 of the present invention is characterized in that, in addition to the configuration of claim 7, the metal fitting 7 is provided with a spring property and the beam 6 is irradiated while holding the electric component 5 by the metal fitting 7. It is what

The invention according to claim 9 of the present invention is characterized in that, in addition to the structure of claim 7, the electric component 5 is held by a metal fitting 7 so as not to move along the surface of the substrate 1. It is a thing. The invention according to claim 10 of the present invention is
In addition to the configuration of claim 7, the electrical component 5 is held by a metal fitting 7 so as not to move in a direction away from the surface of the substrate 1.

The invention according to claim 11 of the present invention is
In addition to the configuration of claim 2, a plurality of recesses 2 or protrusions 3 may be provided on the substrate 1 to form a recess group or a protrusion group, and a brazing material 4 may be provided on each recess 2 or each protrusion 3. It is a feature. The invention according to claim 12 of the present invention is
In addition to the configuration of claim 2, the resin member 9a is coated with a brazing material 4, and the beam 6 is emitted while the electric member 5 is held by the resin member 9a.

The invention according to claim 13 of the present invention is
In addition to the configuration of claim 2, the metal fitting 7 and the resin member 9a are combined to form the socket 9, and the beam 9 is emitted while the electrical component 5 is held by the socket 9. The invention according to claim 14 of the present invention is
In addition to the structure of claims 4 and 6, the metal fitting 7 coated with a brazing material is provided with the flange portion 10 and the flange portion 1
It is characterized by irradiating the beam 6 to 0.

The invention according to claim 15 of the present invention is
In addition to the structure of Claim 14, the mark 11 formed on the metal fitting 7 coated with a brazing material is detected and the beam 6 is irradiated toward the mark 11. The invention according to claim 16 of the present invention is the invention according to claim 1.
In addition to the configuration of 4, the irradiation portion of the beam 6 is formed in a shape that easily absorbs the beam 6.

The invention according to claim 17 of the present invention is
In manufacturing a circuit board having the electric component 5 on the substrate 1, the brazing material 4 is provided on the substrate 1 and the electric component 5 is brought into contact with the brazing material 4, and the brazing material 4 is placed in the atmosphere of the inert gas 8.
The brazing filler metal 4 by irradiating at least a single pulse or a plurality of pulses of a pulse 6 of 1 ms or more and 100 ms or less
Is melted and the electric component 5 is joined to the substrate 1 by the brazing material 4.

The invention according to claim 18 of the present invention is
In addition to the structure of claim 17, at least one of the concave portion 2 and the convex portion 3 is formed on the substrate 1, and the brazing material 4 is provided on the concave portion 2 or the convex portion 3. The invention described in claim 19 of the present invention is characterized in that, in addition to the configuration of claim 17, a metal fitting 7 coated with a brazing material 4 is used as a brazing material.

The invention according to claim 20 of the present invention is
In addition to the structure of claim 17, at least one of the concave portion 2 and the convex portion 3 is formed on the substrate 1, and the concave portion 2 or the convex portion 3 is provided with a metal fitting 7 coated with a brazing material 4. .

[0020]

Embodiments of the present invention will be described below. FIG. 1 shows an embodiment of a circuit board provided with electric components. Reference numeral 1 is a substrate formed of a printed wiring board or the like, and a large number of circuit patterns 13 are formed on the upper surface thereof. The substrate 1 may be a multilayer substrate formed by providing inner layer circuits. Then, on the circuit pattern 13 of the substrate 1, an electrical component (chip component) is provided via the brazing material 4.
5 is joined.

FIG. 2 shows a joint structure of the electric component 5. A pair of recesses 2 penetrating the circuit pattern 13 is provided on the upper surface of the substrate 1 in the peripheral portion of the portion where the electric component 5 is mounted. A brazing material 4 is provided in each recess 2. An insertion part 15 is provided on the lower surface of the brazing material 4, and the brazing material 4 is fixed to the substrate 1 and connected to the circuit pattern 13 by inserting the insertion part 15 into the recess 2 and fixing it. There is. An electric component 5 is joined on the brazing material 4. The electric component 5 is of a surface mounting type such as a capacitor, a resistor, a diode, etc., and electrode portions 14 are provided on the entire peripheries of both end portions of the electric component 5. There is.

Next, an embodiment of a method for manufacturing a circuit board having the electric components shown in FIG. 2 will be described. First, FIG.
As shown in (a), the substrate 1 is penetrated through the circuit pattern 13.
A pair of recesses 2 are provided in the. This recess 2 is shown in FIG.
As shown in FIG. 4B, it may be formed in a groove shape opening on the upper surface of the substrate 1, or may be formed in a slit shape opening on both the upper surface and the lower surface of the substrate 1 as shown in FIGS. 4C and 4D. Alternatively, as shown in FIGS. 4 (e) and 4 (f), a circular hole having a bottom may be formed, or as shown in FIGS. It is formed in a hole shape and provided on the substrate 1.

Next, the insertion portion 15 is inserted into the recess 2 so that the brazing material 4 is brought into contact with the circuit pattern 13 so that the substrate 1 is provided with the brazing material 4 and the brazing material 4 is brought into contact with the electrode portion 14. The electric component 5 is placed on the material 4. Next, as shown in FIG. 3B, only the brazing material 4 is irradiated with a beam (energy beam) 6 such as a laser beam, an electron beam, or a light beam from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, so that the substrate 1, the brazing material 4 and the electrode portion 14 of the electric component 5 can be simultaneously bonded as shown in FIG. it can.

As described above, in this embodiment, the substrate 1
Since the brazing filler metal 4 is provided on the substrate 1 by inserting the insertion portion 15 of the brazing filler metal 4 into the concave portion 2 of the substrate 1, positioning of the brazing filler metal 4 can be easily performed, and therefore, the bonding position of the electric component 5 to the substrate 1 can be easily adjusted. Can be prevented from shifting. Further, the insertion portion 15 of the brazing material 4 is inserted into and locked in the concave portion 2, so that the brazing material 4 is electrically connected to the electrical component 5.
It is possible to prevent the brazing filler metal 4 from moving and causing a positional deviation when it is placed. Further, since the beam 6 irradiates only the brazing material 4, heat is less likely to be transmitted to the electric component 5 and the substrate 1, and the beam 6 can prevent the electric component 5 and the substrate 1 from being damaged. In addition, by providing the brazing material 4 of a certain size on the substrate 2, it is possible to eliminate the need to control the application amount of the brazing material 4 as in the case of the conventional printing.

FIG. 5 shows another embodiment of a method of manufacturing a circuit board having the electric component shown in FIG. This board 1
On the upper surface of the, two substantially parallel convex portions 3 are provided as shown in FIGS. This convex portion 3 is provided on the peripheral portion of the portion of the substrate 1 where the electric component 5 is mounted.
As shown in (a), the ridge is formed. In addition, the circuit pattern 13 is formed on the upper surface and the side surface of the convex portion 3 and around the convex portion 3.
Is formed. The brazing material 4 has a flat upper surface and a fitting recess 16 on the lower surface.

When joining the electric component 5 to the substrate 1, first, as shown in FIG. 5A, the fitting concave portion 16 is inserted into the convex portion 3 and the brazing material 4 is attached to the circuit pattern 13.
The brazing material 4 is provided on the substrate 1 so as to be in contact with the
The electric component 5 is placed on top. Next, as shown in FIG. 5B, only the brazing material 4 is irradiated with the beam 6 from above on the outside of the electric component 5 to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, so that the substrate 1, the brazing material 4 and the electrode portion 14 of the electric component 5 can be bonded as shown in FIG. 5C. .

As described above, in this embodiment, the substrate 1
The fitting concave portion 16 of the brazing material 4 is inserted into the convex portion 3 of the substrate 1
Since the brazing material 4 is provided in the above, the positioning of the brazing material 4 can be easily performed, and thus the joining position of the electric component 5 to the substrate 1 can be prevented from being displaced. Further, the fitting concave portion 16 of the brazing material 4 is inserted into and locked by the convex portion 3, so that when the electric component 5 is placed on the brazing material 4, the brazing material 4 may move to cause a positional deviation. You can avoid it. Further, since the beam 6 irradiates only the brazing material 4, heat is less likely to be transmitted to the electric component 5 and the substrate 1, and the beam 6 can prevent the electric component 5 and the substrate 1 from being damaged. In addition, by providing the brazing material 4 of a certain size on the substrate 2, it is possible to eliminate the need to control the application amount of the brazing material 4 as in the case of the conventional printing.

In the above-described embodiment, the convex portion 3 has the shape shown in FIG.
It may be formed in a cylindrical shape as shown in (c) and (d). FIG. 7 shows another embodiment of a circuit board including electric components. In this embodiment, in the structure shown in FIG. 2, the substrate 1 is not provided with the concave portions 2 and the convex portions 3, and instead of the brazing material 4, a pair of plate-shaped metal fittings 7 coated with the brazing material 4 on the upper surface of the substrate 1 is used. And the brazing material 4 on the lower surface of the metal fitting 7 is brought into contact with the circuit pattern 13. The brazing material 4 may be coated on the metal fitting 7 by any method such as plating, sputtering, vapor deposition, and clad.

Next, an embodiment of a method of manufacturing a circuit board having the electric parts shown in FIG. 7 will be described. First, FIG.
As shown in (a), the electric component 5 is placed on the metal fitting 7 such that the electrode portion 14 is brought into contact with the brazing material 4. Next, as shown in FIG. 8B, only the metal fitting 7 (the brazing material 4) is irradiated with the beam 6 from above on the outer side of the electric component 5 to heat and melt the brazing material 4. Then, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again.
As shown in (c), the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously joined.

As described above, in this embodiment, since the beam 6 is applied only to the metal fitting 7, it is difficult for heat to be transmitted to the electric component 5 and the substrate 1, and the beam 6 does not damage the electric component 5 and the substrate 1. Can be In addition, since the thickness of the brazing filler metal 4 can be controlled more easily by the coating treatment such as plating than in the conventional screen printing, the supply amount of the brazing filler metal 4 can be easily controlled to a constant amount.

FIG. 9 shows another embodiment of a circuit board provided with electric parts. In this embodiment, instead of the brazing material 4 shown in FIG.
A pair of metal fittings 7 coated with is provided. The metal fitting 7 is formed by projecting an insertion portion 17 on the lower surface, and the outer surface of the metal fitting 7 is coated with the brazing material 4 by any method such as plating, sputtering, vapor deposition, and clad.

