JP3214303B2 - Manufacturing method of liquid crystal element - Google Patents

Manufacturing method of liquid crystal element

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Publication number
JP3214303B2
JP3214303B2 JP19382895A JP19382895A JP3214303B2 JP 3214303 B2 JP3214303 B2 JP 3214303B2 JP 19382895 A JP19382895 A JP 19382895A JP 19382895 A JP19382895 A JP 19382895A JP 3214303 B2 JP3214303 B2 JP 3214303B2
Authority
JP
Japan
Prior art keywords
electrode substrates
liquid crystal
pair
adhesive
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19382895A
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Japanese (ja)
Other versions
JPH0943613A (en
Inventor
眞樹 須永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP19382895A priority Critical patent/JP3214303B2/en
Priority to US08/687,990 priority patent/US5942066A/en
Publication of JPH0943613A publication Critical patent/JPH0943613A/en
Application granted granted Critical
Publication of JP3214303B2 publication Critical patent/JP3214303B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、液晶素子の製造方
法に係り、特に対向する一対の電極基板間に液晶を封入
する液晶セル用シール剤及び一対の電極基板を点接着す
る接着剤ビースの硬化工程を有する液晶素子の製造方法
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal element, and more particularly to a sealing agent for a liquid crystal cell for sealing a liquid crystal between a pair of opposing electrode substrates and an adhesive bead for spot bonding the pair of electrode substrates. The present invention relates to a method for manufacturing a liquid crystal element having a curing step.

【0002】[0002]

【従来の技術】従来、一対の電極基板を接着する液晶セ
ル用シール剤及び接着剤ビースの硬化方法は、一対の電
極基板を重ね合わせ、アライメントした後、加熱時の熱
膨張による電極基板の歪みを抑えるために電極基板全面
を、0.1〜5.0kg/cm2 の圧力で加圧しながら10
0〜200℃に設定されたオーブンの中で硬化させると
いう方法が一般的であった。
2. Description of the Related Art Conventionally, a method of curing a liquid crystal cell sealant and an adhesive bead for bonding a pair of electrode substrates is performed by superposing and aligning the pair of electrode substrates, and then distorting the electrode substrates due to thermal expansion during heating. While suppressing the entire surface of the electrode substrate with a pressure of 0.1 to 5.0 kg / cm 2 to suppress
A method of curing in an oven set at 0 to 200 ° C. was common.

【0003】この時の電極基板の歪みを抑えるための加
圧方法としては、例えば、電極基板全面に加重を印加す
るおもりによる加圧方法やエアー圧、バネ荷重等を利用
した加圧治具による方法などがある。
As a pressing method for suppressing the distortion of the electrode substrate at this time, for example, a pressing method using a weight that applies a load to the entire surface of the electrode substrate or a pressing jig using air pressure, spring load, or the like is used. There are methods.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、電極基
板の歪みを抑えるためのおもりやエアー圧、バネ荷重を
利用する加圧治具はそれ自体の熱容量が大きいため、例
えば160℃設定のオーブン中に投入したエアー加圧治
具内の電極基板の温度が150℃に達するには約3時間
を要する。このように、昇温速度が非常に遅い温度プロ
ファイルでの硬化には以下のような問題があった。
However, since a pressurizing jig using a weight, air pressure, and spring load for suppressing the distortion of the electrode substrate has a large heat capacity, it is necessary to set the jig in an oven set at, for example, 160 ° C. It takes about 3 hours for the temperature of the electrode substrate in the supplied air pressure jig to reach 150 ° C. As described above, curing with a temperature profile with a very low temperature rising rate has the following problems.

【0005】(1)ホットメルトタイプの接着剤ビース
が十分に溶ける以前に、接着剤ビース中の硬化剤とエポ
キシ接着剤の硬化反応が進んでしまい、電極基板との界
面にいわゆる濡れが生じず、十分な接着強度が得られな
くなる。このような状態では、とりわけ強誘電性液晶素
子においては耐衝撃性が低下する恐れがある。
(1) Before the hot melt type adhesive bead is sufficiently melted, the curing reaction between the curing agent in the adhesive bead and the epoxy adhesive proceeds, and so-called wetting does not occur at the interface with the electrode substrate. , Sufficient adhesive strength cannot be obtained. In such a state, the impact resistance may be reduced particularly in the ferroelectric liquid crystal element.

