JP3305055B2 - Multilayer circuit board type antenna module and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna module used for a portable telephone or the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art An antenna built in a portable telephone or the like is:
In order to secure the electrical characteristics, high dimensional accuracy is required not only for the external dimensions but also for the gap dimension between the antenna element and the ground. In response to this demand, an antenna module in which an antenna element and a ground are integrated with a resin molding having high dimensional accuracy has been put to practical use.

One example is shown in FIGS. This antenna module has a hollow box-shaped resin molded body 1 having an opening on one end side, an antenna element 2 made of a metal foil such as a copper foil on the upper side, and a ground made of a metal foil on the lower side. 3 are provided integrally.
The antenna element 2 is double-folded on the side opposite to the opening of the resin molded body 1, and its end is connected to the folded-back portion by solder 4 to form a hollow loop. 2a
Is a lead portion extending from the antenna element 2, this lead portion 2 a is bent downward, and its tip is connected to a part of the ground 3 by soldering.

In such an antenna module, injection molding is performed with an antenna element member and a ground member set on the inner surface of a mold for molding the resin molded body 1.
It is manufactured by a method in which the antenna element member and the ground member are integrated simultaneously with the molding of the resin molded body 1 (Japanese Patent Laid-Open No. 4-185003).

[0005]

The above-described conventional antenna module and the method of manufacturing the same have an advantage that high dimensional accuracy can be obtained because the dimensions are defined by the mold, but the antenna module is manufactured by an injection molding machine. There is a drawback that productivity is poor because individual products must be manufactured.

SUMMARY OF THE INVENTION An object of the present invention is to provide an antenna module excellent in productivity which can be manufactured in a large number at a time and a manufacturing method thereof.

[0007]

In order to achieve this object, the present invention provides a multi-layer circuit board type antenna module having a large number of antenna modules formed on one laminated substrate and cutting the same. Thus, a large number of antenna modules can be manufactured at one time.

That is, the multilayer circuit board type antenna module of the present invention comprises a first layer metal foil, a first layer insulating layer, a second layer metal foil, a second layer insulating layer, and a third layer metal foil. , Third
The layer insulating layer and the fourth layer metal foil are laminated and integrated in this order to form a rectangular parallelepiped. The first layer metal foil is a first layer insulating layer, and the fourth layer metal foil is a third layer insulating layer. The second layer metal foil and the third layer metal foil are formed from one end to the middle of both surfaces of the second insulating layer, and are formed from one end to the other end of the outer surface of the layer. The metal foil, the second-layer metal foil, and the third-layer metal foil are electrically connected to each other by a conductor penetrating the first-layer insulating layer and the second-layer insulating layer over substantially the entire width at one end thereof. The three-layer metal foil is electrically connected by a conductor penetrating the second-layer insulating layer over almost the entire width of the other end, and the first-layer metal foil and the fourth-layer metal foil are partially insulated by the first layer at the other end. The continuity is provided by a conductor penetrating the layer, the second insulating layer, and the third insulating layer (claim 1).

In the above construction, the first metal foil and the fourth metal foil are electrically connected by a conductor penetrating the first insulating layer, the second insulating layer, and the third insulating layer. The first-layer metal foil and the fourth-layer metal foil may be configured to be electrically connected by a separately prepared conductor.

The method of manufacturing a multilayer circuit board type antenna module according to the present invention comprises the steps of:
A step of forming a layer metal foil and a third layer metal foil, a step of forming a conductor penetrating an intermediate portion of the second layer insulating layer and conducting the second layer metal foil and the third layer metal foil, a second layer A step of laminating and integrating a first-layer metal foil on a surface on the side of the metal foil via a first-layer insulating layer; a first-layer metal foil penetrating through one end of the first-layer insulating layer and the second-layer insulating layer; Forming a conductor for conducting the second metal foil and the third metal foil, and laminating and integrating the fourth metal foil on the third metal foil side via a third insulating layer; Forming a conductor penetrating the other end of the first insulating layer, the second insulating layer, and the third insulating layer to conduct the first metal foil and the fourth metal foil; Manufacturing a multi-cavity substrate for an antenna module, and cutting the substrate to separate it into individual antenna modules. (Claim 3).

In the above manufacturing method, the multi-piece substrate is cut at the end. However, when the first layer metal foil and the fourth layer metal foil are electrically connected by a separately prepared conductor, the following steps are required. After the step, cutting is performed, and then a conductor for conducting the first-layer metal foil and the fourth-layer metal foil is attached. In this case, when the conductor is attached after being separated into individual antenna module semi-finished products (claim 4)
There is a case where the conductor is attached in a state of a continuum of the semi-finished antenna module and then separated into individual antenna modules (claim 5).

