JP3183063B2 - Semiconductor device - Google Patents

Abstract

PURPOSE: To improve the connecting strength of lead terminals by enhancing the fixing force of a land to the end of the terminal by solder, etc., in a semiconductor device in which the land of an integrated circuit board is fixed to the terminal by the solder, etc., and which is sealed by resin molding. CONSTITUTION: A lead terminal 23 has adjacent two leads (handgrips) 23b at the sites of the adjacent leads of the same potential, and a shared fixing piece 23a coupled to the ends. On the contrary, a wide land (b) wider than the combining allowance of the piece 23a is formed at the rear surface of the edge of a circuit board 10. Since the terminal 23 has the piece 23a having the width size of the sum or more of the widths of the leads 23b at the end, the fixing allowance becomes wider by soldering with the pieces 23a than the case of individually soldering the ends of the adjacent terminals, thereby enhancing the fixing strength. As a result, the connecting strength of the terminals is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted type semiconductor device such as a hybrid integrated circuit (hybrid IC), and more particularly to a semiconductor device having an integrated circuit board sealed with a resin package.

[0002]

2. Description of the Related Art Conventionally, a hybrid integrated circuit (hybrid I
As shown in FIG. 10, a surface mounting structure using a QFP (Quad Flat Package) package or the like of C) is a component mounting substrate (thick film ceramic substrate) of a hybrid integrated circuit on which various electronic components such as a semiconductor chip 1 and a capacitor 2 are mounted. 3 is placed on the island (die pad portion) of the suspension lead 4 for holding the substrate, and is positioned. Then, the tip of the inner lead (lead terminal) 5 of the lead frame and the land portion of the film wiring formed on the substrate are fixed to gold. It has a structure in which bonding is performed with the wire 6 and sealed with a resin package (envelope) 7 by transfer molding. The gold wire 6 is also bonded between the semiconductor chip 1 and the land portion of the film wiring of the substrate 3.
In such a surface mount structure of the resin package of the hybrid integrated circuit board, the electrical connection between the inner lead 5 and the board 3 is achieved by the gold wire 6, so that the wire connection process is performed before the wire bonding step. First, it is necessary to mechanically connect the substrate 3 on the island of the suspension lead 4 for holding the substrate. For this reason, since the suspension lead 4 is indispensable as a separate component, the external dimensions of the resin package are
In some cases, which has been an obstacle to miniaturization of semiconductor devices. In addition, it is necessary to perform a mechanical connection step (mounting of the substrate 3 on the suspension leads 4) in a separate step before the electrical connection step (wire bonding step), so that it is difficult to reduce the number of steps, resulting in an increase in manufacturing cost. I was

As shown in FIG. 11, a surface mounting structure in which a substrate 3 of a hybrid integrated circuit is sealed with a resin package 7 without using the suspension leads 4 can be adopted for the above surface mounting structure. The tip 5a of each inner lead 5 is fixedly connected to the land 3a formed on the edge of the substrate 3 with solder or the like.

[0004]

However, after the tip 5a of the inner lead 5 is soldered to the land 3a of the substrate 3, the substrate 3 and the lead 5 are sealed with a resin package 7 by transfer molding. Then, there are the following problems.

When the external dimensions of the resin package are reduced, the width of the lead terminals 5 and the pitch between the leads are reduced, so that the soldering allowance is reduced, and the lead terminals 5
Adhesion strength (soldering strength) is reduced. In addition, since the pitch between leads is narrow, solder bridges frequently occur, and the yield is reduced.

The significance of the resin mold lies in the sealing property of the substrate and the retention of the lead. However, in recent years, the emphasis has shifted to the retention and retention of the lead. The withstand strength of the lead terminal 5 due to the spread of the resin material must be stronger than the fixing force of the solder or the like at 5a. However, when the width dimension of the lead terminal 5 is reduced, a portion that comes into contact with the resin material is reduced, so that there is a problem that the withstand resistance of the lead terminal is reduced.

