JP3223862B2 - Bonding equipment for electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying a bonding agent such as a solder paste, an adhesive or a flux to an electronic component, and more particularly, to a method for efficiently applying the bonding agent to one surface of a plurality of electronic components. Also, the present invention relates to an improvement of a device for applying a coating reliably.

[0002]

2. Description of the Related Art For example, when mounting a chip-type electronic component on a circuit board, a bonding agent such as a solder paste is applied to one surface of the chip-type electronic component, and the chip-type electronic component coated with the bonding agent is mounted on the circuit board. Mount on top. In order to enhance productivity, it is required to apply the bonding agent to many chip-type electronic components at once.

An example of a conventional bonding agent application device will be described with reference to FIGS. 7 and 8. FIG. In the application device 51, an adhesive 53 is applied on a base plate 52.
The strip-shaped portions of the base plate 52 indicated by broken lines constitute the stages 52a and 52b. That is, the stages 52a and 52b protrude upward from the base plate 52 during use, as shown in FIG. The adhesives 53a applied on the stages 52a and 52b,
A cap member 54 as an electronic component is placed on the 53b, and adhesives 53a, 53
b is applied. After that, the cap members 54, 54 are
By placing the cap member 54 on a piezoelectric substrate or the like (not shown), the cap member 54 is fixed to the piezoelectric substrate or the like via an adhesive.

In the coating device 51, the band-shaped stages 52a and 52b are moved upward from the base plate 52 as described above, whereby the adhesives 53a and 53b can be coated on a part of the lower surface of the cap material 54. Have been.

As an alternative to the coating device 51,
A coating apparatus using the blades 55 and 56 shown in FIGS. 9 and 10 has also been proposed. The blade 55 shown in FIG. 9 functions to smooth the adhesive on the stage 56 and apply the adhesives 53a and 53b in a strip shape as shown in the figure. Therefore, the adhesive can be applied to a part of the lower surface of the cap material 54 by placing the cap material 54 shown in FIG. 8 so as to straddle the band-like adhesives 53a and 53b.

The blade 55 has a structure in which a pair of squeegee portions 55a and 55b are provided on the lower surface to apply the adhesives 53a and 53b in a strip shape on the stage 56, and a recess is provided between the squeegee portions 55a and 55b. 55c.

On the other hand, the blade 57 shown in FIG.
In order to apply 3b, a pair of squeegee portions 57a and 57b are formed on both sides in the width direction. Squeegee part 57a,
A projecting portion 57c for scraping excess adhesive on the stage 56 is formed between 57b.

[0008]

In the coating apparatus 51 shown in FIGS. 7 and 8, after the adhesive 53 is applied flatly on the base plate 52, the band-like stages 52a and 52b are raised and the cap material 54 is removed. Adhesive 53 on the lower surface of
a, 53b, but the adhesive base plate 52
A series of steps, such as application on the top, raising the stages 52a and 52b, lowering the stages 52a and 52b after bonding, and smoothing the adhesive 53 on the base plate 52 must be performed.

Accordingly, the adhesive may enter the sliding portion between the stages 52a and 52b and the base plate 53, and may hinder the raising and lowering of the stages 52a and 52b. Further, when it is necessary to apply an adhesive to a larger number of cap members 54, the length of the stages 52a and 52b must be increased or the number thereof must be increased. The movement of the stages 52a and 52b tends to be difficult due to the intrusion of the adhesive into the portions.

In addition, as a result of the difficulty in moving the stages 52a and 52b, application variations of the adhesive applied to the lower surface of the cap member 54 tend to occur. On the other hand, in the coating apparatus using the blades 55 and 57 shown in FIGS. 9 and 10, it is difficult to form the belt-like adhesives 53a and 53b with high accuracy, though it depends on the viscosity of the adhesives 53a and 53b. Met. As a result, the object to be applied such as the cap member 54 shown in FIG.
When placed along the longitudinal direction of 53b, the cap material 5
4, there is a problem that the coating width and the coating thickness vary, and the positional accuracy of the coating tends to be insufficient.

It is an object of the present invention not only to efficiently apply a bonding agent partially to one surface of an electronic component, but also to reduce application variation of the bonding agent and to reduce the amount of the bonding agent used. An object of the present invention is to provide a bonding agent application device for electronic components that can be achieved.

