JP3272559B2 - Semiconductor manufacturing apparatus and device manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a device manufacturing method for manufacturing semiconductor devices such as LSIs and VLSIs.

[0002]

2. Description of the Related Art Conventionally, as an essential operation in using a semiconductor manufacturing apparatus, for example, in the case of a semiconductor exposure apparatus, an operation of supplying a reticle and a wafer to be used later to the semiconductor exposure apparatus, and There is an operation of collecting a used reticle and an exposed wafer from the semiconductor exposure apparatus to the outside of the apparatus, but these operations are required to be performed within a range that interferes with a movable range of a transfer manipulator inside the apparatus. Then, in order to avoid the danger in this case, in the conventional apparatus, the execution time of the work is limited to a time excluding that the exposure processing is in progress. Further, in order to prevent the worker from performing the above-mentioned work while the exposure process is in progress, a lock provided by the control program of the apparatus is provided on a door provided for performing the work on the chamber of the apparatus, The lock is always locked when the exposure process is in progress.

[0003]

In recent years, in a semiconductor device manufacturing line on which advanced automation such as on-line or in-line has been advanced, the above operations and the like are performed while the exposure process is in progress, thereby improving the work efficiency or manufacturing efficiency of the operator. There are many situations where line operation efficiency is improved. Nevertheless, in the above-described conventional example, these operations cannot be performed while the exposure processing is in progress, and thus take the opportunity to improve the work efficiency of the operator and the operation efficiency of the production line.

Further, in the above conventional example, since the control program secures the safety only by locking the door of the chamber, it is not sufficient to guarantee the safety even when the control program does not operate normally. There is also a disadvantage.

An object of the present invention is to provide a semiconductor manufacturing apparatus and a device manufacturing method that can supply and supply a reticle or wafer even during exposure processing while ensuring sufficient safety. An object of the present invention is to enable a collection operation and the like to be performed, thereby improving the work efficiency of an operator.

[0006]

In order to achieve this object, a semiconductor manufacturing apparatus according to the present invention comprises a door attached to a delivery position to which a substrate is supplied from outside the device, and a substrate provided to the delivery position. A plurality of manipulators to be conveyed inside the device, input means for making a request for unlocking and locking the door to the device, and a possibility of interfering with the operation through the door in response to the unlock request; A specific manipulator is specified, only the operation of the specified manipulator is temporarily stopped, and the locked door is unlocked.In response to the locking request, the locked door is locked. Unlocking means for resuming the operation of the manipulator during a pause, the door being open, and the manipulator entering the delivery position. When it is detected, characterized by comprising, and emergency stop means for urgently stopping the operation of the manipulator.

Further, in the device manufacturing method of the present invention, a step of supplying a substrate from the outside of the apparatus via a door attached to a transfer position and transporting the substrate supplied to the transfer position inside the apparatus using a manipulator. In the method for manufacturing a semiconductor device through the above, a step of inputting a request for unlocking the door to the apparatus, and an operation that may interfere with the operation through the door in response to the unlock request Specifying the manipulator, temporarily suspending only the operation of the specified manipulator, unlocking the locked door, and inputting a request to the device to lock the door, Responding to the locking request, locking the unlocked door and resuming the operation of the manipulator during a pause, and the door is open. When said manipulator from entering into the delivery position is detected, characterized by comprising, a step of an emergency stop the operation of the manipulator.

The opening of the door is detected by a cheat switch, and the intrusion of the manipulator into the delivery position is detected by an optical sensor.
The manipulator is stopped instantaneously in response to this detection.

[0009]

According to this, when the unlocking request is met, the manipulator is temporarily stopped and unlocked, and when the locking is requested, the operation of the temporarily stopped manipulator is restarted and locked. Therefore, even when the manipulator is operating for exposure processing and the like, the unlock request is made by the operator, the door is opened, and the work of loading and unloading the reticle and wafer is performed without fear of interference with the manipulator. Done safely. Then, when the work is completed and the locking is performed in response to the locking request of the operator, the temporary stop of the manipulator is released, and the operation from the stop position is continued. Therefore, the loading and unloading of reticles and wafers is performed as needed, and the manipulator is only temporarily stopped during that time. It is done on a regular basis.

Further, if the door is unlocked during the operation of the manipulator because the manipulator was not normally stopped at the time of unlocking, the manipulator is immediately stopped. Further, work safety is ensured. Hereinafter, the present invention will be described more specifically with reference to examples.

