JP3202977B2 - Flexible wiring board processing method and flexible wiring board fixing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a flexible wiring board and an apparatus for fixing the flexible wiring board.
Further, the present invention relates to a flexible wiring board fixing device used in the method.

[0002]

2. Description of the Related Art A flexible wiring board is a wiring board in which a conductive pattern is formed on a flexible insulating layer. For example, when a flexible wiring board is mounted in a narrow and complicated space inside a device,
Widely used when flexibility is required.

[0003] Such a flexible wiring board usually has holes such as via holes and through holes, holes for forming bumps for connecting terminals, and holes for positioning or processing. I have. As a method for forming such a hole, for example, a hole forming process using a laser is performed.

[0004]

However, in forming a hole at an accurate position and depth in a hole drilling process by a laser, the flexible wiring board is accurately positioned and securely fixed. In such a state, it is necessary to irradiate a laser.

However, in such a laser drilling process, for example, after a flexible wiring board is placed on a receiving plate, the mounted flexible wiring board is placed between the receiving plate and a jig. If the flexible wiring board is fixed by sandwiching the flexible wiring board, the flexible wiring board may sag on the receiving plate due to the flexibility of the flexible wiring board. And it may not be possible to form holes at the correct location and depth.

Further, since a force sandwiched by the jig is applied to a portion of the flexible wiring board sandwiched by the jig, the portion may be damaged by the force sandwiched by the jig.

On the other hand, in recent years, with the miniaturization and high-density of flexible wiring boards, it has been strongly required to make holes more accurately and reliably by laser processing.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for processing a flexible wiring board capable of performing laser processing on a flexible wiring board accurately and reliably. An object of the present invention is to provide a fixing device for a flexible wiring board used in the method.

[0009]

In order to achieve the above object, the present invention provides a flexible wiring board which is mounted on a receiving plate having a suction hole and sucked through the suction hole.
After fixing on the receiving plate, flexi
A method of processing a flexible wiring board, wherein the receiving plate has a thermal conductivity.
Is made of a metal of 8 W / m · K or more .

According to this method, since the flexible wiring board is sucked from the suction hole while being placed on the receiving plate, the flexible wiring board is fixed in a state in which the flexible wiring board is in close contact with the receiving plate. Processing is performed. Moreover, receiving plate
Is made of metal whose thermal conductivity is 8 W / mK or more.
Therefore, when laser processing, flexible wiring board
More heat in the area where the laser is
Heat can be dissipated.

The present invention also provides a flexible wiring board,
Place on a receiving plate with suction holes and suck through the suction holes
After fixing on the receiving plate,
A method of processing a flexible wiring board, comprising:
The plate has a laser ablation threshold of 800 mJ /
Also includes those made of metal of cm ² or more.

According to this method, the flexible wiring board
Is sucked from the suction hole while placed on the receiving plate.
And fixed in a state of being in close contact with the receiving plate, and the fixed
In the state, laser processing is performed. Moreover, receiving plate
Has a laser ablation threshold of 800 mJ
/ Cm ² or more, so that, for example, when a through-hole is formed in the flexible wiring board , even if the surface of the receiving plate is irradiated with a laser, the surface is roughened. Can be reduced.

The present invention also provides a flexible wiring board,
Place on a receiving plate with suction holes and suck through the suction holes
After fixing on the receiving plate,
A method of processing a flexible wiring board, comprising:
The plate has a thermal conductivity of 8 W / m · K or more, and
The ablation threshold is 800 mJ / cm ² or more
And those made of metal . By this method
And the flexible wiring board is placed on the receiving plate
Since it is sucked through the suction hole, it is firmly
Laser processing in the fixed state
Done. Moreover, the receiving plate has a thermal conductivity of 8 W / m ·
K or more and its laser ablation threshold
Is made of metal of 800 mJ / cm ² or more
Thus, it is possible to dissipate more heat in the portion irradiated with the laser , and to reduce the surface roughness of the receiving plate even if the surface is irradiated with the laser.

Further, in this processing method, especially, at the time of laser processing, the processing portion of the flexible wiring board, it is preferable to place so as not to overlap with the suction holes of the receiving plate.

