JP2930923B2 - Cooling structure, portable electronic device using the same, and method of forming cooling structure - Google Patents
Cooling structure, portable electronic device using the same, and method of forming cooling structureInfo
- Publication number
- JP2930923B2 JP2930923B2 JP33857697A JP33857697A JP2930923B2 JP 2930923 B2 JP2930923 B2 JP 2930923B2 JP 33857697 A JP33857697 A JP 33857697A JP 33857697 A JP33857697 A JP 33857697A JP 2930923 B2 JP2930923 B2 JP 2930923B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- diffusion sheet
- pressing member
- heat diffusion
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、熱拡散シートを
利用してマイクロプロセッサ等の発熱部品を冷却する冷
却構造及びその形成方法に関し、更にはその冷却構造を
使用する携帯型電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for cooling a heat-generating component such as a microprocessor using a heat diffusion sheet and a method for forming the same, and further to a portable electronic device using the cooling structure.
【０００２】[0002]
【従来の技術】近年、マイクロプロセッサをはじめとす
る各種電子部品の小型化及びその動作周波数の高周波化
が進行しており、これに伴い、電子部品を効率的に冷却
する手段がますます強く求められるようになってきた。
特に、小型且つ軽量であることが求められる携帯電子機
器では、その内部に設ける冷却構造に対して、小型且つ
軽量であることと同時に、発熱しやすい電子部品をでき
るだけ効率的に冷却する能力が求められている。小型且
つ軽量であることという第１の要請に応える手法として
は、電子部品にて発生した熱を筐体に逃がし、筐体を自
然空冷する手法がある。この手法によれば、強制冷却用
の部材が不要であるため、発熱しやすい電子部品（以
下、単に発熱部品と呼ぶ）を強制冷却する手法に比べ、
小型且つ軽量な冷却構造を提供できる。2. Description of the Related Art In recent years, various electronic components such as microprocessors have been miniaturized and their operating frequencies have been increased, and accordingly, means for efficiently cooling electronic components have been increasingly required. It has come to be.
In particular, in a portable electronic device that is required to be small and lightweight, a cooling structure provided inside the portable electronic device is required to have a capability of cooling an electronic component that easily generates heat as efficiently as possible while being small and lightweight. Have been. As a method for responding to the first requirement of small size and light weight, there is a method in which heat generated in electronic components is released to a housing and the housing is naturally cooled by air. According to this method, since a member for forced cooling is unnecessary, compared with a method of forcibly cooling an electronic component that easily generates heat (hereinafter, simply referred to as a heat-generating component),
A small and lightweight cooling structure can be provided.
【０００３】特開平６−１３４９１７号公報や特開平８
−２３１８３号公報に開示されているグラファイトやそ
の複合材から形成されたシートを、発熱部品にて発生し
た熱を筐体に逃がす手段として用いることにより、更に
小型且つ軽量な冷却構造を実現できる。更に、グラファ
イトやその複合材は、その熱伝導性がよいという特質を
有しているから、携帯電子機器用冷却構造に対する第２
の要請であるところの効率的冷却を達成するにも、有効
である。図１１に、グラファイト又はその複合材のシー
トを発熱部品から筐体への熱輸送に用いた携帯電子機器
を示す。この図では、マイクロプロセッサ等の発熱部品
１が回路基板２に搭載されており、回路基板２は携帯型
電子機器の筐体３の中に収納されている。グラファイト
やその複合材から形成されている熱拡散シート（ヒート
スプレッダシート）４は、まず発熱部品の位置に応じて
絞り加工し、その後、熱拡散シート４の絞り加工部位
（凸部）が発熱部品１に接触するよう筐体３の内壁面に
固着するという手法で、携帯電子機器内部に組み込まれ
る。[0003] Japanese Patent Application Laid-Open Nos. 6-134917 and 8
A smaller and lighter cooling structure can be realized by using a sheet formed of graphite or a composite material thereof disclosed in JP-A-23183 as a means for releasing heat generated by a heat-generating component to a housing. Further, graphite and its composite material have the characteristic of having good thermal conductivity, so that the second structure for the cooling structure for portable electronic devices is required.
It is also effective in achieving the efficient cooling that is required. FIG. 11 shows a portable electronic device in which a sheet of graphite or a composite material thereof is used for transporting heat from a heat-generating component to a housing. In this figure, a heat-generating component 1 such as a microprocessor is mounted on a circuit board 2, and the circuit board 2 is housed in a housing 3 of a portable electronic device. The heat diffusion sheet (heat spreader sheet) 4 made of graphite or its composite material is first drawn according to the position of the heat-generating component, and then the drawn portion (convex portion) of the heat diffusion sheet 4 is formed by the heat-generating component 1. It is built into the portable electronic device by a method of being fixed to the inner wall surface of the housing 3 so as to be in contact with the electronic device.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、この種
の材料にはその加工性の悪さに起因した各種の問題があ
る。即ち、グラファイトやその複合材は一般に柔軟性を
有しているためいわゆる深絞りが難しく、発熱部品１に
接触する程度まで絞ろうとすると図１１に示されるなだ
らかな絞り形状となる。このような絞り形状では、第１
に、熱拡散シート４が発熱部品１の表面に密着しにくい
ため、発熱部品１にて生じた熱を効率的に熱拡散シート
４に移転することが難しい。第２に、熱拡散シート４に
よる熱輸送距離即ち発熱部品１から筐体３の内壁面まで
熱拡散シート４が熱を輸送する道程が長くなってしまう
ため、発熱部品１にて生じた熱を筐体３の外部に効果的
に放熱することが難しい。第３に、なだらかに広がった
熱拡散シート４が回路基板２上の隣接部品５と干渉乃至
接触するのを避けるには、発熱部品１と隣接部品５の間
隔を大きめに設定せざるを得ず、その結果実装スペース
が浪費されるため、小形化に際して支障となる。熱拡散
シート４の表面にグラファイト等の電気伝導面が現れて
いる場合、隣接部品５のリード線との接触ひいてはその
リード線と筐体３との短絡を防ぐため、特に大きめの間
隔設定が必要になる。なお、熱拡散シート４を発熱部品
１に接触させないままでよければ、かかるなだらかな絞
り形状を廃止できるけれども、非接触では効率的な熱輸
送・拡散伝達は難しい。However, this kind of material has various problems due to poor workability. That is, since graphite and its composite material generally have flexibility, so-called deep drawing is difficult, and if the drawing is attempted to be brought into contact with the heat-generating component 1, a smooth drawing shape shown in FIG. 11 is obtained. In such an aperture shape, the first
In addition, since the heat diffusion sheet 4 does not easily adhere to the surface of the heat generating component 1, it is difficult to efficiently transfer the heat generated in the heat generating component 1 to the heat diffusion sheet 4. Second, since the heat transport distance by the heat diffusion sheet 4, that is, the path in which the heat diffusion sheet 4 transports heat from the heat generating component 1 to the inner wall surface of the housing 3 becomes long, the heat generated by the heat generating component 1 is reduced. It is difficult to effectively radiate heat to the outside of the housing 3. Third, in order to prevent the gently spread heat diffusion sheet 4 from interfering with or contacting the adjacent components 5 on the circuit board 2, the distance between the heat-generating component 1 and the adjacent components 5 must be set large. As a result, the mounting space is wasted, which hinders miniaturization. When an electrically conductive surface such as graphite appears on the surface of the heat diffusion sheet 4, a particularly large interval is required to prevent contact with the lead wire of the adjacent component 5 and short circuit between the lead wire and the housing 3. become. If the heat diffusion sheet 4 does not need to be in contact with the heat-generating component 1, such a gentle drawing shape can be abolished, but efficient heat transport / diffusion transmission is difficult without contact.