[0012]

In the manner described above, a multi-piece board of an antenna module or a semi-finished product thereof can be manufactured in the manner of manufacturing a multi-layer circuit board. By cutting the multi-piece board, a large number of antennas can be formed at once. Modules or semi-finished products can be manufactured, and productivity is greatly improved.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 6 show an embodiment corresponding to claim 1 of the present invention. This antenna module includes a first-layer metal foil 11, a first-layer insulating layer 21, a second-layer metal foil 12, a second-layer insulating layer 22, a third-layer metal foil 13, and a third-layer insulating layer. twenty three
And the fourth-layer metal foil 14 are laminated and integrated in this order, and have a rectangular parallelepiped shape as a whole. As the metal foils 11 to 14, for example, copper foil for a printed circuit board is used, and an insulating layer 21 is used.
As the materials Nos. To 23, for example, prepregs for printed circuit boards are used.

The first-layer metal foil 11 is formed on the entire outer surface of the first-layer insulating layer 21 from one end to the other end thereof.
Similarly, 14 is formed on the entire outer surface of the third insulating layer 23 from one end to the other end. On the other hand, the second layer metal foil 12
The third metal foil 13 is formed only in the region from one end to the middle of both surfaces of the second insulating layer 22. As shown in FIG. 6, a remote island portion 14a is provided on a part of the other end of the fourth layer metal foil 14.
Are formed. The fourth metal foil 14 constitutes the ground of the antenna module.

As shown in FIGS. 2 and 3, the first-layer metal foil 11, the second-layer metal foil 12, and the third-layer metal foil 13 have the first-layer insulating layer 21 and the second-layer metal foil Conduction is provided by the conductor 15 penetrating the layer insulating layer 22. The conductor 15 is formed by forming a slit penetrating from the first layer metal foil 11 to the third layer metal foil 13 and plating the inner surface thereof with a conductive material. That is, it is formed in the manner of forming a through hole in a multilayer circuit board.

As shown in FIGS. 2 and 4, the second layer metal foil 12 and the third layer metal foil 13 are electrically connected to each other by a conductor 16 penetrating through the second layer insulating layer 22 at almost the entire width at the other end. . The conductor 16 is also formed by forming a slit penetrating from the second layer metal foil 12 to the third layer metal foil 13 and plating the inner surface thereof.

With the above configuration, the second layer metal foil 12-conductor 16
-Third layer metal foil 13-A loop is formed by the conductor 15, and this loop is connected to the first layer metal foil 11 by the conductor 15. Thereby, an antenna element of the antenna module is configured.

As shown in FIGS. 2 and 5, the first layer metal foil 11 and the fourth layer metal foil 14 are partially separated from each other at the first end by the first layer metal foil.
Conduction is provided by the conductor 17 penetrating the layer insulating layer 21, the second layer insulating layer 22, and the third layer insulating layer 23. Similarly, the islands 14a of the first-layer metal foil 11 and the fourth-layer metal foil are electrically connected by the conductor 18. These conductors 17 and 18 are connected between the first layer metal foil 11 and the fourth
It is formed by forming a hole penetrating to the layer metal foil 14, and plating the inner surface with a conductive material. The antenna module of the present embodiment has the above configuration.

Next, an embodiment (corresponding to claim 3) of this method of manufacturing an antenna module will be described in detail with reference to FIGS. FIGS. 7A to 7F show a manufacturing process for one antenna module. This process is performed on the assumption that a large number of antenna modules are continuous vertically and horizontally.

First, as shown in FIG. 7A, a second-layer metal foil 12 and a third-layer metal foil 13 are formed from one end of both surfaces of a second-layer insulating layer 22 to an intermediate portion. This is performed by laminating a required number of prepregs and copper foil, integrating them by hot pressing, and then removing unnecessary portions of the copper foil by etching. Next, as shown in (b), a slit penetrating the second metal foil 12, the second insulating layer 22, and the third metal foil 13 is formed in the middle of the laminate, and the inner surface of the slit is formed. Plating is performed to form a conductor 16 for conducting the second layer metal foil 12 and the third layer metal foil 13.

Next, as shown in (c), the second layer metal foil 12
A prepreg and a copper foil are laminated on the side surface, and heated and pressed to laminate and integrate the first-layer insulating layer 21 and the first-layer metal foil 11. Next, as shown in (d), a first-layer metal foil is provided on one end side of the laminate.
A slit penetrating from 11 to the third-layer metal foil 13 is formed, and the inner surface of the slit is plated to conduct the first-layer metal foil 11, the second-layer metal foil 12, and the third-layer metal foil 13. The conductor 15 is formed.

