CN110634777B - Device and method for realizing atmosphere protection airtight packaging of electronic component - Google Patents
Device and method for realizing atmosphere protection airtight packaging of electronic component Download PDFInfo
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- CN110634777B CN110634777B CN201910926685.5A CN201910926685A CN110634777B CN 110634777 B CN110634777 B CN 110634777B CN 201910926685 A CN201910926685 A CN 201910926685A CN 110634777 B CN110634777 B CN 110634777B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The invention discloses a device and a method for realizing atmosphere protection airtight packaging of an electronic assembly, and the device comprises a supporting platform and a back plate, wherein the lower end of the supporting platform is provided with a pressure display, the upper end of the supporting platform is provided with a lower electrode seat, a pressure sensor is arranged between the lower electrode seat and the supporting platform, the top of the lower electrode seat is provided with an air hood, a lower electrode is arranged in the air hood, the lower end of the lower electrode is connected with the lower electrode seat, and the upper end of the lower electrode is provided with a shell positioning groove; the back plate is fixed with a sliding guide rail, the sliding guide rail is provided with a cylinder moving part, the upper end of the cylinder moving part is connected with a double-stroke cylinder, the lower end of the cylinder moving part is connected with an upper electrode seat, the lower end of the upper electrode seat is connected with an upper electrode, and the lower end of the upper electrode is provided with a cover plate positioning groove; the bottom of the cylinder moving part is connected with an air cover cap. The invention can ensure that the device is packaged in the required atmosphere in the process of carrying out airtight packaging on the device, and can ensure that the cavity of the packaged device is filled with the required gas, so that the chip and the circuit in the device are protected in the special atmosphere.
Description
Technical Field
The invention belongs to the technical field of electronic component airtight packaging, and particularly relates to a device and a method for realizing atmosphere protection airtight packaging of an electronic component.
Background
With the development of science and technology, microelectronic devices have been widely used in various harsh environments such as outer space and deep ocean and the like. For such devices, increasingly stringent quality requirements are imposed by users, particularly for bare chip assembled circuits, and users have drawn general attention to the quality and long-term reliability requirements of the devices. In order to ensure the long-term reliability of the electronic device during use and improve the service life of the electronic device, it is necessary to perform hermetic packaging (commonly called capping) after the assembly of the chip and the circuit is completed in the device, so as to ensure that the chip and the circuit inside are not affected by the external environment. For devices used in military industry and aviation, the internal circuit of the device needs to be protected in a nitrogen environment, so that the electronic device not only needs to meet the requirement of air tightness, but also needs to be filled with nitrogen. The quality of the hermetic package has a great influence on the quality of the entire device, and research on the hermetic package is continuously conducted both domestically and abroad.
In the existing technology of electronic component airtight packaging, resistance welding has the advantages of high connection strength, short welding time, high air tightness, high yield and the like, resistance energy storage welding is one of the more ideal modes for metal tube shell electronic component airtight packaging, but the resistance welding can melt base metal in the packaging process, and a coating on the surface of an electronic component can be damaged, so that the corrosion resistance of the electronic component is reduced, and the performance and the service life of the electronic component are reduced. Soldering is also a common hermetic packaging method, has the advantages of high yield, small thermal shock and the like, and does not influence a base material and a device plating layer because the temperature in the soldering process is low (soldering is lower than 450 ℃). However, soldering uses integral heating to melt solder, and the chip and circuit inside the electronic component may be heated and cooled, which may cause performance and life degradation, and the efficiency of hermetic packaging is also low. In addition, some electronic components need to be subjected to airtight packaging in a special atmosphere, special gas is filled in a cavity of a packaged device, the airtight packaging is protected in the atmosphere by using a resistance welding and brazing method, airtight packaging needs to be performed in the atmosphere by using closed equipment such as a glove box, the equipment cost is increased, the occupied space of the equipment is increased, and the operation difficulty in the glove box is high.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a device and a method for realizing atmosphere protection airtight packaging of an electronic assembly. In addition, the device can be ensured to be carried out under the required atmosphere in the process of carrying out airtight packaging on the device, and the cavity of the packaged device can be ensured to be filled with the required gas, so that the chip and the circuit in the device are protected under the special atmosphere.
The purpose of the invention can be realized by the following technical scheme.