When the processed portion of the flexible wiring board is placed so as not to overlap with the suction hole of the receiving plate, the portion of the flexible wiring board irradiated with the laser is in contact with the receiving plate. The heat of the portion of the wiring board irradiated with the laser can be immediately released to the receiving plate in contact with the portion.

[0016]

[0017]

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the processing method of the present invention, first, a flexible wiring board is placed on a receiving plate having a suction hole.
It is fixed on the receiving plate by suction through the suction hole.

The flexible wiring board used in the present invention is a wiring board having a conductive pattern formed on a flexible insulating layer. As the insulating layer, a plastic film such as polyimide, polyether nitrile, polyether sulfone, polyethylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, or polyvinyl chloride, which is usually used as an insulating layer of a flexible wiring board, is preferably used. A polyimide film is used.

As the conductor for forming the conductor pattern, a metal such as copper, nickel, gold, solder, or an alloy thereof, which is usually used as a conductor of a flexible wiring board, is preferably used. , Copper is used.

The flexible wiring board is, for example,
For example, forming an insulating layer into a dry film of a predetermined shape,
After being formed by a known method, the conductor is formed on the insulating layer by forming a conductor pattern by a known method such as an additive method, a semi-additive method, and a subtractive method.

In such a flexible wiring board, for example, as shown in FIG. 1, a conductor layer 2 formed as a conductor pattern is formed on a base layer 1 made of an insulating layer. 2, a conductor layer 2 is formed on both sides of a single-sided flexible wiring board covered with a cover layer 3 made of an insulating layer, or as shown in FIG. , Or a multilayer flexible wiring board in which a plurality of single-sided or double-sided flexible wiring boards are stacked as shown in FIG. 3 (in FIG. 3, two double-sided flexible wiring boards are stacked. Further, as shown in FIG. 4, a rigid-flex flexible wiring in which a reinforcing plate 4 is laminated on a single-sided or double-sided flexible wiring board is shown. (FIG. 4 shows an example in which the reinforcing plate 4 is laminated on one side of the double-sided flexible wiring board.) And the like.

In FIGS. 1 to 4, the base layer 1,
Each layer of the conductor layer 2 and the cover layer 3 is laminated via the adhesive layer 5. For example, the adhesive layer 5 is formed by a method of forming the base layer 1 or the cover layer 3 on the conductor layer 2. Each layer may be laminated without passing through. The thickness of the base layer 1 and the cover layer 3 is 5 to 100 μm, preferably 5 to 50 μm, and the thickness of the conductor layer 2 is 1 to 50 μm.
μm, preferably 2 to 35 μm. When the adhesive layer 5 is provided, its thickness is 5 to 300 μm.
m.

In the processing method of the present invention, such a flexible wiring board is placed on a receiving plate of a flexible wiring board fixing device as shown in FIG. 5, for example.

FIG. 5 is a schematic perspective view showing one embodiment of a fixing device for a flexible wiring board. FIG. 5 is for explaining the outline of the fixing device, and does not always coincide with the description of the dimensional relationship described later.

In FIG. 5, the fixing device 11 includes a receiving plate 12 and a support table 13.

The receiving plate 12 is formed in a rectangular flat plate shape, and has a plurality of suction holes 14 penetrating in the thickness direction. This suction hole 14 has, for example, a diameter of 0.1 to 2 m.
m, preferably 0.4 to 1.0 mm, and the pitch between the holes is 0.5 to 15 mm, preferably 1 to 5 mm, arranged in a lattice. The shape of the holes of the suction holes 14 is not limited to a circle but may be a polygon, and the arrangement state is not limited to a lattice shape and may be a staggered shape. Need not be
For example, the density is preferably 0.4 / cm ² or more.

The material of the receiving plate 12 is, for example, a metal such as stainless steel, copper, iron, brass, or aluminum, or a metal such as an alloy.