【0006】(2)液晶セル用シール剤の硬化には約1
50℃で、約1時間の熱処理が必要であるが、上述した
従来の硬化方法では、硬化のための熱処理時間(約1時
間)と、昇温時間(約3時間)、さらに冷却時間必要で
あり、電極基板の投入から取り出しまでの処理時間に長
時間を要する。
(2) It takes about 1 to cure the sealant for the liquid crystal cell.
A heat treatment at 50 ° C. for about 1 hour is required, but the above-described conventional curing method requires a heat treatment time for curing (about 1 hour), a temperature rise time (about 3 hours), and a cooling time. In addition, a long processing time is required from the loading of the electrode substrate to the removal of the electrode substrate.

【0007】更に、加圧治具内に電極基板を設置し、そ
れをオーブンに投入という従来の硬化方法では、大面積
の電極基板の加圧、加熱処理に、大型の加圧治具とオー
ブンが必要となるためにコストが高くなる。
Further, in a conventional curing method in which an electrode substrate is placed in a pressing jig and put into an oven, a large pressing jig and an oven are used for pressing and heating a large-area electrode substrate. Is required, which increases the cost.

【0008】そこで、本発明は、接着剤ビースの接着強
度の向上と、液晶セル用シール剤の硬化処理時間の短縮
化を図ることができる液晶素子の製造方法を提供するこ
とを目的とする。
Accordingly, an object of the present invention is to provide a method of manufacturing a liquid crystal element capable of improving the adhesive strength of an adhesive bead and shortening the curing time of a sealant for a liquid crystal cell.

【0009】[0009]

【課題を解決するための手段】そして、本発明は、上記
目的を達成するため、複数個の一対の電極基板を用意す
る第1工程と、前記複数個の各一対の電極基板毎に、該
一対の電極基板のうちの一方の電極上に該一対の電極基
板間に液晶を封入するための液晶セル用シール材、及び
前記一対の電極基板を接着する接着剤ビーズを取付ける
第2工程と、前記第2工程後に、前記複数個の各一対の
電極基板をそれぞれ貼り合わせる第3工程と、前記第3
工程後に、前記貼り合わされた前記複数個の各一対の電
極基板の両面に、順に緩衝材とヒートプレートとを介し
て発熱体をそれぞれ配置して積層する第4工程と、前記
第4工程後に、積層された前記複数個の各一対の電極基
板、前記複数個の緩衝材、前記複数個のヒートプレート
及び前記複数個の発熱体を一体に加圧し、前記複数個の
発熱体を発熱させて、前記液晶セル用シール材及び前記
接着剤ビーズを硬化させる第5の工程と、を有すること
を特徴としている。
In order to achieve the above-mentioned object, the present invention provides a first step of preparing a plurality of paired electrode substrates, and a step of preparing each of the plurality of paired electrode substrates. A second step of attaching a liquid crystal cell sealing material for enclosing liquid crystal between the pair of electrode substrates on one of the pair of electrode substrates, and an adhesive bead for bonding the pair of electrode substrates; A third step of bonding the pair of electrode substrates to each other after the second step;
After the step, a fourth step of sequentially arranging and laminating a heating element via a buffer and a heat plate on both surfaces of each of the pair of electrode substrates bonded to each other, and after the fourth step, Each of the plurality of stacked pair of electrode substrates, the plurality of buffer materials, the plurality of heat plates and the plurality of heating elements are integrally pressed to cause the plurality of heating elements to generate heat, And a fifth step of curing the liquid crystal cell sealing material and the adhesive beads.

【0010】[0010]

【0011】[0011]

【0012】[0012]

【発明の実施の形態】以下、図面に基づいて本発明の実
施の形態について説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0013】図1は、本発明の実施の形態に係る液晶素
子の製造方法におけるシール剤及び接着剤ビースの硬化
工程を示す概略断面図である。
FIG. 1 is a schematic sectional view showing a step of curing a sealant and an adhesive bead in a method for manufacturing a liquid crystal element according to an embodiment of the present invention.

【0014】この図に示すように、多段に設置された複
数の各一対の電極基板1a,1b間には、それぞれ下か
ら順に緩衝材2a、ヒートプレート3a、面状の発熱体
4、ヒートプレート3b、緩衝材2bが設置されてい
る。ヒートプレート3a、面状の発熱体4は、電極基板
1a,1bよりもやや大きく形成されており、緩衝材2
a,2b、ヒートプレート3bは、電極基板1a,1b
とほぼ同じ大きさで形成されている。
As shown in FIG. 1, a buffer 2a, a heat plate 3a, a planar heating element 4, and a heat plate 4 are provided between a plurality of pairs of electrode substrates 1a and 1b provided in multiple stages in order from the bottom. 3b and a cushioning material 2b are provided. The heat plate 3a and the planar heating element 4 are formed slightly larger than the electrode substrates 1a and 1b.
a, 2b and the heat plate 3b are connected to the electrode substrates 1a, 1b.
It is formed in substantially the same size as.