【０００５】この発明は、このような問題点を解決する
ことを課題としてなされたものであり、グラファイトや
その複合材等のように熱伝導性のみならず柔軟性をも併
有する素材の熱拡散シートを用いつつも、単純な絞り加
工以外の方法で、即ち付加的な部材を用いる方法にて、
熱拡散シートと発熱部品の接触を形成することにより、
発熱部品の熱を熱拡散シートへ伝達し熱拡散シートによ
り輸送し筐体内壁面（より一般には低温面）に伝達する
過程を含め、一連の放熱・冷却過程を効率化すると共
に、熱拡散シートと隣接部品との干渉・接触を防ぎ実装
スペースの節約ひいては装置の小形化を促進することを
第１の目的とする。この発明は、柔軟性を有する素材の
熱拡散シートを用いることにより、発熱部品に加わる荷
重を減らすと共に、熱拡散シートを発熱部品に接触させ
るための構造の工夫により、熱拡散シート及び発熱部品
の実装ばらつき（例えば頂面の傾き等）によらず上記荷
重の均一化を達成し、ひいては発熱部品に負担が掛から
ず冷却も効率的な構造を実現することを第２の目的とす
る。この発明は、熱拡散シートを低温面に固着する手段
の工夫や熱拡散シートを発熱部品に接触させる部材の工
夫によって、更に冷却性能を向上させることを第３の目
的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has been made to solve the problem of thermal diffusion of a material having not only thermal conductivity but also flexibility, such as graphite and its composite material. While using a sheet, by a method other than simple drawing, that is, by a method using additional members,
By forming the contact between the heat diffusion sheet and the heat generating component,
A series of heat dissipation and cooling processes, including the process of transferring the heat of the heat-generating components to the heat diffusion sheet, transporting the heat by the heat diffusion sheet, and transmitting the heat to the inner wall surface of the housing (more generally, the low-temperature surface), make the heat dissipation and cooling processes more efficient. It is a first object of the present invention to prevent interference and contact with adjacent components, to save mounting space, and to promote downsizing of the device. The present invention reduces the load applied to the heat-generating component by using a heat-diffusion sheet made of a flexible material, and also improves the structure of the heat-diffusion sheet and the heat-generating component by devising a structure for bringing the heat-diffusion sheet into contact with the heat-generating component. A second object is to achieve the above-mentioned uniform load regardless of mounting variations (for example, inclination of the top surface, etc.), and to realize a structure in which no load is applied to the heat-generating components and cooling is efficient. A third object of the present invention is to further improve the cooling performance by devising a means for fixing the heat diffusion sheet to the low-temperature surface and devising a member for bringing the heat diffusion sheet into contact with the heat-generating component.
【０００６】[0006]
【課題を解決するための手段】このような目的を達成す
るため、この発明に係る冷却構造においては、回路基板
上の発熱部品と対向するよう低温面上に配置され台状の
外表面を呈する押当部材と、押当部材の外表面の形状が
ほぼ現れるよう低温面を被覆し、その一部が低温面に固
着され、かつ熱伝導性及び柔軟性を有する素材から形成
された熱拡散シートと、を備え、この熱拡散シートの一
部を発熱部品に押し当てかつ他の一部を低温面に固着さ
せることにより、発熱部品にて生じた熱を熱拡散シート
を介し低温面へと逃がすこととする。In order to achieve the above object, a cooling structure according to the present invention has a trapezoidal outer surface arranged on a low-temperature surface so as to face a heat-generating component on a circuit board. A thermal diffusion sheet formed from a material having thermal conductivity and flexibility, which covers the low-temperature surface so that the shape of the outer surface of the pressing member and the pressing member almost appears, and a part of which is fixed to the low-temperature surface. By pressing a part of the heat diffusion sheet against the heat generating component and fixing the other part to the low temperature surface, heat generated in the heat generating component is released to the low temperature surface via the heat diffusion sheet. It shall be.
【０００７】また、この発明においては、好ましくは、
上記熱拡散シートが、予め形成された互いに非平行な線
状切込みを有し、これらの線状切込みに交叉する方向に
沿い熱拡散シートを折り曲げることにより、上記押当部
材を収納する山形収納部を形成する。この発明において
は、好ましくは、熱拡散シートに、その幅が押当部材の
幅とほぼ同じである帯状の部分を設け、この帯状の部分
を折り曲げることにより、押当部材を被覆する山形収納
部を形成する。この発明においては、好ましくは、それ
ぞれ帯状の部分を有する複数枚の熱拡散シートを用い、
これら複数枚の熱拡散シートそれぞれの帯状の部分によ
って押当部材を互いに異なる方向に沿い被覆する。この
発明においては、好ましくは、熱拡散シートを、熱伝導
性の接着剤又は粘着剤にて低温面に固着させる。本発明
においては、好ましくは、熱拡散シートを介した押当て
に係る応力が発熱部品の各部に均等に分布するよう、上
記押当部材と低温面との間に弾性を有する支持フレーム
を配置する。この発明においては、好ましくは、押当部
材と低温面との間にスペーサを配置し、スペーサに設け
た孔の内部にて空気を保持させる。この発明において
は、好ましくは、押当部材、支持フレーム或いはスペー
サを、金属材料より軽量な樹脂材料、樹脂材料より熱伝
導率が高い金属材料、並びに上記回路基板の発熱部品搭
載面及び上記低温面に沿う方向における熱伝導率が高く
これと交叉する方向における熱伝導率が低い異方性熱伝
導材料のうち、いずれかから形成する。この発明におい
ては、好ましくは、熱拡散シートの縁を、発熱部品から
熱拡散シートを介し低温面に至る熱の拡散伝達の方向と
平行とする。In the present invention, preferably,
The heat diffusion sheet has preformed non-parallel linear cuts and bends the heat diffusion sheet along a direction intersecting these linear cuts to thereby store the pressing member. To form In the present invention, preferably, the heat diffusion sheet is provided with a band-shaped portion whose width is substantially the same as the width of the pressing member, and the band-shaped portion is bent to cover the pressing member. To form In the present invention, preferably, a plurality of heat diffusion sheets each having a band-shaped portion,
The pressing members are covered with the strip-shaped portions of the plurality of heat diffusion sheets along different directions. In the present invention, preferably, the heat diffusion sheet is fixed to the low-temperature surface with a thermally conductive adhesive or pressure-sensitive adhesive. In the present invention, preferably, a support frame having elasticity is arranged between the pressing member and the low-temperature surface so that stress relating to pressing through the heat diffusion sheet is evenly distributed to each part of the heat generating component. . In the present invention, preferably, a spacer is disposed between the pressing member and the low-temperature surface, and air is held inside the hole provided in the spacer. In the present invention, preferably, the pressing member, the support frame, or the spacer is made of a resin material that is lighter than a metal material, a metal material that has a higher thermal conductivity than a resin material, and a heating component mounting surface and the low-temperature surface of the circuit board. Is formed of any one of anisotropic heat conductive materials having a high thermal conductivity in a direction along the direction and a low thermal conductivity in a direction crossing the direction. In the present invention, preferably, the edge of the heat diffusion sheet is parallel to the direction of diffusion and transfer of heat from the heat-generating component to the low-temperature surface via the heat diffusion sheet.
【０００８】この発明に係る携帯型電子機器において
は、上記回路基板と、上記回路基板を収納しその内壁面
にて上記低温面を提供する筐体と、この発明に係る冷却
構造と、を備え、上記筐体の外壁面を自然空冷させる。[0008] A portable electronic device according to the present invention includes the circuit board, a housing for accommodating the circuit board and providing the low-temperature surface on an inner wall surface thereof, and a cooling structure according to the present invention. Then, the outer wall surface of the housing is cooled by natural air.
【０００９】この発明に係る冷却構造形成方法において
は、発熱部品を搭載した回路基板、この回路基板を収納
する筐体、熱伝導性及び柔軟性を有する素材から形成さ
れた熱拡散シート、及び台状の外形を有する押当部材
を、予め準備しておくステップと、回路基板を筐体に収
納したとき発熱部品に熱拡散シートの一部が押し当てら
れるよう、押当部材を筐体の内壁面上の所定の位置に配
置するステップと、押当部材及び筐体の内壁面を熱拡散
シートにより被覆した上でこの熱拡散シートの一部を筐
体の内壁面に固着するステップと、発熱部品と押当部材
とが少なくとも部分的に対向し当該対向部位にて熱拡散
シートが発熱部品に接触するよう、回路基板を筐体に収
納するステップと、を実行することにより、その一部が
発熱部品に押し当てられ他の一部が筐体の内壁面に固着
された熱拡散シートを介し、発熱部品にて生じた熱を筐
体へと逃がす冷却構造を、形成する。In the method for forming a cooling structure according to the present invention, a circuit board on which a heat-generating component is mounted, a housing for housing the circuit board, a heat diffusion sheet formed of a material having thermal conductivity and flexibility, and a table Preparing a pressing member having an external shape in a shape in advance, and pressing the pressing member inside the housing so that a part of the heat diffusion sheet is pressed against the heat generating component when the circuit board is housed in the housing. Disposing at a predetermined position on the wall surface, covering the pressing member and the inner wall surface of the housing with a heat diffusion sheet, and fixing a part of the heat diffusion sheet to the inner wall surface of the housing; Housing the circuit board in a housing such that the component and the pressing member at least partially oppose each other and the heat diffusion sheet contacts the heat-generating component at the opposing portion. Pressing on heating parts Re another part via a heat diffusion sheet which is fixed to the inner wall surface of the housing, a cooling structure for releasing the heat generated by the heat generating component to the housing, are formed.
