CN112822837A - Double-sided and multilayer FPC substrate and processing method thereof - Google Patents
Double-sided and multilayer FPC substrate and processing method thereof Download PDFInfo
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- CN112822837A CN112822837A CN202110198311.3A CN202110198311A CN112822837A CN 112822837 A CN112822837 A CN 112822837A CN 202110198311 A CN202110198311 A CN 202110198311A CN 112822837 A CN112822837 A CN 112822837A
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- inclined hole
- sputtering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to the technical field of substrate processing, in particular to a double-sided and multi-layer FPC substrate and a processing method thereof, wherein the processing method comprises the following steps: the base material is provided with a plurality of inclined holes penetrating through the base material along the thickness direction; the sputtering layer is attached to the surfaces of the base material and the inclined hole; the conductive part is arranged in the inclined hole and is connected with the sputtering layer; and the circuit copper layers are positioned on the upper surface and the lower surface of the base material and are connected with the sputtering layer, and the circuit copper layers are connected through the conductive parts. The invention can reduce the production cost, reduce the drilling difficulty, facilitate the sputtering of the inner surface of the hole, enable sputtering ions to be sputtered on the inner surface of the hole and avoid sputtering the sputtering ions on opposite rollers.
Description
Technical Field
The invention relates to the technical field of substrate processing, in particular to a double-sided and multi-layer FPC substrate and a processing method thereof.
Background
FPC: the flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The flexible printed circuit board or FPC for short has the characteristics of high wiring density, light weight and thin thickness.
COF: the packaging technology of the crystal grain soft Film for fixing the driving IC On the flexible circuit board is a technology for jointing a Chip and a flexible substrate circuit by using a soft additional circuit board as a packaging Chip carrier, and the COF is one of the FPC with higher precision requirement.
The traditional method for manufacturing double-sided and multi-layer FPC comprises the following two methods:
1. the semi-additive method comprises the steps of drilling a through hole for conducting, cleaning the hole, shading, pressing a film, exposing, projecting, electroplating copper, stripping the film, removing bottom copper/removing Tieboat and detecting a circuit in sequence.
2. And the etching method comprises the steps of drilling a through hole for conduction, cleaning the hole, shading, electroplating copper, pre-processing of film pressing, exposure, projection/etching/film stripping and line detection in sequence.
In the prior art, a vertical conductive through hole is drilled by purchasing an FPC (flexible printed circuit) substrate copper-clad foil, on one hand, the cost for purchasing the FPC substrate copper-clad foil is high compared with that of an insulating film substrate, on the other hand, due to the fact that a copper layer covers the surface of the FPC substrate copper-clad foil, the requirement on drilling laser energy is high, the drilling efficiency is low, the FPC substrate copper-clad foil is easy to deform due to overheating, and the error is too large;
in addition, if use insulating film substrate drilling to be vertical hole, when vertical hole carries out the sputtering, the sputtering layer is hardly scribbled completely to vertical hole internal surface to vertical hole is when sputtering, and the sputter ion can be through vertical hole sputtering to the subtend running roller on, causes the running roller adhesion, and in addition, the sputter ion is constantly adhered to link to pile up and can form dust pollution after the dropout.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the problem of purchase FPC substrate copper clad laminate among the prior art drill, with high costs and the drilling degree of difficulty is big and bore vertical hole among the prior art, downthehole be difficult to the complete cladding sputter layer and vertical hole sputter ion sputter to the technical problem that the running roller leads to the fact the gluing of running roller even is solved. The invention provides a processing method of a double-sided and multi-layer FPC substrate, which can reduce the production cost, reduce the drilling difficulty, facilitate sputtering of the inner surface of a hole and sputtering ions on the inner surface of the hole, and avoid sputtering the sputtering ions into opposite rollers.
The technical scheme adopted by the invention for solving the technical problems is as follows: a double-sided and multilayer FPC substrate comprising:
the base material is provided with a plurality of inclined holes penetrating through the base material along the thickness direction;
the sputtering layer is attached to the surface of the base material and the inclined hole;
the conductive part is arranged in the inclined hole and is connected with the sputtering layer;
the circuit copper layers are positioned on the upper surface and the lower surface of the base material and connected with the sputtering layer, and the circuit copper layers are connected through the conductive part.
Preferably, the inclined hole is a cylindrical inclined hole.
