JP3285499B2 - Continuity inspection device, its inspection method, and its inspection probe - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting continuity and an inspection method thereof, and more particularly, to an continuity inspection apparatus for inspecting continuity of a pattern on a printed circuit board, an inspection method thereof, and an inspection probe thereof.

[0002]

2. Description of the Related Art Conventionally, there has been proposed a continuity inspection method including a conductor pattern printed on a printed circuit board and components soldered to the conductor pattern. For example, in Japanese Patent Application Laid-Open No. Hei 6-213955, a printed board on which components are soldered is placed on a board on which a plurality of styluses (probes) are arranged in a matrix so that the pattern surface of the printed board is in contact with the board. Further, a plate-shaped inspection probe on which a non-contact sensor is arranged is mounted on the component of the printed circuit board, and a capacitive coupling formed between the inspection probe and each stylus is measured and compared with a predetermined value. By doing
A technique for detecting a soldering failure, a disconnection, or the like is disclosed. Also, for example, in Japanese Patent Application Laid-Open No. 4-244076, a plurality of pin-shaped inspection probes arranged at equal intervals with the conductor pattern of the printed board are brought into contact with one end of the printed board, and the other end is contacted. A method is disclosed in which a continuity check jig is placed above a connector connected to an end portion of the conductor pattern and capacitively coupled to inspect the continuity of each conductor pattern in a non-contact manner.

[0003]

However, in the above conventional example, in the former case, since a plurality of styluses (probes) are arranged in a two-dimensional direction, all the styluses are placed on the printed circuit board to be inspected. It is necessary to confirm that contact is being made properly. Further, since the tip of the stylus has a thin shape, it is necessary to handle the stylus so as not to damage the contact portion of the printed circuit board and to bend the stylus itself. In the latter case, the plurality of pin-shaped inspection probes arranged at equal intervals need to be brought into contact with predetermined positions of the conductor pattern on the printed circuit board. The more difficult it is to position. Further, in any of the above cases, the stylus or the pin-shaped inspection probe is arranged at regular intervals with the conductor pattern of the printed circuit board to be inspected, so that it is difficult to apply to a printed circuit board having different conductor pattern intervals. It is.

Accordingly, an object of the present invention is to provide a continuity inspection apparatus which is easy to position and is excellent in versatility, an inspection method therefor, and an inspection probe therefor.

[0005]

In order to achieve the above object, a continuity inspection apparatus according to the present invention has the following features.

That is, the detection conductor of the inspection probe is brought into contact with the vicinity of one end of a plurality of conductor patterns formed on the substrate, and is arranged near the other end of the plurality of conductor patterns.
Detect the signal from the inspection probe with the sensor installed
A continuity inspection apparatus for inspecting the continuity of the plurality of conductive patterns, the detection conductor section, when contacted near one end of said plurality of conductive patterns, at least in the conductor patterns of the plurality of conductive patterns closely spaced than the spacing of the two patterns adjacent in and each conductor width of one contact to spacing said plurality of conductive patterns, first the detection conductor part certain of the detection conductor portions
And said sensor by the applied voltage detecting conductor portion with the a detection conductor portions other than the detection conductor portions in the detected upon application of a predetermined voltage, related as a conductor pattern of ones of said plurality of conductive patterns Association means;
Said plurality of conductive patterns respectively selected based on the association information obtained by the associating means, said detecting
The voltage applied to the conductor pattern from the conductor is
Wherein the Ru and a checking means for checking the continuity of the conductor pattern by detecting the difference. This eliminates the need for highly accurate positioning of the inspection probe before the continuity inspection.

Further, preferably minimal conductor number of the plurality of detection conductors section, when contacted with the test probe to the substrate, to each of the plurality of conductive patterns, one of said plurality of sensing conductor portion The number of contacts should be good.
This is because a plurality of conductor patterns are collectively grasped by the inspection probe, and the inspection probe has versatility.

Further, for example, by the association means it is associated a plurality of detection conductor portions on the association information, when the conductor number information with the plurality of detection conductor portions respectively are not sequential numbers are directed to the substrate Is determined to be short-circuited.