【００１０】この発明においては、好ましくは、弾性を
有する支持フレームを予め準備しておき、押当部材を支
持フレームを介し筐体の内壁面上に配置する。この発明
においては、好ましくは、孔を有するスペーサを予め準
備しておき、押当部材をスペーサを介し筐体の内壁面上
に配置することにより、押当部材と低温面との間を孔内
部の空気によって部分的に断熱させる。この発明におい
ては、好ましくは、押当部材及び筐体の内壁面を熱拡散
シートにより被覆したとき押当部材が山形収納部に収納
されるよう、熱拡散シートに予め当該山形収納部を設け
ておく。この発明においては、好ましくは、熱拡散シー
トに予め互いに非平行な複数の線状切込みを入れてお
き、押当部材及び筐体の内壁面を熱拡散シートにより被
覆する際にこれらの線状切込みに交叉する方向に沿い熱
拡散シートを折り曲げることにより、上記山形収納部を
形成する。この発明においては、好ましくは、その幅が
押当部材の幅とほぼ同じである帯状の部分を熱拡散シー
トに予め設けておき、この帯状の部分を押当部材の外形
に倣って折り曲げることにより、押当部材を被覆する山
形収納部を形成する。この発明においては、好ましく
は、帯状の部分を有する熱拡散シートを複数枚準備して
おき、互いに異なる方向から押当部材を被覆するよう複
数枚の熱拡散シートを配置しかつそれらの帯状の部分を
折り曲げる。この発明においては、好ましくは、熱拡散
シートに、予め、発熱部品から熱拡散シートを介し低温
面への熱の拡散伝達の方向と平行な縁を設けておく。In the present invention, preferably, an elastic supporting frame is prepared in advance, and the pressing member is arranged on the inner wall surface of the housing via the supporting frame. In the present invention, preferably, a spacer having a hole is prepared in advance, and the pressing member is arranged on the inner wall surface of the housing via the spacer, so that the space between the pressing member and the low-temperature surface is formed inside the hole. Partially insulated by air. In the present invention, preferably, when the pressing member and the inner wall surface of the housing are covered with the heat diffusion sheet, the pressing member is stored in the chevron storage portion, and the chevron storage portion is provided in advance on the heat diffusion sheet. deep. In the present invention, preferably, a plurality of non-parallel linear cuts are previously formed in the heat diffusion sheet, and these linear cuts are formed when the pressing member and the inner wall surface of the housing are covered with the heat diffusion sheet. The angled storage portion is formed by bending the heat diffusion sheet along the direction crossing the direction. In the present invention, preferably, a band-shaped portion whose width is substantially the same as the width of the pressing member is provided in advance on the heat diffusion sheet, and the band-shaped portion is bent according to the outer shape of the pressing member. , Forming a chevron-shaped storage portion that covers the pressing member. In the present invention, preferably, a plurality of heat diffusion sheets having a band-like portion are prepared, and a plurality of heat diffusion sheets are arranged so as to cover the pressing member from different directions, and the band-like portions thereof are arranged. Bend. In the present invention, preferably, the heat diffusion sheet is provided in advance with an edge parallel to the direction of heat diffusion and transmission from the heat-generating component to the low-temperature surface via the heat diffusion sheet.
【００１１】[0011]
【発明の実施の形態】以下、この発明の好適な実施の形
態に関し、図面に基づき説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.
【００１２】実施の形態１．図１に、この発明の実施の
形態１に係る冷却構造断面を示す。この実施の形態にお
いては、マイクロプロセッサ等の発熱部品１を搭載する
回路基板２を携帯型電子機器の筐体３の中に収納すると
き、熱拡散シート４を筐体３の内壁面に固着するという
手法を用いている。但し、熱拡散シート４を絞り加工に
よって発熱部品１に接触させるのではなく、筐体３の内
壁面上に配置した押当部材６により発熱部品１の表面
（高温面）に押し当てる構造を採用している。熱拡散シ
ート４は、いわば、押当部材６と共に筐体３の内壁面を
被覆している。熱拡散シート４は、押当部材６を被覆す
る部分以外の部分にて、筐体３の内壁面に固着されてい
る。筐体３の内壁面と熱拡散シート４の固着面７には、
非常に薄いため図上現れていないが、熱伝導性接着剤や
サーマルグリースなどの接着・粘着材料が存在してい
る。Embodiment 1 FIG. 1 shows a cross section of a cooling structure according to Embodiment 1 of the present invention. In this embodiment, when the circuit board 2 on which the heat-generating component 1 such as a microprocessor is mounted is housed in the housing 3 of the portable electronic device, the heat diffusion sheet 4 is fixed to the inner wall surface of the housing 3. Is used. However, a structure is employed in which the heat diffusion sheet 4 is not brought into contact with the heat-generating component 1 by drawing, but is pressed against the surface (hot surface) of the heat-generating component 1 by the pressing member 6 arranged on the inner wall surface of the housing 3. doing. The heat diffusion sheet 4, as it were, covers the inner wall surface of the housing 3 together with the pressing member 6. The heat diffusion sheet 4 is fixed to the inner wall surface of the housing 3 at a portion other than the portion covering the pressing member 6. The inner wall surface of the housing 3 and the fixing surface 7 of the heat diffusion sheet 4
Although it is very thin and does not appear on the figure, there are adhesive and pressure-sensitive adhesive materials such as thermal conductive adhesive and thermal grease.
【００１３】このような構造とすることにより、この実
施の形態においては、発熱部品１の表面と熱拡散シート
４とを好適に面接触させ、これにより発熱部品１から熱
拡散シート４への熱移転を効率化させている。さらに、
熱拡散シート４が押当部材６の外形に倣った形状にて発
熱部品１に押し当てられているため、熱拡散シート４に
よる熱輸送距離が短くなっている。さらに、熱伝導性接
着剤やサーマルグリースなどにて熱拡散シート４が筐体
３の内壁面に固着されているため、熱拡散シート４から
筐体３への熱輸送も効率化する。加えて、押当部材６を
介した熱輸送も存在しているため、熱拡散シート４が発
熱部品１近傍にて筐体３の内壁面から浮いていた図１１
の構造に比べ、さらに熱輸送が効率化する。総じて、こ
の実施の形態においては、発熱部品１の熱を熱拡散シー
ト４を介して筐体３に逃す過程が効率化し、良好な冷却
性能が得られる。加えて、熱拡散シート４の外形が押当
部材６の外形に倣った形状であるため、熱拡散シート４
が隣接部品５特にそのリード等と接触することを防ぐこ
とができ、従って基板２における部品配設間隔を小さく
することができるから、図７の構成に比べコンパクト化
に適した即ち携帯型電子機器に適した冷却構造が得られ
る。With this structure, in this embodiment, the surface of the heat-generating component 1 and the heat diffusion sheet 4 are preferably brought into surface contact with each other. The transfer has been streamlined. further,
Since the heat diffusion sheet 4 is pressed against the heat generating component 1 in a shape following the outer shape of the pressing member 6, the heat transport distance by the heat diffusion sheet 4 is shortened. Further, since the heat diffusion sheet 4 is fixed to the inner wall surface of the housing 3 with a heat conductive adhesive, thermal grease, or the like, the efficiency of heat transfer from the heat diffusion sheet 4 to the housing 3 is improved. In addition, since heat transfer via the pressing member 6 also exists, the heat diffusion sheet 4 floats from the inner wall surface of the housing 3 in the vicinity of the heat generating component 1 in FIG.
As compared with the structure of the above, the heat transport becomes more efficient. In general, in this embodiment, the process of dissipating the heat of the heat-generating component 1 to the housing 3 via the heat diffusion sheet 4 becomes more efficient, and good cooling performance can be obtained. In addition, since the outer shape of the heat diffusion sheet 4 follows the outer shape of the pressing member 6, the heat diffusion sheet 4
7 can be prevented from coming into contact with the adjacent components 5, especially the leads and the like, and the interval between the components disposed on the substrate 2 can be reduced. The cooling structure suitable for is obtained.
【００１４】また、この実施の形態においては、発熱部
品１と接触する部位近傍における熱拡散シート４の形状
を、図２及び図３に示した構造及び材料を用いることに
よって、押当部材６の外形に倣った形状としている。す
なわち、図３に示すように予め相交叉する２本の切込み
８を形成した熱拡散シート４を準備しておき、この熱拡
散シート４にて筐体３の内壁面及びその上の押当部材６
を被覆したときにこの切込み８が広がり図２に示すごと
き山型収納部９が形成されるようにしているため、押当
部材６を収納する山型収納部９の近傍において熱拡散シ
ート４になだらかな傾斜形状が現れることを、好適に防
止することができる。これにより、前述の各効果はさら
に顕著なものとなる。Further, in this embodiment, the shape of the heat diffusion sheet 4 in the vicinity of the portion in contact with the heat-generating component 1 is changed by using the structure and material shown in FIGS. The shape follows the external shape. That is, as shown in FIG. 3, a heat diffusion sheet 4 in which two notches 8 intersecting each other are formed in advance is prepared, and the heat diffusion sheet 4 is used to hold the inner wall surface of the housing 3 and a pressing member thereon. 6
2 is formed so that the notch 8 is widened to form the mountain-shaped storage portion 9 as shown in FIG. 2, so that the heat diffusion sheet 4 is formed near the mountain-shaped storage portion 9 for storing the pressing member 6. Appearance of a gentle slope can be suitably prevented. As a result, each of the above-mentioned effects becomes more remarkable.