[0012]

According to a first aspect of the present invention, an electronic component is placed on a bonding agent layer of a stage having a bonding agent layer formed on an upper surface, and a bonding agent is provided on one surface of the electronic component. A bonding agent application device for an electronic component, which applies a bonding agent, wherein a stage in which a groove is formed on an upper surface and a bonding agent application section is provided on both sides of the groove, and a length of the groove A blade body that is provided so as to be movable along the direction and has a bonding agent smoothing portion that is in contact with the stage surface on both sides of the groove, and that is integrally formed with the blade body and enters the groove And a blade having a Russell-like projection.

In the above-mentioned apparatus for applying a bonding agent for electronic parts, the Russell-like projection preferably extends obliquely downward from a lower portion of the blade body.
In addition, it has an upper surface that becomes lower toward the distal end so that the width and height become smaller toward the distal end, and a pair of side surfaces that are shifted toward the center in the width direction toward the distal end. .

According to the third aspect of the present invention, the distance between the pair of side surfaces of the Russell-like projection is equal to the width of the groove at the base of the Russell-like projection. Claim 4
More preferably, the upper surface of the Russell-like projection is located above the smoothing portion at the base of the Russell-like projection.

In the present invention, "electronic parts"
For example, it includes not only an electronic component as a finished product such as a chip-type electronic component but also a member constituting a part of the electronic component such as a cap material as a sealing member.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, non-limiting embodiments according to the present invention will be described with reference to the drawings.

FIG. 1 is a partially cutaway perspective view illustrating an apparatus for applying a bonding material for electronic components according to an embodiment of the present invention. The bonding agent application device 1 includes a rectangular stage 2 having an elongated planar shape and a blade 3. Stage 2
For example, it is made of a rigid material such as a synthetic resin or a metal, and has a groove 2a extending in the longitudinal direction on the upper surface. Although the cross-sectional shape of the groove 2a is rectangular, the groove 2a
Is not particularly limited to this. Groove 2a
And the upper surface of the stage 2 is coated with the coating unit 2b and the coating unit 2c.
And is divided into:

In this embodiment, a part of the strip-shaped insulating adhesive layers 5a and 5b provided on the coating portions 2b and 2c is
It is applied to the lower surface of the metal cap material 4. Blade 3
Is used to form the band-like adhesive layers 5a and 5b on the coating portions 2b and 2c.

FIG. 2 is a partially cutaway front view of the blade 3,
FIG. 3 is a partially cutaway side view. The blade 3 includes a blade body 3a moving on the stage 2 and a blade body 3a.
And a Russell-like projection 6 integrally formed. On the lower surface of the blade main body 3a, there are formed smoothing portions 3b and 3c which are in contact with the coating portions 2b and 2c.
Between b and 3c, the Russell-like protrusion 6 extends obliquely downward. Hereinafter, the tip side of the Russell-like projection is referred to as the front.

As shown in FIG. 3, the smoothing portion 3c has a part 3f of the bottom surface of the blade body 3 extending in the horizontal direction, and an inclined surface 3g inclined upward from the front end. The other smoothing portion 3b is similarly configured, and has a portion 3d of the bottom surface and an inclined surface 3e (see FIG. 2).

The Russell-like projection 6 is formed so that the tip 6a becomes thinner toward the tip. More specifically, upper surface 6b of Russell-like projection 6
Has its height lowered toward the tip,
A pair of side surfaces 6c and 6d connected to both sides of the upper surface 6b
It is formed so that the space between them becomes narrower toward the tip.

On the base side of the Russell-like projection 6, the upper surface 6b is located above the smoothing portions 3b, 3c, and the distance between the side surfaces 6c, 6d is equal to the width of the groove 2a. Have been.

A process for partially applying the adhesive to the lower surface of the cap member 4 using the coating device 1 shown in FIG. 1 will be described. First, on the upper surface of the stage 2, an adhesive is applied in front of the Russell-like projections 3, and the blade 3 is moved by the arrow A
Move in the direction, ie forward. The movement of the blade 3 may be performed by a reciprocating drive source (not shown), or the blade 3 may be moved manually.

As the blade 3 moves forward, on the coating sections 2b and 2c of the stage 2, the smoothing section 3
Since b and 3c move forward, the smoothing units 3b and 3c
The adhesive is smoothed between c and the application parts 2b and 2c of the stage, and flat belt-like adhesive layers 5a and 5b are formed. In addition, the adhesive in the groove 2a is pushed up onto the application parts 2b, 2c as the Russell-like projections 6 move forward, and is smoothed by the smoothing parts 3b, 3c. That is, the adhesive in the groove 2a is brought to the side wall side of the groove 2a by the side surfaces 6c and 6d of the Russell-like projection 6, and is also carried to the space between the inclined surfaces 3e and 3g and the application portions 2b and 2c. Become. Therefore, the adhesive adhered in the groove 2a is flattened by the smoothing portions 3b and 3c,
Flat band-shaped adhesive layers 5a and 5b can be formed with high precision.