[0011]

FIG. 1 is a perspective view showing the appearance of a semiconductor exposure apparatus according to one embodiment of the present invention. As shown in the figure, the semiconductor exposure apparatus includes a temperature control chamber 101 for controlling an environmental temperature of the apparatus main body, an EWS main body 106 disposed therein and having a CPU for controlling the apparatus main body, and
An EWS display device 102 for displaying predetermined information in the device, a monitor TV 105 for displaying image information obtained via imaging means in the device main body, an operation panel 103 for performing predetermined input to the device, and an EWS keyboard 104 And a console unit including the same. In the figure, 107 is an ON-OFF switch, 108 is an emergency stop switch, 109 is various switches, a mouse, etc., 110 is a LAN communication cable, 111 is an exhaust duct for generating heat from the console function, and 112 is an exhaust device for the chamber. . The semiconductor exposure apparatus main body is installed inside the chamber 101.

The EWS display 102 is of a thin flat type such as EL, plasma, liquid crystal, etc., is housed in the front of the chamber 101, and is connected to the EWS main body 106 by a LAN cable 110. Operation panel 10
3. A keyboard 104, a monitor TV 105, and the like are also installed on the front surface of the chamber 101 so that a console operation similar to the conventional console operation can be performed from the front surface of the chamber 101.

FIG. 2 is a diagram showing the internal structure of the apparatus shown in FIG. FIG. 1 shows a stepper as a semiconductor exposure apparatus. In the figure, reference numeral 202 denotes a reticle, and 203 denotes a wafer. When a light beam emitted from a light source device 204 illuminates the reticle 202 through an illumination optical system 205, a pattern on the reticle 202 is exposed by a projection lens 206 to a photosensitive area on the wafer 203. Can be transferred to a layer. The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. Wafer 203
Is exposed while being vacuum-sucked by the wafer chuck 291. The wafer chuck 291 is mounted on the wafer stage 20.
9 allows movement in each axis direction. Above the reticle 202, a reticle optical system 281 for detecting the amount of displacement of the reticle is arranged. Above the wafer stage 209, an off-axis microscope 282 is arranged adjacent to the projection lens 206. Off-axis microscope 282
The main role is to detect the relative position between the internal reference mark and the alignment mark on the wafer 203.
In addition, the reticle library 220 and the wafer carrier elevator 2 which are peripheral devices are adjacent to the stepper body.
The reticle 30 and the necessary reticle and wafer are transferred to the stepper body by the reticle transfer device 221 and the wafer transfer device 231.

The chamber 101 mainly comprises an air conditioner room 210 for controlling the temperature of air, a filter box 213 for filtering fine foreign matters to form a uniform flow of clean air, and a booth 214 for shutting off the environment of the apparatus from the outside. Have been. In the chamber 101, air whose temperature has been adjusted by the cooler 215 and the reheater 216 in the air conditioner room 210 is supplied into the booth 214 via the air filter g by the blower 217. The air supplied to the booth 214 is returned to the air conditioner room 210 from the return port ra.
And circulates in the chamber 101. Normally, this chamber 101 is not strictly a complete circulation system, and about 10% of the circulating air amount outside the booth 214 is supplied to the outside air provided in the air conditioner room 210 in order to always maintain a positive pressure inside the booth 214. It is introduced from the mouth oa via a blower. In this way, the chamber 101 enables the environment temperature where the apparatus is placed to be kept constant and the air to be kept clean. In addition, the light source device 204 has an intake port sa and an exhaust port e in preparation for cooling of the ultra-high pressure mercury lamp and generation of toxic gas when the laser is abnormal.
a is provided, and a part of the air in the booth 214 is forcibly exhausted to the factory equipment via the light source device 204 and the exclusive exhaust fan provided in the air conditioner room 210. Further, a chemical adsorption filter cf for removing chemical substances in the air is provided so as to be connected to the outside air introduction port oa and the return port ra of the air conditioner room 210, respectively.

FIG. 3 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG. In the figure, reference numeral 321 denotes a main unit C built in the EWS main unit 106, which controls the entire apparatus.
It is a PU and comprises a central processing unit such as a microcomputer or a minicomputer. 322 is a wafer stage driving device, and 323 is the off-axis microscope 28.
2 is an alignment detection system, 324 is a reticle stage driving device, 325 is an illumination system such as the light source device 204, 3
26 is a shutter driving device, 327 is a focus detection system,
Reference numeral 328 denotes a Z drive, which is a main body CPU 32
1 is controlled. 329 is the reticle transport device 2
21, a transfer system such as a wafer transfer device 231. 330
Is a console unit having the display 102, the keyboard 104, etc., for giving various commands and parameters relating to the operation of the exposure apparatus to the main body CPU 321. That is, it is for exchanging information with the operator. 331 is a console CPU and 332 is an external memory for storing parameters and the like.