【００１５】図１の下半分に、押当部材６の材質による
筐体３の表面温度（図１中押当部材６配設面と逆側の面
の温度）の変化を示す。図中１点鎖線で示されている第
１番目の曲線は、押当部材６を樹脂材料にて形成した場
合の特性であり、実線で示されている２番目の特性は金
属材料にて形成した場合の特性であり、破線で示されて
いる第３番目の特性は異方性熱伝導材料にて形成した場
合の特性である。特に、第３番目の特性は、回路基板２
や筐体３に平行な方向における熱伝導率が高くかつこれ
と直交する方向における熱伝導率が低くなるよう、熱伝
導率の異方性を設定した場合の特性である。これらの曲
線から明らかなように、樹脂材料を用いたときよりも金
属材料を用いたときの方が、また上述のような異方性設
定下において異方性熱伝導材料を用いた方が、筐体表面
温度の局所的な高まりを抑制することが可能になる。こ
れは、樹脂材料よりも金属材料の方が、さらには上述の
ような異方性設定の下における異方性熱伝導材料の方
が、発熱部品１から熱拡散シート４を介して移動した熱
を図中横方向に迅速に拡散伝搬させることができること
による。これら、いずれの材料を使用するのかは、図１
下半分に示されている特性の他、重量等を勘案して適宜
決定する。すなわち、樹脂材料よりも金属材料の方が図
１下半分に示されている特性は良好であるけれども、一
般に金属材料は重いため、場合によっては樹脂材料を用
いることも考慮すべきである。さらに、異方性熱伝導材
料は一般に軽量であるため、特に軽量化が求められる場
合に当該材料を用いるようにするのが好ましい。押当部
材６の形成に適する金属材料としては、例えばアルミニ
ウム、銅などを例示することができる。異方性熱伝導材
料としては、Ｃ／ＣＦ（カーボン／カーボンファイバ
ー）コンポジット材を例示することができる。熱拡散シ
ート４としてグラファイトシートを用いた時には、銅シ
ートを用いた場合に比べ比重が約１／９であるため特に
軽量化が顕著となる。The lower half of FIG. 1 shows a change in the surface temperature of the housing 3 (the temperature on the surface opposite to the surface on which the pressing member 6 is disposed in FIG. 1) depending on the material of the pressing member 6. The first curve shown by the one-dot chain line in the figure is the characteristic when the pressing member 6 is formed of a resin material, and the second characteristic shown by the solid line is the characteristic formed of a metal material. The third characteristic indicated by a broken line is the characteristic when formed of an anisotropic heat conductive material. In particular, the third characteristic is that the circuit board 2
This is a characteristic in the case where the anisotropy of the thermal conductivity is set so that the thermal conductivity in the direction parallel to the housing 3 and the thermal conductivity in the direction perpendicular to the direction is high. As is clear from these curves, when using a metal material than when using a resin material, and when using an anisotropic heat conductive material under the above-described anisotropic setting, It is possible to suppress a local increase in the housing surface temperature. This is because the heat transferred from the heat-generating component 1 via the heat diffusion sheet 4 is higher in the metal material than in the resin material, and in the anisotropic heat conductive material under the above-described anisotropic setting. Can be quickly diffused and propagated in the horizontal direction in the figure. Which of these materials is used is shown in FIG.
In addition to the characteristics shown in the lower half, it is appropriately determined in consideration of the weight and the like. That is, although the characteristics shown in the lower half of FIG. 1 are better for the metal material than for the resin material, the metal material is generally heavy, so that the use of a resin material in some cases should be considered. Further, since the anisotropic heat conductive material is generally light in weight, it is preferable to use the material particularly when a light weight is required. Examples of the metal material suitable for forming the pressing member 6 include aluminum and copper. As the anisotropic heat conductive material, a C / CF (carbon / carbon fiber) composite material can be exemplified. When a graphite sheet is used as the heat diffusion sheet 4, the specific gravity is about 1/9 as compared with the case where a copper sheet is used, so that the weight reduction is particularly remarkable.
【００１６】実施の形態２．図４及び図５に、この発明
の実施の形態２に係る冷却構造の断面及び形成方法を示
す。この実施の形態においては、押当部材６と筐体３の
内壁面との間に、弾性支持フレーム１０が介在してい
る。弾性支持フレーム１０は方形枠状の部材であり、発
熱部品１の実装バラツキ等に関わらず熱拡散シート４を
発熱部品１の表面に好適に面接触させることができるよ
う、その弾性をもって、押当部材６を支持する。このよ
うな弾性支持フレーム１０を用いることにより、本実施
の形態においては、熱拡散シート４を発熱部品１の表面
に好適にすなわち荷重の偏りなく接触させることができ
る。従って、発熱部品１から熱拡散シート４への熱移転
をさらに効率化することができるとともに、特に発熱部
品がベアチップ等デリケートな素子である場合には、荷
重の偏りひいては応力集中による破壊から、この発熱部
品１を保護することができる。Embodiment 2 4 and 5 show a cross section and a method of forming a cooling structure according to Embodiment 2 of the present invention. In this embodiment, an elastic support frame 10 is interposed between the pressing member 6 and the inner wall surface of the housing 3. The elastic support frame 10 is a rectangular frame-shaped member, and has elasticity so that the heat diffusion sheet 4 can be brought into suitable surface contact with the surface of the heat generating component 1 irrespective of mounting variations of the heat generating component 1. The member 6 is supported. By using such an elastic support frame 10, in the present embodiment, the heat diffusion sheet 4 can be brought into contact with the surface of the heat-generating component 1 in a suitable manner, that is, without uneven load. Therefore, the heat transfer from the heat-generating component 1 to the heat diffusion sheet 4 can be made more efficient, and in particular, when the heat-generating component is a delicate element such as a bare chip, the load is uneven and the stress is destroyed due to stress concentration. The heat generating component 1 can be protected.
【００１７】更に、弾性支持フレーム１０の内側には空
気層があり、この空気層は、押当部材６から筐体３への
熱の伝達を阻害している。この実施の形態では、熱の伝
達を阻害するというこの空気断熱作用を積極的に利用す
ることによって、筐体３の表面が局所的に温度上昇する
現象を防いでいる。即ち、実施の形態１のように押当部
材６の一面が全体に亘り筐体３の表面に接している構成
では、発熱部品１にて生じ押当部材６を介し筐体３に移
転した熱によって、筐体３の発熱部品１直下の部分が局
所的に温かくなることがある。これに対し、本実施の形
態のようにいわばその内部に空気を保持するスペーサと
して弾性支持フレーム１０を用いている構成では、発熱
部品１から筐体３への熱の移転は、比較的少ない接触面
積にて筐体３と接している弾性支持フレーム１０を介し
た移転を除けば、熱拡散シート４を介して行われてお
り、発熱部品１にて生じた熱の多くは熱拡散シート４に
沿って拡散していく。従って、発熱部品１の直下だけが
温かくなり使用者が違和感を感じることは生じにくい。
なお、この空気断熱作用をより強めるには、図中水平方
向の熱伝導性が高い素材例えば前掲の異方性熱伝導材料
にて、熱拡散シート４を作成するのが望ましい。Further, an air layer is provided inside the elastic support frame 10, and this air layer hinders the transfer of heat from the pressing member 6 to the housing 3. In this embodiment, a phenomenon in which the surface of the housing 3 locally rises in temperature is prevented by positively utilizing the air heat-insulating action of inhibiting heat transfer. That is, in the configuration in which one surface of the pressing member 6 is entirely in contact with the surface of the housing 3 as in the first embodiment, the heat generated in the heat-generating component 1 and transferred to the housing 3 via the pressing member 6. Accordingly, a portion of the housing 3 immediately below the heat-generating component 1 may be locally warmed. On the other hand, in the configuration in which the elastic supporting frame 10 is used as a spacer for holding air therein, as in the present embodiment, transfer of heat from the heat-generating component 1 to the housing 3 is relatively small. Except for the transfer via the elastic support frame 10 which is in contact with the housing 3 in area, the heat is transmitted through the heat diffusion sheet 4, and most of the heat generated in the heat generating component 1 is transferred to the heat diffusion sheet 4. It spreads along. Therefore, only the area directly below the heat-generating component 1 becomes warm, and the user is unlikely to feel uncomfortable.
In order to further enhance the air heat insulation effect, it is desirable to form the heat diffusion sheet 4 from a material having high thermal conductivity in the horizontal direction in the figure, for example, the anisotropic heat conductive material described above.
【００１８】実施の形態３．図６に、この発明の実施の
形態３に係る冷却構造を示す。この実施の形態において
は、山型収納部９を形成するべき部位に切込み８を設け
るのではなく、山型収納部９を形成すべき部位の稜線に
沿って放射状に、切込み８を設けている。このような構
成によっても、前述の実施の形態２と同様の作用効果を
実現することができる。Embodiment 3 FIG. 6 shows a cooling structure according to Embodiment 3 of the present invention. In this embodiment, notches 8 are provided in the portions where the mountain-shaped storage portions 9 are to be formed, but are provided radially along the ridge lines of the portions where the mountain-shaped storage portions 9 are to be formed. . With such a configuration, the same operation and effect as those of the second embodiment can be realized.