The device for realizing the atmosphere protection airtight packaging of the electronic assembly comprises a supporting platform, wherein a back plate is vertically arranged on the supporting platform, a pressure display instrument is arranged on the lower end surface of the supporting platform, a lower electrode holder is arranged on the upper end surface of the supporting platform, a pressure sensor connected with the pressure display instrument is arranged between the lower electrode holder and the supporting platform, an air hood with an opening at the upper end is arranged at the top end of the lower electrode holder, a lower electrode is arranged in the air hood, the lower end of the lower electrode is fixedly connected with the lower electrode holder, and a shell positioning groove for fixing a metal shell is arranged at the upper end of the lower electrode;
a sliding guide rail is fixed on the back plate, an air cylinder moving part is arranged on the sliding guide rail, the air cylinder moving part is matched with the sliding guide rail in a longitudinal sliding mode, the upper end of the air cylinder moving part is connected with a double-stroke air cylinder, the lower end of the air cylinder moving part is connected with an upper electrode base, the lower end of the upper electrode base is connected with an upper electrode, and a cover plate positioning groove for fixing a cover plate is formed in the lower end of the upper electrode; the bottom of the cylinder moving part is connected with an air cover through a spring, the air cover is positioned between the upper electrode seat and the air cover, and the middle of the air cover is provided with a through hole for the upper electrode to pass through.
The lower end and the side wall of the upper electrode are both provided with vacuum air suction ports.
And a telescopic guide post is arranged in the spring.
The upper electrode and the lower electrode are arranged along a coaxial line and are both connected with a power supply through cables.
The gas hood is provided with an air inlet and is made of transparent materials.
The purpose of the invention can be realized by the following technical scheme.
The invention discloses a method for realizing atmosphere protection airtight packaging of an electronic assembly, which comprises the following steps:
the first step is as follows: printing silver soldering paste on a cover plate by adopting a screen printing method, and printing the silver soldering paste into a 'Chinese character hui' pattern;
the second step is that: installing the upper end of a lower electrode of the metal shell, and positioning by utilizing a shell positioning groove on the end surface of the electrode;
the third step: the mounting cover plate is arranged at the lower end of the upper electrode, the positioning is carried out by utilizing a cover plate positioning groove on the end surface of the electrode, at the moment, the air suction pump is opened, and the cover plate is firmly adsorbed on the lower end surface of the upper electrode by utilizing the vacuum air suction port;
the fourth step: when a switch button is pressed, the electromagnetic valve is electrified, the double-stroke cylinder is pressed down for a first stroke, the gas cover moves down along with the upper electrode to be in contact with the gas cover, the gas cover is closed, and the electromagnetic valve controls the needed gas to be introduced and starts to inflate the gas cover;
the fifth step: through the control of a time relay, when the inflation time reaches a set value, the double-stroke cylinder presses down for a second stroke, the silver soldering paste on the lower end face of the cover plate is contacted with the metal shell, and when a set pressure value is displayed on the pressure display instrument, the upper electrode stops pressing down;
and a sixth step: the silver soldering paste is sintered by power discharge, the encapsulation is completed, and the double-stroke cylinder resets
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
(1) compared with the method adopting silver soldering paste current sintering, good connection can be formed only by reaching the temperature (generally higher than 200 ℃) required by silver soldering paste densification sintering in the packaging process, the plating layer of a device cannot be melted, and the corrosion resistance of the electronic component is not influenced. The brazing airtight packaging process is characterized in that brazing filler metal between the cover plate and the metal tube shell is melted through overall heating of the electronic assembly, then the brazing filler metal is cooled and solidified to form a welding seam, the whole device can experience the same heating and cooling processes, and the internal chip connecting layer can be damaged. Silver paste current sintering hermetic packaging combines the advantages of resistance welding and solder packaging techniques and avoids their respective disadvantages.
(2) The resistance welding equipment designed by the invention can realize the packaging of electronic components under special atmosphere and ensure that the inside of the packaged components is filled with required gas to protect the internal chips and circuits.
(3) The existing resistance welding equipment can only realize the encapsulation under the required special atmosphere by adding a glove box on a machine. The glove box is added on the existing electric resistance welding equipment, the function of the glove box is not only to contain special gas, but also to provide an internal space capable of carrying out experiment operation, so that the volume of the glove box is larger, the occupied space of the equipment can be increased, and the operation difficulty in the glove box is larger. In the resistance welding equipment designed by the invention, the gas hood is arranged on the electrode holder, only plays a role of accommodating special gas and does not need to be operated in the electrode holder, so that the volume of the resistance welding equipment is smaller, and the occupied space of the equipment is not increased, as shown in figure 2. The electric resistance welding airtight packaging equipment designed by the invention is simple to operate manually, and the operation difficulty is reduced.