[0009] For example, the test unit, when selecting the conductor pattern from the plurality of conductive patterns, and applying a second predetermined voltage near one end of the conductor pattern on the basis of the association information, Of the conductor pattern
Characterized by checking the continuity by comparing the number of said plurality of conductive patterns registered in advance and the number of times of detecting the values for a given voltage of the second sensor which is arranged in the vicinity of the other Katatan unit .

Further, preferably, the second predetermined voltage is:
By detecting the AC voltage with a non-contact sensor, the high-precision positioning of the voltage detection end is also abolished.

Further, in order to achieve the above object, a continuity inspection method of the present invention has the following configuration.

Namely, when contacted to a plurality of conductor patterns one end the multiple near the conductor pattern formed on the substrate, at least one contact on the conductor patterns of the plurality of conductive patterns interval And, the conductor width of each of the conductor patterns is brought into contact with the detection conductor portion of the inspection probe arranged at a smaller interval than the interval between two adjacent patterns in the plurality of conductor patterns,
With the sensor arranged near the other end,
A conductivity test method detects the signal to check the continuity of the plurality of conductive patterns, the contact step of contacting the sensing conductor portion of the inspection probe near one end of said plurality of conductive patterns, wherein When the detection conductor portion is brought into contact with the vicinity of one end of the plurality of conductor patterns, at least one interval between the conductor patterns in the plurality of conductor patterns and the width of each conductor are adjacent to the plurality of conductor patterns. A detection conductor among the detection conductors, the detection conductor being arranged at an interval smaller than an interval between two matching patterns;
Wherein in the sensor when the first predetermined voltage is applied to the part
And a detection conductor portion applied voltage is the the detection conductor portions other than the certain detection conductor portions which are detected, an association step of associating associates a conductor pattern of ones of said plurality of conductive patterns, obtained by the association step based on the association information, characterized in that Ru and a test step of examining each selected conducting said plurality of conductor patterns. This eliminates the need for highly accurate positioning of the inspection probe before the continuity inspection.

Further, in order to achieve the above object, an inspection probe of the present invention and an inspection probe of a continuity inspection device having the above configuration have the following configurations.

That is, a plurality of conductors formed on a substrate
Place the detection conductor of the inspection probe near one end of the pattern.
And contact them near the other end of the plurality of conductor patterns.
Detect the signal from the inspection probe with the sensor installed
Continuity inspection device for inspecting continuity of the plurality of conductor patterns
Signals can be individually supplied by
A plurality of detection conductor portions, brought into contact with the detection conductor portion into a plurality of conductor patterns are formed on a substrate, a test probe for inspecting the continuity of the plurality of conductive patterns has a said test probe A plurality of detection conductor parts are arranged at intervals of at least one contact with each conductor pattern in the plurality of conductor patterns, and conductor widths of the plurality of detection conductors are adjacent to each other in the plurality of conductor patterns. The distance between the two patterns is narrower.

Preferably, minimum conductor number of the plurality of detection conductors section, when contacted with the test probe to the substrate, to each of the plurality of conductive patterns, one of said plurality of sensing conductor portion is in contact It is good to set the number to be. Multiple conductor patterns are grasped collectively by the inspection probe,
In addition, this is to make the inspection probe versatile.

[0016]

An embodiment of the present invention will be described below with reference to the drawings. First, the overall configuration of the continuity inspection device according to the present invention will be described with reference to FIGS.