【００１９】実施の形態４．図７及び図８に、この発明
の実施の形態４に係る冷却構造を示す。この実施の形態
では、熱拡散シート４のうち押当部材６を覆う部分を帯
状とし、この帯状の部分を押当部材６（及び弾性支持フ
レーム１０）の外形に沿って折り曲げている。このよう
にすると、切込み８を形成するための加工なしで、即ち
より簡単に、山形収納部９に相当する構造を形成でき
る。Embodiment 4 7 and 8 show a cooling structure according to Embodiment 4 of the present invention. In this embodiment, a portion of the heat diffusion sheet 4 that covers the pressing member 6 is formed in a band shape, and the band-shaped portion is bent along the outer shape of the pressing member 6 (and the elastic support frame 10). In this manner, a structure corresponding to the chevron-shaped storage portion 9 can be formed without processing for forming the cuts 8, that is, more easily.
【００２０】実施の形態５．図９に、この発明の実施の
形態５に係る冷却構造を示す。この実施の形態では、山
形収納部９に相当する構造を実施の形態４と同様にして
形成している。更に、この実施の形態では、互いに異な
る方向に沿って配置された複数枚の熱拡散シート４−１
及び４−２を重ね合わせて押当部材６を覆っている。実
施の形態４においてはある一つの方向に沿って配置され
た熱拡散シート４により熱移転が行われていたのに対
し、この実施の形態においては互いに異なる複数の方向
に沿って配置された熱拡散シート４−１及び４−２によ
り熱移転が行われているため、発熱部品１から筐体３へ
の熱の移転はより効率的となる。Embodiment 5 FIG. 9 shows a cooling structure according to Embodiment 5 of the present invention. In this embodiment, a structure corresponding to the chevron storage 9 is formed in the same manner as in the fourth embodiment. Further, in this embodiment, a plurality of heat diffusion sheets 4-1 arranged along different directions from each other.
And 4-2 are overlapped to cover the pressing member 6. In the fourth embodiment, the heat transfer is performed by the heat diffusion sheet 4 arranged along a certain direction. In the fourth embodiment, the heat transfer is performed along a plurality of different directions. Since the heat transfer is performed by the diffusion sheets 4-1 and 4-2, the heat transfer from the heat-generating component 1 to the housing 3 becomes more efficient.
【００２１】実施の形態６．図１０に、この発明の実施
の形態６に係る冷却構造を示す。この実施の形態では、
実施の形態５と同様、互いに異なる方向に沿って配置さ
れた複数枚の熱拡散シート４−１及び４−２を重ね合わ
せて押当部材６を覆っている。この実施の形態では、更
に、熱の流れる方向（図中の矢印）とほぼ平行となるよ
う縁４ａをカットした斜めカットタイプの熱拡散シート
４−１及び４−２を用いている。これによって、熱拡散
シート４−１及び４−２に沿った熱拡散の効果が高ま
る。Embodiment 6 FIG. 10 shows a cooling structure according to Embodiment 6 of the present invention. In this embodiment,
As in the fifth embodiment, a plurality of heat diffusion sheets 4-1 and 4-2 arranged along different directions are overlapped to cover the pressing member 6. In this embodiment, oblique cut-type heat diffusion sheets 4-1 and 4-2 in which the edge 4a is cut so as to be substantially parallel to the direction in which heat flows (arrows in the drawing) are used. Thereby, the effect of the thermal diffusion along the thermal diffusion sheets 4-1 and 4-2 is enhanced.
【００２２】なお、前述の説明では、弾性支持フレーム
１０を方形枠としていたが、これは、中央部を繰り抜い
ていない単なるブロックまたはシートとしても構わない
し、またはさらにその他の形状としても構わない。さら
に、押当部材６を直方体としていたが、その角に丸みを
付与したり、あるいは円柱形状としても構わない。さら
に、以上の実施の形態では発熱部品１個に対応して１個
の押当部材６を設けていたが、例えば、複数の発熱部品
１に対応して１個の押当部材６を設けたり、あるいは１
個の発熱部品１に対応して複数個の押当部材６を設けた
りしても構わない。切込み８は、直線状でなくてもよ
い。また、以上の説明では、本発明を冷却構造、その形
成方法及びこれを用いた携帯型電子機器の発明として把
握しているが、当業者であれば、本願に明示的又は暗示
的に開示された事項及び当業界の常識に基づき、本発明
を他のカテゴリに属する発明として把握及び表現できる
であろう。本発明は、かかる変形をも包含する。In the above description, the elastic support frame 10 is a rectangular frame. However, the elastic support frame 10 may be a simple block or sheet without a central portion, or may have another shape. Further, although the pressing member 6 is a rectangular parallelepiped, the corner thereof may be rounded or formed in a cylindrical shape. Further, in the above-described embodiment, one pressing member 6 is provided corresponding to one heat generating component. However, for example, one pressing member 6 is provided corresponding to a plurality of heat generating components 1. Or 1
A plurality of pressing members 6 may be provided corresponding to the plurality of heat generating components 1. The cut 8 may not be linear. Further, in the above description, the present invention is grasped as an invention of a cooling structure, a method of forming the same, and a portable electronic device using the same. However, those skilled in the art will explicitly or implicitly disclose the present invention. Based on the matters described above and common sense in the art, the present invention can be grasped and expressed as an invention belonging to another category. The present invention includes such modifications.
【００２３】[0023]
【発明の効果】以上説明したように、この発明に係る冷
却構造によれば、押当部材にて熱拡散シートを発熱部品
に押し当てるようにしたため、熱拡散シートに絞り加工
を施したときのようななだらかな形状が現れることを、
防止できる。従って、熱拡散シートによる熱輸送距離の
短縮や、熱拡散シートの隣接部品との干渉・接触の防止
を、達成できる。また、熱拡散シートと発熱部品との面
接触が安定に提供されるため、発熱部品から熱拡散シー
トへの熱の移動も効率化する。更に、熱拡散シートの低
温面固着部位及び押当部材配設部位にて熱拡散シートか
ら低温面への熱の移動が行われるため、当該移動が効率
化する。これらの結果、発熱部材から熱拡散シートを経
て低温面に至る熱の移動・輸送が効率化され放熱冷却過
程が効率化されると共に、部品間隔の縮小、実装スペー
スの節約ひいては装置の小形化を促進できる。As described above, according to the cooling structure of the present invention, the heat diffusion sheet is pressed against the heat-generating component by the pressing member. That such a gentle shape appears,
Can be prevented. Therefore, it is possible to shorten the heat transport distance by the heat diffusion sheet and prevent interference and contact with the adjacent parts of the heat diffusion sheet. Further, since the surface contact between the heat diffusion sheet and the heat generating component is stably provided, the transfer of heat from the heat generating component to the heat diffusion sheet is also efficient. Further, since heat is transferred from the heat diffusion sheet to the low-temperature surface at the low-temperature surface fixing portion and the pressing member disposing portion of the heat diffusion sheet, the transfer becomes more efficient. As a result, the movement and transportation of heat from the heat-generating member to the low-temperature surface via the heat diffusion sheet is made more efficient, and the heat-radiation and cooling process is made more efficient. Can promote.