Among these materials, the thermal conductivity (thermal conductivity at 0 ° C.) is 8 W / m · K or more, preferably 70 to 4 W / m · K.
30 W / m · K is used. Thermal conductivity is 8W
/ M · K or more, during laser processing, more heat can be radiated from the portion of the flexible wiring board to which the laser is irradiated, so that the heat storage of the portion of the flexible wiring board to which the laser is irradiated can be performed. Damage can be prevented. More specifically, for example, as shown in FIG. 7, when a bump is formed on a single-sided flexible wiring board, or when laser processing is performed such that the cover layer 3 is perforated to expose the conductor layer 2. In, by continuous irradiation of laser,
Heat is stored in the conductor layer 2, and as a result, the surface of the conductor layer 2 is damaged by the heat and is roughened.
In some cases, undulations such as protrusions (irregularities of several μm or the like) may occur. When such projections are formed, the projections serve as starting points when the bumps are formed, and the plating locally grows unevenly. For example, as shown in FIG. 8, the bumps have an irregular shape. This may cause poor conduction.

Therefore, the receiving plate 12 has a thermal conductivity of 8 W /
If the conductor layer 2 is formed of a material of m · K or more, even if the conductor layer 2 is heated by continuous irradiation of the laser, the heat is radiated (conducted) to the receiving plate 12 having good thermal conductivity. 2 does not accumulate heat, thereby effectively preventing the surface of the conductor layer 2 from being roughened by heat. For example, forming a bump having a good shape as shown in FIG. Can be.

Further, among these materials, laser ablation threshold, 800 mJ / cm ² or more, preferably of 1000~30000mJ / cm ² is used. The laser ablation threshold is defined as the energy density at which an etching rate of 0.1 μm / pulse or more can be obtained for industrial practical use. When the laser ablation threshold is 800 mJ / cm ² or more, the receiving plate 12 Even if the surface is irradiated with a laser, the surface can be less likely to be roughened. Therefore, it is possible to prevent dust and the like of the receiving plate 12 generated by roughening from adhering to the flexible wiring board. More specifically, for example, as shown in FIG. 10, in order to form through-hole plating on a double-sided flexible wiring board, through-holes passing through the cover layer 3, the conductor layer 2, and the base layer 1 are formed by laser processing. In the case of forming, the surface of the receiving plate 12 is roughened by irradiating the surface of the receiving plate 12 with a laser, and dust (burns and decomposed products) generated by the roughening are removed. In such a case, the quality of the flexible wiring board may be degraded due to the adhesion of foreign matter.

Therefore, if the receiving plate 12 is formed of a material having a laser ablation threshold of 800 mJ / cm ² or more, even if the surface of the receiving plate 12 is irradiated with a laser, the surface is roughened. Therefore, it is possible to prevent dust and the like of the receiving plate 12 generated by roughening from adhering to the flexible wiring board, and to reduce the quality of the flexible wiring board due to adhesion of foreign matter. It can be effectively prevented.

Therefore, the receiving plate 12 is made of metal.
Since the thermal conductivity is good and the laser ablation threshold is high, more heat can be dissipated from the portion irradiated with the laser, and the surface of the receiving plate 12 is irradiated with the laser. However, it is possible to reduce the surface roughness.

The surface of the receiving plate 12 is preferably smooth in order to receive the flexible wiring board in close contact. More specifically, for example, an effective area of 500 m
The surface of the m-square is sectioned in a grid pattern at intervals of 100 mm, and the four corners of each grid are defined as measurement points (36 points).
is preferably 50 μm or less.

The thickness of the receiving plate 12 is not particularly limited. For example, as described above, the thermal conductivity is 8 W / m ·
For the purpose of promoting heat radiation of the flexible wiring board at the time of laser processing by using a material of K or more, it is advantageous that the thickness is thicker, but in consideration of the handleability of the receiving plate 12, especially the portability, etc. , Preferably 5.0 mm or less, and more preferably 1.0 to 3.0 mm. When the thickness is 1.0 mm or less, the smoothness of the surface of the receiving plate 12 may decrease.

The receiving plate 12 may be formed, for example, by drilling a suction hole 14 in a flat plate with a drill, or
It can be produced by a known molding method such as using photolithography. Note that by using photolithography, it can be manufactured at low cost.

The support table 13 has a box shape and is formed so that the receiving plate 12 is placed on the upper surface thereof. Although not shown in FIG. 5, a plurality of large-diameter through holes communicating with the plurality of suction holes 14 are formed on the upper surface on which the receiving plate 12 is placed. When the receiving plate 12 is placed on the upper surface of the support table 13, the suction holes 14 of the receiving plate 12 face the holes formed on the upper surface of the support table 13. And support table 13
The suction hole 14 is closed by the upper surface of the support table 13 (that is, the hole formed on the upper surface of the support table 13 does not face the suction hole 14). There may be things. In such a case, it is preferable that the ratio of the suction holes 14 closed by the upper surface of the support table 13 be 10% or less of all the suction holes 14.