FIG. 1 is a system configuration diagram of a continuity inspection device as one embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes an inspection probe (to be described in detail later), which is brought into contact with a contact 101A at one end of a conductor pattern 102 on a substrate 10 to be inspected. A control device 3 controls the operation of the entire inspection device (the operation will be described later). Reference numeral 6 denotes a switch circuit, which preferably includes a switching element composed of a plurality of semiconductor elements. Reference numeral 5 denotes a DC power supply, which is supplied for driving the switch circuit 6. Reference numeral 7 denotes an AC power supply, which is supplied to a circuit selected by the switch circuit 6 based on a command from the control device 3. Reference numeral 8 denotes a driver / receiver circuit, which interfaces a voltage between the probe 1 and the switch circuit 6 and / or the control device 3. Reference numeral 2 denotes a non-contact sensor, which is arranged near the contact 101B at the other end of the conductor pattern 102. The non-contact sensor 2 includes a driver / receiver circuit 8 and a probe 1
Supplied to a certain conductor pattern 102 through
This is a non-contact sensor for performing a non-contact inspection by applying a so-called AC voltage, which detects an AC signal from the power supply 7. 9
Is a waveform processing device, which generates an analog signal according to the AC signal detected by the non-contact sensor 2. Reference numeral 4 denotes an analog / digital (hereinafter, A / D) converter, which converts an analog output voltage from the waveform processing device 9 into a digital signal and inputs the digital signal to the control device 3. Since a method of detecting an AC signal by a non-contact sensor is general, detailed description is omitted.

Preferably, the setting of the substrate 10 at a predetermined position and the movement of the probe 1 and the non-contact sensor 2 to the set substrate 10 are automated by an industrial robot and a stage (not shown). I do.

In the following description, the pattern 102 of the board 10 is a printed board or a flexible board having conductors arranged in parallel as shown in the figure.

FIG. 2 is a block diagram of a control device according to an embodiment of the present invention.

In the figure, a control device 3 is, for example, a personal computer, 21 is a CPU for controlling the continuity inspection device according to a program, 22 is a CRT as display means,
23, a keyboard as input means; 24, a ROM (read only memory) storing a boot program and the like;
25 is a RAM for temporarily storing various processing results, 26 is a CP
A storage device such as a hard disk drive (HDD) for storing programs and the like used in U21, an input interface 27 for receiving a digital signal from the A / D converter 4, and an operation control signal 28 for the switch circuits 6 and 7 It has an output interface for outputting. These components are connected via an internal bus 29.

Here, an outline of the operation of the continuity inspection device having the above configuration will be described. First, the control device 3 applies the AC power source 7 or the DC power source 5 to the switch circuit 6 and connects the switch circuit 6. By sequentially switching, the contact state between the probe 1 and the contact 101A is determined (the details will be described later). Next, the control device 3 sets the pattern 102 to A
In order to sequentially apply the voltage of the C power supply 7, the switch circuit 6 is switched based on the determination result, and the AC signal obtained from the non-contact sensor is converted and obtained by the A / D converter 4 via the waveform processing device 9. Thus, a continuity test of the pattern 102 is performed.

Next, a continuity inspection method according to the present embodiment will be described.

FIG. 3 is a diagram for explaining the relationship between a probe and a substrate according to one embodiment of the present invention.

In the figure, a substrate 10 has M conductor patterns (# 1 to #M). On the other hand, the probe 1 has N conductors (# 1 to #N). The conditions required for the conductors of the probe 1 are as follows: 1) Conductor spacing of the probe 1: the interval at which at least one conductor of the probe 1 contacts one pattern 102 when the probe 1 is brought into contact with the substrate 10. And

2) Conductor width of probe 1: It is assumed that it is smaller than the interval between two adjacent patterns 102. This is because, when a certain conductor of the probe 1 is positioned so as to straddle (short-circuit) two adjacent patterns 102, the control device 3 converts the two adjacent patterns 102 into one pattern 102. This is to prevent the judgment.

3) Minimum number of conductors of the probe 1: When the probe 1 is brought into contact with the substrate 10 once, any one of the N conductors of the probe 1 comes into contact with each of the M conductor patterns of the substrate 10. Number. This is to prevent the probe 1 from moving in the lateral direction of the substrate 10 during the continuity test of one substrate 10.

First, each conductor of the probe 1 and each pattern 10 of the substrate 10 are
2 is determined. That is, the controller 3 assigns (associates) which conductor of the probe 1 is in contact with which pattern 102. The flow from the allocation processing to the continuity inspection processing will be described with reference to FIGS.