Next, an embodiment of a method of manufacturing a circuit board having the electric parts shown in FIG. 9 will be described. FIG. 10 (a)
Insert the insertion part 17 into the recess 2 as shown in
The metal fitting 7 is provided on the substrate 1 so that the brazing material 4 on the lower surface of the metal plate 7 contacts the circuit pattern 13, and
The electric component 5 is placed on the metal fitting 7 such that the electric components 5 contact each other. Next, as shown in FIG. 10B, only the metal fitting 7 (the brazing material 4) is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, so that the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded as shown in FIG. .

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the substrate 1 by inserting the insertion portion 17 of the metal fitting 7 into the concave portion 2, the metal fitting 7 can be easily positioned, so that the joining position of the electric component 5 to the substrate 1 does not shift. You can Further, the insertion portion 17 of the metal fitting 7 is inserted into and locked in the recess 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 should not move and be displaced. You can Further, since the metal fitting 7 is not melted by the irradiation of the beam 6, the metal fitting 7 can support the electric component 5,
It is possible to prevent the electric component 5 from being displaced and joined to the metal fitting 7. Further, since the beam 6 irradiates only the metal fitting 7, heat is less likely to be transmitted to the electric component 5 and the substrate 1, and the beam 6 can prevent the electric component 5 and the substrate 1 from being damaged. In addition, since the thickness of the brazing material 4 can be controlled more easily by the coating treatment such as plating than the conventional screen printing, it is possible to easily control the supply amount of the brazing material 4 at a constant amount.

FIG. 11 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular shape in a plane, a support portion 20 projecting from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above method. When the electric component 5 is joined to the substrate 1, the insertion portion 19 is inserted into the recess 2 and the brazing material 4 on the lower surface of the bottom portion 18 is inserted.
A pair of metal fittings 7 are provided on the substrate 1 so as to contact the circuit pattern 13, and the supporting portion 20 is brought into contact with the electrode portion 14 on the end face in the lateral direction of the electric component 5 and the electrode portion 14 is placed on the bottom portion 18. The electric component 5 is installed between the metal fittings 7 so as to be placed. After this, as shown in FIG. 11A, the bottom 18 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, by sandwiching the electric component 5 with the metal fitting 7, it is possible to prevent the electric component 5 from moving and being displaced.

FIG. 12 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed into a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from the upper surface of the bottom portion 18.
Is formed by providing an insertion portion 19 on the back surface thereof, and the metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the substrate 1, the insertion portion 19 is inserted into the recess 2 so that the brazing material 4 on the lower surface of the bottom portion 18 comes into contact with the circuit pattern 13 and a pair of metal fittings are attached to the substrate 1. 7 is provided, and the supporting portion 20 is brought into contact with the electrode portion 14 on the end face in the lateral direction of the electric component 5 to make the metal fitting 7
An electric component 5 is installed between them. Thereafter, as shown in FIG. 12A, the beam 6 is irradiated onto the bottom portion 18 from above and the brazing material 4 is formed.
To heat and melt. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, by sandwiching the electric component 5 with the metal fitting 7, it is possible to prevent the electric component 5 from moving and being displaced.

FIG. 13 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed in a plate shape, and the metal fitting 7 is formed by coating with the brazing material 4 by the method described above. When joining the electric component 5 to the board 1, the pair of fittings 7 is provided on the board 1 by inserting the lower end of the fitting 7 into the recess 2 so that the brazing material 4 contacts the circuit pattern 13 in the recess 2. The metal component 7 is brought into contact with the electrode portion 14 on the end face of the electrical component 5 in the lateral direction, and the electrical component 5 is installed between the metal components 7.
After this, as shown in FIG. 13, the metal fitting 7 is laterally irradiated with the beam 6 to heat and melt the brazing material 4. Then beam 6
By stopping the irradiation of No. 2 and curing the brazing material 4 again, the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously joined.

As described above, in this embodiment, the substrate 1
Since the lower end of the metal fitting 7 is inserted into the concave portion 2 and provided on the board 1, the metal fitting 7 can be easily positioned, and thus the joint position of the electric component 5 to the board 1 can be prevented from being displaced. it can. Further, the metal fitting 7 is the recess 2
Therefore, when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 is prevented from moving and being displaced. Further, by sandwiching the electric component 5 with the metal fitting 7, it is possible to prevent the electric component 5 from moving and being displaced.

FIG. 14 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular shape in a plane, a support portion 20 projecting from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above method. Further, as shown in FIG. 14A, the electrode portion 14 of the electric component 5 has a through hole 21 penetrating the upper surface and the lower surface.

When the electric component 5 is joined to the board 1, as shown in FIGS.
Is inserted into the recess 2 so that the brazing material 4 on the lower surface of the bottom 18 is brought into contact with the circuit pattern 13 and a pair of metal fittings 7 is provided on the substrate 1, and the through hole 21 of the electric component 5 is inserted into the support 20 from above. The electric part 5 is installed between the metal fittings 7 so that the electrode part 14 is brought into contact with the support part 20 and the electrode part 14 is placed on the bottom part 18. After that, as shown in FIG. 14C, the bottom portion 18 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, by inserting the support portion 20 of the metal fitting 7 into the through hole 21 of the electric component 5, it is possible to prevent the electric component 5 from moving and being displaced.

FIG. 15 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular shape in a plane, a support portion 20 projecting from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the above method. Further, as shown in FIG. 15A, the electrode portion 14 of the electric component 5 is provided with a groove portion 22 that is open to the upper surface and the lower surface and to the side surface in the lateral direction of the electric component 5.

When the electric component 5 is joined to the board 1, as shown in FIGS.
Is provided in the recess 2 so that the brazing material 4 on the lower surface of the bottom 18 is brought into contact with the circuit pattern 13 and the substrate 1 is provided with a pair of metal fittings 7. The electric part 5 is installed between the metal fittings 7 so that the support part 20 is brought into contact with the electrode 14 and the electrode part 14 is placed on the bottom part 18. After that, as shown in FIG. 15C, the bottom portion 18 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, by inserting the support portion 20 of the metal fitting 7 into the electric component 5, it is possible to prevent the electric component 5 from moving along the surface of the substrate 1 and causing a positional deviation.

FIG. 16 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed into a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from the upper surface of the bottom portion 18.
Is formed by providing an insertion portion 19 on the back surface thereof, and the metal fitting 7 is formed by coating with the brazing material 4 by the method described above. The support portion 20 is slightly bent toward the bottom portion 18, so that the support portion 20 is formed to have a spring property.

When the electric component 5 is joined to the substrate 1, the recessed portion 2 is inserted into the insertion portion 19 so that the brazing material 4 on the lower surface of the bottom portion 18 comes into contact with the circuit pattern 13. 7 is provided, and the supporting portion 20 is brought into contact with the electrode portion 14 on the end face of the electric component 5 in the lateral direction to make the metal fitting 7
The electric component 5 is installed by inserting it from above. After this, as shown in FIG. 16B, the beam 6 is applied to the bottom 18 from above.
And the brazing material 4 is heated to melt. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, by sandwiching the electric component 5 between the supporting portions 20 of the metal fitting 7 having a spring property, the elastic force of the supporting portion 20 firmly holds the electric component 5 so that the electric component 5 does not move and become displaced. be able to.

FIG. 17 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed into a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from the upper surface of the bottom portion 18.
Is formed by providing an insertion portion (not shown) on the back surface of
Further, sandwiching pieces 23 are provided on both sides of the supporting portion 20.
The sandwiching piece 23 is bent toward the inside of the metal fitting 7 toward the tip, and thus the sandwiching piece 23 is formed to have a spring property. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the board 1, the insertion part is inserted into the recess 2 so that the brazing material 4 on the lower surface of the bottom 18 is brought into contact with the circuit pattern 13 and the pair of metal fittings 7 are attached to the board 1. Sandwiching the strips 23 to face each other,
The sandwiching piece 23 is attached to the electrode portion 14 on the end face in the longitudinal direction of the electric component 5.
Then, the electric component 5 is inserted between the metal fittings 7 from above and installed. After this, as shown in FIG.
The brazing material 4 is heated and melted by irradiating a beam 6 from above. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electric component 5 are
It is possible to simultaneously join the electrode part 14 of

As described above, in this embodiment, the substrate 1
Insert the fitting part of the metal fitting 7 into the concave portion 2 of the
Since the metal fitting 7 is provided, the metal fitting 7 can be easily positioned, and thus the joint position of the electric component 5 to the substrate 1 can be prevented from being displaced. Further, the insertion portion of the metal fitting 7 is inserted into the recess 2 and locked,
Therefore, when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 is prevented from moving to cause positional displacement. Further, by sandwiching the electrical component 5 with the sandwiching piece 23 of the metal fitting 7 having a spring property, the electrical piece 5 is firmly held by the sandwiching piece 23, and the electrical component 5 moves along the surface of the substrate 1 to cause displacement. You can avoid it.

FIG. 18 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed by a bottom portion 18 having a substantially circular shape in a plane, a support portion 20 projecting from a substantially central portion of the upper surface of the bottom portion 18, and an insertion portion 19 provided on the back surface of the bottom portion 18. Also, a burr piece 24 is provided on the upper portion of the support portion 20 so as to project. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the substrate 1, the insertion portion 19 is inserted into the recess 2 and the bottom portion 1 is inserted.
A pair of metal fittings 7 are provided on the board 1 so that the brazing material 24 on the lower surface of the electric circuit board 8 is in contact with the circuit pattern 13. 14 and the electrode portion 1 on the bottom 18
4 is mounted, and the burr piece 24 is locked on the upper surface of the electric component 5, and the electric component 5 is installed between the metal fittings 7.
After this, the bottom portion 18 is irradiated with a beam from above to heat and melt the brazing material 4. Next, the irradiation of the beam is stopped and the brazing material 4 is cured again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, by locking the burr piece 24 of the metal fitting 7 on the upper surface of the electric component 5, it is possible to prevent the electric component 5 from floating so that the electric component 5 moves in a direction away from the upper surface of the substrate 1 and does not shift its position. be able to.

FIG. 19 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed into a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from the upper surface of the bottom portion 18.
An insertion portion 19 is provided on the back surface of the support member 20, and an abutment piece 25 is provided on one side end of the support portion 20.
The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the substrate 1, the insertion portion is inserted into the recess 2 so that the brazing material 4 on the lower surface of the bottom 18 is brought into contact with the circuit pattern 13 and the pair of metal fittings 7 are attached to the substrate 1. Is provided with the contact pieces 25 facing each other,
As shown in FIG. 19B, the contact piece 25 of one of the metal fittings 7 is brought into contact with the electrode portion 14 of one end face of the electric component 5 in the longitudinal direction, and the contact piece 25 of the other metal fitting 7 is contacted with the electric component 5. The electrode portion 14 on the other longitudinal end face of the
An electric component 5 is installed between them. After this, as shown in FIG. 19A, the beam 6 is applied to the bottom portion 18 from above and the brazing material 4 is formed.
To heat and melt. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, the contact piece 25 of the metal fitting 7 is brought into contact with the side surface of the electric component 5 and sandwiched therebetween, so that the electric piece 5 is firmly held by the contact piece 25 so that the electric component 5 moves along the upper surface of the substrate 1 and is positioned. It is possible to prevent deviation.