The orthographic projection of the upper opening of the inclined hole is not intersected with the orthographic projection of the lower opening of the inclined hole, and the linear distance between the orthographic projection of the upper opening and the orthographic projection of the lower opening is not larger than the longest chord of the orthographic projection of the upper opening. Because the orthographic projection of the upper opening of the inclined hole and the orthographic projection of the lower opening of the inclined hole do not have an intersection, when sputtering ions are sputtered vertically, the sputtering ions cannot penetrate out from the upper opening and the lower opening directly, the technical problem that the sputtering ions penetrate out of the holes and sputter on opposite rollers is further avoided, the linear distance between the orthographic projection of the upper opening and the orthographic projection of the lower opening is not more than the longest chord of the orthographic projection of the upper opening, and when the linear distance between the orthographic projection of the upper opening and the orthographic projection of the lower opening is more than the longest chord of the orthographic projection of the upper opening, the effective area of the sputtering ions sputtered on the inner wall of the inclined hole is reduced, so that the sputtering ions can not be conducted in the inclined hole in the.
The orthographic projection edge of the upper opening of the inclined hole is tangent to the orthographic projection edge of the lower opening of the inclined hole. When the orthographic projection edge of the upper opening of the inclined hole is tangent to the orthographic projection edge of the lower opening of the inclined hole, sputtering ions can not be sputtered onto the opposite roller wheel from the inclined hole, and the sputtering ions sputtered from the upper opening can be guaranteed to be just on the inner surface of one side of the inclined hole, so that the sputtering distribution effect in the hole is further improved.
Preferably, the substrate is a PI film, and the PI film has excellent high and low temperature resistance, electric insulation, adhesion, radiation resistance and medium resistance.
The method for processing the double-sided and multi-layer FPC substrate comprises the following steps:
s1, forming an inclined hole penetrating through the surface of the base material along the thickness direction of the base material;
s2, cleaning the inclined hole;
s3, sputtering a sputtering layer on the inner surface of the inclined hole and the double surfaces of the substrate;
and S4, carrying out electroplating thickening treatment on the base material and the inclined hole to form a conductive part in the inclined hole, covering a plurality of circuit copper layers on the surface of the base material, and conducting the circuit copper layers through the conductive part.
The utility model provides a processing method of two-sided and multilayer FPC base plate, set up the inclined hole through its thickness direction of edge at the substrate, because there is not the copper foil copper layer on the substrate, low in purchase cost, conveniently drill, avoid having the laser energy requirement that leads to on copper foil copper layer high, and drilling efficiency is low, easy overheated production substrate deformation, cause the too big technical problem of error, carry out two-sided sputtering to the internal surface and the substrate of inclined hole after cleaning the inclined hole, because set up for the inclined hole, when sputtering, the inclined hole internal surface is the tilt state, sputter the internal surface of inclined hole more easily when sputtering, sputter the ion more easily attached to the surface of substrate, and when the inclined hole internal surface is the tilt state, sputter the ion is difficult to directly pass on the downthehole sputtering running roller of subtend.
In order to achieve uniform distribution of metal sputtering ions on the inner wall of the positioning hole, in step S3, a part of the inner wall of the inclined hole and one surface of the substrate are sputtered with a part of the sputtering layer, and another part of the inner wall of the inclined hole and the other surface of the substrate are sputtered with another part of the sputtering layer.
In order to achieve uniform plating, in step S4, the inner wall of the inclined hole and both sides of the base material are simultaneously subjected to plating treatment.
Preferably, in step S2, the inclined hole is cleaned by Plasma or Desmear.
Preferably, in step S1, the inclined hole is formed by a laser beam.
The double-sided and multi-layer FPC substrate and the processing method thereof have the following beneficial effects:
1. the substrate does not have the metal layer, low cost and can make laser drilling energy low, and drilling speed is efficient, and the heat is few, and the substrate deflection is little, and the precision improves relatively.
2. Adopt the inclined hole to sputter, downthehole sputtering distributes effectually and can avoid sputtering the ion to wear out the inclined hole in the sputtering running roller to subtend, causes the running roller to glue and link to and avoid constantly gluing to the dust pollution that drops and form.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic view of a double-sided and multi-layer FPC substrate according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a second embodiment of the double-sided and multi-layer FPC substrate of the present invention;
FIG. 3 is a schematic orthographic view of the upper opening and the lower opening of the inclined hole of the method for processing a double-sided and multi-layer FPC substrate of the present invention;
FIG. 4 is a schematic cross-sectional view of the double-sided and multi-layer FPC substrate of the present invention.
