JP3210010B2 - 例示的に種々の構造高さを有するミクロ構造体の製造法 - Google Patents

例示的に種々の構造高さを有するミクロ構造体の製造法

Info

Publication number
JP3210010B2
JP3210010B2 JP51233091A JP51233091A JP3210010B2 JP 3210010 B2 JP3210010 B2 JP 3210010B2 JP 51233091 A JP51233091 A JP 51233091A JP 51233091 A JP51233091 A JP 51233091A JP 3210010 B2 JP3210010 B2 JP 3210010B2
Authority
JP
Japan
Prior art keywords
layer
resist material
microstructures
synthetic resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP51233091A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06501343A (ja
Inventor
コーヴァンツ，ベルント
ブライ，ペーター
バッハー，ヴァルター
ハルメニング，ミヒャエル
モール，ユルゲン
Original Assignee
ケルンフォルシュングスツェントルム カールスルーエ ゲゼルシャフト ミット ベシュレンクテル ハフツング
ビュルケルト ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ケルンフォルシュングスツェントルム カールスルーエ ゲゼルシャフト ミット ベシュレンクテル ハフツング, ビュルケルト ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー filed Critical ケルンフォルシュングスツェントルム カールスルーエ ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JPH06501343A publication Critical patent/JPH06501343A/ja
Application granted granted Critical
Publication of JP3210010B2 publication Critical patent/JP3210010B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G03F7/2039—X-ray radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Inorganic Fibers (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP51233091A 1990-07-31 1991-07-25 例示的に種々の構造高さを有するミクロ構造体の製造法 Expired - Fee Related JP3210010B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4024275A DE4024275A1 (de) 1990-07-31 1990-07-31 Verfahren zur herstellung von mikrostrukturen mit bereichsweise unterschiedlicher strukturhoehe
DE4024275.7 1990-07-31

Publications (2)

Publication Number Publication Date
JPH06501343A JPH06501343A (ja) 1994-02-10
JP3210010B2 true JP3210010B2 (ja) 2001-09-17

Family

ID=6411372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51233091A Expired - Fee Related JP3210010B2 (ja) 1990-07-31 1991-07-25 例示的に種々の構造高さを有するミクロ構造体の製造法

Country Status (7)

Country Link
US (1) US5260175A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0542768B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP3210010B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE155257T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE4024275A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK (1) DK0542768T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO1992002858A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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DE4200396C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1992-01-10 1993-02-04 Imm Institut Fuer Mikrotechnik Gmbh, 6500 Mainz, De
DE4200397C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1992-01-10 1993-03-04 Imm Institut Fuer Mikrotechnik Gmbh, 6500 Mainz, De
US5529681A (en) * 1993-03-30 1996-06-25 Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh Stepped mould inserts, high-precision stepped microstructure bodies, and methods of producing the same
US6029337A (en) * 1994-06-06 2000-02-29 Case Western Reserve University Methods of fabricating micromotors with utilitarian features
US6360424B1 (en) 1994-06-06 2002-03-26 Case Western Reserve University Method of making micromotors with utilitarian features
US5705318A (en) * 1994-06-06 1998-01-06 Case Western Reserve University Micromotors and methods of fabrication
DE4434009A1 (de) * 1994-09-23 1996-03-28 Karlsruhe Forschzent Verfahren zur Herstellung gestufter Mikrostrukturen
US5788468A (en) * 1994-11-03 1998-08-04 Memstek Products, Llc Microfabricated fluidic devices
US5730924A (en) * 1994-12-28 1998-03-24 Sumitomo Heavy Industries, Ltd. Micromachining of polytetrafluoroethylene using radiation
GB9509487D0 (en) * 1995-05-10 1995-07-05 Ici Plc Micro relief element & preparation thereof
US6115634A (en) * 1997-04-30 2000-09-05 Medtronic, Inc. Implantable medical device and method of manufacture
US6379773B1 (en) * 1998-06-16 2002-04-30 Sumitomo Heavy Industries, Ltd. Micro structure and its manufacture method
JP3360282B2 (ja) * 1997-06-19 2002-12-24 住友重機械工業株式会社 微細構造体の製造方法
US6048649A (en) * 1998-04-30 2000-04-11 International Business Machines Corporation Programmed defect mask with defects smaller than 0.1 μm
WO2000013916A1 (en) * 1998-09-08 2000-03-16 Commonwealth Scientific And Industrial Research Organisation Three-dimensional microstructure
US6280147B1 (en) 1998-10-13 2001-08-28 Liquid Metronics Incorporated Apparatus for adjusting the stroke length of a pump element
US6174136B1 (en) 1998-10-13 2001-01-16 Liquid Metronics Incorporated Pump control and method of operating same
EP1222053A1 (en) * 1999-06-08 2002-07-17 Biomicro Systems, Inc. Laser ablation of doped fluorocarbon materials and applications thereof
US6272275B1 (en) 1999-06-25 2001-08-07 Corning Incorporated Print-molding for process for planar waveguides
US6264432B1 (en) 1999-09-01 2001-07-24 Liquid Metronics Incorporated Method and apparatus for controlling a pump
US6858253B2 (en) * 2001-05-31 2005-02-22 3M Innovative Properties Company Method of making dimensionally stable composite article
DE10134692A1 (de) * 2001-07-05 2003-01-16 Micro Resist Technology Gmbh Herstellung und Anwendung von optischen Formkörpern mit nanostrukturierter Oberfläche
DE10161493C5 (de) * 2001-12-14 2008-09-18 Micromotion Gmbh Getriebe nach dem Spannungswellen-Prinzip mit Hohlwellen
US6743368B2 (en) * 2002-01-31 2004-06-01 Hewlett-Packard Development Company, L.P. Nano-size imprinting stamp using spacer technique
WO2003086958A2 (de) * 2002-04-15 2003-10-23 Schott Ag Verfahren zur herstellung eines erzeugnisses mit einer strukturierten oberfläche
KR100476317B1 (ko) * 2002-10-24 2005-03-16 한국전자통신연구원 광결합 소자 및 그 제작 방법, 광결합 소자 제작을 위한마스터 및 그 제작 방법
US7470544B2 (en) * 2005-05-26 2008-12-30 Hewlett-Packard Development Company, L.P. Sensor array using sail