【００２４】更に、熱拡散シートに複数の非平行な切込
みを入れておき、これらの切込みに交叉する方向に沿っ
て熱拡散シートを折り曲げて山形収納部を作るようにす
れば、押当部材近傍での熱拡散シートの外形がなだらか
になるのを防止できる。また、熱拡散シートにその幅が
押当部材の幅とほぼ同じである帯状の部分を設けてお
き、この帯状の部分を折り曲げることにより押当部材を
被覆する山形収納部を形成するようにすれば、切込み形
成加工なしで、押当部材近傍での熱拡散シートの外形が
なだらかになることを防止できる。更に、それぞれ帯状
の部分を有する複数枚の熱拡散シートを用い、これら複
数枚の熱拡散シートそれぞれの帯状の部分によって押当
部材を互いに異なる方向に沿い被覆するようにすれば、
熱拡散シートによる熱の拡散伝達の方向が広がり、冷却
の効率が高まる。また、熱拡散シートを熱伝導性の接着
剤又は粘着剤にて低温面に固着させるようにすれば、熱
拡散シートから低温面への熱の輸送を更に効率化でき
る。更に、熱拡散シートを介した押当てに係る応力が発
熱部品の各部に均等に分布するよう、上記押当部材と低
温面との間に弾性を有する支持フレームを配置するよう
にすれば、熱拡散シート及び発熱部品の実装ばらつきが
あっても、発熱部品から熱拡散シートへの熱の移転を効
率化でき、また発熱部品に応力等の負担が掛かりにくく
なり、特にベアチップ等デリケートな部品の冷却に適す
る構造を提供できる。また、押当部材と低温面との間に
スペーサを配置し、スペーサに設けた孔の内部にて空気
を保持させるようにすれば、発熱部品の直下が局所的に
温まることを防止できる。更に、このスペーサに係る機
能と前述の支持フレームに係る機能は単一の部材にて同
時に実現できる。更に、押当部材や支持フレームやスペ
ーサを樹脂材料から形成することにより構造を軽量化で
き、金属材料から形成することにより冷却性能を向上で
き、異方性熱伝導材料から形成し更に回路基板の発熱部
品搭載面及び上記低温面に沿う方向における熱伝導率が
高くこれと交叉する方向における熱伝導率が低くなるよ
うこれを配置することにより、更に冷却性能を高め更に
軽量にすることができる。また、熱拡散シートの縁を、
発熱部品から熱拡散シートを介し低温面に至る熱の拡散
伝達の方向と平行とすることにより、熱拡散シートを介
した熱の伝達が阻害されにくくなり、従って冷却が効率
的になる。Further, if a plurality of non-parallel cuts are made in the heat diffusion sheet, and the heat diffusion sheet is bent along a direction intersecting these cuts to form a chevron-shaped storage portion, the vicinity of the pressing member can be improved. Can prevent the heat diffusion sheet from becoming smooth. Further, a band-shaped portion whose width is almost the same as the width of the pressing member is provided on the heat diffusion sheet, and the band-shaped portion is bent to form a chevron-shaped storage portion that covers the pressing member. For example, it is possible to prevent the outer shape of the heat diffusion sheet in the vicinity of the pressing member from becoming smooth without the cut forming process. Furthermore, if a plurality of heat diffusion sheets each having a band-shaped portion are used, and the pressing members are covered along different directions by the respective band-shaped portions of the plurality of heat diffusion sheets,
The direction of diffusion and transfer of heat by the heat diffusion sheet is widened, and cooling efficiency is enhanced. Further, if the heat diffusion sheet is fixed to the low-temperature surface with a thermally conductive adhesive or pressure-sensitive adhesive, the heat transfer from the heat diffusion sheet to the low-temperature surface can be made more efficient. Furthermore, if a support frame having elasticity is arranged between the pressing member and the low-temperature surface so that the stress related to pressing through the heat diffusion sheet is evenly distributed to each part of the heat-generating component, heat can be generated. Even if there is variation in the mounting of the diffusion sheet and the heat-generating component, heat transfer from the heat-generating component to the heat-diffusion sheet can be made more efficient, and the heat-generating component is less likely to be subjected to a load such as stress. Can be provided. In addition, if a spacer is arranged between the pressing member and the low-temperature surface and air is held inside the hole provided in the spacer, it is possible to prevent local heating directly below the heat-generating component. Further, the function relating to the spacer and the function relating to the above-described support frame can be simultaneously realized by a single member. Further, the structure can be reduced in weight by forming the pressing member, the support frame, and the spacer from a resin material, and the cooling performance can be improved by forming the pressing member, the support frame, and the spacer from a metal material. By arranging such that the thermal conductivity in the direction along the heat-generating component mounting surface and the low-temperature surface is high and the thermal conductivity in the direction crossing the heat-generating component is low, the cooling performance can be further enhanced and the weight can be further reduced. Also, the edge of the heat diffusion sheet,
By making the direction parallel to the direction of diffusion and transmission of heat from the heat-generating component to the low-temperature surface via the heat diffusion sheet, the transmission of heat through the heat diffusion sheet is less likely to be hindered, and thus cooling is more efficient.
【００２５】この発明に係る携帯型電子機器によれば、
回路基板、回路基板を収納しその内壁面にて上記低温面
を提供する筐体及びこの発明に係る冷却構造を用い、筐
体の外壁面を自然空冷するようにしたため、上述の各作
用効果が得られ、小型軽量で冷却性能が高い携帯型電子
機器を実現できる。According to the portable electronic device of the present invention,
Using the circuit board, the housing that accommodates the circuit board and provides the low-temperature surface on the inner wall surface thereof and the cooling structure according to the present invention, the outer wall surface of the housing is naturally cooled with the air, so that the above-described respective effects are achieved. As a result, a portable electronic device that is small, lightweight, and has high cooling performance can be realized.
【００２６】この発明に係る冷却構造形成方法によれ
ば、発熱部品を搭載した回路基板、この回路基板を収納
する筐体、熱伝導性及び柔軟性を有する素材から形成さ
れた熱拡散シート、及び台状の外形を有する押当部材を
予め準備し、押当部材を筐体の内壁面上の所定の位置に
配置し、押当部材及び筐体の内壁面を熱拡散シートによ
り被覆した上でこの熱拡散シートの一部を筐体の内壁面
に固着し、熱拡散シートが発熱部品に接触した状態で回
路基板を筐体に収納するようにしたため、或いは更に弾
性を有する支持フレームを予め準備し、押当部材を支持
フレームを介し筐体の内壁面上に配置するようにしたた
め、或いは更に孔を有するスペーサを予め準備し、押当
部材をスペーサを介し筐体の内壁面上に配置して押当部
材と低温面との間を孔内部の空気によって部分的に断熱
させるようにしたため、本発明の一実施の形態に係る冷
却構造を形成できる。特に、押当部材及び筐体の内壁面
を熱拡散シートにより被覆したとき押当部材が山形収納
部に収納されるよう、熱拡散シートに予め当該山形収納
部を設けることにより、押当部材の近傍で熱拡散シート
になだらかな立体外形が現れることを好適に防止でき
る。更に、熱拡散シートに予め互いに非平行な複数の線
状切込みを入れておき、押当部材及び筐体の内壁面を熱
拡散シートにより被覆する際にこれらの線状切込みに交
叉する方向に沿い熱拡散シートを折り曲げることによ
り、上記山形収納部を形成するようにすれば、切込み形
成等の簡単な加工にて、上記効果を実現できる。また、
その幅が押当部材の幅とほぼ同じである帯状の部分を熱
拡散シートに予め設けておき、この帯状の部分を押当部
材の外形に倣って折り曲げることにより、押当部材を被
覆する山形収納部を形成することにより、切込み加工な
しでも、上記山形収納部に係る効果を実現できる。特
に、それぞれ帯状の部分を有する複数枚の熱拡散シート
を準備し、互いに異なる方向から押当部材を被覆するよ
うこれら複数枚の熱拡散シートを配置しかつそれらの帯
状の部分を折り曲げることにより、拡散伝達による冷却
の効果が高まる。更に、熱拡散シートの縁を、発熱部品
から熱拡散シートを介し低温面への熱の拡散伝達の方向
と平行にしておくという比較的単純な形状設定によっ
て、冷却の効果が更に高まる。According to the cooling structure forming method of the present invention, a circuit board on which a heat-generating component is mounted, a housing for housing the circuit board, a heat diffusion sheet formed of a material having thermal conductivity and flexibility, and A pressing member having a trapezoidal outer shape is prepared in advance, the pressing member is arranged at a predetermined position on the inner wall surface of the housing, and the pressing member and the inner wall surface of the housing are covered with a heat diffusion sheet. A part of this heat diffusion sheet is fixed to the inner wall surface of the housing, and the circuit board is housed in the housing in a state where the heat diffusion sheet is in contact with the heat-generating component, or a more elastic supporting frame is prepared in advance. Then, the pressing member is arranged on the inner wall surface of the housing via the support frame, or a spacer having a further hole is prepared in advance, and the pressing member is arranged on the inner wall surface of the housing via the spacer. Between the pressing member and the cold surface. Due to so as to partially insulated by internal air to form a cooling structure according to an embodiment of the present invention. In particular, when the pressing member and the inner wall surface of the housing are covered with the heat diffusion sheet, the pressing member is stored in the chevron storage portion, and the heat diffusion sheet is provided with the chevron storage portion in advance, so that the pressing member The appearance of a gentle three-dimensional outer shape on the heat diffusion sheet in the vicinity can be suitably prevented. Furthermore, a plurality of non-parallel linear cuts are previously formed in the heat diffusion sheet, and the pressing member and the inner wall surface of the housing are covered with the heat diffusion sheet along the direction intersecting the linear cuts. If the above-mentioned chevron-shaped storage portion is formed by folding the heat diffusion sheet, the above-mentioned effect can be realized by simple processing such as notch formation. Also,
A band-shaped portion whose width is substantially the same as the width of the pressing member is provided in advance on the heat diffusion sheet, and the band-shaped portion is bent according to the outer shape of the pressing member, thereby covering the pressing member. By forming the accommodating portion, it is possible to realize the effect of the angled accommodating portion without cutting. In particular, by preparing a plurality of heat diffusion sheets each having a band-shaped portion, by arranging these heat diffusion sheets so as to cover the pressing member from different directions from each other and by bending those band-shaped portions, The effect of cooling by diffusion transmission increases. Further, the effect of cooling is further enhanced by a relatively simple shape setting in which the edge of the heat diffusion sheet is made parallel to the direction of diffusion and transfer of heat from the heat-generating component to the low-temperature surface via the heat diffusion sheet.