FIG. 20 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed into a substantially L-shaped cross section by a plate-shaped bottom portion 18 and a support portion 20 protruding from the upper surface of the bottom portion 18.
Is formed by providing an insertion portion 19 on the back surface thereof, and contact pieces 25 are provided on both side end portions of the support portion 20.
The metal fitting 7 is formed by coating with the brazing material 4 by the method described above. When the electric component 5 is joined to the substrate 1, the insertion portion is inserted into the recess 2 and the bottom portion 18 is formed.
A pair of metal fittings 7 is provided on the substrate 1 so that the brazing material 4 on the lower surface of the metal pattern 7 is brought into contact with the circuit pattern 13, and as shown in FIG. The metal fitting 7 so that the electrode portion 14 on the end face in the direction of contact is brought into contact with the metal fitting 7
An electric component 5 is installed between them. After this, as shown in FIG. 20 (a), the bottom portion 18 is irradiated with the beam 6 from above and the brazing material 4 is formed.
To heat and melt. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, the contact pieces 25 of the metal fitting 7 are brought into contact with and sandwiched between the both side surfaces of the electric component 5, so that the electric piece 5 is firmly held by the contact pieces 25 and the electric component 5 moves along the upper surface of the substrate 1. It is possible to prevent misalignment.

FIG. 21 shows another embodiment of a method of manufacturing a circuit board having electric parts. In the metal fitting 7 of this embodiment, a plate-shaped bottom portion 18, a support portion 20 projectingly provided on the upper surface of the bottom portion 18, and a pressing piece 26 projecting to the opposite side of the bottom portion 18 are provided at the upper end of the support portion 20. The cross section is formed into a substantially S shape, and an insertion portion (not shown) is provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the substrate 1, the supporting portion 20 of the metal fitting 7 and the pressing piece 26 are brought into contact with the end surface and the upper surface of the electrode portion 14 of the electric component 5, respectively, on both sides of the electric component 5. The metal fitting 7 is provided on the bottom part 1 in this state.
The brazing material 4 on the lower surface of 8 is inserted into the recess 2 so that the brazing material 4 is in contact with the circuit pattern 13 to dispose the pair of metal fittings 7 and the electric component 5 on the substrate 1, and as shown in FIG.
The brazing material 4 is heated and melted by irradiating the beam 8 onto the beam 8 from above. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Insert the fitting part of the metal fitting 7 into the concave portion 2 of the
Since the metal fitting 7 is provided, the metal fitting 7 can be easily positioned, and thus the joint position of the electric component 5 to the substrate 1 can be prevented from being displaced. Further, by bringing the pressing piece 26 of the metal fitting 7 into contact with the upper surface of the electric component 5, the electric piece 5 is firmly held on the board 1 by the pressing piece 26, and the electric part 5 is floated so that the electric part 5 can be placed on the board 1.
It is possible to move away from the upper surface of the so as not to cause displacement.

FIG. 22 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment includes a plate-shaped bottom portion 18, a support portion 20 provided on the upper surface of the bottom portion 18, a pressing piece 26 protruding from the upper end of the support portion 20 to the opposite side of the bottom portion 18, and a support piece 26. It is formed by abutting pieces 25 provided on both sides of the portion 20, and an insertion portion (not shown) is provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When joining the electric component 5 to the substrate 1, the supporting portion 20 of the metal fitting 7, the pressing piece 26, and the abutting piece 25 are brought into contact with the end surface, upper surface, and side surface of the electrode portion 14 of the electric component 5, respectively. The metal fittings 7 are provided on both sides of the electric component 5,
In this state, the brazing material 4 on the bottom surface of the bottom 18 is connected to the circuit pattern 1
The insertion part is inserted into the recess 2 so as to be in contact with the metal plate 3, the pair of metal fittings 7 and the electric component 5 are arranged on the substrate 1, and the beam 6 is irradiated onto the bottom part 18 from above as shown in FIG. The material 4 is heated and melted. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Insert the fitting part of the metal fitting 7 into the concave portion 2 of the
Since the metal fitting 7 is provided, the metal fitting 7 can be easily positioned, and thus the joint position of the electric component 5 to the substrate 1 can be prevented from being displaced. Further, by bringing the pressing piece 26 of the metal fitting 7 into contact with the upper surface of the electric component 5, the electric piece 5 is firmly held on the board 1 by the pressing piece 26, and the electric part 5 is floated so that the electric part 5 can be placed on the board 1.
It is possible to move away from the upper surface of the so as not to cause displacement. Further, by bringing the contact piece 25 of the metal fitting 7 into contact with the side surface of the electric component 5, the contact piece 25
Thus, it is possible to firmly hold the electric component 5 on the substrate 1 and prevent the electric component 5 from moving along the upper surface of the substrate 1 and causing positional displacement.

FIG. 23 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment includes a holding piece 26, a holding piece 27 formed at both ends of the holding piece 26 so as to project downward, and a bottom portion provided at the end of each holding piece 27 so as to project outward. 18 and an insertion portion (not shown) is provided on the back surface of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the substrate 1, the pressing piece 26 and the holding piece 27 of the metal fitting 7 are brought into contact with the upper surface and the side surface of the electrode portion 14 of the electric component 5, respectively. 7 is provided, and in this state, the brazing material 4 on the lower surface of the bottom portion 18 is brought into contact with the circuit pattern 13, and the insertion portion is inserted into the concave portion 2 to attach the pair of metal fittings 7 to the substrate 1.
Then, the electric component 5 is provided, and the bottom portion 18 is irradiated with the beam 6 from above as shown in FIG. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the pressing piece 26 of the metal fitting 7 is brought into contact with the upper surface of the electric component 5, so that the pressing piece 26 firmly holds the electric component 5 on the substrate 1 and moves the electric component 5 away from the upper surface of the substrate 1. It is possible to prevent deviation. Further, the holding piece 27 of the metal fitting 7 is brought into contact with the side surface of the electric component 5, so that the holding piece 27 firmly holds the electric component 5 on the substrate 1 so that the electric component 5 moves along the upper surface of the substrate 1 and is displaced. Can be prevented.

FIG. 24 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment has a bottom portion 18 formed in a substantially circular shape in a plane, a support portion 20 protruding from a substantially central portion of an upper surface of the bottom portion 18, and a substantially circular shape in a plane formed at an upper end of the support portion 20. Fixing piece 28 of
It is formed by the insertion portion 19 provided on the back surface of the bottom portion 18, and the metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When joining the electric component 5 to the substrate 1, the electrode portion 14 of the electric component 5 is connected to the bottom portion 18 of the metal fitting 7.
And the fixing piece 2 and the bottom portion 18 and the fixing piece 2
8 are respectively brought into contact with the bottom surface and the top surface of the electrode portion 14 to provide the metal fittings 7 on both sides of the electric component 5, and in this state, the brazing material 4 of the bottom portion 18 is brought into contact with the circuit pattern 13 and the insertion portion 19 is provided. The pair of metal fittings 7 and the electric component 5 are arranged on the substrate 1 by being inserted into the recesses 2, and the fixing piece 28 is irradiated with the beam 6 from above as shown in FIG. Let Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the fixing piece 28 of the metal fitting 7 is brought into contact with the upper surface of the electric component 5, so that the fixing piece 28 firmly holds the electric component 5 on the substrate 1 and moves the electric component 5 away from the upper surface of the substrate 1. It is possible to prevent deviation.

FIG. 25 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed of a fixed piece 28 having a substantially circular shape in a plan view and a support portion 20 projecting from a substantially central portion of the lower surface of the fixed piece 28. It is formed by coating with a brazing material 4. Further, as shown in FIG. 25A, the electrode portion 14 of the electric component 5 is formed with a through hole 21 penetrating the upper surface and the lower surface.

When the electric component 5 is joined to the substrate 1, the support portion 20 is inserted into the through hole 21 from the upper side and the fixing piece 28 is attached as shown in FIGS.
The brazing material 4 on the lower surface of the electric component 5 is brought into contact with the upper surface of the electrode portion 14 to provide the electric component 5 with a pair of metal fittings 7. The electric component 5 and the metal fitting 7 are placed on the substrate 1 so as to come into contact with the circuit pattern 13 in the recess 2. After this, FIG.
As shown in (c), the fixing piece 28 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
Since the metal member 7 is provided on the board 1 by inserting the support portion 20 of the metal member 7 into the concave portion 2 of the metal plate 7, the metal fitting 7 can be easily positioned, so that the joining position of the electric component 5 to the board 1 does not shift. You can Further, by inserting the support portion 20 of the metal fitting 7 into the electric component 5, it is possible to prevent the electric component 5 from moving and being displaced. Further, the fixing piece 28 of the metal fitting 7 is brought into contact with the upper surface of the electric component 5, so that the fixing piece 28 firmly holds the electric component 5 on the substrate 1 and moves the electric component 5 away from the upper surface of the substrate 1. It is possible to prevent deviation.

FIG. 26 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed in a substantially U-shape by the pressing piece 26 and the holding pieces 27 formed at both ends of the pressing piece 26 so as to project downward. It is formed by coating with a brazing material 4 by a method. Further, as shown in FIG. 26A, the electrode portion 14 of the electric component 5 is provided with a groove portion 22 that is open to the upper surface and the lower surface and the side surface in the longitudinal direction of the electric component 5.

When joining the electric component 5 to the substrate 1, the pressing piece 26 of the metal fitting 7 is brought into contact with the upper surface of the electrode portion 14 of the electric component 5 and the holding piece 27 is inserted into the groove portion 22 as shown in FIG. As shown in (b), metal fittings 7 are provided on both sides of the electric component 5, and in this state, the brazing material 4 at the bottom of the holding piece 27 is brought into contact with the circuit pattern 13 in the recess 2 so that the lower end of the holding piece 27 is recessed. 26, a pair of metal fittings 7 and electric components 5 are arranged on the substrate 1, and the pressing piece 26 is irradiated with a beam 6 from above as shown in FIG. 26 (c) to heat and melt the brazing material 4. . Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, so that the substrate 1
The metal fitting 7 and the electrode portion 14 of the electric component 5 can be joined at the same time.