FIG. 4 is a schematic view from above for explaining how the reticle is carried in and out of the apparatus of FIG. 1 with respect to the outside of the apparatus, and FIG. 5 is a side view thereof. Also,
FIG. 6 is a schematic diagram showing a configuration of a portion related to loading and unloading of the reticle. In these figures, reference numeral 401 denotes a delivery position when a reticle is put in and out, and is a position where the reticle library 220 (FIG. 1) exists. The manipulator (reticle transport device) 221 is located at the delivery position 4
01 is a part of the movable range. An optical sensor 402 detects intrusion of the manipulator 221 into the delivery position 401, and 601 and 602 denote optical sensors 40.
2, an optical sensor and a light source; 501, a door that is opened and closed when a reticle is put in and out; 502, a door 501;
LED 503 indicating the lock state of the lock button 503 is a push button for allowing the control program to detect a request to open or close the lock of the door 501, 6
03 is a cheat switch (door open / close sensor) for detecting the open / closed state, and 604 detects signals output from the optical sensor 402 and the door open / close sensor 603 and outputs an emergency stop signal to the control circuit of the manipulator 221. Interlock circuit.

FIG. 7 is a flowchart showing a process for unlocking the door of the door 501. If you follow this procedure,
When the control program detects that the push button 503 is pressed with the door 501 locked, the door lock unlocking process is started, and whether the manipulator 221 that may enter the transfer position 401 operates. Is determined (step S71). And the manipulator 22
If it is determined that 1 is operating, the operation is gently stopped (step S72), and if it is determined that it is not operating (waiting), the door lock is unlocked immediately (step S73). Thereafter, the fact that the door lock has been unlocked is displayed on the LED 502 (step S74), and the unlocking process ends.

FIG. 8 shows the door 5 after the reticle is loaded and unloaded after performing the unlocking operation in this manner.
11 is a flowchart showing a locking process of No. 01. According to this procedure, when the control program detects that the push button 503 is pressed while the door 501 is unlocked, the control program starts the door lock locking process and locks the door of the door 501 (step S81). Is displayed on the LED 502 (step S82). Then, manipulator 2
It is determined whether or not 21 is on standby or stopped because it was stopped in step S72 of FIG. 7 (step S83). If it is determined that it is on standby, the locking process is immediately terminated, and If it is determined that there is, the operation of the manipulator 221 is immediately restarted (step S84), and the locking process ends.

Therefore, when it is determined that the supply or collection of a wafer or a reticle needs to be performed, the operator causes the control program to detect this, and then holds the unlock. The door 501 is released, the work is performed, and after the work is completed, the door 501 is closed, and the completion of the work is detected by the control program, whereby the work can be performed safely.

On the other hand, when the optical sensor 402 detects that the manipulator 221 has entered the transfer position 401, the open / close sensor 603 detects that the door 501 is open.
, An emergency stop signal is issued from the interlock circuit 604 to the manipulator 221. Thus, safety is sufficiently ensured even when the control program is not operating normally.

The differences from the known semiconductor exposure apparatus required to realize this embodiment are the addition of the optical sensor 402, the cheat switch 603, and the interlock circuit 604, and the procedure corresponding to FIGS. 7 and 8 of the control program. Is relatively small. further,
By arranging the status display LED 502 and the push button 503 near the door 501, the above-described series of operations can be performed efficiently.

The functions of the LED 502 for displaying the unlocking / locking state of the door lock and the push button 503 for notifying the unlocking request are replaced with display and command processing in a console unit provided in a known semiconductor manufacturing apparatus. This allows the present invention to be implemented with smaller modifications to known semiconductor manufacturing equipment. 9 and 10 are screen diagrams illustrating this example. For example, when the “RETICLE” button 91 is pressed to perform an operation related to the reticle on the screen of FIG. 9, the screen of FIG. 10 is displayed. In this screen, "UNLOCK" button 9
When 2 is pressed, the above-described unlocking process is performed, and when the “LOCK” button 93 is pressed, the locking process is performed. Further, on this screen, the open / closed state of the door and the unlocked / locked state of the lock are displayed on areas 94 and 95.

In the configuration of the above embodiment, the door 5
By replacing the push button 503 for allowing the control program to detect the opening / closing request of the lock 01 and the path for transmitting the signal with a communication interface and a communication line, the door 501 is opened and closed by an actuator controlled by the control program. , Chamber 101
, A reticle may be delivered to and received from a transport system having the same communication interface.

Further, the present invention is not limited to the case of loading / unloading a reticle, but can be applied to the loading / unloading of a wafer or the like as it is to ensure safety.

[0025]

As described above, according to the present invention,
If the unlocking request is met, identify the operating manipulator that may interfere with the work through the door, suspend only the identified operation of the manipulator and unlock it, and if there is a locking request , The operation of the suspended manipulator is resumed and locking is performed, so that the supply and collection of the reticle or wafer to the semiconductor exposure equipment can be executed at any time, and the time to wait for the completion of the exposure processing is omitted. Thereby, the working efficiency of the worker and the operating efficiency of the semiconductor device manufacturing line can be improved. In addition, higher safety can be ensured in the operation of supplying and collecting a reticle or a wafer as compared with the related art.