【図１】 この発明の実施の形態１に係る冷却構造の断
面及び押当部材の材質による筐体表面温度分布の変化を
示す断面及び特性図である。FIG. 1 is a cross-sectional view and a characteristic diagram showing a cross-section of a cooling structure and a change in a housing surface temperature distribution depending on a material of a pressing member according to Embodiment 1 of the present invention.
【図２】 実施の形態１に係る冷却構造の分解斜視図で
ある。FIG. 2 is an exploded perspective view of the cooling structure according to the first embodiment.
【図３】 実施の形態１に係る冷却構造を実現するのに
用いる熱拡散シートの形状を示す斜視図である。FIG. 3 is a perspective view showing a shape of a heat diffusion sheet used to realize the cooling structure according to the first embodiment.
【図４】 この発明の実施の形態２に係る冷却構造を示
す断面図である。FIG. 4 is a sectional view showing a cooling structure according to a second embodiment of the present invention.
【図５】 実施の形態２に係る冷却構造の分解斜視図で
ある。FIG. 5 is an exploded perspective view of a cooling structure according to a second embodiment.
【図６】 この発明の実施の形態３に係る冷却構造を示
す分解斜視図である。FIG. 6 is an exploded perspective view showing a cooling structure according to a third embodiment of the present invention.
【図７】 この発明の実施の形態４に係る冷却構造、特
にその熱拡散シートの形状を示す分解斜視図である。FIG. 7 is an exploded perspective view showing a cooling structure according to a fourth embodiment of the present invention, particularly the shape of a heat diffusion sheet thereof.
【図８】 実施の形態４に係る冷却構造を、発熱部品及
び回路部品を省略して示す斜視図である。FIG. 8 is a perspective view showing a cooling structure according to a fourth embodiment with heat-generating components and circuit components omitted.
【図９】 この発明の実施の形態５に係る冷却構造、特
に使用されている２枚の熱拡散シートの形状を示す平面
図である。FIG. 9 is a plan view showing a cooling structure according to a fifth embodiment of the present invention, particularly the shapes of two heat diffusion sheets used.
【図１０】 この発明の実施の形態６に係る冷却構造、
特に使用されている２枚の熱拡散シートの形状を示す平
面図である。FIG. 10 shows a cooling structure according to a sixth embodiment of the present invention;
It is a top view which shows the shape of the two heat-diffusion sheets used especially.
【図１１】 一参考例に係る冷却構造を示す断面図であ
る。FIG. 11 is a cross-sectional view illustrating a cooling structure according to a reference example.
１ 発熱部品、２ 基板、３ 筐体、４，４−１，４−
２ 熱拡散シート、４ａ 縁、５ 隣接部品、６ 押当
部材、７ 固着面、８ 切込み、９ 山型収納部、１０
弾性支持フレーム。1 Heating components, 2 boards, 3 housings, 4,4-1,4-
2 heat diffusion sheet, 4a edge, 5 adjacent parts, 6 pressing member, 7 fixing surface, 8 cut, 9 mountain-shaped storage section, 10
Elastic support frame.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 7/20 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 7/20
Claims (18)
温面上に配置され当該発熱基板側に台状の外表面を呈す
る押当部材と、この押当部材の外表面の形状がほぼ現れ
るよう上記低温面を被覆し、その一部が上記低温面に固
着され、かつ熱伝導性及び柔軟性を有する素材から形成
された熱拡散シートと、を備え、この熱拡散シートの一
部を上記発熱部品に押し当てかつ他の一部を上記低温面
に固着させることにより、上記発熱部品にて生じた熱を
上記熱拡散シート又は上記押当部材を介し上記低温面へ
と逃がすことを特徴とする冷却構造。1. A pressing member which is disposed on a low-temperature surface so as to face a heat-generating component on a circuit board and presents a trapezoidal outer surface on the side of the heat-generating substrate, and the shape of the outer surface of the pressing member substantially appears. And a heat diffusion sheet formed of a material having thermal conductivity and flexibility, a part of which is fixed to the low temperature surface. By pressing against the heat-generating component and fixing the other part to the low-temperature surface, heat generated in the heat-generating component is released to the low-temperature surface via the heat diffusion sheet or the pressing member. Cooling structure.
いに非平行な線状切込みを有し、これらの線状切込みに
交叉する方向に沿い上記熱拡散シートを折り曲げること
により、上記押当部材を収納する山形収納部が形成され
ていることを特徴とする請求項１記載の冷却構造。2. The pressing member according to claim 1, wherein the heat diffusion sheet has preformed non-parallel linear cuts and bends the heat diffusion sheet along a direction intersecting these linear cuts. The cooling structure according to claim 1, wherein a chevron-shaped storage portion for storing the airbag is formed.
部材の幅とほぼ同じである帯状の部分を有し、この帯状
の部分を折り曲げることにより、上記押当部材を被覆す
る山形収納部が形成されていることを特徴とする請求項
１記載の冷却構造。3. The heat diffusion sheet has a band-shaped portion whose width is substantially the same as the width of the pressing member, and the band-shaped portion is bent to cover the pressing member. The cooling structure according to claim 1, wherein a portion is formed.
の上記熱拡散シートを備え、これら複数枚の上記熱拡散
シートそれぞれの上記帯状の部分によって上記押当部材
を互いに異なる方向に沿い被覆することを特徴とする請
求項３記載の冷却構造。4. A plurality of heat diffusion sheets each having the band-shaped portion, and the pressing members are covered by the band-shaped portions of the plurality of heat diffusion sheets in different directions. 4. The cooling structure according to claim 3, wherein:
又は粘着剤にて上記低温面に固着させたことを特徴とす
る請求項１乃至４のいずれかに記載の冷却構造。5. The cooling structure according to claim 1, wherein said heat diffusion sheet is fixed to said low-temperature surface with a thermally conductive adhesive or pressure-sensitive adhesive.
応力が上記発熱部品の各部に均等に分布するよう、上記
押当部材と上記低温面との間に弾性を有する支持フレー
ムを配置したことを特徴とする請求項１乃至５のいずれ
かに記載の冷却構造。6. A supporting frame having elasticity is arranged between the pressing member and the low-temperature surface so that stress relating to pressing through the heat diffusion sheet is evenly distributed to each part of the heat generating component. The cooling structure according to claim 1, wherein:
されその内部にて空気を保持する孔を有するスペーサを
備えることを特徴とする請求項１記載の冷却構造。7. The cooling structure according to claim 1, further comprising a spacer disposed between said pressing member and said low-temperature surface and having a hole for retaining air therein.
スペーサが、金属材料より軽量な樹脂材料、樹脂材料よ
り熱伝導率が高い金属材料、並びに上記回路基板の発熱
部品搭載面及び上記低温面に沿う方向における熱伝導率
が高くこれと交叉する方向における熱伝導率が低い異方
性熱伝導材料のうち、いずれかから形成されたことを特
徴とする請求項１乃至７のいずれかに記載の冷却構造。8. The pressing member, the support frame and / or the spacer are made of a resin material which is lighter than a metal material, a metal material which has a higher thermal conductivity than a resin material, and a heating component mounting surface and a low temperature surface of the circuit board. 8. An anisotropic heat conductive material having a high thermal conductivity in a direction along the direction and a low thermal conductivity in a direction crossing the direction, and formed from any one of the anisotropic heat conductive materials. Cooling structure.
当該熱拡散シートを介し上記低温面に至る熱の拡散伝達
の方向と平行な縁を有することを特徴とする請求項１乃
至８のいずれかに記載の冷却構造。9. The thermal diffusion sheet according to claim 1, wherein the thermal diffusion sheet has an edge parallel to a direction of diffusion and transfer of heat from the heat-generating component to the low-temperature surface via the thermal diffusion sheet. A cooling structure as described in Crab.
しその内壁面にて上記低温面を提供する筐体と、請求項
１乃至９のいずれかに記載の冷却構造と、を備え、上記
筐体の外壁面が自然空冷されることを特徴とする携帯型
電子機器。10. The cooling board according to claim 1, further comprising: the circuit board; a housing for accommodating the circuit board and providing the low-temperature surface on an inner wall surface thereof; A portable electronic device wherein an outer wall surface of a housing is naturally cooled by air.