【0015】また、最上部に位置する電極基板1a,1
bの上部には、緩衝材2a、ヒートプレート3a、発熱
体4、ヒートプレート3b、緩衝材2bを介してエアー
圧による加圧を受けるアルミ等からなるエアー圧受け用
の金属材5が載置される。金属材5は、その厚さが均一
で、受けたエアー圧を均一に電極基板1a,1bに伝え
ることができる。
The uppermost electrode substrate 1a, 1
Above b, a metal material 5 for receiving air pressure made of aluminum or the like, which is pressurized by air pressure via the buffer material 2a, the heat plate 3a, the heating element 4, the heat plate 3b, and the buffer material 2b is placed. Is done. The metal material 5 has a uniform thickness and can transmit the received air pressure uniformly to the electrode substrates 1a and 1b.

【0016】また、最下部に位置する電極基板1a,1
bの下部にも、加圧台6との間に緩衝材2a、ヒートプ
レート3a、発熱体4、ヒートプレート3b、緩衝材2
bが設置されている。
Further, the lowermost electrode substrates 1a, 1
b, the buffer 2a, the heat plate 3a, the heating element 4, the heat plate 3b, the buffer 2
b is installed.

【0017】対向して配置された一対の電極基板1a,
1bの、対向する面の少なくともどちらか一方側には、
それ自身とで液晶セルを封入するための一液型熱硬化性
エポキシ接着剤を含む液晶セル用シール剤7、及び電極
基板1a,1bを点接着する熱硬化性エポキシ接着剤を
含むホットメルトタイプの接着剤ビース8が取り付けら
れている。
A pair of electrode substrates 1a,
1b, on at least one of the opposing surfaces,
A liquid crystal cell sealant 7 containing a one-part type thermosetting epoxy adhesive for enclosing the liquid crystal cell with itself, and a hot melt type containing a thermosetting epoxy adhesive for spot bonding the electrode substrates 1a and 1b. Adhesive bead 8 is attached.

【0018】緩衝材2a,2bは薄く形成されており、
各電極基板1a,1bが受けるエアー圧による加圧力を
均一化するために設置されている。
The cushioning members 2a and 2b are formed thinly.
It is provided to equalize the pressing force of the air pressure received by each of the electrode substrates 1a and 1b.

【0019】ヒートプレート3a,3bは、その間に配
置される面状の発熱体4の発熱を電極基板1a,1bに
対して均一に伝熱するためのものであり、伝熱性のよい
アルミ材等で形成されている。
The heat plates 3a and 3b are for uniformly transferring the heat generated by the planar heating element 4 disposed between the heat plates 3a and 3b to the electrode substrates 1a and 1b. It is formed with.

【0020】このように、本発明の実施の形態に係る液
晶素子の製造方法における液晶セル用シール剤及び接着
剤ビースの硬化工程では、貼り合わせた各電極基板1
a,1bをエアー圧で加圧しながら、各発熱体4の発熱
をヒートプレート3a,3b、緩衝材2a,2bを介し
て各電極基板1a,1bに伝熱して、液晶セル用シール
剤7及び接着剤ビース8を硬化させる。
As described above, in the step of curing the liquid crystal cell sealant and the adhesive bead in the method of manufacturing a liquid crystal element according to the embodiment of the present invention, the electrode substrates 1 bonded together are used.
While pressurizing a and 1b with air pressure, the heat generated by each heating element 4 is transferred to each of the electrode substrates 1a and 1b via the heat plates 3a and 3b and the cushioning materials 2a and 2b, and the liquid crystal cell sealant 7 and The adhesive bead 8 is cured.

【0021】尚、緩衝材2a,2bは薄く形成され、ヒ
ートプレート3a,3bは伝熱性がよいので、発熱体4
の発熱をほとんど逃がすことなく電極基板1a,1bに
伝熱することができる。
Since the cushioning members 2a and 2b are formed to be thin and the heat plates 3a and 3b have good heat conductivity, the heating elements 4
Can be transferred to the electrode substrates 1a and 1b with almost no loss of heat.

