JP3225459B2 - Heating part cooling structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for a heating section.

[0002]

2. Description of the Related Art In recent years, with the increase in the density of LSI elements such as CPUs, the cooling method has become a serious technical problem, while the size of the entire device has been reduced. Heat dissipation and cooling are becoming more difficult.

Therefore, conventionally, it has been attempted to provide a heat radiating portion outside the device or the like, and thermally connect the heat generating portion and the heat radiating portion in the device with a heat conductor having good thermal conductivity.

[0004]

However, in the above-mentioned conventional example, aluminum or a heat pipe is used as a heat transfer member. However, since these heat transfer members cannot be bent freely, the heat transfer member cannot be freely bent in the apparatus. It has a drawback that it is difficult to route it.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks. The present invention is applied to an LCD unit which needs to pass through a small space, especially an LCD unit which needs to pass through a narrow space, or an outside of the apparatus which is far away from a heating unit. It is an object of the present invention to provide a cooling structure for a heat-generating portion that can improve the heat-radiating efficiency of the heat-radiating portion by arranging the heat-radiating portion freely.

[0006]

SUMMARY OF THE INVENTION According to the present invention, an object of the present invention is to provide a heat-generating device in which a heat-generating portion and a heat-radiating portion which are spaced apart from each other are thermally connected by a heat-transfer body, and the heat generated by the heat-generating portion is radiated by the heat-radiating portion. A cooling structure of the section, wherein the heat transfer element includes a plurality of heat transfer elements formed of a material having good heat conductivity;
Made of a material with good thermal conductivity interposed between heat elements
A filler material consisting of acicular, or granules are, outside
This is achieved by providing a cooling structure for a heat generating portion that is formed to be bendable by an insulating layer covering the periphery .

In the present invention, the heat generating portion 1 housed inside the device and the heat radiating portion 2 arranged at a position having good heat radiation efficiency such as the outside of the device or the outer wall portion of the device are thermally connected by the heat transfer member 3. The heat generated by the heat generating portion 1 is quickly transmitted to the heat radiating portion 2.

The heat transfer body 3 is formed in a flat cross-sectional shape by a plurality of heat transfer element bodies 4, 4,..., Which facilitates bending in one direction, and is provided in a space having a narrow width or height. It is possible to insert.

The heat transfer element 4 is a thin wire made of a material having good heat conductivity such as aluminum and having a length capable of independently transferring heat from the heat generating portion 1 to the heat radiating portion 2. The heat transfer element 4 is formed by arranging the heat transfer elements 4 in parallel with each other or by knitting the heat transfer elements 4 in a mesh shape.

The heat transfer element 3 is composed of a number of heat transfer elements 4, 4,...
With this configuration, it is possible to increase the heat transfer cross-sectional area of the heat transfer body 3 while maintaining flexibility, and it is easy to route the heat transfer inside the apparatus. For example, it becomes easy to dispose the heat radiating portion 2 at a movable portion.

[0011] the heat transfer body 3, in addition to forming a fine line-shaped heat transfer element body 4, a number of foil-like heat transfer element assembly 4, 4, ... formed by a material having good thermal conductivity Can also be formed by laminating.

In order to improve the heat transfer efficiency of the heat transfer member by substantially increasing the cross-sectional area of the heat transfer portion , a filler material formed of a material having good heat conductivity is provided between the heat transfer elements 4. Is interposed.

The filler material is a needle-like or granular material such as aluminum or copper, and is interposed between the heat transfer elements 4 to enable heat conduction between the heat transfer elements 4. , Which contribute to a substantial increase in cross-sectional area.

Means for interposing the filler material can be achieved by simply enclosing the filler material when the heat transfer body 3 has an outer skin. In the case of joining and integrating with a synthetic resin or the like, it is sufficient that the synthetic resin material 6 is kneaded with a filler material in advance.

[0015] Also, the insulating layer 5 having electrical insulation on the outer periphery
Is formed, it is possible to dispose the heat transfer body 3 in the device without worrying about a short circuit with an element or the like in the device.

Further, as described in claim 2 , the heat transfer member 3 is detachably connected to at least one of the heat generating portion 1 and the heat radiating portion 2 , so that the heat generating portion 1 and the heat radiating portion 2 are exchanged. Becomes easier.

[0017]

[0018]

[0019]

[0020]

FIG. 1 shows an embodiment of the present invention. In this embodiment, a high heat generating element 1 housed in an apparatus main body 70 of a portable information processing apparatus such as a notebook personal computer is described.
Reference numeral 7 denotes a case where cooling is performed. Reference numeral 7 denotes a mounting board housed in the apparatus main body 70, reference numeral 1 denotes a heating unit mounted on the mounting board 7, a high heating element 10, and a heat sink surface of the high heating element 10. And a heat receiving block 11 fixed thereon and formed of a material having good thermal conductivity such as aluminum.