In view of the above problems, there is provided a semiconductor device in which a land portion of a wiring formed on an integrated circuit board and a tip portion of a lead terminal are fixedly connected by soldering or the like, conductively connected, and sealed with a resin mold. A first object of the present invention is to improve the connection strength of a lead terminal by increasing the fixing force of a land portion of a sealed integrated circuit board and the tip of a lead terminal by soldering or the like, A second object of the present invention is to
It is an object of the present invention to improve the connection strength of the lead terminals by improving the resin contact of the resin package and increasing the withstand resistance of the lead terminals.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a method in which a land portion of a wiring formed on an integrated circuit board and a tip end portion of a lead terminal are fixedly connected by soldering or the like and conductively connected. In a semiconductor device sealed with a resin mold, two or more adjacent lead terminals have a common fixing piece connected to each other at a tip portion of their handle, and the common fixing piece is attached to the integrated circuit board. It is formed a wide range wider land portion than the combined cost of the piece, the lead terminals each other the co
Fixing pieces for receiving and supporting the back surface of the edge of the integrated circuit board.
It is a pad-down type that serves as a substrate hanging portion . Here, on the inside of the bent part of the handle part between the lead terminals
It is desirable that a hook-shaped portion is formed. The group of lead terminals includes an unconnected positioning lead terminal having an abutting portion abutting on a side surface of the integrated circuit board.

[0009]

[0010]

First, the first means of the present invention is applied to a portion where adjacent leads have the same potential, and two or more adjacent lead terminals are interconnected to the tips of their handle portions. The integrated circuit board has a common fixed piece, and a wider land portion is formed on the integrated circuit board, which is wider than a margin of the common fixed piece. For this reason, compared with the case where the tips of the adjacent lead terminals are individually fixed, fixing with the shared fixing piece causes a fixing allowance between the tips of the lead terminals, thereby increasing the fixing strength. be able to. As a result, the connection strength of the lead terminals is improved. This makes it possible to increase the pitch between leads and suppress the occurrence of solder bridges.

In addition, a common fixing piece is integrated between the lead terminals.
Becomes a board suspension that receives and supports the back of the edge of the circuit board
Because of the pad-down type, the rise between lead terminals
As the resin mold enters between the handle parts and moves around,
The resin mold and the lead terminals are strongly linked to each other
To prevent the lead terminals from slipping out of the resin mold.
Power can be increased. Therefore , it is necessary to increase the solder fixing strength.
At the same time, it also has a retaining strength against the resin mold.
Can be enhanced.

[0012]

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a plan view showing a semiconductor device according to an embodiment of the present invention, FIG. 2 is a bottom view of the semiconductor device, and FIG.
FIG. 5 is a sectional view taken along the line AA ′ of FIG.

The basic structure of the semiconductor device of this embodiment is as follows: a rectangular hybrid integrated circuit board 10; an aluminum lead frame (tie bars not shown) 20 connected thereto;
It is composed of four independent lead frames 31 to 34 on which power electronic components are exclusively mounted, and a surface mount type resin package (QFP) 40 molded by transfer molding to seal them. Hybrid integrated circuit board 10
Is a ceramic integrated circuit board, and resistors R1, R
3 to R5, R7, R8, capacitors C1 to C9, diodes D2 and D3, and a resistor R
2, R6, R9, a control semiconductor integrated circuit (IC1) chip (flip chip) 15 are mounted, and thick-film wiring (not shown) is formed on the front and back. W1 is an aluminum bonding wire connecting the anode of the diode D2 and the bonding pad P5, and W2 is an aluminum bonding wire connecting the anode of the diode D3 and the bonding pad P7. Note that a semiconductor IC chip may be mounted on the hybrid integrated circuit board 10 and wire-bonded between the semiconductor IC chip and wiring on the board.