【0022】次に、本発明の実施例を挙げて詳細に説明
する。
Next, an embodiment of the present invention will be described in detail.

【0023】[0023]

【実施例】【Example】

(実施例1)上述した液晶セル用シール剤及び接着剤ビ
ースの硬化工程において、各一対の電極基板1a,1b
を構成する一方のガラス基板(板厚:1.1mm、サイ
ズ:300mm×320mm)上に、スクリーン印刷法
にて液晶セル用シール剤(例えば、三井東圧化学社製、
商品名:ストラクトボンドXN−21−F)を印刷し、
その後、平均粒径5.6μm 程度の接着剤ビース(例え
ば、東レ社製、商品名:トレパールタイプIII )を1mm
2 当たり平均170個の密度で散布した。
(Embodiment 1) In the curing step of the liquid crystal cell sealant and the adhesive bead, the pair of electrode substrates 1a and 1b
A liquid crystal cell sealant (for example, manufactured by Mitsui Toatsu Chemical Co., Ltd.) on a glass substrate (sheet thickness: 1.1 mm, size: 300 mm × 320 mm) constituting
Product name: Print Structbond XN-21-F)
Then, an adhesive bead having an average particle size of about 5.6 μm (for example, trade name: Trepearl Type III, manufactured by Toray Industries, Inc.) is 1 mm thick.
Sprayed at an average density of 170 pieces per 2 .

【0024】また、一対の電極基板1a,1bを構成す
る他方のガラス基板(板厚は1.1mm)上に平均粒径
1.04μm 程度のスペーサー(例えば、触媒化成工業
社製、商品名:シリカマイクロビーズ)を1mm2 当たり
平均300個の密度で散布した。
A spacer having an average particle size of about 1.04 μm (for example, manufactured by Catalyst Kasei Kogyo Co., Ltd., on the other glass substrate (having a thickness of 1.1 mm) constituting the pair of electrode substrates 1 a and 1 b) (Silica microbeads) were applied at an average density of 300 per mm 2 .

【0025】そして、この2枚のガラス基板を貼り合わ
せて、一対の電極基板1a,1bを作成した。
Then, the two glass substrates were bonded to form a pair of electrode substrates 1a and 1b.

【0026】そして、図1に示すように、加圧台6上に
設けた緩衝材(例えば、ブリジストン社製、商品名:エ
バーライトスコットフェルト、厚さ:1mm)2a、ヒー
トプレート(板厚が1mmのアルミ板)3a、面状の発熱
体(例えば、坂口電熱社製、商品名:サミコン230、
ワット密度:1W/cm2 )4、ヒートプレート(板厚が3
mmのアルミ板)3b、緩衝材(緩衝材2aと同じもの)
2bの上に最下部に位置する電極基板1a,1bを載置
し、最上部に位置する電極基板1a,1bとの間に設置
される複数の各電極基板1a,1b間にも同様の緩衝材
2a、ヒートプレート3a、発熱体4、ヒートプレート
3b、緩衝材2bを設け、更に、最上部に位置する電極
基板1a,1b上に設けた同様の緩衝材2a、ヒートプ
レート3a、発熱体4、ヒートプレート3b、緩衝材2
bの上にエアー圧を受ける金属材(板圧が8mmのアルミ
板)5を載置する。
As shown in FIG. 1, a cushioning material (eg, manufactured by Bridgestone Corporation, trade name: Everlight Scott Felt, thickness: 1 mm) 2a provided on the press table 6 and a heat plate (plate thickness: A 1 mm aluminum plate) 3a, a planar heating element (for example, Sakicon 230, manufactured by Sakaguchi Electric Heat Co., Ltd.)
Watt density: 1 W / cm 2 ) 4, heat plate (plate thickness is 3
mm aluminum plate) 3b, cushioning material (same as cushioning material 2a)
The lowermost electrode substrates 1a and 1b are placed on the uppermost electrode substrates 1a and 1b, and a similar buffer is provided between the plurality of electrode substrates 1a and 1b disposed between the lowermost electrode substrates 1a and 1b. A material 2a, a heat plate 3a, a heating element 4, a heat plate 3b, and a buffer 2b are provided, and a similar buffer 2a, heat plate 3a, and a heating element 4 provided on the uppermost electrode substrates 1a and 1b. , Heat plate 3b, cushioning material 2
A metal material (aluminum plate having a plate pressure of 8 mm) 5 which receives an air pressure is placed on b.