Reference numerals:
1. sputtering layer, 2, circuit copper layer, 10, substrate, 11, inclined hole, 12, upper opening, 13 and lower opening.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1, which is a first embodiment of the present invention, a double-sided and multi-layer FPC board includes:
a base material 10, wherein the base material 10 is provided with a plurality of inclined holes 11 penetrating through along the thickness direction; the inclined hole 11 is a cylindrical inclined hole, the orthographic projection of an upper opening 12 of the inclined hole 11 does not intersect with the orthographic projection of a lower opening 13 of the inclined hole 11, the linear distance between the orthographic projection of the upper opening 12 and the orthographic projection of the lower opening 13 is not more than the longest chord of the orthographic projection of the upper opening 12, and the base material 10 is a PI film.
The sputtering layer 1, the sputtering layer 1 is attached to the surface of the base material 10 and the inclined hole 11;
a conductive portion which is provided in the inclined hole 11 and is connected to the sputtering layer 1;
and the circuit copper layers 2 are positioned on the upper surface and the lower surface of the base material 10 and are connected with the sputtering layer 1, and the circuit copper layers 2 are connected through a conductive part.
When the orthographic projection of the upper opening 12 of the inclined hole 11 and the orthographic projection of the lower opening 13 of the inclined hole 11 do not intersect, and the linear distance between the orthographic projection of the upper opening 12 and the orthographic projection of the lower opening 13 is not more than the longest chord of the orthographic projection of the upper opening 12, as shown in fig. 1 and 3, the length of the longest chord of the orthographic projection of the upper opening 12 is L, likewise, the length of the longest chord of the lower opening 13 is L, and the linear distance between the orthographic projection of the upper opening 12 and the orthographic projection of the lower opening 13 is d, i.e., 0 < d < L, the sputtering ions cannot completely sputter the inner surface of the inclined hole 11 during sputtering, but in a subsequent electroplating treatment step, the base material 10 is filled on the basis of the conductive layer of the inner surface of the inclined hole 11 through electroplating, so that the base.
The first embodiment has the following beneficial effects:
the utility model provides a two-sided and multilayer FPC substrate, inclined hole 11 is seted up through its thickness direction of edge at substrate 10, because there is not the copper foil copper layer on the substrate, low in purchase cost, conveniently drill, avoid having the laser energy requirement that leads to on copper foil copper layer high, and drilling efficiency is low, easy overheated production substrate deformation, cause the too big technical problem of error, carry out two-sided sputtering to the internal surface and the substrate of inclined hole after cleaning the inclined hole, because set up for the inclined hole, when sputtering, the inclined hole internal surface is the tilt state, sputter the internal surface of inclined hole more easily when sputtering, sputter the ion more easily attached to the surface of substrate, and when the inclined hole internal surface is the tilt state, sputter the ion is difficult to directly pass on the downthehole sputtering subtend running roller.
As shown in fig. 2, a substrate for double-sided and multi-layer FPC according to a second embodiment of the present invention is different from the first embodiment in that:
the orthographic projection edge of the upper opening 12 of the inclined hole 11 is tangent to the orthographic projection edge of the lower opening 13 of the inclined hole 11.
The second embodiment has the following beneficial effects:
when the orthographic projection edge of the upper opening 12 of the inclined hole 11 is tangent to the orthographic projection edge of the lower opening 13 of the inclined hole 11, sputtering ions cannot be sputtered onto opposite rollers from the inclined hole, and meanwhile sputtering ions sputtered from the upper opening 12 can be sputtered on the inner surface of one side of the inclined hole completely, so that the sputtering distribution effect in the hole is further improved.
According to the processing method of the double-sided and multi-layer FPC substrate in the two embodiments, the processing method comprises the following steps: s1, forming an inclined hole 11 penetrating through the surface of the base material 10 along the thickness direction; the inclined hole 11 is formed by a laser beam.
S2, cleaning the inclined hole 11; in step S2, the inclined hole 11 is cleaned by Plasma or Desmear.
S3, sputtering a conductive layer on the inner surface of the inclined hole 11 and the double surfaces of the substrate 10; in step S3, a part of the inner wall of the inclined hole 11 and one surface of the substrate 10 are sputtered with the conductive layer at the same time, and the other part of the inner wall of the inclined hole 11 and the other surface of the substrate 10 are sputtered with the conductive layer at the same time.