With respect to the rectangular hybrid integrated circuit board 10, a large number of inner leads (lead terminals) 22, 22 ', 23, 2 of a QFP lead frame 20 are provided on three sides thereof.
The tip of 3 ', 24, 25 faces. As shown in FIG. 3, several types of lead terminals 22, 22 ', 23, 23', and 25 have a spoon-shaped bent portion (pad down type) in which the distal end is bent downward and then returned upward. ing. Of these, the tips of the lead terminals 22, 22 ', 23, 23' are lands a, b, c on the back surface of the edge of the circuit board 10.
Receiving portions 22a, 22 'for supporting the substrate 10
a, 23a and 23'a. Board suspension 22
a, 22'a, 23a, and 23'a are fixed by soldering or a conductive adhesive to achieve mechanical connection simultaneously with electrical connection. Therefore, a suspension lead for holding the substrate is not required. Therefore, since there are no suspension leads for limiting the external dimensions of the semiconductor device, a semiconductor device having a small package can be realized.

Here, in a portion of the back surface of the edge of the circuit board 10 where adjacent leads have the same potential, FIG.
As shown in the figure, a specially shaped lead terminal 23 is used.

The lead terminal 23 has two adjacent lead portions (pattern portions) 23b, 23b, and has a shared fixing piece 23a mutually connected to the tip portions thereof. On the other hand, on the back surface of the edge of the circuit board 10, a wide land portion b is formed which is wider than the allowance of the joint fixing piece 23a. The normal lead terminal 22 has a single lead portion having a uniform width up to the tip, but the lead terminal 23 has a shared fixing piece 23 having a width at the tip that is equal to or greater than the sum of the widths of the lead portions 23b.
a, the bonding margin is wider when soldering with the common fixing piece 23a than when soldering the tips of the adjacent lead terminals 22 individually. Can be enhanced. As a result, the connection strength of the lead terminals is improved. Further, since the pitch between leads can be widened, the occurrence rate of solder bridges can be reduced. Here, hook-shaped portions 23c are provided inside the bent portions of the two lead portions (pattern portions) 23b of the lead terminal 23.
Are formed. As shown in FIGS. 1 and 2, the hook-shaped portion 23c is also sealed with the resin in the resin package 40, so that the anchoring effect is exerted and the connection strength of the lead terminals is increased.

Although a typical lead terminal 22 of a single lead in this embodiment has a uniform width, as shown in FIG. 6A, a lead terminal having a hook-like portion 22c on both sides or one side in a bent portion. 26 is acceptable. When the hook-like portion 22c is provided and the tip portion 26a is wide (joist-shaped), an anchoring effect can be exerted, the withstand resistance of the lead terminal to the resin mold material is improved, and the connection strength of the lead terminal is improved. Is increasing. The lead terminal 27 shown in FIG.
A hook-like portion 27c is formed on the side of the tip 27a.
Is a rectangular piece. Further, the tip 28a of the lead terminal 28 shown in FIG.
The leading end 29a of the lead terminal 29 shown in (a) is a disc-shaped piece.

In this embodiment, there is a lead terminal 22 'having a single lead portion different in shape from the lead terminal 22. The tip end 22'a of the lead terminal 22 'as a substrate hanging portion is L-shaped, and has a width larger than the width of the lead portion. On the other hand, on the back surface of the edge of the circuit board 10, a wide land portion b wider than the margin of the front end portion 22'a is formed.

The lead terminal 23 'is connected to the lead terminal 23.
, But has two L-shaped lead portions at its distal end, but has an L-shaped shared fixed piece 2 wider than the shared fixed piece 23a.
3'a. On the other hand, on the back surface of the edge of the circuit board 10, a wide land portion c is formed, which is wider than the margin of the joint fixing piece 23'a.

The lead terminals 24 of the plurality of unconnected leads (NC pins) of the lead frame 20 are positioning unconnected lead terminals, and come into contact with the side surface of the circuit board 10 as shown in FIGS. It has an abutment portion 24a.
The abutting portion 24a of the positioning non-connecting lead 24 in this example is a lead end surface. This butting part 24
As shown in FIG. 6, a has a T-shape in plan view so as to have an anchoring effect with the resin package 40. In addition,
As shown in FIG. 9B, a lead bent portion 24b may be formed by bending the lead tip downward. In the bent front end portion 24b, the margin of contact with the side surface of the substrate can be widened. However, in bending or the like, it may be difficult to obtain the positioning accuracy due to springback or the like. Therefore, it is possible to increase the positioning accuracy by leaving the lead end surface as in the abutting portion 24a.

