JP3234062B2 - Semiconductor package and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package and a method of manufacturing the same, and more particularly, to a thin or compact semiconductor package suitable for an external storage medium which can be detached and replaced, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Various types of memory cards such as IC cards are known as storage devices or storage elements capable of recording and storing various data. In the configuration of this kind of cards, the size and thickness of the card are limited, so that, for example, a thin mounting of an IC element contributing to a memory function or the like is required, and it is also possible to package the IC element. It is desired to achieve a compact and compact design.

In order to meet such requirements for thin mounting, for example, mounting in a space of 1 mm or less in the thickness direction, TAB (Tape Automated Bonding), flip chip mounting, COB (Chip on Board) The law is known. Further, as an example of a thin package, as shown in a sectional view of a main part in FIG. 6, for example, a resin-based circuit board 2 for mounting and mounting a required IC chip 1 and the like on one main surface;
A configuration including an external connection terminal 4 led out to the other main surface side of the resin circuit board 2 through the through hole 3 and a mold resin layer 5 for sealing and covering a mounting area surface of the IC chip 1 and the like. Modules are known. In FIG. 6, reference numeral 6 denotes a bonding wire.

[0004]

However, the above-mentioned T
In the case of the AB method, in addition to the relatively high manufacturing cost of the carrier tape, a special mold and a bonding tool are required according to the package size in the mounting process, so that the assembly cost is relatively high. There is an economic problem as a practical means.

On the other hand, in the case of the flip-chip mounting and the COB method, since a burn-in test cannot be performed on the IC chip 1 to be used in advance, there is a problem in reliability. In other words, this type of IC chip 1 cannot perform a so-called burn-in test for detecting a defect that will appear in the near future as a chip itself.
This has the potential to cause trouble at the early stage of practical use after modularization, and it can be said that there is a problem in terms of reliability. This reliability problem can be dealt with by mounting / dismounting / exchanging means such as the mounted IC chip 1, that is, repair or rework, but as a result, the assembly cost is further increased. Become. In particular, in the case where the IC chip 1 with the increased number of terminals is mounted by the COB method, in any case, a large amount of time is required for assembly, which increases the cost.

Further, in terms of compactness, the TAB method and the COB method require a larger mounting area than the flip-chip mounting method, which hinders compactness. For a packaged module by generic (regular)
In the transfer molding process, a flow of the bonding wire 6 and a detachment of the connection portion are apt to occur, which causes problems in reliability and yield. At present, it is difficult to control the height of the bonding wire to 0.1 mm or less, which is an obstacle to forming a thin package.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is a thin and low-cost semiconductor package capable of guaranteeing high reliability, and a manufacturing method capable of manufacturing the semiconductor package at low cost and high yield. The purpose is to provide a method.

[0008]

According to a method of manufacturing a semiconductor package according to the present invention, an electronic component including at least one IC chip is provided on one main surface of a resin-based substrate having a wiring circuit. A step of aligning and arranging the corresponding connecting terminals and the face-down type, and a step of assembling a module by fixing and connecting the corresponding connecting terminals of the resin-based substrate surface and the electronic components by flip chip bonding. The assembled module is mounted and placed in a mold that can be evacuated and decompressed, and the hardening mold resin is injected in liquid form into the evacuated and depressurized mold, and the electronic component mounting surface of the module is mounted. Molding the side.

According to the present invention, one principal surface (one side) of a resin substrate is provided.
In addition, the required electronic components including the IC chip are mounted, and the mounted electronic components are molded and sealed with a single-sided mold to achieve a thin, compact and low cost. The main point is that the external connection terminals are led out to the other main surface side (non-mold surface side) of the system substrate, and can be easily formed by carding.

In the process of manufacturing the semiconductor package, when assembling a module by fixing and connecting the connection terminals corresponding to and aligned with the resin-based substrate surface and the electronic component, the connection terminals on the resin-based substrate surface may be, for example, A relatively simple means such as a structure in which a conductive paste is formed and a connection terminal of a corresponding electronic component is press-fitted and connected may be employed.

[0011]

The semiconductor package according to the present invention has a flip chip.
Harden electronic components including chip-bonded IC chips.
The single-sided molding using the mold resin allows not only protection and stabilization associated with dense sealing, but also a reduction in thickness and size. That is, since the semiconductor device is stable in characteristics and has high reliability, the semiconductor device has a function as a thin and compact semiconductor package suitable for, for example, cards. Further, according to the method of manufacturing a semiconductor module according to the present invention, a resin for a hardening mold (for example, an epoxy resin) is injected in a liquid state into a mold in which a single-sided mold is vacuumed and decompressed. By performing the molding, it is possible to obtain a highly reliable semiconductor package with a high yield without breaking the previously assembled module, for example, without peeling off the terminal connection portion.