As described above, in this embodiment, the substrate 1
Since the holding piece 27 of the metal fitting 7 is inserted into the concave portion 2 of the metal fitting 7 to provide the metal fitting 7 on the substrate 1, the metal fitting 7 can be easily positioned, so that the joining position of the electric component 5 to the substrate 1 does not shift. You can Further, the pressing piece 26 of the metal fitting 7 is brought into contact with the upper surface of the electric component 5, so that the pressing piece 26 firmly holds the electric component 5 on the substrate 1 and moves the electric component 5 away from the upper surface of the substrate 1. It is possible to prevent deviation. Further, the holding piece 27 of the metal fitting 7 is provided in the groove 22 of the electric component 5.
It is possible to firmly hold the electric component 5 on the substrate 1 by the holding piece 27 and prevent the electric component 5 from moving along the upper surface of the substrate 1 and causing a positional shift.

FIG. 27 shows another embodiment of a method of manufacturing a circuit board having electric parts. As shown in FIG. 27B, the recesses 2 formed in the substrate 1 of this embodiment are formed in the shape of a bottomed hole, and four recesses are provided in the substrate 1 as shown in FIG. 27A. As a group of recesses. The metal fitting 7 is formed, for example, in the same manner as that shown in FIG.

When the electric component 5 is joined to the board 1, the mounting portion is inserted into the recess 2 so that the brazing material 4 on the lower surface of the bottom 18 is brought into contact with the circuit pattern 13 and four metal fittings are attached to the board 1. 7, the supporting portion 20 is brought into contact with the electrode portions 14 on the end faces of the electric component 5 in the lateral direction, and the electrode portions 14 at the four corners of the electric component 5 are placed on the bottom portion 18 as shown in FIG. 27 (c). In this way, the electric component 5 is installed between the metal fittings 7. After this, the bottom portion 18 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Then beam 6
By stopping the irradiation of No. 2 and curing the brazing material 4 again, the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously joined.

As described above, in this embodiment, the substrate 1
Insert the fitting part of the metal fitting 7 into the concave portion 2 of the
Since the metal fitting 7 is provided, the metal fitting 7 can be easily positioned, and thus the joint position of the electric component 5 to the substrate 1 can be prevented from being displaced. Further, the insertion portion of the metal fitting 7 is inserted into the recess 2 and locked,
Therefore, when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 is prevented from moving to cause positional displacement. Further, by holding the periphery of the electric component 5 with the four metal fittings 7, the joint area between the electric component 5 and the metal fitting 7 is increased, and the electric component 5 can be firmly held so as not to move and be displaced. .

FIG. 28 shows another embodiment of a method of manufacturing a circuit board having electric parts. In this embodiment, the electrical component 5 is attached to the substrate 1 by using the socket 9 formed by coating the resin member 9a made of an insulating resin with the brazing material 4. As shown in FIG. 28 (a), the resin member 9 a includes a housing portion 30 whose lower surface is open, a peripheral piece 31 provided on the lower edge of the housing portion 30 so as to project outward, and a lower surface of the peripheral piece 31. It is formed with the insertion part 19 protrudingly provided. See also FIG.
As shown in (b), the storage member 3 is provided on the front and back of the resin member 9a.
A portion other than the substantially central portion of 0 (shown by cross hatching) is coated with the brazing material 4.

When the electric component 5 is joined to the substrate 1, the electric component 5 is fitted into the storage portion 30 from below and the brazing material 4 and the electrode portion 14 in the storage portion 30 are held in contact with each other. In this state, the brazing material 4 on the lower surface of the peripheral piece 31 is brought into contact with the circuit pattern 13, and the insertion portion 19 is inserted into the recess 2 to install the electric component 5 and the socket 9 on the substrate 1. Then, as shown in FIG. 28C, the beam 6 is irradiated onto the peripheral piece 31 from above to heat and melt the brazing material 4. Then, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the socket 9 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The insertion portion 19 of the socket 9 is inserted into the concave portion 2 of the substrate 1
Since the socket 9 is provided in the socket, the socket 9 can be easily positioned, so that the joint position of the electric component 5 with respect to the substrate 1 can be prevented from being displaced. In addition, by holding the entire periphery of the electric component 5 with the socket 9, the joint area between the electric component 5 and the socket 9 is increased, and the electric component 5 can be firmly held so as not to move and be displaced. The contact between the socket 9 and the electric component 5 can be largely and surely obtained, and stable joining can be performed. Further, by holding the electric component 5 in the socket 9, the electric component 5 can be easily handled.

FIG. 29 shows a multi-socket 40 formed by integrating a plurality of the sockets 9 shown in FIG.
Is shown. The multi-socket 40 has a plurality of accommodating portions 30 formed on the lower surface of a flat plate-shaped resin member 9a. In addition, an insertion portion 19 that projects to the lower surface is provided at the opening edge portion of the storage portion 30. Further, the resin member 9 is coated with the brazing material 4 over the entire surface except the joint portion of the peripheral piece 31 adjacent to the portion other than the substantially central portion of the storage portion 30.

When the electric component 5 is joined to the substrate 1 as shown in FIGS. 4A to 4H by using the multi-socket 40, as shown in FIG. Multi-socket 40 by fitting parts 5
Holds a large number of electric components 5 and holds the brazing material 4 in the storage section 30.
And the electrode portion 14 are brought into contact with each other, and the brazing material 4 on the lower surface of the peripheral piece 31 is brought into contact with the circuit pattern 13 in this state, the insertion portion 19 is inserted into the concave portion 2, and the electric component 5 and the multi-socket are mounted on the substrate 1. 40 is installed. The rear peripheral piece 31 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the multi-socket 40, and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the multi-chip 40 can hold a large number of electric components 5 and can be attached to the substrate 1, and the electric components 5 can be multi-processed. FIG. 31 shows another embodiment of a method of manufacturing a circuit board having electric components. The metal fitting 7 of this embodiment has a plate-shaped bottom portion 1 as shown in FIG.
8, a support portion 20 projectingly provided on the upper surface of the bottom portion 18, and a pressing piece 2 protruding from the upper end of the support portion 20 to the side opposite to the bottom portion 18.
6 is formed to have a substantially S-shaped cross section, and a bottom portion 18
An insertion portion 19 is provided on the back surface of the above, and a fitting piece 33 is projected from the tip of the pressing piece 26. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above. Further, the resin member 9a of this embodiment is formed in a plate shape, and fitting recesses 34 are provided on both side surfaces thereof. Then, by inserting the fitting pieces 33 into the fitting recesses 34 and attaching the metal fittings 7 to both sides of the resin member 9a,
A socket 9 as shown in FIG. 31B is formed, and the socket 9 has a supporting portion 20, a pressing piece 26, and a resin member 9a.
A storage portion 30 is formed which is surrounded by and is opened downward.

When the electric component 5 is joined to the substrate 1, the electric component 5 is fitted into the storage portion 30 from below and the brazing material 4 and the electrode portion 14 in the storage portion 30 are held in contact with each other. In this state, the brazing material 4 on the lower surface of the bottom portion 18 is brought into contact with the circuit pattern 13, and the insertion portion 19 is inserted into the concave portion 2 to install the electric component 5 and the socket 9 on the substrate 1. After this, as shown in FIG. 31C, the beam 6 is irradiated onto the peripheral piece 31 from above to heat and melt the brazing material 4. Then, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1, the socket 9 and the electrode portion 14 of the electric component 5 can be simultaneously bonded.

As described above, in this embodiment, the substrate 1
The insertion portion 19 of the socket 9 is inserted into the concave portion 2 of the substrate 1
Since the socket 9 is provided in the socket, the socket 9 can be easily positioned, so that the joint position of the electric component 5 with respect to the substrate 1 can be prevented from being displaced. Further, by holding the periphery of the electric component 5 with the socket 9, the joint area between the electric component 5 and the socket 9 is increased, and the electric component 5 can be firmly held so as not to move and be displaced. A large amount of close contact between the electric component 9 and the electric component 5 can be reliably obtained, and stable joining can be performed. Further, by holding the electric component 5 in the socket 9, the electric component 5 can be easily handled.

FIG. 32 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment has a plate-shaped bottom portion 18 as shown in FIG.
And a support portion 20 protruding upward from one end of the bottom portion 18, and an insertion portion 19 protruding downward from the other end portion of the bottom portion 18. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above. Further, the resin member 9a of this embodiment is formed by providing a storage portion 30 having an opening on the lower surface. Then, the support portion 20 of the metal fitting 7 is inserted into the storage portion 30 to insert the resin member 9a.
32 by attaching the metal fittings 7 on both sides of
The socket 9 as shown in (b) is formed.

When the electric component 5 is joined to the substrate 1, the electric component 5 is fitted into the housing portion 30 from below and the end portion of the electrode portion 14 is held in contact with the supporting portion 20 of the metal fitting 7. In this state, the brazing material 4 on the lower surface of the bottom portion 18 is brought into contact with the circuit pattern 13 and the insertion portion 19 is inserted into the concave portion 2 to install the electric component 5 and the socket 9 on the substrate 1. After this, as shown in FIG. 32 (c), the beam 6 is irradiated onto the peripheral piece 31 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is cured again, so that the substrate 1, the socket 9 and the electrical component 5 are
It is possible to simultaneously join the electrode part 14 of

As described above, in this embodiment, the substrate 1
The insertion portion 19 of the socket 9 is inserted into the concave portion 2 of the substrate 1
Since the socket 9 is provided in the socket, the socket 9 can be easily positioned, so that the joint position of the electric component 5 with respect to the substrate 1 can be prevented from being displaced. Further, by holding the periphery of the electric component 5 with the socket 9, the joint area between the electric component 5 and the socket 9 is increased, and the electric component 5 can be firmly held so as not to move and be displaced. A large amount of close contact between the electric component 9 and the electric component 5 can be reliably obtained, and stable joining can be performed. Further, by holding the electric component 5 in the socket 9, the electric component 5 can be easily handled.