The tip of the lead terminal 25 of the unconnected leads (NC pins) is T-shaped in plan.
This is to provide anchoring effect and to secure the retaining strength.

Next, four lead frames 31 to 34 on which power electronic components are mounted will be described. The four lead frames 31 to 34 made of aluminum are located on one short side of the resin seal package 40 in an area adjacent to the integrated circuit board 10. The lead frames 31 to 34 are
Flat wide portions (component mounting portions) 31b to 34b for mounting electronic components and the like, and a large number of pad-down type lead terminals 31c to 34 branched and connected therefrom.
c. The wide portion 31b of the lead frame 31 has a rectangular shape, and one side of the corner edge portion of the integrated circuit substrate 10 is solder or a conductive adhesive (fixed portion) 31a.
The four lead terminals 31c branch from the wide portion 31b and extend toward the longer side of the package. One terminal surface of the chip resistor of the shunt resistor R1 is fixed on the wide portion 31b near the long side of the package with solder or a conductive adhesive. The wide portion 32b of the lead frame 32 has a planar convex shape, and the leading edge portion is fixed to the periphery of the integrated circuit board 10 with solder or a conductive adhesive (fixing portion) 32a, and from the base of the wide portion 32b. In the figure, four lead terminals 32c are branched and extend to the short side of the package.

A lead terminal 32c 'branches from the left lead terminal of these four lead terminals 32c to the outermost left side. The power MOS transistor chip Q1 is mounted on the wide portion 32b, and its drain terminal surface is fixed with solder or a conductive adhesive. A gate terminal surface G and a source terminal surface S are formed on the upper surface of the power MOS transistor chip Q1, and the bonding terminal P3 formed on the integrated circuit substrate 10 is bonded to the gate terminal surface G by an aluminum bonding wire W3. Connected by Further, the source terminal surface S and a bonding pad P6 formed on a wide portion 33b of the lead frame 33 described later are connected to a bonding wire W4 made of aluminum.
Connected by Wide portion 33b of lead frame 33
Is a substantially L-shaped plane, and the edge of the edge of the integrated circuit board 10 is solder or conductive adhesive (fixed portion) 3
3a, and six lead terminals 33c branch from the base of the wide portion 33b to the short side of the package and extend therefrom. The above-mentioned bonding pad P6 is formed on the front end side of the wide portion 33b, and a relatively small-scale MOS transistor chip Q3 is mounted thereon.
The drain terminal surface is fixed with solder or a conductive adhesive. A gate terminal surface G and a source terminal surface S are formed on the upper surface of the MOS transistor chip Q3, and the gate terminal surface G and the bonding pad P2 formed on the integrated circuit substrate 10 are bonded by an aluminum bonding wire W5. It is connected. In addition, the source terminal surface S
And a bonding pad P1 formed on the integrated circuit substrate 10 are connected by a bonding wire W6 made of aluminum. On the base of the wide portion 33b, a power MO
The S transistor chip Q2 is mounted, and its drain terminal surface is fixed with solder or a conductive adhesive. On the upper surface of the power MOS transistor chip Q2, a gate terminal surface G and a source terminal surface S are formed, and the bonding terminal P and the bonding pad P3 formed on the integrated circuit substrate 10 are made of an aluminum bonding wire W.
7 are connected. Further, the source terminal surface S and a bonding pad P8 formed on a wide portion 34b of the lead frame 34 described later are connected by a bonding wire W8 made of aluminum. Lead frame 33
The diode chip D1 is mounted on the base of the wide portion 33b, and its cathode terminal surface is fixed with solder or a conductive adhesive. An anode terminal surface A formed on the upper surface of the diode chip D1 and a lead frame 34 described later
Pad P8 formed on wide portion 34b of
Are connected by an aluminum bonding wire W9. The wide portion 34b of the lead frame 34 has a rectangular shape, and the curved side portion is fixed with solder or a conductive adhesive (fixed portion) 34a at the other corner edge of the integrated circuit board 10, and the wide portion 34b Five lead terminals 34c are branched in a comb shape and extend to the other long side of the package. Only the bonding pad P8 is formed on the wide portion 34b, and the bonding wires W8 and W9 are connected to the bonding pad P8 as described above. Note that a ceramic plate (metallized plate) 50 is lined on the back side of the lead frames 31 to 34.