And S4, carrying out electroplating thickening treatment on the base material 10 to enable the surface of the base material 10 to be covered with a circuit copper layer and realize double-sided conduction. In step S4, the inner wall of the inclined hole 11 and both sides of the base material 10 are simultaneously subjected to plating treatment.
In summary, according to the double-sided and multi-layer FPC substrate and the method for processing the same of the present invention, since the substrate 10 has no metal layer, the cost is low, the laser drilling energy is low, the drilling speed efficiency is high, the heat is small, the substrate deformation is small, and the precision is relatively improved, and in addition, the sputtering is performed by using the inclined hole 11, the sputtering effect is good, and the sputtering ions can be prevented from penetrating through the inclined hole and being sputtered to the opposite roller to cause roller adhesion, and dust pollution caused by continuous adhesion and falling off can be avoided.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A double-sided and multilayer FPC substrate, comprising:
the base material (10) is provided with a plurality of inclined holes (11) penetrating through the base material (10) along the thickness direction;
the sputtering layer (1) is attached to the surfaces of the base material (10) and the inclined hole (11);
the conductive part is arranged in the inclined hole (11) and is connected with the sputtering layer (1);
the circuit copper layers (2) are located on the upper surface and the lower surface of the base material (10) and connected with the sputtering layer (1), and the circuit copper layers (2) are connected through the conducting parts.
2. The double-sided and multi-layer FPC substrate according to claim 1, wherein said inclined hole (11) is a cylindrical inclined hole.
3. The double-sided and multi-layer FPC substrate according to claim 2, wherein an orthographic projection of an upper opening (12) of the inclined hole (11) does not intersect with an orthographic projection of a lower opening (13) of the inclined hole (11), and a linear distance between the orthographic projection of the upper opening (12) and the orthographic projection of the lower opening (13) is not greater than a longest chord of the orthographic projection of the upper opening (12).
4. The double-sided and multi-layer FPC substrate according to claim 2, wherein an orthographic projection edge of the upper opening (12) of the inclined hole (11) is tangent to an orthographic projection edge of the lower opening (13) of the inclined hole (11).
5. The double-sided and multilayer FPC substrate according to claim 1, wherein the base material (10) is a PI film.
6. A method of processing a double-sided and multi-layer FPC substrate according to any one of claims 1 to 5, comprising the steps of:
s1, forming an inclined hole (11) penetrating through the surface of the base material (10) along the thickness direction;
s2, cleaning the inclined hole (11);
s3, sputtering a sputtering layer (1) on the inner surface of the inclined hole (11) and the double surfaces of the base material (10);
and S4, carrying out electroplating thickening treatment on the base material (10) and the inclined hole (11), forming a conductive part in the inclined hole (11), covering a plurality of circuit copper layers (2) on the surface of the base material (10), and conducting the plurality of circuit copper layers (2) through the conductive part.
7. The process of claim 6, wherein in step S3, a part of the inner wall of the inclined hole (11) and one surface of the substrate (10) simultaneously sputter a part of the sputtered layer (1), and another part of the inner wall of the inclined hole (11) and another surface of the substrate (10) simultaneously sputter another part of the sputtered layer (1).
8. The process of claim 6, wherein in step S4, the inner wall of the inclined hole (11) and the double-sided surface of the substrate (10) are simultaneously subjected to plating treatment.
9. The machining method according to claim 6, characterized in that in step S2, the inclined hole (11) is cleaned by Plasma or Desmear.
10. The machining method according to claim 6, characterized in that in step S1, the inclined hole (11) is formed by a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110198311.3A CN112822837A (en) | 2021-02-22 | 2021-02-22 | Double-sided and multilayer FPC substrate and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110198311.3A CN112822837A (en) | 2021-02-22 | 2021-02-22 | Double-sided and multilayer FPC substrate and processing method thereof |
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| CN112822837A true CN112822837A (en) | 2021-05-18 |
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| CN202110198311.3A Pending CN112822837A (en) | 2021-02-22 | 2021-02-22 | Double-sided and multilayer FPC substrate and processing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172760A (en) * | 2022-09-06 | 2022-10-11 | 常州欣盛半导体技术股份有限公司 | Composite current collector, processing method thereof and battery |
-
2021
- 2021-02-22 CN CN202110198311.3A patent/CN112822837A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115172760A (en) * | 2022-09-06 | 2022-10-11 | 常州欣盛半导体技术股份有限公司 | Composite current collector, processing method thereof and battery |
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