FIG. 33 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment is formed of a plate-shaped bottom portion 18 and an insertion portion 19 which is provided so as to project substantially at the center of the lower surface of the bottom portion 18.
One end is formed as the flange portion 10. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

In order to join the electric component 5 to the substrate 1, first, as shown in FIG. 33 (a), the brazing material 4 on the lower surface of the metal fitting 7 is inserted into the concave portion 2 so as to contact the circuit pattern 13. The electric component 5 is placed on the metal fitting 7 by inserting the portions 19 to provide the pair of metal fittings 7 on the substrate 1 and bringing the electrode portion 14 into contact with the brazing material 4. Next, the flange 6 of the metal fitting 7 protruding to the outside of the electric component 5 is irradiated with the beam 6 from above to heat and melt the brazing material 4. Next, the irradiation of the beam 6 is stopped and the brazing material 4 is hardened again, so that the substrate 1 is removed as shown in FIG.
The metal fitting 7 and the electrode portion 14 of the electric component 5 can be joined together.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the board 1 by inserting the insertion part 19 of the metal fitting 7 into the concave portion 2 of the metal fitting 7, the metal fitting 7 can be easily positioned, and thus the joining position of the electric component 5 to the board 1 is displaced. You can avoid it. Further, the insertion portion 19 of the metal fitting 7 is inserted into and locked in the recessed portion 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 does not move and become displaced. .
Further, the metal fitting 7 is provided with a flange portion 10, and the flange portion 1
Since the beam 6 is irradiated to 0, the irradiation area of the beam 6 can be increased, and the allowable amount of deviation of the irradiation position of the beam 6 can be increased. Further, by adjusting the thickness of the bottom portion 18, it is possible to change the height at which the electric component 5 is joined to the substrate 1, and it is possible to control the height of the electric component 5.

FIG. 34 shows another embodiment of a method of manufacturing a circuit board having electric parts. In this embodiment, in the flange portion 10 of the metal fitting 7 of FIG. 32, the mark 11 is provided in a portion which becomes the irradiation area of the beam 6. The mark 11 may be any mark as long as it can be monitored by a camera. For example, a mark as shown in FIG. 34 (a), a recess as shown in FIG. 34 (b), a protrusion, or a mark having a specific shape. Etc. can be used.

When joining the electric component 5 to the substrate 1, the metal fitting 7 is provided on the substrate 1 and the electrode portion 14 is brought into contact with the brazing material 4 on the upper surface of the metal fitting 7 as in the case shown in FIG. The electric component 5 is placed on the metal fitting 7.
Next, as shown in FIG.
It is monitored and detected at 5, and the beam 6 is irradiated as shown in FIG. 34A with this mark 11 as the irradiation position. After that, the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be joined in the same manner as shown in FIG.

As described above, in this embodiment, the mark 11 provided on the flange portion 10 is detected and the mark 11 is detected.
Since the beam 6 is radiated toward the side, the accuracy of the irradiation position of the beam 6 can be improved, and therefore the erroneous irradiation of the beam 6 on the electric component 5 and the substrate 1 is eliminated, and the irradiation of the beam 6 causes the substrate 1 and the substrate 1 to be electrically irradiated. It is possible to prevent the component 5 from being damaged.

FIG. 35 shows another embodiment of a method of manufacturing a circuit board provided with electric parts. In this embodiment, in the flange portion 10 of the metal fitting 7 of FIG. 32 or the brazing material 4 covering the flange portion 10, the uneven surface 12 is provided in a portion which becomes the irradiation region of the beam 6. The uneven surface 12 may be any as long as it can reflect the beam 6 multiple times or can increase the surface area of the irradiation area. For example, a V-shaped scratch or a figure as shown in FIG. 35 (b), or a mountain-shaped protrusion 12a and a V-shaped scratch 12b as shown in FIG. 35 (c) can be formed repeatedly.

When joining the electric component 5 to the board 1, the metal fitting 7 is provided on the board 1 and the electrode portion 14 is brought into contact with the brazing material 4 on the upper surface of the metal fitting 7 as in the case shown in FIG. The electric component 5 is placed on the metal fitting 7. Next, as shown in FIGS. 35A to 35C, the uneven surface 12 is irradiated with the beam 6. After that, the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be joined in the same manner as shown in FIG.

As described above, in this embodiment, since the uneven surface portion 12 is formed on the flange portion 10 and the uneven surface portion 12 is irradiated with the beam 6, the beam 6 of the metal fitting 7 is formed.
It is possible to improve the absorption of the energy, and it is possible to join the substrate 1, the electrical component 5, and the metal fitting 7 with a small amount of heat input. FIG. 36 shows another embodiment of a method of manufacturing a circuit board having electric components. In this embodiment, a pair of plate-shaped brazing materials 4 are provided on the upper surface of the substrate 1 so as to be in contact with the circuit pattern 13. The brazing material 4 does not contain a flux component, and Sn-Pb solder, Sn-based solder or the like having a relatively low melting point can be used.

When joining the electric component 5 to the substrate 1, first, as shown in FIG. 36A, the electric component 5 is placed on the brazing material 4 by bringing the electrode portion 14 into contact with the brazing material 4. Place it. Next, as shown in FIG. 36B, the electric component 5 and the brazing filler metal 4 are blown with an inert gas 8 such as argon, nitrogen or helium as shown in FIG.
The periphery of the brazing material is shielded by the atmosphere of the inert gas 8 and only the brazing material 4 is irradiated with the beam 6 from above on the outside of the electric component 5 to heat and melt the brazing material 4. The beam 6 used here is a pulsed laser with high energy density. Also, here, the brazing material 4 has a length of 1 ms or more and 100 m.
A single pulse or a plurality of pulses of s or less is irradiated, and only the brazing material 4 is locally heated. The pulse of the beam 6 can be shortened by increasing the amount of energy per unit time, but in order to obtain stable laser (beam) light, a time of about 1 ms or more is necessary. Then beam 6
By stopping the irradiation of No. 2 and curing the brazing material 4 again, the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded as shown in FIG.

As described above, in this embodiment, by irradiating the brazing material 4 with the beam 6 in the atmosphere of the inert gas 8 and irradiating the beam 6 in a short time, the brazing material 4 and the electrode portion 14 are irradiated. Can be prevented, and it becomes unnecessary to add a flux component to the brazing material 4. And because fluxless bonding is possible in this way,
The flux does not scatter when the electric component 5 is joined to the substrate 1, and it is not necessary to wash the substrate 1 after the electric component 5 is joined.

As a concrete example of the above-mentioned embodiment, the brazing material 4 is formed by the solder of the tin-lead alloy and is irradiated with a pulse of about 10 ms, so that the board 1 and the electrical components 5 are in good condition. And can be joined. Further, in the above-described embodiment, the number of irradiation shots of the beam 6 can be changed depending on the size of the electric component 5, and thus the bonding state such as the bonding strength between the substrate 1 and the electric component 5 can be managed. .

FIG. 37 shows another embodiment of a method of manufacturing a circuit board provided with electric parts. The substrate 1 of this embodiment is the same as that shown in FIGS.
Any of those shown in (c) and (d), those shown in FIGS. 4 (e) and (f), or those shown in FIGS. 4 (g) and (h) may be adopted. Further, the brazing material 4 has a flat upper surface, and an insertion portion 15 is provided on the lower surface of the brazing material 4 so as to project therefrom.

When joining the electric component 5 to the substrate 1, first, as shown in FIG.
The brazing material 4 is provided on the substrate 1 so that the brazing material 4 is brought into contact with the circuit pattern 13, and the electrode part 14 is brought into contact with the brazing material 4, and the electrical component 5 is placed on the brazing material 4. To do. Next, as shown in FIG. 37 (b), the electric component 5 and the brazing material 4 are blown with an inert gas 8 such as argon, nitrogen or helium as shown in FIG.
The periphery of the brazing material is shielded by the atmosphere of the inert gas 8 and only the brazing material 4 is irradiated with the beam 6 from above on the outside of the electric component 5 to heat and melt the brazing material 4. The beam 6 used here is a pulsed laser with high energy density. Also, here, the brazing material 4 has a length of 1 ms or more and 100 m.
A single pulse or a plurality of pulses of s or less is irradiated, and only the brazing material 4 is locally heated. The pulse of the beam 6 can be shortened by increasing the amount of energy per unit time, but in order to obtain stable laser (beam) light, a time of about 1 ms or more is necessary. Then beam 6
By stopping the irradiation of No. 2 and curing the brazing material 4 again, the substrate 1, the brazing material 4 and the electrode portion 14 of the electric component 5 can be simultaneously bonded as shown in FIG. 37 (c).

As described above, in this embodiment, the brazing material 4 is irradiated with the beam 6 in the atmosphere of the inert gas 8 and the irradiation of the beam 6 is performed in a short time, whereby the brazing material 4 and the electrode portion 14 are irradiated. Can be prevented, and it becomes unnecessary to add a flux component to the brazing material 4. And because fluxless bonding is possible in this way,
The flux does not scatter when the electric component 5 is joined to the substrate 1, and it is not necessary to wash the substrate 1 after the electric component 5 is joined. In addition, the brazing material 4 is placed in the recess 2 of the substrate 1.
Since the brazing filler metal 4 is provided on the substrate 1 by inserting the insertion portion 15 of the above, the positioning of the brazing filler metal 4 can be easily performed, so that the joint position of the electric component 5 to the substrate 1 is not displaced. You can Brazing material 4
The insertion portion 15 of the above is inserted into and locked by the recessed portion 2, so that when the electric component 5 is placed on the brazing material 4, it is possible to prevent the brazing material 4 from moving and being displaced. it can.

FIG. 38 shows another embodiment of a method of manufacturing a circuit board having electric parts. In this embodiment, a pair of plate-shaped metal fittings 7 coated with the brazing material 4 are provided on the upper surface of the substrate 1 so that the brazing material 4 contacts the circuit pattern 13. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

When the electric component 5 is joined to the substrate 1, first, as shown in FIG. 38 (a), the electrode portion 14 is brought into contact with the brazing material 4 on the upper surface of the metal fitting 7 and then the metal fitting 7 is placed thereon. The electric component 5 is placed. Next, as shown in FIG. 38B, the electric component 5 and the metal fitting 7 are blown with an inert gas 8 such as argon, nitrogen or helium.
The periphery of the metal fitting 7 is shielded by the atmosphere of the inert gas 8 and only the metal fitting 7 (the brazing material 4) is irradiated with the beam 6 from above on the outside of the electric component 5 to heat and melt the brazing material 4. The beam 6 used here is a pulsed laser with high energy density. Here, the brazing material 4 is irradiated with a single pulse or a plurality of pulses of 1 ms or more and 100 ms or less, and only the brazing material 4 is locally heated. The pulse of the beam 6 can be shortened by increasing the amount of energy per unit time, but in order to obtain stable laser (beam) light, a time of about 1 ms or more is necessary. Next, by stopping the irradiation of the beam 6 and curing the brazing material 4 again, the substrate 1, the metal fitting 7 and the electrode portion 14 of the electric component 5 can be simultaneously bonded as shown in FIG. 38 (c). .