FIG. 4 is a diagram showing a short circuit of a pattern on a substrate as one embodiment of the present invention.

FIG. 8 is a flowchart showing an assignment process / continuity check process as one embodiment of the present invention.

In the figure, steps S1 to S6 are:
This is a routine for allocating the conductor of the probe 1 to the pattern 102 (at this time, the non-contact sensor 2 is not operated). The control device 3 initializes the counter in response to an inspection start command from the keyboard 23 (step S1), operates the switch circuit 6, selects the conductor I, and applies the voltage of the AC power supply 7 or the DC power supply 5 (step S2). ). Then, the control device 3 switches the conductors of the probe 1 other than the conductor I from which the voltage applied in step S2 can be detected to the switch circuit 6
Is operated, and all conductors whose voltages are detected are assigned as one certain pattern 102 (step S3). For example, when I is 1, a voltage is applied to the conductor # 1 of the probe 1 in FIG. At this time, when the switch circuit 6 sequentially selects the conductors # 2 to #N, the voltage applied to the conductor # 1 is applied to the conductor # 2 via the pattern # 1 because the probe 1 is in contact with the substrate 10. At the same time, the voltage is also applied to the conductor # 4 because # 1 and # 2 of the pattern 102 are short-circuited. When the control device 3 detects this voltage, the conductors # 1, # 2, and # 4 of the probe 1 are associated as one certain pattern. Then, the control device 3 executes step S
3, a plurality of conductors of the probe 1 are associated, and it is determined whether or not the conductor numbers of the conductors are serial numbers (Step S).
4). If it is not a serial number, it is determined that there is a short-circuit portion of the pattern as shown in FIG. 4 on the substrate 10, and the continuity test of the target substrate 10 is ended. On the other hand, in the case of the serial number, it is determined whether the allocation process for the N conductors of the probe 1 has been completed (step S5). If this processing is sequentially performed from the conductor # 1 to the conductor #N of the probe 1, the M patterns on the substrate 10 are associated with the N conductors of the probe 1. Then, in step S5, N
If the book conductors are associated, the process proceeds to a continuity inspection process (details are shown in FIG. 9).

It goes without saying that the number of conductors from which the applied voltage is detected increases in accordance with the distance between the conductors of the probe 1. In addition, the conductor for which the applied voltage has been detected may be excluded from the subsequent allocation processing to speed up the processing.

Next, a continuity inspection process performed based on the association information will be described with reference to FIGS. still,
It is assumed that the number M of patterns on the substrate 10 is registered in the control device 3 in advance. Further, in the present embodiment, since each pattern 102 on the substrate 10 is located at an interval of the order of 100 microns, it is difficult to obtain a resolution for detecting a signal from the individual pattern 102 by the non-contact sensor 2, so that The signal detection surface has a plate shape.
Therefore, by comparing the number M of patterns registered in advance with the number of times signals are detected from the non-contact sensor,
Perform defective product judgment.

FIG. 5 is a diagram for explaining a state of the continuity inspection processing performed based on the association information as one embodiment of the present invention.

FIG. 6 is a diagram for explaining a state of the continuity inspection process performed based on the association information as one embodiment of the present invention (when there is a disconnection in the pattern). FIG. 7 is a diagram illustrating a state of a continuity inspection process performed based on association information according to an embodiment of the present invention (when two adjacent patterns are short-circuited).

FIG. 9 is a flowchart showing details of the continuity inspection processing as one embodiment of the present invention.

In the figure, steps S11 to S16
Until the continuity inspection routine of each pattern 102,
Steps S17 to S19 constitute a non-defective / defective product determination loop.