【0027】そして、これらをエアー加圧式の治具(図
示省略)内にセットし、各電極基板1a,1bに対して
エアー圧(1kg/cm2)で加圧し、各発熱体4に通電して
発熱させる。
These are set in an air pressurized jig (not shown), and pressurized by air pressure (1 kg / cm 2 ) on each of the electrode substrates 1 a and 1 b, and each heating element 4 is energized. To generate heat.

【0028】この時、接しているヒートプレート3bの
温度が160℃に保たれるように、接続されている温度
センサ(図示省略)と温調器(図示省略)で発熱体4の
発熱を調整する。
At this time, the heat generated by the heating element 4 is adjusted by a connected temperature sensor (not shown) and a temperature controller (not shown) so that the temperature of the heat plate 3b in contact with the plate is maintained at 160 ° C. I do.

【0029】各発熱体4の発熱は、それぞれヒートプレ
ート3a,3b、緩衝材2a,2bを介して各電極基板
1a,1bに伝熱され、電極基板1a,1bの温度が1
50℃に達するまでに10〜15分を要した。その後、
電極基板1a,1bを150℃で1時間保持した後、発
熱体4への通電をオフにして自然冷却させてから、この
治具(図示省略)内からこれらの電極基板1a,1b等
を取り出す。
The heat generated by each heating element 4 is transmitted to each of the electrode substrates 1a and 1b via the heat plates 3a and 3b and the cushioning members 2a and 2b, respectively, so that the temperature of the electrode substrates 1a and 1b becomes 1
It took 10-15 minutes to reach 50 ° C. afterwards,
After holding the electrode substrates 1a and 1b at 150 ° C. for one hour, the power supply to the heating element 4 is turned off to allow natural cooling, and then the electrode substrates 1a and 1b and the like are taken out of the jig (not shown). .

【0030】そして、この電極基板1a,1bを35mm
角にカットして、接着剤ビース8の接着強度を剪断法に
よって測定した。表1は、この時の接着剤ビース8の接
着強度を示す測定結果である。
Then, the electrode substrates 1a and 1b are set at 35 mm.
After cutting into corners, the adhesive strength of the adhesive bead 8 was measured by a shearing method. Table 1 shows the measurement results indicating the adhesive strength of the adhesive bead 8 at this time.

【0031】[0031]

【表1】 そして、上述した本実施例による接着剤ビース8の接着
強度と、従来の液晶セル用シール剤及び接着剤ビースの
硬化工程における接着剤ビースの接着強度とを比較する
ために、下記のような比較サンプルを作成した。
[Table 1] In order to compare the adhesive strength of the adhesive bead 8 according to the present embodiment with the adhesive strength of the adhesive bead in the curing step of the conventional liquid crystal cell sealant and the adhesive bead, the following comparison was made. Made a sample.

【0032】この比較サンプルは、上述した実施例1と
同様の方法で形成した一対の電極基板を張り合せ、この
電極基板と緩衝材とを交互に積層してオーブン内にセッ
トし、各電極基板に対して、エアー加圧式の治具による
エアー圧(1kg/cm2)で加圧した後、オーブン内を16
0℃に保温する。
This comparative sample was prepared by laminating a pair of electrode substrates formed in the same manner as in Example 1 described above, alternately laminating the electrode substrates and the buffer material, and setting them in an oven. Then, after pressurizing with air pressure (1 kg / cm 2 ) using an air pressurizing jig,
Keep at 0 ° C.

【0033】この場合、この電極基板の温度が150℃
に達するまでに約3時間を要した。その後、この150
℃の温度で1時間保持した後、自然冷却させてから、こ
の電極基板を取り出す。
In this case, the temperature of the electrode substrate is 150 ° C.
It took about 3 hours to reach. Then, this 150
After holding at a temperature of 1 ° C. for 1 hour, the electrode substrate is naturally cooled, and the electrode substrate is taken out.

【0034】そして、この電極基板を35mm角にカット
して、同様に接着剤ビースの接着強度を剪断法によって
測定した。表2は、この時の接着剤ビースの接着強度を
示す測定結果である。
Then, this electrode substrate was cut into a 35 mm square, and the adhesive strength of the adhesive bead was similarly measured by a shearing method. Table 2 shows the measurement results indicating the adhesive strength of the adhesive bead at this time.