Next, the cap material 4 is placed so as to straddle the band-like adhesive layers 5a and 5b formed as described above. As a result, as shown in FIG. 4, on the lower surface of the cap material 4, the insulating adhesive is applied to the portions in contact with the adhesive layers 5a and 5b.

As described above, the adhesive can be partially applied to the lower surface of the cap member 4. The cap material 4 to which the adhesive has been applied in this manner is, for example, as shown in FIG.
The base substrate 7 and the cap material 4
Thus, a space for accommodating the piezoelectric resonator can be formed. In the piezoelectric resonance component 8, a piezoelectric resonance element (not shown) is fixed on the base substrate 7 so as to be surrounded by the cap member 4. Further, terminal electrodes 9a, 9b, 9c are formed on the upper surface of the base substrate 7. The piezoelectric resonator is electrically connected to the terminal electrodes 9a and 9b.

On the other hand, the insulating adhesive is applied to the lower surface of the cap member 4 as described above in the region outside the dashed lines B and C shown in FIG. Therefore, the cap material 4
Are firmly joined to the base substrate 7. In addition, the insulating adhesive is generally cured by heating.
Is not bonded to the base substrate 7 in the region sandwiched between the dashed lines B and C, so that even if the air in the cap material 4 expands during curing, Air is released from the gap between the base substrate 7. Therefore, the cap material 4 due to the increase of the internal pressure
In addition, it is possible to prevent the misalignment or the accident that the cap member 4 comes off the base substrate 7 and also prevent the fluctuation of the characteristics of the piezoelectric resonator due to the increase of the internal pressure.

Next, in the region between the dashed lines B and C, the cap material 4 and the base substrate 7 are formed using a conductive adhesive.
And connecting the conductive adhesive to the terminal electrode 9c connected to the ground potential, the cap material 4 can have an electromagnetic shielding function.

In the coating apparatus 1 of the present embodiment, as described above, the adhesive layer 5 having a band shape
The adhesive derived from a and 5b can be applied reliably.
Moreover, since the blade 3 has the Russell-like projections 6, the width and flatness of the band-like adhesive layers 5a and 5b are maintained with high accuracy. Therefore, when the adhesive is partially applied to the lower surfaces of the many cap members 4, the adhesive can be applied to the lower surfaces of the cap members 2 with high precision.

In the above-described embodiment, the cap member 4 having the lower opening periphery having the same height is used as the cap member 4, but the notches 14a and 14b are formed on the lower surface of the cap member 14 as shown in FIG. The notches 14a, 14
b, if the adhesive is hardly attached,
When the adhesive is partially applied to the lower surface of the cap member 4, it is possible to more effectively prevent the adhesive from adhering to an undesired portion.

In the above-described embodiment, the case where the insulating adhesive is partially applied to the lower surface of the cap member 4 for forming the piezoelectric resonance component has been described. For the application of solder paste or conductive adhesive to multiple electrodes that should not be touched when mounting electronic components, or to apply conductive or insulating adhesive partially to the lower surface of electronic components It can be generally used for applications such as coating.

[0032]

As described above, according to the first aspect of the present invention, the groove is formed on the upper surface of the stage for applying the bonding agent, and the bonding agent application portions are provided on both sides of the groove. A blade is provided so as to be movable along the length direction of the groove, and the blade has a bonding agent smoothing portion for smoothing the upper surface of the bonding agent layer on both sides of the groove, and a blade. Since it has a Russell-like projection that enters, the bonding agent is applied to the upper surface of the stage, and the blade is moved along the length direction of the groove, so that the bonding agent entering the groove is bonded to both sides of the groove. The bonding agent layer can be reliably moved to the coating portion, and in the bonding agent coating portion on both sides of the groove, the bonding agent layer is flattened with high precision by the bonding agent smoothing portion. Therefore, by bringing the above-mentioned electronic components such as the cap material and the chip-type electronic component into contact with the bonding agent layer, it is possible to apply the bonding agent to one surface of these electronic components reliably and with high precision. It becomes possible.

In addition, the conventional coating apparatus shown in FIGS. 7 and 8 requires a complicated structure for moving the stage up and down, and has a problem that the bonding agent enters the sliding portion. In the bonding agent applying apparatus for an electronic component according to the first aspect of the present invention, since the stage has no moving mechanism, such a failure hardly occurs.