A suction pipe 15 facing the inside of the support table 13 is connected to a side wall of the support table 13. A free end of the suction pipe 15 is connected to a known suction pipe such as a vacuum pump or an exhaust blower. The means are connected. In this embodiment, a vacuum pump P is connected.

Then, as shown in FIG. 6, a flexible wiring board (in FIG. 6, the flexible wiring board is indicated by reference numeral 16) is placed on the receiving plate 12 of the fixing device thus configured. After the mounting, the vacuum pump P is operated. Then, the support table 13 is moved through the suction pipe 15.
The inside is sucked and the receiving plate 1 is sucked through the suction hole 14.
The flexible printed circuit board mounted on 2 is sucked. Thus, the flexible wiring board is fixed on the receiving plate 12 in a state of being in close contact therewith.

Next, the thus fixed flexible wiring board is punched by a laser. For example, a laser ablation method or the like is used for drilling with a laser. As a laser used for processing, for example, an infrared laser such as a carbon dioxide laser, for example, an excimer laser (248 nm), YAG
The third harmonic (355 nm) or the fourth harmonic (2
An ultraviolet laser such as 66 nm) is used. In the case of forming a hole having a small diameter, an ultraviolet laser is preferably used.

The irradiation energy of the laser is usually set at 0.
At 5 to 9 J / cm ² , as described below, for example, when forming a non-penetrating hole, 0.5 to 1.5 J / cm 2
² , when forming a through-hole, 1.0 to
It is about 2.0 J / cm ² .

The shape and depth of the hole to be formed by the laser are not particularly limited, and any hole may be used. That is, a hole that penetrates the flexible wiring board or a hole that does not penetrate may be used,
Further, the holes may be openings that open one by one, or may be continuous holes that are formed as a predetermined pattern. The holes formed by such a drilling process are, for example, holes that do not penetrate, such as via holes for connecting between the conductor layers 2, holes for forming bumps, and holes for processing (for example, flexible wiring boards). And a through hole for plating, a hole for positioning, a hole for processing, and a hole for processing (for example, cutting a flexible wiring board). Perforations for forming the holes).

In this laser drilling process, in particular, as shown in FIG. 11, the processing portion 17 of the flexible wiring board, that is, the portion to be irradiated with the laser, It is preferable to place it so as not to overlap with the suction hole 14 of the receiving plate 12.

For example, as shown in FIG. 12, when the processed portion 17 of the flexible wiring board is placed so as to overlap the suction hole 14 of the receiving plate 12, the processed portion 17
2, the heat accumulated in the processed portion 17 due to the irradiation of the laser is not directly transmitted to the receiving plate 12 at the time of drilling by the laser, and the heat may not be efficiently radiated.

On the other hand, as shown in FIG. 11, when the processed portion 17 of the flexible wiring board is placed so as not to overlap with the suction hole 14 of the receiving plate 12, the processed portion 17 comes into contact with the receiving plate 14. Therefore, at the time of drilling with a laser, the heat stored in the processing portion 17 by the laser irradiation is immediately transmitted to the receiving plate 12 in contact with the processing portion 17, thereby efficiently dissipating heat. it can. Therefore, damage due to heat storage of the processed portion 17 can be more effectively prevented by rapid heat radiation.

According to such a processing method, the flexible wiring board is fixed on the receiving plate 12 in close contact with the flexible wiring board. The flexible wiring board can be accurately positioned and fixed without sagging. Therefore, by laser drilling,
Holes can be formed at precise locations and depths. Further, since the flexible wiring board is fixed by suction, the flexible wiring board can be installed simply by placing the flexible wiring board on the receiving plate 12 without using a jig, and furthermore, the damage is caused as if the flexible wiring board is sandwiched between the jigs. Not even.

In the above description, in the flexible wiring board fixing device shown in FIG. 5, the receiving plate 12 and the supporting table 13 are formed separately, but the receiving plate 12 and the supporting table 13 are integrated. The support table 13 may not be provided, and may be directly suctioned from the lower surface of the receiving plate 12 by a suction means such as a vacuum pump P.