路基板を収納する筐体、熱伝導性及び柔軟性を有する素
材から形成された熱拡散シート、及び台状の外形を有す
る押当部材を、予め準備しておくステップと、上記回路
基板を上記筐体に収納したとき上記発熱部品に上記熱拡
散シートの一部が押し当てられるよう、上記押当部材を
上記筐体の内壁面上の所定の位置に配置するステップ
と、上記押当部材及び上記筐体の内壁面を上記熱拡散シ
ートにより被覆した上でこの熱拡散シートの一部を上記
筐体の内壁面に固着するステップと、上記発熱部品と上
記押当部材とが少なくとも部分的に対向し当該対向部位
にて上記熱拡散シートが上記発熱部品に接触するよう、
上記回路基板を上記筐体に収納するステップと、を実行
することにより、その一部が上記発熱部品に押し当てら
れ他の一部が上記筐体の内壁面に固着された上記熱拡散
シートを介し、上記発熱部品にて生じた熱を上記筐体へ
と逃がす冷却構造を、形成することを特徴とする冷却構
造形成方法。11. A circuit board on which a heat-generating component is mounted, a housing for housing the circuit board, a heat diffusion sheet formed of a material having thermal conductivity and flexibility, and a pressing member having a trapezoidal outer shape. Preparing, in advance, the pressing member on the inner wall surface of the housing so that a part of the heat diffusion sheet is pressed against the heat generating component when the circuit board is housed in the housing. Arranging at a predetermined position, and fixing a part of the heat diffusion sheet to the inner wall surface of the housing after covering the inner wall surface of the pressing member and the housing with the heat diffusion sheet, The heat generating component and the pressing member are at least partially opposed to each other so that the heat diffusion sheet contacts the heat generating component at the opposed portion,
Storing the circuit board in the housing, and executing the heat diffusion sheet, a part of which is pressed against the heat-generating component and the other part is fixed to the inner wall surface of the housing. Forming a cooling structure for radiating heat generated by the heat-generating component to the housing via the heat-generating component.
しておき、上記押当部材を上記支持フレームを介し上記
筐体の内壁面上に配置することを特徴とする請求項１１
記載の冷却構造形成方法。12. A support frame having elasticity is prepared in advance, and said pressing member is disposed on an inner wall surface of said housing via said support frame.
The method for forming a cooling structure according to the above.
き、上記押当部材を上記スペーサを介し上記筐体の内壁
面上に配置することにより、上記押当部材と上記低温面
との間を上記孔内部の空気によって部分的に断熱させる
ことを特徴とする請求項１１記載の冷却構造形成方法。13. A spacer having a hole is prepared in advance, and the pressing member is disposed on the inner wall surface of the housing via the spacer, so that the space between the pressing member and the low-temperature surface is provided. The cooling structure forming method according to claim 11, wherein the heat is partially insulated by air inside the hole.
上記熱拡散シートにより被覆したとき上記押当部材が山
形収納部に収納されるよう、上記熱拡散シートに予め当
該山形収納部を設けておくことを特徴とする請求項１１
乃至１３のいずれかに記載の冷却構造形成方法。14. When the pressing member and the inner wall surface of the housing are covered with the heat diffusion sheet, the heat diffusion sheet stores the angled storage portion in advance so that the pressing member is stored in the angled storage portion. 12. An arrangement according to claim 11, wherein
14. The method for forming a cooling structure according to any one of claims 13 to 13.
な複数の線状切込みを入れておき、上記押当部材及び上
記筐体の内壁面を上記熱拡散シートにより被覆する際に
これらの線状切込みに交叉する方向に沿い上記熱拡散シ
ートを折り曲げることにより、上記山形収納部を形成す
ることを特徴とする請求項１４記載の冷却構造形成方
法。15. A plurality of non-parallel linear cuts are previously made in the heat diffusion sheet, and these linear cuts are formed when the pressing member and the inner wall surface of the housing are covered with the heat diffusion sheet. 15. The cooling structure forming method according to claim 14, wherein the chevron-shaped storage portion is formed by bending the heat diffusion sheet along a direction intersecting the cut.
である帯状の部分を上記熱拡散シートに予め設けてお
き、この帯状の部分を上記押当部材の外形に倣って折り
曲げることにより、上記押当部材を被覆する山形収納部
を形成することを特徴とする請求項１４記載の冷却構造
形成方法。16. A band-like portion whose width is substantially the same as the width of the pressing member is provided in advance on the heat diffusion sheet, and the band-like portion is bent along the outer shape of the pressing member. 15. The cooling structure forming method according to claim 14, wherein a chevron-shaped storage portion for covering the pressing member is formed.
ートを複数枚準備しておき、互いに異なる方向から上記
押当部材を被覆するよう上記複数枚の熱拡散シートを配
置しかつそれらの上記帯状の部分を折り曲げることを特
徴とする請求項１６記載の冷却構造形成方法。17. A plurality of the heat diffusion sheets having the band-shaped portions are prepared, and the plurality of heat diffusion sheets are arranged so as to cover the pressing member from different directions from each other. 17. The method according to claim 16, wherein the portion is bent.
部品から当該熱拡散シートを介し上記低温面への熱の拡
散伝達の方向と平行な縁を設けておくことを特徴とする
請求項１１乃至１７のいずれかに記載の冷却構造形成方
法。18. The heat diffusion sheet is provided with an edge parallel to a direction in which heat is transmitted from the heat-generating component to the low-temperature surface via the heat diffusion sheet. 18. The method for forming a cooling structure according to any one of claims 17 to 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33857697A JP2930923B2 (en) | 1996-12-13 | 1997-12-09 | Cooling structure, portable electronic device using the same, and method of forming cooling structure |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-334017 | 1996-12-13 | ||
| JP33401796 | 1996-12-13 | ||
| JP33857697A JP2930923B2 (en) | 1996-12-13 | 1997-12-09 | Cooling structure, portable electronic device using the same, and method of forming cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10229287A JPH10229287A (en) | 1998-08-25 |
| JP2930923B2 true JP2930923B2 (en) | 1999-08-09 |
Family
ID=26574709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33857697A Expired - Fee Related JP2930923B2 (en) | 1996-12-13 | 1997-12-09 | Cooling structure, portable electronic device using the same, and method of forming cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2930923B2 (en) |
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|---|---|---|---|---|
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| CN1290391C (en) * | 2000-06-06 | 2006-12-13 | 三菱电机株式会社 | Cooling structure of communication device |
| JP2005129734A (en) | 2003-10-23 | 2005-05-19 | Sony Corp | Electronic device |
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| JP4729296B2 (en) * | 2003-12-11 | 2011-07-20 | パナソニック株式会社 | Heat dissipation structure for electronic equipment |
| JP4430451B2 (en) * | 2004-04-21 | 2010-03-10 | 大成ラミネーター株式会社 | Semiconductor device heat dissipation device |
| JP4483598B2 (en) * | 2005-01-21 | 2010-06-16 | パナソニック株式会社 | Electronic equipment with graphite sheet |
| JP2007027520A (en) * | 2005-07-20 | 2007-02-01 | Nec Access Technica Ltd | Radiator |
| JP2007266518A (en) * | 2006-03-30 | 2007-10-11 | Nec Personal Products Co Ltd | Heat dissipating structure, and information processing apparatus |
| JP4656047B2 (en) * | 2006-11-29 | 2011-03-23 | ミツミ電機株式会社 | Electronic device casing structure and power supply device |
| JP4978521B2 (en) * | 2008-03-14 | 2012-07-18 | 富士通東芝モバイルコミュニケーションズ株式会社 | Mobile device |
| WO2011021384A1 (en) | 2009-08-18 | 2011-02-24 | パナソニック株式会社 | Electronic device cooling structure |
| JP5051256B2 (en) * | 2010-03-11 | 2012-10-17 | ソニー株式会社 | Electronics |
| JP5899473B2 (en) | 2011-02-03 | 2016-04-06 | パナソニックＩｐマネジメント株式会社 | Electronic equipment cooling structure |
| JP5906140B2 (en) | 2012-06-22 | 2016-04-20 | 日東電工株式会社 | Radiation heat conduction suppression sheet |
| WO2014021046A1 (en) * | 2012-07-30 | 2014-02-06 | 株式会社村田製作所 | Electronic apparatus and heat conductive sheet |
| JP6024297B2 (en) * | 2012-08-30 | 2016-11-16 | 株式会社村田製作所 | Electronic device, method for manufacturing electronic device |
| WO2014045671A1 (en) * | 2012-09-21 | 2014-03-27 | 株式会社村田製作所 | Electronic device |
| US9291400B2 (en) * | 2013-03-13 | 2016-03-22 | Elwha Llc | Management of exterior temperatures encountered by user of a portable electronic device using multiple heat-rejection elements |
| US8971043B2 (en) | 2013-03-13 | 2015-03-03 | Elwha Llc | Management of exterior temperatures encountered by user of a portable electronic device in response to an inferred user contact with the portable electronic device |
| US9291399B2 (en) | 2013-03-13 | 2016-03-22 | Elwha Llc | Management of exterior temperatures encountered by user of a portable electronic device |
| US9826668B2 (en) | 2013-12-31 | 2017-11-21 | Amogreentech Co., Ltd. | Composite sheet and portable terminal having same |
| JP2017195514A (en) * | 2016-04-20 | 2017-10-26 | キヤノン株式会社 | Head mount device and gripping device |
| JP6578616B1 (en) * | 2018-06-27 | 2019-09-25 | レノボ・シンガポール・プライベート・リミテッド | Electronics |
-
1997
- 1997-12-09 JP JP33857697A patent/JP2930923B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10229287A (en) | 1998-08-25 |
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| LAPS | Cancellation because of no payment of annual fees |