On the other hand, if only an interlock mechanism for instantly stopping the manipulator when the door is unlocked during the operation of the manipulator is employed, the same safety can be ensured, but the operation of the manipulator and the Interference with the worker's work frequently occurs, and the manipulator is stopped urgently each time.However, since the manipulator attached to a semiconductor exposure apparatus or the like requires high positional accuracy, the emergency stop described above is required. Thereafter, it is difficult to immediately continue the operation while maintaining the positional accuracy. On the other hand, according to the present invention, when the control program is operating normally, the manipulator is always gently stopped, that is, temporarily stopped so that the operation can be restarted and continued. The operation of the manipulator can be restarted instantaneously.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a semiconductor exposure apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing the internal structure of the device of FIG.

FIG. 3 is a block diagram showing an electric circuit configuration of the device shown in FIG.

FIG. 4 is a schematic view seen from above for explaining a state of loading and unloading of a reticle with respect to the outside of the apparatus in the apparatus of FIG. 1;

FIG. 5 is a side view of FIG. 4;

FIG. 6 is a schematic diagram showing a configuration of a portion related to loading and unloading of a reticle of the apparatus of FIG. 1;

FIG. 7 is a flowchart showing a door lock unlocking procedure in the apparatus of FIG. 1;

FIG. 8 is a flowchart showing a door lock locking procedure in the apparatus of FIG. 1;

FIG. 9 is a diagram showing an example of a screen in the apparatus shown in FIG. 1;

FIG. 10 is a diagram showing another example of the screen in the apparatus shown in FIG. 1;

[Explanation of symbols]

91, 92, 93: button, 94, 95: area, 10
1: temperature control chamber, 102: EWS display device, 103: operation panel, 104: EWS keyboard, 105: monitor TV, 106: EWS body, 10
7: ON-OFF switch, 108: emergency stop switch, 109: various switches, mouse, etc. 110: LAN
Communication cable, 111: exhaust duct, 112: exhaust device, 202: reticle, 203: wafer, 204: light source device, 205: illumination optical system, 206: projection lens, 20
7: reticle stage, 209: wafer stage, 28
1: reticle microscope, 282: off-axis microscope, 2
10: air conditioner room, 213: filter box, 214:
Booth, 217: blower, g: air filter, cf: chemical adsorption filter, oa: outside air introduction port, ra: return port, 321: main body CPU, 330: console, 33
1: console CPU, 332: external memory, 401:
Delivery position, 402: optical sensor, 601 and 60
2: light sensor and light source, 501: door, 502: LE
D, 503: push button, 603: cheat switch (door open / close sensor), 604: interlock circuit.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/027 G05B 19/18

Claims (6)

(57) [Claims] 1. A delivery position where a substrate is supplied from outside the apparatus.
Transporting the substrate supplied to the door and the substrate supplied to the transfer position inside the apparatus.
A plurality of manipulators, an input unit performed for unlocking request and lock requesting device of the door, in response to the unlocking request, identifies the manipulator during operation with a work and may interfere through the door Suspending only the operation of the identified manipulator,
Performs unlocking of the door is locked, in response to said locking request, row locking of the door is locked
Have, and unlocking locking means for resuming the operation of the manipulator paused, the door is open, the manipulator is the delivery
When it is detected that the
And an emergency stop means for urgently stopping the operation of the semiconductor device. 2. The method of claim 2, wherein said door is open.
2. The semiconductor manufacturing apparatus according to claim 1, wherein the detection is performed by a switch . 3. The method according to claim 1, wherein the manipulator is in the delivery position.
Intrusions can be detected by optical sensors.
3. The semiconductor manufacturing apparatus according to claim 1, wherein: 4. Via a door mounted at the delivery position
The board is supplied from outside the machine, and the manipulator is used to
A process for transporting the substrate supplied to the transfer position inside the device
A method of manufacturing a semiconductor device through a degree, and performing input requesting unlocking of the door with respect to the apparatus, in response to a request of the unlocking, a work and may interfere through said door operation Identify the manipulator inside,
Suspending only the specified operation of the manipulator, unlocking the locked door, inputting a request for locking the door to the device, and requesting this locking. Responsively, locking the unlocked door and resuming the operation of the manipulator during a pause, the door being open and the manipulator being
When it is detected that the
Semiconductors device manufacturing method characterized by comprising the step of emergency stop the operation of the over data, the. 5. The method of claim 1, wherein said door is open.
5. The method according to claim 4 , wherein the detection is performed by a switch . 6. The method according to claim 6, wherein the manipulator is in the delivery position.
Intrusion is detected using an optical sensor.
The semiconductor device manufacturing according to claim 4 or 5, wherein
Method.