(4) According to the invention, the gas hood is added on the electrode base, and when the cylinder is pressed down for a first stroke, the gas hood is closed, so that a device can be packaged in a special atmosphere.
(5) The vacuum air suction port is arranged on the upper electrode, and the cover plate can be adsorbed under the action of the air suction pump, so that the cover plate can move along with the up-and-down movement of the upper electrode. After the double-stroke cylinder is pressed down for the first stroke, the cover plate is not in contact with the metal shell, and after all the gas in the metal shell cavity in the gas hood is required, the cylinder is pressed down for the second stroke, so that the silver soldering paste printed on the cover plate is in contact with the metal shell and electrified for packaging. The packaged device is ensured to be filled with required special gas to protect the internal chip and the circuit.
Drawings
Fig. 1 is a schematic view of an electronic assembly to be hermetically sealed under a special atmosphere according to the present invention.
Fig. 2 is an overall effect diagram of the present invention, (a) a front view, and (b) a side view.
Fig. 3 is a schematic diagram of the electrodes of the resistance welding device designed by the invention, (a) an upper electrode, and (b) a lower electrode.
Fig. 4 is a schematic diagram of screen printing.
Fig. 5 is a solder paste pattern on the cap plate.
FIG. 6 is a schematic view of electric current sintering.
Reference numerals are as follows: the device comprises a cover plate 1, a metal shell 2, a double-stroke cylinder 3, a cylinder moving part 4, a sliding guide rail 5, an electrode holder on the electrode holder 6, a spring 7, an air cover 8, an air cover 9, a lower electrode holder 10, a pressure sensor 11, a pressure display 12, an upper electrode 13, a lower electrode 14, a vacuum suction port 15, a back plate 16, a cover plate positioning groove 17, a shell positioning groove 18, a silk screen plate 19, silver soldering paste 20, a supporting platform 21 and a scraper 22.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 2 and fig. 3, the apparatus for realizing atmosphere protection and airtight packaging of an electronic component according to the present invention includes a supporting platform 21, a back plate 16 is vertically disposed on the supporting platform 21, a pressure display 12 is disposed on a lower end surface of the supporting platform 21, a lower electrode holder 10 is disposed on an upper end surface of the supporting platform 21, a pressure sensor 11 connected to the pressure display 12 is disposed between the lower electrode holder 10 and the supporting platform 21, and the pressure display 12 is configured to measure a pressure of an electrode on a workpiece. The top end of the lower electrode holder 10 is provided with an air hood 9 with an opening at the upper end, a lower electrode 14 is arranged in the air hood 9, the lower end of the lower electrode 14 is fixedly connected with the lower electrode holder 10, and the upper end of the lower electrode 14 is provided with a shell positioning groove 18 for fixing the metal shell 2. The gas hood 9 is provided with an air inlet, the gas hood 9 is made of transparent materials, and the process of packaging electronic components in the gas hood 9 is convenient to observe.
The back plate 16 is fixed with a sliding guide rail 5, the sliding guide rail 5 is provided with a cylinder moving part 4, the cylinder moving part 4 is matched with the sliding guide rail 5 in a longitudinal sliding mode, the upper end of the cylinder moving part 4 is connected with a double-stroke cylinder 3, the lower end of the cylinder moving part is connected with an upper electrode base 6 through a screw, the lower end of the upper electrode base 6 is connected with an upper electrode 13, and the lower end of the upper electrode 13 is provided with a cover plate positioning groove 17 for fixing a cover plate 1. The double-stroke cylinder 3 is used as power, and the double-stroke cylinder 3 is matched with the sliding guide rail 5, so that the upper electrode 13 can accurately move. The bottom of the cylinder moving part 4 is connected with an air cover 8 through a spring 7, the air cover 8 is positioned between the upper electrode seat 6 and the air cover 9, and the middle part of the air cover 8 is provided with a through hole for the upper electrode 13 to pass through. Wherein, the lower end and the side wall of the upper electrode 13 are provided with a vacuum air suction port 15. And a telescopic guide pillar is arranged in the spring 7. The upper electrode 13 and the lower electrode 14 are arranged along a coaxial line, the upper electrode 13 and the lower electrode 14 are both connected with a power supply through cables, and the power supply is used for electrifying the upper electrode 13 and the lower electrode 14 through the cables.