[0012]

Embodiment 1 An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a sectional view showing an example of a configuration of a main part of a semiconductor package according to the present invention. Reference numeral 7 denotes a resin circuit board having a region for mounting and mounting electronic components on one principal surface;
Reference numeral 9 denotes an electronic component such as a required IC chip mounted and mounted on one main surface of the resin circuit board 7. Reference numeral 9 denotes another side of the resin circuit board 7 through the through hole 10 of the resin circuit board 7. The external connection terminal led out to the IC chip 8
This is a mold resin layer that seals and covers the surface of the mounting area, such as. In this configuration example, the connection terminals (connection pads) 7a on the surface of the resin-based circuit board 7 are formed of conductive paste, and the corresponding connection bumps 8a of the mounted and mounted IC chip 8 are press-fitted. Thereafter, the conductive paste is cured and fixedly connected.

Next, an example of manufacturing the semiconductor package having the above configuration will be described.

First, a wiring including a connection terminal portion for flip-chip mounting is provided on one surface (one main surface), and a back surface (another main surface) is provided through a through hole 10 provided on the outer peripheral side of the connection terminal portion. 2), a resin circuit board 7 having a configuration in which the external connection terminals 9 are led out is prepared. This resin-based circuit board 7 has a length of 20 mm, a width of 10 mm, a thickness of 0.2 mm, a length of 15 mm, a width of 5 mm, for example.
The IC chip 8 having a thickness of 0.25 mm and a thickness of 0.25 mm is mounted and mounted.

Next, the resin-based circuit board 7 is fixed on, for example, a stage of a screen printer having a vacuum suction mechanism, and connection pads 7a corresponding to the electrode terminals of the IC chip 8 are formed. That is, a thickness of 100 μm having an opening (for example, 150 × 150 μm) corresponding to an electrode terminal (for example, 100 × 100 μm) of the IC chip 8 to be mounted / mounted.
Using a metal mask, a silver paste (for example, silver particle diameter 1 μm, viscosity 1000 ps) is screen-printed on one main surface of the resin circuit board 7, and a connection having a diameter of 150 μm and a height of about 80 μm is formed on the connection terminal surface. Pads 7a are formed. On the other hand, an IC chip 8 is prepared in which gold bumps (for example, height 30 μm, 100 × 100 μm) 8 a for connection are formed on the electrode terminal surfaces by electroplating.

A connection pad 7a and a connection gold bump 8a corresponding to the IC chip 8 are aligned and arranged on one main surface of the resin-based substrate 7, and the surface of the resin-based substrate 7 and the electronic component 8 Corresponding and aligned connection terminals 7
The modules a and 8a are press-fitted to each other and press-fitted into the connection pad 7a so as to embed at least the tip of the connection bump 8a, and fixedly connected to assemble the module. In this step, the surface of the resin-based substrate 7 and the IC chip 8 are coated with an insulating adhesive in a region other than the joint between the connection terminals 7a and 8a.
The connection and fixing may be reinforced by bonding to the lower surface. In this state, the so-called flip-chip bonding is completed by thermally curing the silver paste forming the connection pads 7a. As shown in cross-section in FIG. The connection is achieved and the desired semiconductor module is assembled.

Next, the assembled module is mounted and arranged in a mold for injection molding, which can be evacuated and decompressed,
The molding resin is injected into the mold under pressure to mold the electronic component mounting surface side of the module. FIG. 3 schematically shows an embodiment of this step. The mold 12 includes a mold (upper mold) 12a with a heating device, a mold (lower mold) 12b with a heating device, and a pressurizing mechanism 13. A vacuum pump 14 for evacuating and depressurizing the inside of the mold 12, a resin supply mechanism 15 for supplying a molding resin into the mold 12, and switching between vacuum / decompression and normal pressure inside the mold 12. The assembled module is mounted and arranged in a mold apparatus for injection molding including the valve 16. On the other hand, the vacuum pump 14 is operated to evacuate and depressurize the inside of the mold apparatus for injection molding, and then the low-viscosity epoxy resin in the resin supply mechanism 15 is injected into the module where the assembled module is mounted. Supply into mold equipment for molding
Fill. Thereafter, the heating device for the molds 12a and 12b is operated, and the mold 12 is heated and held at the curing temperature of the molding resin to cure the molding resin, whereby the semiconductor having the configuration shown in FIG. You can get the package.

The semiconductor package thus configured has a total thickness.
This means that, for example, when the total thickness is the same, the IC chip 8 and the resin-based substrate 7 to be mounted and mounted by the height of the bonding wire as compared with the case where the semiconductor module by the COB method is used. Can be set thicker, which means that it is easier to manufacture and superior in mass productivity. Conversely, if the thickness of the IC chip 8 and the resin-based substrate 7 to be mounted are the same, there is an advantage that the total thickness can be reduced.