As described above, in this embodiment, since the beam 6 is applied only to the metal fitting 7, it is difficult for heat to be transferred to the electric component 5 and the substrate 1, and the beam 6 does not damage the electric component 5 and the substrate 1. Can be Further, since the thickness of the brazing filler metal 4 can be controlled more easily by the coating treatment such as plating than the conventional screen printing, it is possible to easily control the supply amount of the brazing filler metal 4 to a constant amount. In addition, the beam 6 is applied to the brazing material 4 in the atmosphere of the inert gas 8.
By irradiating the same and irradiating the beam 6 in a short time, it is possible to prevent the brazing material 4 and the electrode portion 14 from being oxidized, and it becomes unnecessary to contain a flux component in the brazing material 4. Since fluxless joining is possible in this manner, the flux does not scatter when joining the electric component 5 to the substrate 1, and the substrate 1 is joined after the electric component 5 is joined.
This eliminates the need for washing.

FIG. 39 shows another embodiment of a method of manufacturing a circuit board provided with electric parts. The substrate 1 of this embodiment is the same as that shown in FIGS.
Any of those shown in (c) and (d), those shown in FIGS. 4 (e) and (f), or those shown in FIGS. 4 (g) and (h) may be adopted. Further, the metal fitting 7 is formed by flattening the upper surface and projecting the insertion portion 17 on the lower surface, and the metal fitting 7 is formed by coating with the brazing material 4 by the above-described method.

When the electric component 5 is joined to the substrate 1, first, as shown in FIG. 39 (a), the recess 2 is formed.
The insertion part 17 is inserted into the metal plate 7 so that the brazing material 4 on the lower surface of the metal fitting 7 is brought into contact with the circuit pattern 13 and the metal fitting 7 is attached to the board 1.
And the electrode part 14 is brought into contact with the metal fitting 7, and the electric component 5 is placed on the metal fitting 7. Next, in FIG.
As shown in (b), an inert gas 8 such as argon, nitrogen, or helium is blown onto the electric component 5 and the metal fitting 7 to shield the periphery of the electric component 5 and the metal fitting 7 with an atmosphere of the inert gas 8. On the outside of the electric component 5, only the metal fitting 7 (the brazing material 4) is irradiated with the beam 6 from above to heat and melt the brazing material 4. The beam 6 used here is a pulsed laser with high energy density. Further, here, the brazing material 4 is irradiated with a pulse of 1 ms or more and 100 ms or less in a single pulse or a plurality of pulses.
Only heat locally. The pulse of the beam 6 can be shortened by increasing the amount of energy per unit time, but in order to obtain stable laser (beam) light, a time of about 1 ms or more is necessary. Next, the irradiation of the beam 6 is stopped and the brazing material 4
39C, the substrate 1, the metal fitting 7, and the electrode portion 14 of the electric component 5 can be simultaneously bonded by curing the resin.

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the substrate 1 by inserting the insertion portion 17 of the metal fitting 7 into the concave portion 2, the metal fitting 7 can be easily positioned, so that the joining position of the electric component 5 to the substrate 1 does not shift. You can Further, the insertion portion 17 of the metal fitting 7 is inserted into and locked in the recess 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 should not move and be displaced. You can Further, since the metal fitting 7 is not melted by the irradiation of the beam 6, the metal fitting 7 can support the electric component 5,
It is possible to prevent the electric component 5 from being displaced and joined to the metal fitting 7. Further, since the beam 6 irradiates only the metal fitting 7, heat is less likely to be transmitted to the electric component 5 and the substrate 1, and the beam 6 can prevent the electric component 5 and the substrate 1 from being damaged. In addition, the thickness of the brazing filler metal 4 can be controlled more easily by the coating treatment such as plating than the conventional screen printing, and thus the supply amount of the brazing filler metal 4 can be easily controlled to a constant amount.

Further, in the atmosphere of the inert gas 8, the brazing material 4
By irradiating the beam 6 with the beam 6 and irradiating the beam 6 in a short time, it is possible to prevent the brazing material 4 and the electrode portion 14 from being oxidized, and the brazing material 4 does not need to contain a flux component. Since fluxless bonding is possible in this way, the flux does not scatter when the electrical component 5 is bonded to the substrate 1, and the substrate 1 does not need to be cleaned after the electrical component 5 is bonded.

[0115]

As described above, the invention according to claim 1 of the present invention comprises a substrate having a circuit pattern, in which at least one of a concave portion and a convex portion is formed around a joint portion of an electric component,
Since the brazing material provided in the concave portion or the convex portion and the electric component joined to the substrate by the brazing material are provided, the brazing material can be easily positioned by providing the brazing material in the concave portion or the convex portion of the substrate. It is possible to prevent the displacement of the joining position of the electric component joined to the substrate by the brazing material to the substrate. Further, the brazing material is inserted into and locked in the concave portion or the convex portion, so that when the electric component is placed on the brazing material, it is possible to prevent the brazing material from moving and being displaced. The joint position of the electric component with respect to the substrate can be prevented from shifting.

According to a second aspect of the present invention, in manufacturing a circuit board having electric components on the board,
At least one of a concave portion and a convex portion is formed on the substrate, a brazing material is provided in the concave portion or the convex portion, the brazing material is irradiated with a beam and the brazing material is irradiated with a beam, and the brazing material is melted to form a substrate. Since the electric component is joined to the substrate, the brazing material can be easily positioned by providing the brazing material on the concave portion or the convex portion of the substrate. It can be prevented from slipping. Further, the brazing material is inserted into and locked in the concave portion or the convex portion, so that when the electric component is placed on the brazing material, it is possible to prevent the brazing material from moving and being displaced. The joint position of the electric component with respect to the substrate can be prevented from shifting. Further, the invention according to claim 3 of the present invention comprises a substrate provided with a circuit pattern and an electric component joined to the substrate through a metal fitting coated with a brazing material, so that the brazing material can be printed on the substrate by printing. The thickness of the brazing material can be made constant more easily than by coating, and the supply amount of the brazing material can be easily controlled.

According to a fourth aspect of the present invention, in manufacturing a circuit board having electric components on the board,
The board is provided with a brazing material-coated metal fitting, and the brazing material is brought into contact with the electrical component, and the brazing material is irradiated with a beam to melt the brazing material and bond the electrical component to the substrate. It is possible to make the thickness of the brazing material constant more easily than when the above is applied to the substrate, and it is possible to easily control the supply amount of the brazing material.

Further, in the invention according to claim 5 of the present invention, since the recess or the protrusion is provided with the metal member coated with the brazing material and the electric component is joined to the substrate through the metal member, By providing the metal fitting on the convex portion, the metal fitting can be easily positioned, and the joining position of the electric component joined to the board by the metal fitting with respect to the board can be prevented from being displaced. In addition, the metal fitting will be inserted into the concave or convex portion and locked,
Therefore, when the electric component is placed on the metal fitting, it is possible to prevent the metal fitting from moving and causing a positional shift, and it is possible to prevent the joining position of the electric component with respect to the substrate from shifting. Further, the thickness of the brazing material can be made constant more easily than when the brazing material is applied to the substrate by printing, and the supply amount of the brazing material can be easily controlled.

According to a sixth aspect of the present invention, in manufacturing a circuit board having electrical components on the board,
Since the metal fitting coated with the brazing material is provided in the concave portion or the convex portion, the metal fitting can be easily positioned by providing the metal fitting in the concave portion or the convex portion of the board. The bonding position with respect to the substrate can be prevented from shifting. In addition, the metal fitting will be inserted into the concave or convex portion and locked,
Therefore, when the electric component is placed on the metal fitting, it is possible to prevent the metal fitting from moving and causing a positional shift, and it is possible to prevent the joining position of the electric component with respect to the substrate from shifting. Further, the thickness of the brazing material can be made constant more easily than when the brazing material is applied to the substrate by printing, and the supply amount of the brazing material can be easily controlled.

Further, in the invention according to claim 7 of the present invention, since the beam is irradiated while the electric component is held by the metal fitting coated with the brazing material, the positioning at the time of mounting the electric component by the metal fitting can be easily performed. In addition, it is possible to prevent the joint position of the electric component joined to the substrate by the metal fitting from being displaced from the substrate. In the invention according to claim 8 of the present invention, the metal fitting coated with the brazing material is given a spring property, and the beam is emitted while holding the electric component by the metal fitting, so that the metal fitting is elastically contacted with the electric component. By holding it, the metal parts can be stably held by the metal fitting so as not to shift the joining position of the electric components.

According to the ninth aspect of the present invention, since the electric component is held by the metal fitting so as not to move along the surface of the substrate, the joint position of the electric component should not be displaced along the surface of the substrate. Is something that can be. According to the tenth aspect of the present invention, since the electric component is held by the metal fitting so as not to move in the direction away from the surface of the substrate, the joining position of the electric component is prevented from shifting in the direction away from the surface of the substrate. Is what you can do.

Further, the invention according to claim 11 of the present invention is
Since a plurality of concave portions or convex portions are provided on the substrate to form a concave portion group or a convex portion group, and a brazing material is provided on each concave portion or each convex portion, it is possible to bond an electric component to the substrate with a plurality of brazing materials. Therefore, the bonding strength of the electric component to the substrate can be increased. Further, the electric component can be held by a plurality of brazing materials, and the positioning of the electric component with respect to the substrate can be improved.

The invention according to claim 12 of the present invention is
Since the resin member was coated with a brazing material and the beam was irradiated while holding the electric component with the resin member, by attaching the socket to the concave or convex portion of the substrate while holding the entire electric component in the socket By the work of mounting the socket on the board, the electric component can be arranged on the board at the same time, and the handling of the electric component when mounting the electric component on the board can be facilitated. Further, by holding the whole of the electric component in the socket, the electric component can be securely held in close contact with the socket and the electric component can be held in the socket, and the bonding strength of the electric component to the substrate can be made high and stable. In addition, the electric parts can be prevented from being displaced by being restrained by the socket.

The invention according to claim 13 of the present invention is
Since the socket was formed by combining the metal parts coated with the brazing material and the resin member, and the beam was emitted while holding the electrical parts in the socket, the socket was held in the recess of the substrate or the whole of the electrical parts. By mounting the socket on the board, the electrical parts can be placed on the board at the same time by attaching the socket to the board, and the handling of the electric parts when mounting the electrical parts on the board can be facilitated. is there. Further, by holding the whole of the electric component in the socket, the electric component can be securely held in close contact with the socket and the electric component can be held in the socket, and the bonding strength of the electric component to the substrate can be made high and stable. In addition, the electric parts can be prevented from being displaced by being restrained by the socket.

The invention according to claim 14 of the present invention is
Since the metal part coated with the brazing material is provided with the flange part and the beam is irradiated to the flange part, the irradiation area of the beam can be enlarged, and the allowable amount of the irradiation position deviation is increased. It is possible to make it difficult to irradiate the beam on the substrate and prevent damage to the electric components and the substrate.