【0035】[0035]

【表2】 この比較結果から明らかなように、表1に示す実施例1
における接着剤ビースは、発熱体4の発熱がヒートプレ
ート3a、緩衝材2a,2bを介して電極基板1a,1
bの全面に直接伝熱されることによって、電極基板1
a,1bの温度分布が均一になり、また、昇温時間も早
いため、各サンプルとも安定した強い接着強度(剪断強
度)が得られている。
[Table 2] As is clear from this comparison result, Example 1 shown in Table 1 was used.
In the adhesive bead described above, the heat generated by the heating element 4 is generated by the electrode substrates 1a, 1 via the heat plate 3a and the cushioning materials 2a, 2b.
b, the heat is directly transferred to the entire surface of the electrode substrate 1.
Since the temperature distributions a and 1b are uniform and the temperature rise time is short, a stable and strong adhesive strength (shear strength) is obtained for each sample.

【0036】これに対し、表2に示す比較のために作成
した従来の硬化工程による接着剤ビースは、オーブンで
加熱するために電極基板の内側より外側の方が温度が高
くなり(温度分布が不均一)、また、昇温時間も遅いた
め、極端に接着強度の低い部分が存在し、そのサンプル
(表2のサンプルNO. 1、2)に関しては、接着強度
(剪断強度)の測定が不可能であり、各サンプルの接着
強度(剪断強度)の平均値も実施例1よりも低かった。
尚、表2で示した従来工程による接着剤ビースの接着強
度の平均値は、接着強度(剪断強度)を測定できたもの
に関してのみの値である。
On the other hand, in the case of the adhesive bead formed by the conventional curing process prepared for comparison shown in Table 2, the temperature is higher on the outside than on the inside of the electrode substrate due to heating in an oven (the temperature distribution is low). Since the temperature rise time is too slow, there is a part with extremely low adhesive strength, and the measurement of the adhesive strength (shear strength) of the sample (Sample Nos. 1 and 2 in Table 2) is not sufficient. It was possible, and the average value of the adhesive strength (shear strength) of each sample was lower than that of Example 1.
In addition, the average value of the adhesive strength of the adhesive bead according to the conventional process shown in Table 2 is a value only for those for which the adhesive strength (shear strength) could be measured.

【0037】(実施例2)本実施例では、図1におい
て、各一対の電極基板1a,1bを構成する一方のガラ
ス基板(板厚:1.1mm)上に、スクリーン印刷法にて
液晶セル用シール剤(例えば、三井東圧化学社製、商品
名:ストラクトボンドXN−21−F)を印刷し、その
後、平均粒径5.6μm 程度の接着剤ビース(例えば、
東レ社製、商品名:トレパールタイプIII )を1mm2
たり平均80個の密度で散布した。
(Embodiment 2) In this embodiment, as shown in FIG. 1, a liquid crystal cell is formed by screen printing on one glass substrate (plate thickness: 1.1 mm) constituting each pair of electrode substrates 1a and 1b. Sealant (for example, product name: Structbond XN-21-F, manufactured by Mitsui Toatsu Chemicals Co., Ltd.), and then an adhesive bead (for example, having an average particle size of about 5.6 μm)
Toray Corp., trade name: Trepearl Type III) was sprayed at an average density of 80 pieces per 1 mm 2 .

【0038】また、各一対の電極基板1a,1bを構成
する他方のガラス基板(板厚は1.1mm)上に平均粒径
1.04μm 程度のスペーサー(例えば、触媒化成工業
社製、商品名:シリカマイクロビーズ)を1mm2 当たり
平均300個の密度で散布した。
Further, a spacer having an average particle size of about 1.04 μm (for example, a product of Catalyst Kasei Kogyo Co., Ltd., on the other glass substrate (having a thickness of 1.1 mm) constituting each pair of electrode substrates 1a and 1b) : Silica microbeads) at an average density of 300 per mm 2 .

【0039】そして、この2枚のガラス基板を貼り合わ
せて、一対の電極基板1a,1bを作成した。
Then, the two glass substrates were bonded to form a pair of electrode substrates 1a and 1b.

【0040】そして、この電極基板1a,1bを実施例
1と同様の方法で硬化処理した後、下記の相転移温度を
示すピリミジン系の強誘電性液晶を注入して、図2に示
すような液晶パネル10を作成した。
Then, after curing the electrode substrates 1a and 1b in the same manner as in Example 1, a pyrimidine-based ferroelectric liquid crystal having the following phase transition temperature is injected, and as shown in FIG. The liquid crystal panel 10 was created.