The control device 3 initializes the counter (step S1), and applies an AC voltage to the conductor #I by operating the switch circuit 6 (step S12). At this time, when a plurality of conductors are associated with one association information as a result of the above-described step S3, a voltage is applied to any one of the conductors. Then, it is determined whether a signal of the applied AC voltage can be detected by the non-contact sensor 2 (step S13). FIG. 5 shows a state where a voltage is sequentially applied to the conductor of the probe 1 based on the association information, and a state where the applied voltage signal is detected by the non-contact sensor 2. Here, pattern 10
Conductor of probe 1 not in contact with 2 (# 3, # 5, etc.)
Is applied to the control device 3 as shown in FIG.
Only the association information obtained in step 1
This is because it cannot be determined whether only one of the conductors of the probe 1 is in contact or not, such as the conductors # 3 and # 5. If it is detected in step S13, the counter J is incremented by 1 (step S1).
4). On the other hand, if it cannot be detected, the conductor #
It is determined whether the continuity test has been performed up to N (step S1).
5). This process is sequentially performed from the conductor # 1 to the conductor #N of the probe 1. Then, the number M of the patterns 102 registered in advance is compared with the value of the counter J that has detected a signal from the non-contact sensor (step S17). If they are equal, it is determined to be non-defective (step S18). It is determined to be non-defective (step S19). Here, if the case where J ≠ M is described, for example, as shown in FIG.
There is a case where #M of No. 02 is disconnected, or a case where two adjacent patterns 102 are short-circuited as shown in FIG. In these cases, J = M-1 and it is determined to be defective.

Next, the structure of the probe 1 will be described with reference to FIGS.

FIG. 10 is a perspective view of an inspection probe as one embodiment of the present invention.

FIG. 11 is a structural explanatory view of a test probe as one embodiment of the present invention.

In FIGS. 10 and 11, the flexible substrate 51 for forming the contact point of the probe 1 with the object to be inspected is
As shown in FIG. 11, the probe 55 is fixed (partially adhered) by a probe body cover 56 so as to surround the probe body 54 to which the rubber 55 is attached. One end of the flexible board 51 is connected to the driver receiver circuit 8 via a connector 52 and a flat lead wire 53. As for the N conductors of the flexible substrate 51, the contact P portion comes into contact with each pattern 102 of the substrate 10. At this time, due to the properties of the rubber 55 as the elastic material and the shape of the contact point P of the flexible substrate 51, the substrate 10 and the pattern 102 are not damaged and each pattern 102 is not damaged.
At an appropriate pressure. In addition, the role of the lead wire 53 is given to the flexible substrate itself, and the connector 5
FIG. 12 shows a probe 1A in which 2 is omitted.

FIG. 12 is a perspective view of an inspection probe as a modified example of the embodiment of the present invention, and is different from the probe 1 of FIGS. 10 and 11 except that the flexible substrate 51A itself is connected to a driver / receiver circuit. The description is omitted because it is the same.

<Effects of the present embodiment> (1) The probe 1 satisfies the conditions 1) to 3) required for the conductor of the probe 1 so that the probe 1 is not a jig dedicated to a certain substrate, but a general-purpose jig. The jig was able to be used. (2) The probe 1 is connected to the substrate 1 by performing an allocation process (FIG. 8) for each of the substrates 10 to be inspected.
It is unnecessary to perform high-precision positioning in the short direction of 0. As a result, the lead time can be reduced even in a continuity test of a small and high-density substrate. (3) When a plurality of conductors are associated with one piece of association information by the allocation processing (FIG. 8),
The value of the counter J obtained by the continuity inspection process (FIG. 9) in which a voltage is applied to the two conductors and the pattern 1 registered in advance
By comparing with the number M of 02, a substrate having a broken pattern (FIG. 6) and / or a substrate having two adjacent patterns 102 short-circuited (FIG. 7) could be detected. (4) In the allocation process (FIG. 8), if the plurality of conductor numbers of the associated probe 1 are not serial numbers, it is determined that a short circuit has occurred, and the subsequent continuity inspection process has been stopped, thereby reducing the lead time. Can be reduced. (5) By using the plate-shaped non-contact sensor 2 for the detection unit, it is unnecessary to position the substrate 10 in the short direction with high accuracy. As a result, the lead time can be reduced even in a continuity test of a small and high-density substrate.

If this allocation process is performed using a probe that satisfies the above conditions 1) to 3), the pattern 1
A continuity test can also be performed on substrates in which 02 is not arranged at equal intervals.