In the above description, laser drilling has been exclusively described as laser processing. However, in the laser processing in the present invention, the shape of the flexible wiring board is irradiated by irradiating a laser to the flexible wiring board. Includes all processes that change the

[0049]

The present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to Examples and Comparative Examples.

Example 1 SUS304 (thermal conductivity: about 80 W / m · K, laser
Ablation Threshold: 10000mJ / cm ²⁾ using a receiving plate (600 mm square having a plurality of suction holes,
(1.5 mm thick). The suction holes were arranged in a lattice pattern, the hole diameter was 0.5 mm, and the pitch between the holes was 5.0 mm.

This receiving plate is placed on a support table prepared in advance, and a single-sided flexible wiring board is placed thereon so that the processed portion of the flexible wiring board does not overlap with the suction hole of the receiving plate. Placed. Next, holes were formed in the cover layer of the processed portion (5000 places) of the flexible wiring board using an ultraviolet laser (YAG laser (third harmonic) or excimer laser) to expose the conductor layer. Bumps were respectively formed on the exposed conductor layers by plating. There was no displacement of the formed bumps. The deformation rate of bumps is 0.6%
Met.

Example 2 The same operation as in Example 1 was performed except that through holes were formed by using an ultraviolet laser (YAG laser (third harmonic) or excimer laser).

Next, evaluation was made by an interlayer conduction test after through-hole plating. As a result, the conduction failure rate was 0 %.

Example 3 A single-sided flexible wiring board was mounted on a flexible wiring board.
The part to be processed is placed so that it overlaps the suction hole of the receiving plate.
Except for, the same operation as in Example 1 was performed. Formed
There was no displacement of the bumps. In addition, bump deformation occurs
The rate was 1.0%.

Example 4 Copper (thermal conductivity: about 400 W / m · K, laser abrasion)
Threshold: 9000 mJ / cm ² )
(600mm square, 3.0mm thickness)
Was performed in the same manner as in Example 1. Formed van
There was no misalignment in the loop. The bump occurrence rate is
0.5%.

Comparative Example 1 A single-sided flexible wiring board was placed on a flat board, and
Example 1 except that it was fixed by pinching
The same operation as described above was performed. As a result, 30% bumps
Misalignment occurred. In addition, the displacement is from the regular position.
If the position is shifted by 30 μm or more, it is determined
Was.

Comparative Example 2 Glass-reinforced epoxy resin (thermal conductivity: about 0.2 W / m ·
K, laser ablation threshold: 800 mJ / c
m ² ), a receiving plate having a plurality of suction holes (600 m
m square, 1.5 mm thick). The suction hole is
The holes are arranged in a matrix and have a hole diameter of 0.5 mm.
H was 5.0 mm.

This receiving plate is connected to a support table prepared in advance.
On a single-sided flexible circuit board.
The processed part of the flexible wiring board is
It was placed so as not to overlap with the draw hole. Then, the flexible
Cover layer of the processed part (5000 places) of the shivle wiring board
In addition, ultraviolet laser (YAG laser (third harmonic)
Or excimer laser).
The conductive layer was exposed. Plating on the exposed conductor layer
Each bump was formed. Position on formed bump
There was no gap. In addition, the deformation rate of bumps is 15%
there were.

Comparative Example 3 An ultraviolet laser (YAG laser (third harmonic) or
Using excimer laser) to make through holes
The same operation as in Comparative Example 2 was performed except that a hole was formed.
Done. Next, the interlayer continuity inspection after through-hole plating
Assessment. As a result, the conduction failure rate is 0.01
%Met.

[0060]

As described above, according to the method for processing a flexible wiring board of the present invention, the flexible wiring board is fixed in a state in which it is in close contact with the receiving board. The flexible wiring board can be accurately positioned and fixed without sagging on the receiving plate due to the flexibility of the flexible wiring board.
Therefore, laser processing can be performed at an accurate position and depth. Further, since the flexible wiring board is fixed by suction, the flexible wiring board can be easily installed without using a jig, and furthermore, there is no occurrence of damage as when sandwiched between jigs.