Further, the invention according to claim 15 of the present invention is
Since the mark formed on the metal fitting coated with the brazing material is detected and the beam is irradiated toward the mark, it is possible to improve the accuracy of the irradiation position of the beam and make it difficult for the beam to be irradiated to the electric component or the substrate. It is possible to prevent the electric parts and the board from being damaged. Further, according to the sixteenth aspect of the present invention, since the beam irradiation portion is formed in a shape that easily absorbs the beam, the beam absorption efficiency of the brazing material can be increased, and the amount of the beam can be reliably reduced. The component and the substrate can be joined together.

The invention according to claim 17 of the present invention is
When manufacturing a circuit board having electrical components on the substrate, a brazing material is provided on the substrate, the electrical components are brought into contact with the brazing material, and a pulse beam of 1 ms or more and 100 ms or less is applied only to the brazing material in an inert gas atmosphere. Irradiate at least single pulse or multiple pulses to melt the brazing filler metal and bond the electrical parts to the substrate with the brazing filler metal, so that the brazing filler metal is irradiated with the beam in an inert gas atmosphere and the beam irradiation is performed in a short time. As a result, it is possible to prevent oxidation of the brazing filler metal and electrodes, which eliminates the need to include a flux component in the brazing filler metal, and enables fluxless bonding. Since there is no scattering, there is no need to clean the board after joining the electrical parts, and soldering due to the scattering of flux and solder It is capable to make good does not occur.

The invention according to claim 18 of the present invention is
Since at least one of the concave portion and the convex portion is formed on the substrate and the brazing material is provided on the concave portion or the convex portion, the brazing material can be easily positioned by providing the brazing material on the concave portion or the convex portion of the substrate. It is possible to prevent the joint position of the electric component joined to the substrate by the brazing material from being displaced. Further, the brazing material is inserted into and locked in the concave portion or the convex portion, so that when the electric component is placed on the brazing material, it is possible to prevent the brazing material from moving and being displaced. The joint position of the electric component with respect to the substrate can be prevented from shifting.

The invention according to claim 19 of the present invention is
Since the metal fitting coated with the brazing material is provided on the substrate as the brazing material, it is possible to make the thickness of the brazing material more constant than when applying the brazing material to the substrate by printing, and it is easy to control the supply amount of the brazing material. It can be done. In the invention according to claim 20 of the present invention, since at least one of the concave portion and the convex portion is formed on the substrate and the metal fitting coated with the brazing material is provided on the concave or convex portion, By providing the metal fitting, the metal fitting can be easily positioned, and the fitting position of the electric component, which is joined to the board by the metal fitting, with respect to the board can be prevented from being displaced. Further, the metal fitting is inserted into and locked in the concave portion or the convex portion, so that when the electric component is placed on the metal fitting, it is possible to prevent the metal fitting from moving and causing a positional shift, and The bonding position with respect to the substrate can be prevented from shifting. The thickness of the brazing material can be made constant more easily than when the brazing material is applied to the substrate by printing, and the supply amount of the brazing material can be easily controlled.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a circuit board provided with an electric component of the present invention.

FIG. 2 is a cross-sectional view showing a joint structure of the above electric component.

3A is a cross-sectional view showing an embodiment of a method for manufacturing a circuit board including the same electric component, and FIG. 3B is a cross-sectional view.
(C) is a sectional view.

FIG. 4A is a plan view showing the same substrate, FIG. 4B is a sectional view of FIG. 4A, and FIG. 4C is a plan view showing another substrate.
(D) is a sectional view of (c), (e) is a plan view showing another substrate, (f) is a sectional view of (e), (g) is a plan view showing another substrate, and (h) is. It is sectional drawing of (g).

FIG. 5A is a sectional view showing another embodiment of the above.
(B) is sectional drawing, (c) is sectional drawing.

6A is a plan view showing the same substrate, FIG. 6B is a sectional view of FIG. 6A, and FIG. 6C is a plan view showing another substrate;
(D) is a sectional view of (c).

FIG. 7 is a cross-sectional view showing another joint structure of the above electric component.

FIG. 8A is a sectional view showing another embodiment of the above,
(B) is sectional drawing, (c) is sectional drawing.

FIG. 9 is a cross-sectional view showing still another joint structure of the electric component of the above.

10A is a sectional view showing another embodiment of the above, FIG. 10B is a sectional view, and FIG. 10C is a sectional view.

11A is a cross-sectional view showing another embodiment of the above, and FIG. 11B is a plan view.

FIG. 12 (a) is a sectional view showing another embodiment of the above, and FIG. 12 (b) is a plan view.

FIG. 13 is a sectional view showing another embodiment of the above.

14A is a plan view of the electric component of the above, FIG. 14B is a plan view showing another embodiment of the above, and FIG. 14C is a sectional view.

15A is a plan view of an electric component, FIG. 15B is a plan view showing another embodiment of the same, and FIG. 15C is a side view.

16A is a sectional view showing another embodiment of the above, and FIG. 16B is a sectional view.

17A is a plan view showing another embodiment of the above, and FIG. 17B is a plan view.

FIG. 18 is a sectional view showing another embodiment of the above.

FIG. 19 (a) is a side view showing another embodiment of the above, and FIG. 19 (b) is a plan view.

20A is a side view showing another embodiment of the above, and FIG. 20B is a plan view.

FIG. 21 is a perspective view showing another embodiment of the above.

FIG. 22 is a perspective view showing another embodiment of the above.

FIG. 23 is a perspective view showing another embodiment of the above.

FIG. 24 (a) is a cross-sectional view showing another embodiment of the above, and FIG. 24 (b) is a plan view.

25A is a plan view of an electric component, FIG. 25B is a plan view showing another embodiment of the same, and FIG. 25C is a sectional view.

26A is a plan view of an electric component, FIG. 26B is a plan view showing another embodiment of the same, and FIG. 26C is a sectional view.

27A is a plan view showing a substrate, FIG. 27B is a sectional view showing the substrate, and FIG. 27C is a plan view showing another embodiment of the same.

28A is a side view showing a resin member, FIG. 28B is a side view showing a socket, and FIG. 28C is a sectional view showing another embodiment of the same.

FIG. 29 is a back view showing another embodiment of the above.

30 is a partial cross-sectional view showing the embodiment of FIG. 29 above.

31A is a sectional view showing a metal fitting, FIG. 31B is a sectional view showing a socket, and FIG. 31C is a sectional view showing another embodiment of the same.

32A is a side view showing a resin member, FIG. 32B is a sectional view showing a socket, and FIG. 32C is a sectional view showing another embodiment of the same.

FIG. 33 (a) is a sectional view showing another embodiment of the above, and FIG. 33 (b) is a sectional view.

34A is a sectional view showing a part of a metal fitting, and FIG. 34B is a sectional view showing a part of another metal fitting.

35A is a sectional view showing a part of a metal fitting, FIG. 35B is a sectional view showing a part of another metal fitting, and FIG. 35C is a sectional view showing a part of another metal fitting.

36A is a sectional view showing another embodiment of the above, FIG. 36B is a sectional view, and FIG. 36C is a sectional view.

37A is a sectional view showing another embodiment of the above, FIG. 37B is a sectional view, and FIG. 37C is a sectional view.

38A is a sectional view showing another embodiment of the above, FIG. 38B is a sectional view, and FIG. 38C is a sectional view.

FIG. 39 (a) is a sectional view showing another embodiment of the above, FIG. 39 (b) is a sectional view, and FIG. 39 (c) is a sectional view.

40A is a sectional view showing a conventional example, FIG. 40B is a plan view of FIG. 40A, FIG. 40C is a sectional view showing another conventional example,
(D) is a top view of (c).

[Explanation of symbols]

 1 substrate 2 convex part 3 concave part 4 brazing material 5 electric part 6 beam 7 metal fittings 8 inert gas 9 socket 9a resin member 10 flange part 11 mark 13 circuit pattern

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[Procedure amendment]

[Submission date] October 2, 1995

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction contents]

As described above, in this embodiment, the substrate 1
Since the metal fitting 7 is provided on the substrate 1 by inserting the insertion portion 17 of the metal fitting 7 into the concave portion 2, the metal fitting 7 can be easily positioned, so that the joining position of the electric component 5 to the substrate 1 does not shift. You can Further, the insertion portion 17 of the metal fitting 7 is inserted into and locked in the recess 2, so that when the electric component 5 is placed on the metal fitting 7, the metal fitting 7 should not move and be displaced. You can Further, since the metal fitting 7 is not melted by the irradiation of the beam 6, the metal fitting 7 can support the electric component 5,
It can be Rukoto so is not bonded to the metal fitting 7 shifted electrical components 5. Further, since the beam 6 irradiates only the metal fitting 7, heat is less likely to be transmitted to the electric component 5 and the substrate 1, and the beam 6 can prevent the electric component 5 and the substrate 1 from being damaged. In addition, since the thickness of the brazing material 4 can be controlled more easily by the coating treatment such as plating than the conventional screen printing, it is possible to easily control the supply amount of the brazing material 4 at a constant amount.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0061

[Correction method] Change

[Correction contents]

FIG. 21 shows another embodiment of a method of manufacturing a circuit board having electric parts. In the metal fitting 7 of this embodiment, a plate-shaped bottom portion 18, a support portion 20 projectingly provided on the upper surface of the bottom portion 18, and a pressing piece 26 projecting to the side opposite to the bottom portion 18 are provided at the upper end of the support portion 20. Yes formed in a substantially S-shaped, more to the back surface of the bottom portion 18 is provided insertion portion (not shown). The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0064

[Correction method] Change

[Correction contents]

FIG. 22 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 according to this embodiment includes a plate-shaped bottom portion 18, a support portion 20 projecting from the upper surface of the bottom portion 18, a pressing piece 26 protruding from the upper end of the support portion 20 to the side opposite to the bottom portion 18, and a supporting piece. Yes formed by the abutting piece 25 provided on both sides of the section 20, further on the back surface of the bottom portion 18 is provided insertion portion (not shown). The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0067

[Correction method] Change

[Correction contents]

FIG. 23 shows another embodiment of a method of manufacturing a circuit board having electric parts. The metal fitting 7 of this embodiment includes a holding piece 26, a holding piece 27 formed at both ends of the holding piece 26 so as to project downward, and a bottom portion provided at the end of each holding piece 27 so as to project outward. 18 Yes formed by, more to the back surface of the bottom portion 18 is provided insertion portion (not shown). The metal fitting 7 is formed by coating with the brazing material 4 by the method described above.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0085

[Correction method] Change

[Correction contents]