The continuity inspection apparatus is not limited to the detection method using the AC power supply 7, the non-contact sensor 2, and the waveform processing apparatus 9, but includes a pin probe and a connector arranged at regular intervals with the pattern 102. It goes without saying that it may be used.

[0048]

As described above, according to the present invention,
It is possible to provide a continuity inspection device which is easy to position and has excellent versatility, an inspection method thereof, and an inspection probe thereof.

[0049]

[Brief description of the drawings]

FIG. 1 is a system configuration diagram of a continuity inspection device as one embodiment of the present invention.

FIG. 2 is a block configuration diagram of a control device as one embodiment of the present invention.

FIG. 3 is a diagram illustrating a relationship between a probe and a substrate according to an embodiment of the present invention.

FIG. 4 is a diagram showing a short circuit of a pattern on a substrate as one embodiment of the present invention.

FIG. 5 is a diagram illustrating a state of a continuity inspection process performed based on association information as one embodiment of the present invention.

FIG. 6 is a diagram illustrating a state of a continuity inspection process performed based on association information according to an embodiment of the present invention (when there is a disconnection in a pattern).

FIG. 7 is a diagram illustrating a state of a continuity inspection process performed based on association information according to an embodiment of the present invention (when two adjacent patterns are short-circuited).

FIG. 8 is a flowchart illustrating an assignment process / continuity check process as one embodiment of the present invention.

FIG. 9 is a flowchart showing details of a continuity inspection process as one embodiment of the present invention.

FIG. 10 is a perspective view of an inspection probe as one embodiment of the present invention.

FIG. 11 is a structural explanatory view of an inspection probe as one embodiment of the present invention.

FIG. 12 is a perspective view of a test probe as a modification of the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inspection probe 2 Non-contact sensor 3 Control device 4 A / D converter 5 DC power supply 6 Switch circuit 7 AC power supply 8 Driver / receiver circuit 9 Waveform processing circuit 10 Substrate 21 CPU 22 CRT 23 Keyboard 24 ROM 25 RAM 26 Storage device 27 Input Interface 28 Output interface 29 Internal bus 51, 51A Flexible board 52 Connector 53 Lead wire 54 Probe body 55 Rubber 56, 56A Probe body cover 101A, 101B Contact 102 Conductive pattern # 1 to #N Conductor number of probe 1 # 1 to #M Board 10 conductor pattern numbers

Claims (12)