Further, since the receiving plate is made of metal having a thermal conductivity of 8 W / m · K or more, more heat is radiated from the portion of the flexible wiring board to which the laser is irradiated during laser processing. Therefore, it is possible to prevent a portion of the flexible wiring board to be irradiated with the laser from being damaged by heat storage.

The receiving plate is made of a metal having a laser ablation threshold value of 800 mJ / cm ² or more .
Thus, even if the surface of the receiving plate is irradiated with laser, the surface can be less likely to be roughened. Therefore, it is possible to prevent dust and the like on the receiving plate generated by the roughening from adhering to the flexible wiring board, and to prevent the quality of the flexible wiring board from deteriorating due to the adhesion of foreign matter.

[0063]

Further, in this processing method, if the processed portion of the flexible wiring board is placed so as not to overlap the suction hole of the receiving plate during laser processing, the portion of the flexible wiring board to which the laser is irradiated can be reduced. Because it is in contact with the receiving plate, during laser processing, the heat of the portion of the flexible wiring board that is irradiated with the laser can be immediately radiated to the receiving plate that is in contact with that portion. As a result, heat can be more quickly dissipated,
Damage due to heat storage in a portion of the flexible wiring board to which the laser is irradiated can be further effectively prevented.

[0065]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing one embodiment of a single-sided flexible wiring board used in the processing method of the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of a double-sided flexible wiring board used in the processing method of the present invention.

FIG. 3 is a cross-sectional view showing one embodiment of a multilayer flexible wiring board used in the processing method of the present invention.

FIG. 4 is a cross-sectional view showing one embodiment of a rigid / flexible flexible wiring board used in the processing method of the present invention.

FIG. 5 is a schematic perspective view showing one embodiment of a fixing device for a flexible wiring board.

FIG. 6 is a schematic perspective view showing a use state of the fixing device of the flexible wiring board shown in FIG. 5;

FIG. 7 is a cross-sectional view showing a state in which laser processing is performed such that a cover layer of the single-sided flexible wiring board is perforated to expose a conductor layer.

FIG. 8 is a cross-sectional view showing a state in which an irregular bump is formed in a hole formed by the laser processing in FIG. 7;

FIG. 9 is a cross-sectional view corresponding to FIG. 8, showing a state where a normal bump is formed.

FIG. 10 is a cross-sectional view showing a state in which through holes are formed in the double-sided flexible wiring board by laser processing.

FIG. 11 is a cross-sectional view showing a state where a processed portion of the flexible wiring board is placed so as not to overlap with a suction hole of the receiving plate.

FIG. 12 is a cross-sectional view showing a state where a processed portion of the flexible wiring board is placed so as to overlap a suction hole of the receiving plate.

[Explanation of symbols]

 12 Receiving plate 14 Suction hole 16 Flexible wiring board 17 Processing part P Vacuum pump

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akiyoshi Itokawa 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nippon Denko Corporation (72) Inventor Kenkichi Iekura 1-1-1, Shimohozumi, Ibaraki-shi, Osaka No. 2 Nitto Denko Corporation (56) References JP-A-10-296473 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/00

Claims (4)

(57) [Claims] 1. A flexible wiring board is placed on a receiving plate having a suction hole, and suction is performed through the suction hole.
After fixing on the receiving plate, flexi
A method of processing a bull wiring board, wherein the receiving plate is made of a metal having a thermal conductivity of 8 W / m · K or more.
A method for processing a flexible wiring board
Law. 2. A flexible wiring board is placed on a receiving plate having a suction hole, and suction is performed through the suction hole.
After fixing on the receiving plate, flexi
A method of processing a flexible wiring board, wherein the receiving plate has a laser ablation threshold value of 800.
mJ / cm ² or more made of metal,
Processing method of flexible wiring board. 3. A flexible wiring board is placed on a receiving plate having a suction hole, and suction is performed through the suction hole.
After fixing on the receiving plate, flexi
A method of processing a flexible wiring board, wherein the receiving plate has a thermal conductivity of 8 W / m · K or more,
The laser ablation threshold is 800 mJ / c
characterized by comprising the m ² or more metal, Flexi
Bull wiring board processing method. 4. The method for processing a flexible wiring board according to claim 1, wherein the processing portion of the flexible wiring board is placed so as not to overlap with the suction hole of the receiving plate. .