FIG. 4 is a schematic circuit diagram illustrating the circuit configuration in the area of four lead frames 31 to 34 on which power electronic components are mounted. Arrows in FIG. 4 indicate directions of heat conduction of heat generated from the electronic components. The shunt resistor R1 is a chip resistor for detecting a voltage drop when a large current flows.
The other terminal surface is conductively fixed on the wide portion 31b of the lead frame 32 while being conductively fixed on the first wide portion 31b. Even if the amount of heat generated by the shunt resistor R1 is large, heat is conducted to the two lead frames 31 and 32, and the lead terminals 31c and 32c as heat radiation fins are removed from the resin seal package 40 through the wide portions 31b and 32b. The heat is dissipated. In particular, since the wide portion 31b of the lead frame 31 is near the contour of the resin package, heat radiation by the lead frame 31 is more dominant than heat radiation by the lead frame 32.
On the lead frame 32, a power MOS transistor
The amount of heat generated by the chip Q1 is considerably larger than that of the shunt resistor R1. For this reason, the power MOS transistor chip Q1 is mounted on the base of the wide portion 32b, that is, on the lead terminal 32c side, so that heat can be quickly radiated to the outside with low heat conduction resistance. Is tapered to increase the heat conduction resistance, so that the heat from the chip Q1 is unlikely to spread to the tip side. Although the space between the chip Q1 and the shunt resistor R1 may be positively constricted,
If the layout allows, it is better to mount them on separate lead frames. Here, the heat generated by the power MOS transistor chip Q1 does not cause a problem on the gate terminal surface G as the control terminal, and the drain terminal surface and the source terminal surface S
Therefore, a lead frame 3 may be attached to the drain terminal surface.
In addition, a bonding wire W4 made of aluminum having good thermal conductivity is bonded to the source terminal surface S, and the other end is bonded to a bonding pad P6 of the lead frame 33. Heat generated at the source terminal surface S is conducted to the lead frame 33 via the bonding wire W4. Wide part 3 of lead frame 33
On 3c, heat is generated on the drain terminal surface and the source terminal surface S of the power MOS transistor chip Q2 and on the cathode terminal surface and the anode terminal surface A of the diode chip D1. Transistor chip Q2 and diode
Since the chip D1 is located near the lead terminal 33c, heat on the drain terminal surface and the cathode terminal surface is quickly radiated to the outside with low heat conduction resistance. Heat generated at the source terminal surface S of the transistor chip Q2 is transmitted to the lead frame 34 via the bonding wire W8, and heat generated at the anode terminal surface A of the diode chip D1 is transmitted to the lead frame 34 via the bonding wire W9. I do.
The lead frame 34 has no electronic components mounted thereon, only a bonding pad P8 is formed, and only two bonding wires W8, 9 are bonded thereon. It has the same potential power supply function and heat dissipation function. If circumstances permit, bonding pad P8 and anode terminal surface A
Alternatively, two or more bonding wires may be bonded to the source terminal surface S.