Reference numeral 2 denotes a heat radiating portion fixed to the outer wall of the apparatus main body 70, and is formed in a block shape from a material having good heat conductivity such as aluminum. In order to improve the heat radiation effect in the heat radiation part 2, the heat radiation part 2 is provided with a plurality of heat radiation fins, or the fan device 20 can be mounted as desired.

Reference numeral 3 denotes a heat transfer body for thermally connecting the heat receiving block 11 and the heat radiating section 2 to each other.
1 and the heat radiating section 2. Heat transfer body 3
2A is an aggregate of fine wires (heat transfer elements 4) formed of a material having good heat conductivity such as aluminum, as shown in FIG. The cross section is flat and oblong.

In addition to the structure shown in FIG. 2 (a), the structure of the heat transfer body 3 may be such that a plurality of fine wires are twisted and formed into a rope shape. The cross-sectional shape can be easily handled because the flat shape can be easily bent in the thickness direction, but may be a circular cross-sectional shape. Further, although the outer skin is not always necessary, when the outer skin is formed of an insulating material, the heat transfer body 3 can be freely connected to the device main body 70 without worrying about an electrical short circuit with an electronic component on the mounting board 7. It can be routed within.

Further, as the heat transfer element 4, besides the thin wire form, it is possible to use a foil form as shown in FIG. 2 (b). After laminating the body 4, the outermost periphery may be covered with an outer skin.

When the heat transfer elements 4, 4,... Are connected to each other by a synthetic resin or the like, the handling as the heat transfer element 3 is increased because the integrity of the heat transfer element 3 is increased.
If the synthetic resin material 6 is kneaded with a filler material formed of a material having good thermal conductivity such as aluminum, heat is transferred between the heat transfer elements 4, 4,... Via the filler material. Thus, the same effect can be obtained as when the substantial cross-sectional area of the heat transfer body 3 is increased.

In this way, the heat transfer element 4 formed of a material having good heat conductivity, which is formed by bending the synthetic resin material 6 kneaded with a filler material, can be used alone. In this case, an insulating layer 5 having electrical insulation properties can be separately formed on the outer surface of the cable.

In order to detachably attach the heat transfer member 3 to the heat radiating section 2 or the like, a heat transfer connection 9 is attached to an end of the heat transfer member 3 to form a heat transfer cable 9. Heat transfer connector 8
As shown in FIGS. 3 and 4, the heat transfer plate 12 is detachably connected to the heat transfer plate 12 by sandwiching a heat transfer plate 12 projecting from the heat receiving block 11. A fixed block 80 fixed to the distal end, a sandwiching block 82 connected to the fixed block 80 via a link 81, and a pivotally rotatably supported by the fixed block 80 to operate the sandwiching block 82. An operation lever 83 is provided.

Fixed block 80 and clamping block 82
Is a block body made of a material having good thermal conductivity such as aluminum. A torsion spring 84 having a straight rod portion also serving as a link 81 is mounted around a hinge pin for pivotally supporting the operation lever 83. Figure 3
In (b), it is urged in the direction of arrow A.

Therefore, in this embodiment, FIG.
When the operating lever 83 is turned in the direction of arrow B from the open state shown in FIG.
The straight rod portion (link 81) rotates to pinch the block 82
Moves down. When the sandwiching block 82 moves downward, the heat transfer plate section 12 is in a state of being sandwiched between the sandwiching block 82 and the fixed block 80.

The operating lever 83 is
After contacting the heat transfer plate portion 12, the torsion spring 84 is bent during the overstroke operation, and the pinching block 82 is moved to the heat transfer plate portion 12 by its elastic restoring force. Press.

In FIG. 3B, reference numeral 83a denotes a lock projection provided on the operation lever 83, 83b locks the lock portion 83a at the stroke end position, and opposes the operation lever 83 against the restoring force of the torsion spring 84. 4 shows a locking recess for holding the end position of the stroke.

FIG. 5 shows a modification of the heat transfer connector 8. In this modification, the fixed block 80 includes a hinge tongue 80.
is formed, and a pinching block 82 having an operation portion 82b is pivotally supported around a hinge pin 80b inserted into the hinge tongue piece 80a.

Around the hinge pin 80b, a torsion spring 84 for urging the pinching block 82 to the position shown in FIGS. 5A and 5B is provided. Thus, the connection is completed by rotating the pinching block 82 against the urging force of the torsion spring 84 and then shifting to the state shown in FIG. 5B by the urging force of the torsion spring 84.

FIG. 6 shows another modification of the heat transfer connector 8.
In this modification, a connecting block 85 having a plurality of heat transfer pins 85a, 85a,... Protrudingly fixed to the heat receiving block 11, and the heat transfer pin 85a is provided on the heat transfer body 3 side. Is fixed, and the heat transfer element 3 is connected by connecting the connection block 85 and the connection block 86 formed of a material having good thermal conductivity. The heat appropriate group of the heat receiving block 11 is performed. In FIG. 6, reference numeral 87 denotes a lock for maintaining the connected state of the connecting block 85 and the connected block 85.