(57) [Claims] 1. A detection conductor of an inspection probe is brought into contact with one end of a plurality of conductor patterns formed on a substrate and arranged near the other end of the plurality of conductor patterns.
A continuity inspection device that detects a signal from the inspection probe with a sensor and inspects continuity of the plurality of conductor patterns, wherein the detection conductor portion includes one end of the plurality of conductor patterns.
When contacting the vicinity , at least one interval between the conductor patterns in the plurality of conductor patterns and an interval in which each conductor width is smaller than an interval between two adjacent patterns in the plurality of conductor patterns are arranged. a first of said certain detection conductor section and the detection conductor portions other than said certain detection conductor portion where the applied voltage is detected by the sensor in the case of applying a predetermined voltage to the detection conductor part certain of the detection conductor portions and a associating means for associating a conductor pattern of ones of said plurality of conductive patterns, the plurality of conductive patterns respectively selected based on the association information obtained by the associating means, said detecting
The voltage applied to the conductor pattern from the conductor is
Continuity testing device characterized by Ru and a checking means for checking the continuity of the conductor pattern by detecting the difference. 2. A minimum conductor number of the plurality of detection conductors section, when contacted with the test probe to the substrate, to each of the plurality of conductive patterns, the plurality of detection conductors
2. The continuity inspection device according to claim 1, wherein the number is such that any one of the portions makes contact. In wherein said association means, said association has a plurality of detection conductor portions is associated with information, when the conductor number information with the plurality of detection conductor portions respectively are not sequential number is a substrate as an object 3. The continuity inspection device according to claim 1, wherein it is determined that a short circuit occurs. Wherein said inspecting means, when selecting the conductor pattern from the plurality of conductive patterns, and applying a second predetermined voltage near one end of the conductor pattern on the basis of the association information, the other Katatan portion near the conductor pattern
The continuity is inspected by comparing the number of times the value related to the second predetermined voltage is detected by a sensor arranged beside and the number of the plurality of conductor patterns registered in advance. A continuity inspection device according to claim 3. 5. The continuity inspection device according to claim 4, wherein the second predetermined voltage is an AC voltage, and the AC voltage is detected by a non-contact sensor. 6. A plurality of conductive patterns formed on a substrate, the first conductive patterns being in contact with the plurality of conductive patterns near one end thereof.
Each of the conductor patterns in the plurality of conductor patterns.
At least one contact with the conductors and each conductor
The width of two adjacent patterns in the plurality of conductor patterns is
Of test probes arranged in closely spaced than the turn spacing
The detection conductor portion is brought into contact with the other of the plurality of conductor patterns.
The signal from the inspection probe is
A continuity testing method detecting and inspecting the continuity of the plurality of conductive patterns No., a contact step of contacting said detection conductor portion of the inspection probe near one end of said plurality of conductive patterns, the detection A conductor portion near one end of the plurality of conductor patterns;
When they are in contact with each other, they are arranged at intervals at which at least one of the conductor patterns in the plurality of conductor patterns is in contact with each other, and each conductor width is arranged at an interval smaller than the interval between two adjacent patterns in the plurality of conductor patterns. and, a first of said certain detection conductor section and the detection conductor portions other than said certain detection conductor portion where the applied voltage is detected by the sensor in the case of applying a predetermined voltage to the detection conductor part certain of the sensing conductor and a associating step of associating the conductor pattern of ones of said plurality of conductive patterns, Ru and an inspection step in which the association on the basis of the association information obtained by the step select each of the plurality of conductor patterns for inspecting the continuity A continuity inspection method, characterized in that: In wherein said association step, the association has a plurality of detection conductor portions is associated with information, when the conductor number information with the plurality of detection conductor portions respectively are not sequential number is a substrate as an object 7. The continuity inspection method according to claim 6, wherein it is determined that a short circuit occurs. 8. In the inspection step, a conductor pattern is selected from the plurality of conductor patterns based on the association information, and a second predetermined voltage is applied near one end of the conductor pattern. other Katatan unit distribution in the vicinity of
Claim, characterized in that to inspect the continuity by comparing the number of said plurality of conductor patterns in set the sensor registered in advance and the number of times of detecting the values for a given voltage of the second 6 or claim 7 The continuity inspection method described. 9. A plurality of conductor patterns formed on a substrate
Contact the detection conductor of the inspection probe near one end of the probe
Disposed near the other end of the plurality of conductor patterns.
The signal from the inspection probe is detected by the sensor
A continuity inspection device that inspects the continuity of a plurality of conductor patterns.
Multiple units that can be individually supplied
Has a detection conductor, is contacted with said detection conductor in a plurality of conductor patterns are formed on a substrate, a test probe for inspecting the continuity of the plurality of conductive patterns, a plurality of detection with the said test probe A conductor portion is arranged at an interval of at least one contact with each conductor pattern in the plurality of conductor patterns, and a conductor width of each of the plurality of detection conductor portions is two adjacent conductor lines in the plurality of conductor patterns. An inspection probe characterized by being narrower than the interval of the pattern. 10. The minimum number of conductors of the plurality of detection conductors is determined by setting the plurality of detection conductors to each of the plurality of conductor patterns when the inspection probe is brought into contact with the substrate.
The inspection probe according to claim 9, wherein the number is such that any one of the portions comes into contact with the inspection probe. 11. A plurality of detection conductor portions, the test probe of claim 10, wherein a created by the flexible substrate. 12. The inspection probe according to claim 11, wherein a contact portion of the flexible substrate with the plurality of conductor patterns is supported by an elastic material.