In the case of injection molding in this embodiment, the resin used for the mold is a relatively low-viscosity or liquid epoxy resin and the inside of the mold is evacuated and decompressed.
Fluidity is also improved, and resin penetration (entry) into the micro-areas of the module progresses smoothly, enabling dense filling and molding, and detachment between the corresponding connection pads 7a and connection bumps 8a. Also, the fear of damage to the IC chip 8 or the like is completely eliminated. Such a phenomenon provides a significant improvement or advantage over the problems often encountered in conventional general single-sided mold encapsulation. In other words, in the conventional molding means, it is necessary to inject the molding resin at a high pressure in order to infiltrate (enter) the resin into the fine area of the module, etc., so that the resin-based substrate 7 itself may be damaged or the connection pads 7a may be damaged. Damage, and furthermore, damage to the connection bumps 8a of the IC chip 8 and the like are liable to occur, so that it can be said that this brings many practical advantages as compared with the difficulty in obtaining a semiconductor package with high yield.

As a comparative example, FIG.
In the above configuration, a resin-based board with a thickness of 0.2 mm and a thickness of 0.25
The IC chip of mm is mounted and arranged and connected by wire bonding (height of the wire bonding part is 0.15 mm), the thinnest part of the mold resin layer is 0.05 mm, and the total thickness is 0.65 mm, as described above. Thinning has been alienated.

In the above configuration example, the external connection terminals 9 are led out to the back side of the resin-based substrate 7, but, for example, as shown in FIG. It may be.

Embodiment 2 In the IC chip 8 in the embodiment 1, solder (for example, 63Sn-37Pb) is applied to the electrode terminal surface (100 × 100 μm) by so-called selective plating or vapor deposition (using a solder mask). Using a 100μm-high connection pad 8a formed by a flip chip bonder,
Position IC chip 8 on one main surface of resin-based substrate 7
After being temporarily fixed, the semiconductor module was passed through a reflow furnace and heated to a temperature equal to or higher than the solder melting temperature (183 ° C.) to perform flip chip bonding, thereby assembling a semiconductor module.

Next, a semiconductor package was manufactured by performing molding under the same conditions using the same mold apparatus for injection molding as in the case of the first embodiment. As in the case of the first embodiment, this semiconductor package was thin and compact, had high characteristic reliability, and had a good yield.

It should be noted that the present invention is not limited to the configuration described above, and various modifications can be made within the spirit of the invention. For example, a plurality of IC chips to be mounted and mounted may be provided as shown in FIG.

[0026]

As can be seen from the above description, the semiconductor package according to the present invention can be easily made thin and compact.
In addition, since the reliability of characteristics and functions is high, it can be said that it is suitable as a functional component for a card, for example. In particular,
The ability to reduce the thickness allows the selection and setting range of the thickness of the resin-based substrate and the thickness of the IC chip to be mounted and mounted to be expanded. Since the adjustment is possible, it can be said that it also contributes to the expansion of applications.

Further, according to the method of manufacturing a semiconductor package according to the present invention, a semiconductor package having excellent functions as described above can be manufactured in good yield and in mass production. It can be said that they bring many advantages in practical use. In the COB method and the flip chip mounting, as described above, since it is impossible to perform a burn-in test, it is difficult to guarantee the reliability. On the other hand, in the semiconductor package according to the present invention, a burn-in test can be performed after injection molding, so that a highly reliable mounting circuit device can be configured without using a so-called repair technique. That is, by mounting and mounting the semiconductor package according to the present invention, high reliability can be guaranteed, and as a result, yield can be improved and manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a configuration of a main part of a semiconductor package according to the present invention.

FIG. 2 is a cross-sectional view showing a configuration example of a main part of a semiconductor module constituting a semiconductor package according to the present invention.

FIG. 3 is a cross-sectional view schematically showing an outline of an embodiment of a resin mold in a semiconductor package manufacturing process according to the present invention.

FIG. 4 is a cross-sectional view showing another configuration example of the main part of the semiconductor package according to the present invention.

FIG. 5 is a cross-sectional view showing an example of a configuration of a main part of another semiconductor module constituting the semiconductor package according to the present invention.

FIG. 6 is a cross-sectional view showing a main part configuration of a conventional semiconductor package.

[Explanation of symbols]

1,8 ... IC chip 2,7 ... Resin substrate 3,10
... Through holes 4, 9 ... Terminals for external connection 5 ... Mold resin layer 6 ... Bonding wires 7a ... Pads for connection 8a ... Pumps for connection 11 ... Mold resin layer
12 Mold for mold 12a Mold for heating device (upper mold) 12b Mold for heating device (lower mold) 13 Pressure mechanism 14 Vacuum pump 15 Resin supply mechanism for molding 16 Switching valve

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/56 H01L 21/60 311 H01L 23/28

Claims (1)

(57) [Claims] 1. A resin-based substrate provided with a wiring circuit on one principal surface,
A step of aligning and arranging an electronic component including at least one IC chip in a face-down manner with a corresponding connection terminal on the resin-based substrate surface, and a connection for matching and aligning the resin-based substrate surface and the electronic component. A step of assembling a module by fixing and connecting the terminals to each other by flip chip bonding, and mounting and disposing the assembled module in a mold that can be evacuated and decompressed, and a mold in which the hardening mold resin is evacuated and decompressed. And injecting a liquid into the module, and molding the electronic component mounting surface side of the module.