【0041】 そして、上述した本実施例による電気実装を施した液晶
パネル10と、実施例1の従来の液晶セル用シール剤及
び接着剤ビースの硬化方法で貼り合わせた電極基板に、
上述した強誘電性液晶を注入し電気実装を施して作成し
た比較サンプルの液晶パネルとの耐衝撃試験を、50G
の落下試験によって行った。
[0041] Then, the liquid crystal panel 10 on which the electric mounting according to the present embodiment described above is performed and the electrode substrate bonded by the conventional liquid crystal cell sealing agent and the adhesive bead curing method of the first embodiment,
A shock resistance test with a liquid crystal panel of a comparative sample prepared by injecting the above-described ferroelectric liquid crystal and performing electrical mounting was performed using a 50 G
Was performed by a drop test.

【0042】この落下試験(耐衝撃試験)の結果、本実
施例による液晶パネル10の液晶の配向に乱れは認めら
れなかったが、図2に示すように比較サンプルの液晶パ
ネルは、表示面11の両サイド11a,11b(斜線部
分)に位置する液晶の配向に乱れが生じた。
As a result of this drop test (impact resistance test), no disturbance was found in the orientation of the liquid crystal of the liquid crystal panel 10 according to the present embodiment. However, as shown in FIG. The alignment of the liquid crystal located on both sides 11a and 11b (shaded portions) was disturbed.

【0043】このように、本実施の形態に係る液晶セル
用シール剤及び接着剤ビースの硬化工程により、硬化処
理の時間の短縮化と、接着剤ビースの接着強度を上げて
液晶素子の耐衝撃性の向上を図ることができる。
As described above, the curing step of the liquid crystal cell sealant and the adhesive bead according to the present embodiment shortens the curing time and increases the adhesive strength of the adhesive bead to improve the impact resistance of the liquid crystal element. Performance can be improved.

【0044】また、ヒートプレート3a,3bを用いず
に発熱体4を、一対の電極基板1a,1b上に緩衝材2
a,2bを介して設置して、電極基板1a,1bを加熱
するようにしてもよい。
Further, without using the heat plates 3a, 3b, the heating element 4 is provided on the pair of electrode substrates 1a, 1b with the cushioning material 2.
The electrode substrates 1a and 1b may be heated through the electrodes a and 2b.

【0045】[0045]

【発明の効果】以上説明したように、本発明によると、
貼り合わされた複数個の各一対の電極基板の両面に、順
に緩衝材とヒートプレートとを介して発熱体をそれぞれ
配置して積層した後に、複数個の各一対の電極基板、複
数個の緩衝材、複数個のヒートプレート及び複数個の発
熱体を同時に加圧し、複数個の発熱体を発熱させて、液
晶セル用シール材及び接着剤ビーズを硬化させることに
より、電極基板の全面が均一に加熱され、且つ昇温時間
を早くすることができる。
As described above, according to the present invention,
After the heating elements are respectively arranged and laminated on both sides of each of the plurality of paired electrode substrates via a buffer and a heat plate, a plurality of each pair of electrode substrates and a plurality of buffer Simultaneously pressurize a plurality of heat plates and a plurality of heating elements, generate heat from the plurality of heating elements, and cure the sealing material for liquid crystal cells and adhesive beads to uniformly heat the entire surface of the electrode substrate. And the heating time can be shortened.

【0046】従って、十分な接着剤ビースの接着強度が
得られることにより、作成される液晶素子の耐衝撃性を
高めることができ、また、硬化処理時間が短縮化される
ことによって、液晶素子の製造効率の向上を図ることが
できる。
Therefore, by obtaining a sufficient adhesive strength of the adhesive bead, it is possible to enhance the impact resistance of the liquid crystal element to be produced, and to shorten the curing treatment time, thereby improving the liquid crystal element. Manufacturing efficiency can be improved.

【0047】また、大面積の電極基板に対してもそれに
合わせた発熱体を使用するだけでよいので、従来のよう
に電極基板を加熱するための大型のオーブン等の設備が
不要となり、コストの低減を図ることができる。
Further, since it is only necessary to use a heating element corresponding to a large-sized electrode substrate, equipment such as a large oven for heating the electrode substrate as in the related art is not required, and cost is reduced. Reduction can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態に係る液晶セル用シール剤
及び接着剤ビースの硬化工程を示す概略断面図。
FIG. 1 is a schematic cross-sectional view showing a curing step of a liquid crystal cell sealant and an adhesive bead according to an embodiment of the present invention.

【図2】比較サンプル用に作成した液晶パネルの落下試
験による液晶の配向の乱れを模式的に示した図。
FIG. 2 is a diagram schematically showing the disorder of the orientation of liquid crystal in a drop test of a liquid crystal panel prepared for a comparative sample.