FIG. 29 shows a multi-socket 40 formed by integrating a plurality of the sockets 9 shown in FIG.
Is shown. The multi-socket 40 has a plurality of accommodating portions 30 formed on the lower surface of a flat plate-shaped resin member 9a. In addition, an insertion portion 19 that projects to the lower surface is provided at the opening edge portion of the storage portion 30. The resin member 9 are subjected is coated by cormorants wood 4 Iro except the joint portion of the portions between adjacent peripheral piece 31 other than the substantially central portion of the housing portion 30.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0087

[Correction method] Change

[Correction contents]

[0087] Multi-source in this embodiment as described above
A large number of electric components 5 can be held on the board 40 and attached to the substrate 1, and the electric components 5 can be multi-layered. FIG. 31 shows another embodiment of a method of manufacturing a circuit board having electric components. As shown in FIG. 31 (a), the metal fitting 7 of this embodiment has a plate-shaped bottom portion 18, a support portion 20 projecting from the upper surface of the bottom portion 18, and an upper end of the support portion 20 on the opposite side of the bottom portion 18. A protruding pressing piece 26 is provided to have a substantially S-shaped cross section, and the bottom portion 1
8 is provided with an insertion portion 19 on the back surface and a pressing piece 26.
A fitting piece 33 is projectingly provided at the tip of the. The metal fitting 7 is formed by coating with the brazing material 4 by the method described above. Further, the resin member 9a of this embodiment is formed in a plate shape, and fitting recesses 34 are provided on both side surfaces thereof. Then, by inserting the fitting pieces 33 into the fitting recesses 34 and attaching the metal fittings 7 to both sides of the resin member 9a,
A socket 9 as shown in FIG. 31B is formed, and the socket 9 has a supporting portion 20, a pressing piece 26, and a resin member 9a.
A storage portion 30 is formed which is surrounded by and is opened downward.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0096

[Correction method] Change

[Correction contents]

FIG. 34 shows another embodiment of a method of manufacturing a circuit board having electric parts. In the flange portion 10 of the fitting 7 in Fig. 3 3 In this embodiment, the mark 11 on the portion serving as the irradiation area of the beam 6 is provided. The mark 11 may be any mark as long as it can be monitored by a camera. For example, a mark as shown in FIG. 34 (a), a recess as shown in FIG. 34 (b), a protrusion, or a mark having a specific shape. Etc. can be used.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

FIG. 35 shows another embodiment of a method of manufacturing a circuit board provided with electric parts. In the brazing material 4 in this embodiment for covering the flange portion 10 or the flange portion 10 of the fitting 7 in Fig. 3 3, the uneven surface 12 on the portion serving as the irradiation area of the beam 6 is provided. The uneven surface 12 may be any as long as it can reflect the beam 6 multiple times or can increase the surface area of the irradiation area. For example, a V-shaped scratch or a figure as shown in FIG. 35 (b), or a mountain-shaped protrusion 12a and a V-shaped scratch 12b as shown in FIG. 35 (c) can be formed repeatedly.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0103

[Correction method] Change

[Correction contents]

As described above, in this embodiment, by irradiating the brazing material 4 with the beam 6 in the atmosphere of the inert gas 8 and irradiating the beam 6 in a short time, the brazing material 4 and the electrode portion 14 are irradiated. Can be prevented, and it becomes unnecessary to add a flux component to the brazing material 4. And because fluxless bonding is possible in this way ,
In which it is not necessary to clean the substrate 1 after the bonding of electrical components 5.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0107

[Correction method] Change

[Correction contents]

As described above, in this embodiment, the brazing material 4 is irradiated with the beam 6 in the atmosphere of the inert gas 8 and the irradiation of the beam 6 is performed in a short time, whereby the brazing material 4 and the electrode portion 14 are irradiated. Can be prevented, and it becomes unnecessary to add a flux component to the brazing material 4. And because fluxless bonding is possible in this way ,
In which it is not necessary to clean the substrate 1 after the bonding of electrical components 5. Further, since the insertion portion 15 of the brazing material 4 is inserted into the concave portion 2 of the substrate 1 to provide the brazing material 4 on the substrate 1, the brazing material 4 can be easily positioned, so that the electric component 5 with respect to the substrate 1 can be positioned. It is possible to prevent the joining position of the. Further, the insertion portion 15 of the brazing material 4 is inserted and locked in the recessed portion 2, so that when the electric component 5 is placed on the brazing material 4, the brazing material 4 does not move and the position is displaced. Can be

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0110

[Correction method] Change

[Correction contents]

As described above, in this embodiment, since the beam 6 is applied only to the metal fitting 7, it is difficult for heat to be transferred to the electric component 5 and the substrate 1, and the beam 6 does not damage the electric component 5 and the substrate 1. Can be Since towards the coating process such as screen printing by Rimomekki the conventional example easy to manage the thickness of the brazing material 4, it is possible to easily manage the supply amount of the brazing material 4 to a predetermined amount. In addition, the beam 6 is applied to the brazing material 4 in the atmosphere of the inert gas 8.
By irradiating the same and irradiating the beam 6 in a short time, it is possible to prevent the brazing material 4 and the electrode portion 14 from being oxidized, and it becomes unnecessary to contain a flux component in the brazing material 4. And since this way it is possible to fluxless bonding, but is unnecessary to clean the substrate 1 after the bonding of electrical components 5.

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0114

[Correction method] Change

[Correction contents]

Further, in the atmosphere of the inert gas 8, the brazing material 4
By irradiating the beam 6 with the beam 6 and irradiating the beam 6 in a short time, it is possible to prevent the brazing material 4 and the electrode portion 14 from being oxidized, and the brazing material 4 does not need to contain a flux component. And since this way it is possible to fluxless bonding, electrostatic substrate 1 after the bonding of the gas components 5
This eliminates the need for washing.

[Procedure amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0127

[Correction method] Change

[Correction contents]

The invention according to claim 17 of the present invention is
When manufacturing a circuit board having electric components on a substrate, a brazing material is provided on the substrate, the electric components are brought into contact with the brazing material, and a pulse beam of 1 ms or more and 100 ms or less is applied only to the brazing material in an inert gas atmosphere. Irradiate at least one pulse or multiple pulses to melt the brazing material and bond the electrical parts to the substrate with the brazing material, so that the brazing material is irradiated with the beam in an inert gas atmosphere and the beam irradiation is performed in a short time. by, it is possible to prevent oxidation of the brazing material and the electrode unit, thus it unnecessary to incorporate a flux component enables fluxless bonding the brazing material, it is not necessary to clean the substrate after bonding the electrical components In addition, it is possible to prevent defective soldering due to the scattering of flux and solder.

 ────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yoshimitsu Nakamura 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (20)

[Claims] 1. A substrate provided with a circuit pattern, in which at least one of a concave portion and a convex portion is formed around a joint portion of an electric component, a brazing material provided in the concave portion or the convex portion, and a substrate made of a brazing material. A circuit board provided with an electric component, the electric circuit being provided with an electric component to be joined. 2. When manufacturing a circuit board having an electric component on a substrate, at least one of a concave portion and a convex portion is formed on the substrate and a brazing material is provided on the concave portion or the convex portion, and the electric component is brought into contact with the brazing material. At the same time, the brazing material is irradiated with a beam to melt the brazing material, and the electric component is bonded to the substrate with the brazing material. 3. A circuit board provided with an electric part, comprising a board provided with a circuit pattern and an electric part joined to the board via a metal fitting coated with a brazing material. 4. When manufacturing a circuit board having an electric component on a substrate, a metal fitting coated with a brazing material is provided on the substrate, the electric component is brought into contact with the brazing material, and the brazing material is irradiated with a beam to form the brazing material. A method of manufacturing a circuit board having an electric component, which comprises melting and joining the electric component to the substrate with a brazing material. 5. The electrical component according to claim 1, further comprising an electrical component which is provided with a brazing material coated on the concave portion or the convex portion and which is joined to the substrate through the metallic component. Circuit board. 6. A circuit board provided with an electric component according to claim 2, wherein when manufacturing a circuit board provided with an electric component on the board, a metal member coated with a brazing material is provided in a concave portion or a convex portion. Manufacturing method. 7. A method of manufacturing a circuit board having an electric component according to claim 6, wherein the beam is irradiated while the electric component is held by a metal member coated with a brazing material. 8. A circuit board provided with an electric component according to claim 7, wherein the metal member coated with a brazing material is provided with a spring property, and the metal member is irradiated with a beam while holding the electric component. Production method. 9. The method for manufacturing a circuit board having an electric component according to claim 7, wherein the electric component is held by a metal fitting so as not to move along the surface of the substrate. 10. The method for manufacturing a circuit board having an electric component according to claim 7, wherein the electric component is held by a metal fitting so as not to move in a direction away from the surface of the substrate. 11. The electrical equipment according to claim 2, wherein the substrate is provided with a plurality of concave portions or convex portions to form a concave portion group or a convex portion group, and a brazing material is provided in each concave portion or each convex portion. A method for manufacturing a circuit board including components. 12. The method for manufacturing a circuit board having an electric component according to claim 2, wherein the resin member is coated with a brazing material, and the beam is irradiated while the electric member is held by the resin member. . 13. The electrical component according to claim 2, wherein a bracket coated with a brazing material and a resin member are combined to form a socket, and the beam is emitted while the electrical component is held by the socket. Circuit board manufacturing method. 14. The method for manufacturing a circuit board having an electric component according to claim 4, wherein the metal fitting coated with a brazing material is provided with a flange portion and the flange portion is irradiated with a beam. 15. The method for manufacturing a circuit board having an electric component according to claim 14, wherein a mark formed on a metal member coated with a brazing material is detected and a beam is irradiated toward the mark. 16. The method for manufacturing a circuit board having an electric component according to claim 14, wherein the irradiation portion of the beam is formed into a shape that easily absorbs the beam. 17. When manufacturing a circuit board having an electric component on the substrate, a brazing material is provided on the substrate and the electric component is brought into contact with the brazing material, and only the brazing material is 1 ms or more and 100 ms or less in an inert gas atmosphere. The method for manufacturing a circuit board having an electric component, comprising: irradiating a pulsed beam of at least a single pulse or a plurality of pulses to melt the brazing filler metal and joining the electric component to the substrate with the brazing filler metal. 18. The method of manufacturing a circuit board having an electric component according to claim 17, wherein at least one of a concave portion and a convex portion is formed on the substrate and a brazing material is provided on the concave portion or the convex portion. 19. The method for manufacturing a circuit board having an electric component according to claim 17, wherein a metal member coated with a brazing material is used as the brazing material. 20. A circuit board having an electric component according to claim 17, wherein at least one of a concave portion and a convex portion is formed on the substrate, and a metal fitting coated with a brazing material is provided on the concave portion or the convex portion. Production method.