The cover plate 1 and the metal housing 2 of the electronic assembly shown in fig. 1 are hermetically sealed in a closed gas enclosure, ensuring that the device is sealed under a special atmosphere. The invention relates to a method for realizing atmosphere protection airtight packaging of an electronic component, which comprises the steps of using silver soldering paste 20 as a connecting material of a cover plate 1 and a metal shell 2, printing the silver soldering paste 20 on the cover plate 1 in advance, using a designed device to realize current sintering under atmosphere protection, completing the connection of the cover plate 1 and the metal shell 2, realizing the airtight packaging of the electronic component under the protection of special atmosphere, and ensuring that the interior of a packaged device is filled with required special gas to protect a chip and a circuit in the electronic component. The specific implementation process is as follows:
the first step is as follows: the silver solder paste 20 is printed on the cover plate 1 by a screen printing method and is printed in a ' Chinese character ' hui ' pattern. Specifically, the silver solder paste 20 is pushed by the scraper 22 to fill the meshes of the screen plate 19, and after printing is completed, the screen plate 19 is lifted off, so that a uniform printing pattern is formed on the cover plate 1, the screen printing schematic diagram is shown in fig. 4, and the printed pattern is in a shape of a Chinese character 'hui', as shown in fig. 5.
The second step: the upper end of the lower electrode 14 of the metal shell 2 is arranged and positioned by utilizing a shell positioning groove 18 on the end surface of the electrode.
The third step: the mounting cover plate 1 is arranged at the lower end of the upper electrode 13, the positioning is carried out by utilizing the cover plate positioning groove 17 on the end surface of the electrode, at the moment, the air suction pump is opened, the cover plate 1 is firmly adsorbed on the lower end surface of the upper electrode 13 by utilizing the vacuum air suction port 15, and the cover plate 1 moves along with the movement of the upper electrode 13.
The fourth step: when a switch button is pressed, the electromagnetic valve is electrified, the double-stroke cylinder 3 is pressed down for a first stroke, the air cover cap 8 moves downwards along with the upper electrode 13 to be in contact with the air cover 9, the air cover 9 is closed, and at the moment, the cover plate 1 is not in contact with the metal shell 2. After the gas hood 9 is closed, the electromagnetic valve controls the needed gas to be introduced through the gas inlet, and the gas is inflated into the gas hood 9.
The fifth step: through the control of the time relay, when the inflation time reaches a set value, after the gas hood 9 is filled with the required gas (the required gas is ensured to be completely in the cavity of the metal shell 2 in the gas hood 9), the double-stroke cylinder 3 is pressed downwards for a second stroke, the gas hood 8 is tightly pressed on the gas hood 9 through the action of the spring 7 and does not move continuously along with the upper electrode 13, the silver soldering paste 20 adsorbed on the lower end face of the cover plate 1 of the upper electrode 13 is contacted with the metal shell 2, and when the pressure display instrument 12 displays a set pressure value, the upper electrode 13 stops being pressed downwards.
And a sixth step: the power supply discharges to sinter the silver solder paste 20, the encapsulation is completed, and the double-stroke cylinder 3 resets, so that the cavity of the encapsulated electronic component is ensured to be filled with required gas to protect an internal chip and a circuit.
The silver solder paste 20 is used as a connecting material, and is connected in a sintering mode to complete airtight packaging, so that in the packaging process, the required temperature is far lower than the melting point (961.78 ℃) of silver, a connecting joint can be formed at the temperature of more than 200 ℃, and the gold plating layer of the electronic component is not damaged.
The current sintering is that the electrode, the workpiece and the silver soldering paste form a loop, when the current passes through, the silver soldering paste is sintered by using joule heat generated by the internal resistance of the electrode, the workpiece and the silver soldering paste and the contact resistance of the contact surface to form a connection joint, and the schematic diagram is shown as the attached figure 6.
While the present invention has been described in terms of its functions and operations with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise functions and operations described above, and that the above-described embodiments are illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope or spirit of the invention as defined by the appended claims.