Further, as described above, the bonding agent adhered to the groove is reliably moved to the upper surface of the stage on both sides of the groove by the Russell-like projection, so that the amount of the bonding agent used can be reduced. .

According to the second aspect, the Russell-like protrusion extends obliquely downward from the lower portion of the blade body, and has an upper surface that becomes lower toward the distal end and a width that increases toward the distal end. And a pair of side surfaces that are brought to the center in the direction, so that the Russell-like protrusions are moved in the groove toward the tip direction of the protrusion, so that the bonding agent adhering to the groove is removed. Are moved toward the side wall of the groove by the pair of side surfaces of the groove, and are reliably moved to the bonding agent application portions on both sides of the groove by the upper surface of the Russell-like projection.

In the third aspect of the present invention, the distance between the pair of side surfaces of the Russell-like projection is equal to the width of the groove at the base of the Russell-like projection, so that the Russell-like projection adheres to the inside of the groove. The forward movement of the Russell-like projections ensures that the bonding agent is brought closer to the side wall of the groove, so that the excess bonding agent in the groove can be reliably moved to the bonding agent application section.

According to the fourth aspect of the present invention, since the upper surface of the Russell-like projection is located above the smoothing portion at the base of the Russell-like projection, the bonding agents in the groove can be removed.
The forward movement of the Russell-like projections can ensure that the Russell-like projections can be moved toward the bonding agent application portions on both sides of the groove.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view for explaining a bonding agent application device for an electronic component according to an embodiment of the present invention.

FIG. 2 is a partially cutaway front view for explaining a blade used in the bonding agent applying apparatus of the embodiment.

FIG. 3 is a side view for explaining a main part of a blade used in the embodiment.

FIG. 4 is a partially cutaway perspective view for explaining a step of partially applying a bonding agent to a lower surface of a cap material using the bonding agent application device of the embodiment shown in FIG. 1;

FIG. 5 is a plan view showing a piezoelectric resonance component configured using a cap material on which an adhesive is applied using the bonding agent application device of the embodiment.

FIG. 6 is a perspective view showing another example of a cap material that is effectively used in the bonding agent applying apparatus of the embodiment.

FIG. 7 is a perspective view showing an example of a conventional bonding agent application device.

8 is a perspective view showing a state in which the stage has been moved upward in the bonding agent applying apparatus shown in FIG. 7;

FIG. 9 is a perspective view showing another example of a conventional bonding agent application device.

FIG. 10 is a perspective view for explaining still another example of a conventional bonding agent applying device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Bonding agent application device of electronic components 2 ... Stage 2a ... Groove 2b, 2c ... Bonding agent coating part 3 ... Blade 3a ... Blade main body 3b, 3c ... Bonding agent smoothing part 4: Cap material 5a, 5b ... Adhesive layer 6 ... Russell-like projection 6a ... Tip 6b ... Top surface 6c, 6d ... Side surface

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Atsushi Hirakawa 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (56) References JP-A-3-34325 (JP, A) 5-13740 (JP, U) Japanese Utility Model 7-37653 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/34

Claims (4)

(57) [Claims] 1. A bonding agent applying apparatus for an electronic component, wherein an electronic component is placed on the bonding agent layer of a stage having a bonding agent layer formed on an upper surface, and the bonding agent is applied to one surface of the electronic component. A stage in which a groove is formed on the upper surface, and a bonding agent application section is provided on both sides of the groove, and a stage is provided movably along the length direction of the groove,
And a blade body having a bonding agent smoothing portion that is in contact with the stage surfaces on both sides of the groove, and a blade that is integrally formed with the blade body and has a Russell-like projection that enters the groove. Characterized by a bonding agent application device for electronic components. 2. An upper surface, wherein the Russell-like projection extends obliquely downward from a lower portion of the blade body, and has a width and a height that become smaller toward the tip, and become lower toward the tip. The bonding agent application device for an electronic component according to claim 1, further comprising a pair of side surfaces that are closer to the center in the width direction toward the front end side. 3. The application of a bonding agent for an electronic component according to claim 2, wherein a distance between the pair of side surfaces of the Russell-like projection is equal to a width of the groove at a base of the Russell-like projection. apparatus. 4. The bonding agent applying apparatus for an electronic component according to claim 2, wherein an upper surface of the raschel-shaped projection is located above the smoothing portion at a base of the raschel-shaped projection. .