Next, as shown in (e), the third layer metal foil 13
The prepreg and the copper foil are laminated on the side surface, and heated and pressed to laminate and integrate the third-layer insulating layer 23 and the fourth-layer metal foil 14. Thereafter, the fourth layer metal foil 14 is pattern-etched to form the isolated island portion 14.
a is formed. Next, as shown in (f), two holes penetrating from the first-layer metal foil 11 to the fourth-layer metal foil 14 are formed on the other end side of the laminate, and the inner surface of the holes is plated. A conductor 17 (see FIG. 5) for electrically connecting the first-layer metal foil 11 and the fourth-layer metal foil 14, and an isolated island portion 14 between the first-layer metal foil 11 and the fourth-layer metal foil.
The conductor 18 for conducting a is formed.

In the above-described steps, a multi-cavity substrate in which a number of antenna modules 31 as shown in FIG. 8 are continuously arranged vertically and horizontally is manufactured, and the substrate is cut to obtain individual antenna modules.
Separate into 31. This allows a large number of antenna modules 31
Can be manufactured at once.

FIG. 9 shows an embodiment corresponding to claim 2 of the present invention. This antenna module uses the conductor shown in FIG.
Without providing 17, 18, another conductor 32, on the end face of the insulating layers 21 to 23,
Along the first layer metal foil 11
Are connected to the fourth-layer metal foil 14 and its islands by soldering 35, respectively. It is desirable to use the conductors 32 and 33 in the form of a flexible printed wiring board integrated with the insulating film. Since the configuration other than the above is the same as that of the antenna module shown in FIGS. 1 to 6, the same portions are denoted by the same reference numerals and description thereof will be omitted.

As a method of manufacturing an antenna module as shown in FIG. 9, a multi-piece substrate of a semi-finished antenna module without conductors 17 and 18 shown in FIG. 9 is cut and separated into individual antenna module semi-finished products, and then the conductors 32 and 33 shown in FIG.
Is attached by soldering (claim 4).

Another method for manufacturing an antenna module as shown in FIG. 9 is to use a large number of semi-finished antenna modules without conductors 17 and 18 shown in FIG. An individual substrate is manufactured, and the substrate is cut to form a continuous body of the semi-finished antenna module (as shown by a solid line in FIG. 8). In this state, the conductors 32 and 33 in FIG. There is a method of further cutting and separating into individual antenna modules (claim 5).

[0027]

As described above, according to the present invention, a multi-piece substrate of an antenna module or a semi-finished product is manufactured, and the substrate is cut to form a large number of antenna modules or semi-finished products at a time. Since the antenna module can be manufactured, the productivity of the antenna module can be greatly improved, and the cost of the antenna module can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an antenna module according to the present invention.

FIG. 2 is a longitudinal sectional view of the antenna module of FIG. 1 taken along line AA.

FIG. 3 is a transverse sectional view taken along line BB of FIG. 2;

FIG. 4 is a transverse sectional view taken along line CC of FIG. 2;

FIG. 5 is a transverse sectional view taken along line DD of FIG. 2;

FIG. 6 is a bottom view of the antenna module of FIG. 1;

FIGS. 7A to 7F are longitudinal sectional views showing one embodiment of a method for manufacturing an antenna module according to the present invention.

FIG. 8 is a perspective view of a multi-piece board of the antenna module manufactured in the process of FIG. 7;

FIG. 9 is a perspective view showing another embodiment of the antenna module according to the present invention.

FIG. 10 is a perspective view showing a conventional antenna module.

FIG. 11 is a longitudinal sectional view of the antenna module of FIG. 10;

FIG. 12 is a transverse sectional view of the antenna module of FIG. 10;

[Explanation of symbols]

 11: First-layer metal foil 12: Second-layer metal foil 13: Third-layer metal foil 14: Fourth-layer metal foil 15, 16, 17, 18: Conductor 21: First-layer insulating layer 22: Second-layer insulating Layer 23: Third insulating layer 31: Antenna module 32, 33: Conductor

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mitsuo Inagaki 1015 Kamiodanaka Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Co., Ltd. 72) Inventor Maeda Health 1015 Uedanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (56) References JP-A-5-167333 (JP, A) JP-A-5-110325 (JP, A) 4-185003 (JP, A) JP-A-5-305639 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01Q 1/38 H01Q 9/28

Claims (5)