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3039110A1 (de) * 1980-10-16 1982-05-13 Siemens AG, 1000 Berlin und 8000 München Verfahren fuer die spannungsfreie entwicklung von bestrahlten polymethylmetacrylatschichten
US4349621A (en) * 1981-04-13 1982-09-14 General Electric Company Process for X-ray microlithography using thin film eutectic masks
DE3133350A1 (de) * 1981-08-22 1983-03-10 Philips Patentverwaltung Gmbh, 2000 Hamburg "verfahren zur herstellung von maskierungsschichten auf einer zu strukturierenden flaeche eines festkoerpers"
GB2152223B (en) * 1983-11-28 1987-01-14 Fusion Semiconductor Systems Process for imaging resist materials
BR8505473A (pt) * 1984-11-02 1986-08-05 Kernforschungsz Karlsruhe Processo para produzir uma pluralidade de elementos conectores deformaveis,processo para produzir cada parte de um conector de duas partes mecanicamente separavel possuindo multiplos elementos conectores elementos conectores deformaveis e conector multiplo mecanicamente separavel para ligacoes eletricas de componentes microeletronicas
US4845014A (en) * 1985-10-21 1989-07-04 Rca Corporation Method of forming a channel
DE3623637A1 (de) * 1986-07-12 1988-01-21 Kernforschungsz Karlsruhe Verfahren zur herstellung von mikrostrukturen unterschiedlicher strukturhoehe mittels roentgentiefenlithographie
JPS63185022A (ja) * 1987-01-27 1988-07-30 Fujitsu Ltd パタ−ン形成方法
DE3727142C2 (de) * 1987-08-14 1994-02-24 Kernforschungsz Karlsruhe Verfahren zur Herstellung von Mikrosensoren mit integrierter Signalverarbeitung
DE4010669C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1990-04-03 1991-04-11 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De

Also Published As

Publication number Publication date
JPH06501343A (ja) 1994-02-10
DE4024275A1 (de) 1992-02-06
DE4024275C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-06-11
DE59108773D1 (de) 1997-08-14
DK0542768T3 (da) 1997-08-11
EP0542768A1 (de) 1993-05-26
EP0542768B1 (de) 1997-07-09
ATE155257T1 (de) 1997-07-15
US5260175A (en) 1993-11-09
WO1992002858A1 (de) 1992-02-20

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