【符号の説明】[Explanation of symbols]

1a,1b 電極基板 2a,2b 緩衝材 3a,3b ヒートプレート 4 発熱体 5 金属材 7 液晶セル用シール剤 8 接着剤ビース 10 液晶パネル 1a, 1b Electrode substrate 2a, 2b Buffer material 3a, 3b Heat plate 4 Heating element 5 Metal material 7 Liquid crystal cell sealant 8 Adhesive bead 10 Liquid crystal panel

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G02F 1/1339 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) G02F 1/1339

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 複数個の一対の電極基板を用意する第1
工程と、 前記複数個の各一対の電極基板毎に、該一対の電極基板
のうちの一方の電極上に該一対の電極基板間に液晶を封
入するための液晶セル用シール材、及び前記一対の電極
基板を接着する接着剤ビーズを取付ける第2工程と、 前記第2工程後に、前記複数個の各一対の電極基板をそ
れぞれ貼り合わせる第3工程と、 前記第3工程後に、前記貼り合わされた前記複数個の各
一対の電極基板の両面に、順に緩衝材とヒートプレート
とを介して発熱体をそれぞれ配置して積層する第4工程
と、 前記第4工程後に、積層された前記複数個の各一対の電
極基板、前記複数個の緩衝材、前記複数個のヒートプレ
ート及び前記複数個の発熱体を一体に加圧し、前記複数
個の発熱体を発熱させて、前記液晶セル用シール材及び
前記接着剤ビーズを硬化させる第5の工程と、を有す
、 ことを特徴とする液晶素子の製造方法。
(1)A first method of preparing a plurality of paired electrode substrates;
Process and For each of the plurality of pairs of electrode substrates, the pair of electrode substrates
Liquid crystal is sealed between the pair of electrode substrates on one of the electrodes.
Sealing material for a liquid crystal cell for entering, and the pair of electrodes
A second step of mounting an adhesive bead for bonding the substrate; After the second step, the plurality of each pair of electrode substrates is removed.
A third step of laminating each, After the third step, each of the plurality of the
On both sides of a pair of electrode substrates, buffer material and heat plate
Fourth step of arranging and stacking heating elements via
When, After the fourth step, a pair of the plurality of stacked electrodes are stacked.
Polar substrate, the plurality of cushioning materials, the plurality of heat presses.
And the plurality of heating elements are pressed together to form the plurality of heating elements.
By causing the heating elements to generate heat, the liquid crystal cell sealing material and
A fifth step of curing the adhesive beads.
To A method for manufacturing a liquid crystal element, comprising:
【請求項2】 前記発熱体は、面状に形成され前記電極
基板に対応した大きさである、 請求項1記載の液晶素子の製造方法。
2. The method according to claim 1, wherein the heating element is formed in a planar shape and has a size corresponding to the electrode substrate.
【請求項3】 前記シール剤は、一液型熱硬化性エポキ
シ接着剤を含んでいる、 請求項1記載の液晶素子の製造方法。
3. The method according to claim 1, wherein the sealant includes a one-component thermosetting epoxy adhesive.
【請求項4】 前記接着剤ビーズは、前記一対の電極基
板を点接着する熱硬化性エポキシ接着剤を含むホットメ
ルトタイプである、 請求項1記載の液晶素子の製造方法。
4. The method according to claim 1, wherein the adhesive beads are of a hot melt type including a thermosetting epoxy adhesive for spot bonding the pair of electrode substrates.
JP19382895A 1995-07-28 1995-07-28 Manufacturing method of liquid crystal element Expired - Fee Related JP3214303B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP19382895A JP3214303B2 (en) 1995-07-28 1995-07-28 Manufacturing method of liquid crystal element
US08/687,990 US5942066A (en) 1995-07-28 1996-07-29 Process for producing liquid crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19382895A JP3214303B2 (en) 1995-07-28 1995-07-28 Manufacturing method of liquid crystal element

Publications (2)

Publication Number Publication Date
JPH0943613A JPH0943613A (en) 1997-02-14
JP3214303B2 true JP3214303B2 (en) 2001-10-02

Family

ID=16314426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19382895A Expired - Fee Related JP3214303B2 (en) 1995-07-28 1995-07-28 Manufacturing method of liquid crystal element

Country Status (1)

Country Link
JP (1) JP3214303B2 (en)

Also Published As

Publication number Publication date
JPH0943613A (en) 1997-02-14

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