(57) [Claims] 1. A first layer metal foil, a first layer insulating layer, a second layer metal foil, a second layer insulating layer, a third layer metal foil, a third layer insulating layer, and a fourth layer. The metal foil and the metal foil are laminated and integrated in this order to form a rectangular parallelepiped. The first metal foil is the first layer of the insulating layer, and the fourth metal foil is the other from one end of the outer surface of the third insulating layer. Formed up to the end side, the second
The layer metal foil and the third layer metal foil are formed from one end side of both surfaces of the second layer insulating layer to an intermediate portion, and the first layer metal foil, the second layer metal foil and the third layer metal foil are connected at one end thereof. The second layer metal foil and the third layer metal foil are electrically connected to each other by a conductor penetrating the first layer insulating layer and the second layer insulating layer over substantially the entire width on the other side. The first layer metal foil and the fourth layer metal foil are partially connected to the first layer at the other end side.
A multilayer circuit board type antenna module, wherein conduction is provided by a conductor penetrating the layer insulating layer, the second layer insulating layer, and the third layer insulating layer. 2. A first layer metal foil, a first layer insulating layer, a second layer metal foil, a second layer insulating layer, a third layer metal foil, a third layer insulating layer, and a fourth layer. The metal foil and the metal foil are laminated and integrated in this order to form a rectangular parallelepiped. The first metal foil is the first layer of the insulating layer, and the fourth metal foil is the other from one end of the outer surface of the third insulating layer. Formed up to the end side, the second
The layer metal foil and the third layer metal foil are formed from one end side of both surfaces of the second layer insulating layer to an intermediate portion, and the first layer metal foil, the second layer metal foil and the third layer metal foil are connected at one end thereof. The second layer metal foil and the third layer metal foil are electrically connected to each other by a conductor penetrating the first layer insulating layer and the second layer insulating layer over substantially the entire width on the other side. Wherein the first layer metal foil and the fourth layer metal foil are electrically connected by a conductor provided outside the insulating layer at a part of the other end side. Circuit board type antenna module. 3. The method of manufacturing a multilayer circuit board type antenna module according to claim 1, comprising the following steps. The second insulating layer extends from one end to the middle of both surfaces of the second insulating layer.
Forming a layer metal foil and a third layer metal foil; Forming a conductor that penetrates an intermediate portion of the second-layer insulating layer and that conducts the second-layer metal foil and the third-layer metal foil; A step of laminating and integrating the first-layer metal foil on the surface on the second-layer metal foil side via the first-layer insulating layer. Forming a conductor that penetrates through one end of the first and second insulating layers and connects the first, second and third metal foils to each other; A step of laminating and integrating the fourth-layer metal foil on the surface on the third-layer metal foil side via the third-layer insulating layer. Forming a conductor penetrating the other end of the first insulating layer, the second insulating layer, and the third insulating layer to conduct the first metal foil and the fourth metal foil; A step of manufacturing a multi-cavity substrate for the antenna module in the above steps, and cutting the substrate to separate it into individual antenna modules. 4. The method of manufacturing a multilayer circuit board type antenna module according to claim 2, comprising the following steps. The second insulating layer extends from one end to the middle of both surfaces of the second insulating layer.
Forming a layer metal foil and a third layer metal foil; Forming a conductor that penetrates an intermediate portion of the second-layer insulating layer and that conducts the second-layer metal foil and the third-layer metal foil; A step of laminating and integrating the first-layer metal foil on the surface on the second-layer metal foil side via the first-layer insulating layer. Forming a conductor that penetrates through one end of the first and second insulating layers and connects the first, second and third metal foils to each other; A step of laminating and integrating the fourth-layer metal foil on the surface on the third-layer metal foil side via the third-layer insulating layer. A step of manufacturing a semi-manufactured semi-finished product of the antenna module in the above steps, and cutting the substrate to separate the semi-finished product of each antenna module. A step of attaching a conductor for conducting the first-layer metal foil and the fourth-layer metal foil to each of the semifinished antenna module products to complete the antenna module. 5. The method for manufacturing a multilayer circuit board type antenna module according to claim 2, comprising the following steps. The second insulating layer extends from one end to the middle of both surfaces of the second insulating layer.
Forming a layer metal foil and a third layer metal foil; Forming a conductor that penetrates an intermediate portion of the second-layer insulating layer and that conducts the second-layer metal foil and the third-layer metal foil; A step of laminating and integrating the first-layer metal foil on the surface on the second-layer metal foil side via the first-layer insulating layer. Forming a conductor that penetrates through one end of the first and second insulating layers and connects the first, second and third metal foils to each other; A step of laminating and integrating the fourth-layer metal foil on the surface on the third-layer metal foil side via the third-layer insulating layer. A step of manufacturing a multi-cavity substrate for a semi-finished product of the antenna module in the above steps, and cutting the substrate to separate it into a continuous body of semi-finished antenna module. Attaching a conductor for conducting the first layer metal foil and the fourth layer metal foil to each antenna module semi-finished product in a state of the continuous body. A step of cutting the continuum and separating it into individual antenna modules.