In the above description, the heat receiving block 11
Although the case where the heat transfer body 3 is detachably connected to the heat dissipating unit 2 is shown, the heat transfer unit 3 is also detachably connected to the heat radiating unit 2. FIG. 7 shows how the heat transfer cable 9 is used in a portable information processing device. In this example, the information processing apparatus is formed by rotatably mounting a display unit 71 on an apparatus main body 70, and the apparatus main body 70 and the display unit 71 are detachably connected by a heat transfer cable 9.

Therefore, in this example, after the heat generated from the high heat generating element 10 is transmitted to the heat receiving block 11,
The heat is transmitted to the heat transfer cable 9 through the heat transfer body 3 in the device main body 70, and is radiated from the heat radiator 2 disposed on the rear wall of the display unit 71.

When the heat transfer body 3 of the heat transfer cable 9 is fatigued or broken by the opening / closing operation of the display unit 71,
The heat transfer cable 9 may be detached from the display unit 71 and the apparatus main body 70, and another heat transfer cable 9 may be attached.

FIG. 8 shows another example of use of the heat transfer cable 9. In this example, heat generated by the high heat-generating element 10 in the apparatus main body 70 is radiated in a heat exchanger 72 separate from the apparatus main body 70. By separately providing the heat exchanger 72, the heat radiation effect is further enhanced. be able to. FIG. 8 shows a case where one heat exchanger 72 is connected to one apparatus main body 70, but a plurality of apparatus main bodies 70 are connected to one heat exchanger 72. It is also possible.

[0039]

As is apparent from the above description, according to the present invention, since the heat radiating portion can be freely arranged at a position separated from the heat generating portion such as the outer wall of the apparatus, the cooling efficiency of the heat generating portion can be reduced. Can be improved.

[Brief description of the drawings]

FIG. 1 is a view showing the present invention, wherein FIG.
(B) is a figure which shows a heat transfer body.

FIG. 2 is a sectional view of a heat transfer body.

FIGS. 3A and 3B are views showing a heat transfer connection body, wherein FIG.
(B) is a right side view, and (c) is an enlarged view near the rotation center of the operation lever.

FIGS. 4A and 4B are views showing a connection state of the heat transfer connection body, wherein FIG. 4A is a front view, FIG. 4B is a right side view, and FIG. 4C is an enlarged view near the rotation center of the operation lever.

5A and 5B are diagrams showing a modification of FIG. 3, wherein FIG. 5A is a diagram showing a heat transfer connecting body, FIG. 5B is a diagram showing a connection state to a heat receiving block, and FIG. is there.

6A and 6B are views showing another modification of FIG. 3, wherein FIG. 6A is a front view and FIG. 6B is a plan view.

FIG. 7 is a diagram showing a use state of the heat transfer cable.

FIG. 8 is a diagram showing a modification of FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat generating part 10 High heat generating element 11 Heat receiving block 2 Heat radiating part 3 Heat transfer body 4 Heat transfer element 5 Insulating layer 6 Synthetic resin material 7 Mounting board 70 Device main body 72 Heat exchanger 8 Heat transfer connecting body 9 Heat transfer cable

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-57-1299 (JP, A) JP-A-5-102355 (JP, A) JP-A-5-16275 (JP, A) JP-A 8- 42983 (JP, A) JP-A-61-12097 (JP, A) JP-A-7-162177 (JP, A) JP-A-5-299545 (JP, A) JP-A-5-48280 (JP, A) JP-A-3-200397 (JP, A) JP-A-60-155113 (JP, U) JP-A-59-9589 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 7/20 H01L 23/36

Claims (3)

(57) [Claims] 1. A cooling structure for a heat-generating portion, wherein a heat-generating portion and a heat-radiating portion are thermally connected to each other by a heat-transfer member, and heat generated by the heat-generating portion is radiated by the heat-radiating portion. , it is formed by a material having good thermal conductivity
Shaped by multiple heat transfer elements and a material with good thermal conductivity interposed between the heat transfer elements
A cooling structure for a heat-generating portion formed so as to be bendable by a filler material formed of a needle-like or granular material and an insulating layer covering the outer periphery . 2. The heat transfer device according to claim 1, wherein the heat transfer member includes a heat generating portion and a heat radiating portion.
The cooling structure of the heat generating unit according to claim 1 , wherein the cooling structure is detachably connected to at least one of the heat generating units. 3. A high heat generating element is mounted by said heat conductor.
Connecting the main unit and a heat exchanger separate from the main unit
The cooling structure of the heat generating section according to claim 1 or 2, wherein heat generated in the apparatus main body is cooled in the heat exchanger .