Claims (2)
1. The method for realizing the atmosphere protection airtight packaging of the electronic component is characterized in that silver soldering paste (20) is used as a connecting material of a cover plate (1) and a metal shell (2), the silver soldering paste (20) is printed on the cover plate (1) in advance, current sintering is realized under atmosphere protection by using a device for realizing the atmosphere protection airtight packaging of the electronic component, the connection of the cover plate (1) and the metal shell (2) is completed, and the electronic component is realized to carry out airtight packaging under special atmosphere protection, and the method comprises the following specific steps:
the first step is as follows: printing silver soldering paste (20) on the cover plate (1) by adopting a screen printing method, and printing the silver soldering paste into a 'Chinese character hui' pattern;
the second step: the upper end of a lower electrode (14) of a metal shell (2) is arranged, and a shell positioning groove (18) on the end face of the electrode is used for positioning;
the third step: installing a cover plate (1) at the lower end of an upper electrode (13), positioning by using a cover plate positioning groove (17) on the end surface of the electrode, opening an air suction pump at the moment, and firmly adsorbing the cover plate (1) on the lower end surface of the upper electrode (13) by using a vacuum air suction port (15);
the fourth step: when a switch button is pressed, the electromagnetic valve is electrified, the double-stroke cylinder (3) is pressed down for a first stroke, the air cover cap (8) moves downwards along with the upper electrode (13) to be in contact with the air cover (9), the air cover (9) is sealed, and the electromagnetic valve controls the required gas to be introduced and starts to inflate the air cover;
the fifth step: under the control of a time relay, when the inflation time reaches a set value, the double-stroke air cylinder (3) is pressed down for a second stroke, the silver soldering paste (20) on the lower end face of the cover plate (1) is contacted with the metal shell (2), and when a set pressure value is displayed on the pressure display instrument (12), the upper electrode (13) stops pressing down;
and a sixth step: the silver soldering paste (20) is sintered by power discharge to complete packaging, and the double-stroke cylinder (3) is reset.
2. Method of realizing an atmosphere-protective, gas-tight encapsulation of an electronic component according to claim 1, the device for realizing the atmosphere protection airtight packaging of the electronic component comprises a supporting platform (21), a back plate (16) is vertically arranged on the supporting platform (21), a pressure display instrument (12) is arranged on the lower end surface of the supporting platform (21), a lower electrode seat (10) is arranged on the upper end surface of the supporting platform (21), a pressure sensor (11) connected with a pressure display instrument (12) is arranged between the lower electrode seat (10) and the supporting platform (21), the top end of the lower electrode seat (10) is provided with an air hood (9) with an opening at the upper end, a lower electrode (14) is arranged in the gas hood (9), the lower end of the lower electrode (14) is fixedly connected with a lower electrode seat (10), the upper end of the lower electrode (14) is provided with a shell positioning groove (18) for fixing the metal shell (2);
a sliding guide rail (5) is fixed on the back plate (16), the sliding guide rail (5) is provided with a cylinder moving part (4), the cylinder moving part (4) is matched with the sliding guide rail (5) in a sliding mode along the longitudinal direction, the upper end of the cylinder moving part (4) is connected with a double-stroke cylinder (3), the lower end of the cylinder moving part is connected with an upper electrode holder (6), the lower end of the upper electrode holder (6) is connected with an upper electrode (13), and the lower end of the upper electrode (13) is provided with a cover plate positioning groove (17) for fixing the cover plate (1); the bottom of the cylinder moving part (4) is connected with an air cover cap (8) through a spring (7), the air cover cap (8) is positioned between the upper electrode seat (6) and the air cover (9), and a through hole for the upper electrode (13) to pass through is formed in the middle of the air cover cap (8).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910926685.5A CN110634777B (en) | 2019-09-27 | 2019-09-27 | Device and method for realizing atmosphere protection airtight packaging of electronic component |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910926685.5A CN110634777B (en) | 2019-09-27 | 2019-09-27 | Device and method for realizing atmosphere protection airtight packaging of electronic component |
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| CN110634777A CN110634777A (en) | 2019-12-31 |
| CN110634777B true CN110634777B (en) | 2022-07-15 |
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| CN201910926685.5A Active CN110634777B (en) | 2019-09-27 | 2019-09-27 | Device and method for realizing atmosphere protection airtight packaging of electronic component |
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| CN116967673B (en) * | 2023-09-20 | 2023-12-19 | 合肥中航天成电子科技有限公司 | Packaging equipment of infrared sensor shell |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2448497Y (en) * | 2000-10-08 | 2001-09-19 | 西北有色金属研究院 | Micro resistance pulse gas shileding soldering machine |
| CN1951619A (en) * | 2005-10-18 | 2007-04-25 | 甘志银 | Vacuum fusion welding packaging method and packaging device |
| CN102522348A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip |
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2019
- 2019-09-27 CN CN201910926685.5A patent/CN110634777B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2448497Y (en) * | 2000-10-08 | 2001-09-19 | 西北有色金属研究院 | Micro resistance pulse gas shileding soldering machine |
| CN1951619A (en) * | 2005-10-18 | 2007-04-25 | 甘志银 | Vacuum fusion welding packaging method and packaging device |
| CN102522348A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip |
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