As described above, the shunt resistor R1 and the power MO are connected to the wide portions 31b to 34b of the lead frames 31 to 34.
The S transistor chips Q1, Q2 and the diode chip D1 are conductively fixed, and the terminal surfaces (source terminal surface S, anode terminal surface A) of opposite polarities to the fixed terminal surfaces are also made of aluminum having high thermal conductivity. The bonding wires W4, W8, W9 are connected to other lead frames. All of the heat generating parts of the power electronic components do not pass through the integrated circuit board 10 through the lead frame or the bonding wire, but a large number of lead terminals 31c as radiation fins.
To 34c, from which heat is radiated out of the resin package. Even when sealed with the surface-mount type resin seal package 40, heat generated from the power electronic component is well conducted to the lead terminals 31 to 34c exposed to the outside from the wide portions 31b to 34b, so that the heat radiation characteristics are good. Becomes

Wide portions 31b of lead frames 31 to 34
To 34b are edge back surfaces 31a to 34a of the integrated circuit substrate 10.
However, since the fixing portions are partially overlapped, the conduction of heat from the wide portions 31b to 34b to the integrated circuit board 10 does not matter. The thermal effect on the electronic components of the integrated circuit board 10 can be significantly reduced as compared with the case where power electronic components are directly mounted on the integrated circuit board 10.

Since the chip resistors, the transistor chips Q1, Q2, and the diode chip D1 are conductively fixed to the lead frames 31 to 34, the wiring impedance is much lower than that of the printed wiring of the integrated circuit board. In particular, it is possible to reduce the voltage drop of the wiring portion related to the shunt resistor R1.

The lead frames 31 to 34 and the integrated circuit board 10 are fixed at fixing portions 31a to 34a and are integrated. For this reason, blurring of the pad portion can be suppressed, and ultrasonic bonding can be used in the wire bonding step. Further, positioning during resin molding is easy. In this example, since the thickness of the lead frames 31 to 34 is 0.25 mm and the thickness of the bonding wires is 0.25 mm, the ceramic plate 50 is fixed as a backing member in consideration of unstable bonding in the ultrasonic bonding process. I have.

In the lead frames 31 and 32 on which the shunt resistor R1 is mounted straddling, the lead terminal arrangement sides are orthogonal to each other. Further, the lead frame 33 on which the chip Q2 is mounted and the lead frame 34 whose source terminal surface S is connected via the bonding wire W8 have an orthogonal relationship between the lead terminal arrangement sides. When the adjacent lead frames are oriented in the orthogonal direction as described above, the flatness is increased, which contributes to an improvement in yield.

In this embodiment, a large number of lead terminals 31c to 34c are branched from the wide portions 31b to 34b.
In the case where the lead terminals 22 on the integrated circuit board 10 side are connected to the board by soldering, when the solder is melted, minute floating of the leads occurs instantaneously. Lead terminals 31c to 34c equivalent to the lead terminals 22 are provided to improve the reliability of the solder connection. Of course, when a large number of lead terminals 31c to 34c are connected by soldering in a comb shape, the side surfaces of the lead thickness are also electrically and mechanically connected, so that the heat radiation characteristics and the reduction in wiring impedance become more remarkable.
Here, in this example, a large number of lead terminals 31 c to 34
The branch position of “c” is inside the outline of the resin seal package 40.

As seen from the lead terminal 32c ', it branches off from the adjacent lead terminal 32c inside the outline of the package 40. Since the resin material also wraps around between the lead terminals, an anchoring effect is exhibited, and the mutual fixing is stable and reliable.

Wide portions 31b of the lead frames 31 to 34
34b are fixed not on the upper surface of the edge of the integrated circuit substrate 10 but on the rear surface of the edge. For this reason, electronic components thicker by the thickness of the integrated circuit board 10 can be mounted on the wide portions 31b to 34b, and there is a margin for mounting a thick power device. In addition, since the resin thickness on the rear surface side of the wide portion is thin, it is convenient for securing heat dissipation.

[0035]

As described above, the present invention has the following effects.

According to the present invention, the fixing margin is generated between the leading end portions of the lead terminals in the case where the leading end portions of the adjacent lead terminals are separately fixed in comparison with the case where the leading end portions of the adjacent lead terminals are individually fixed. In addition, the fixing strength can be increased. As a result, the connection strength of the lead terminals is improved. For this reason, the generation of solder bridges can be suppressed by increasing the pitch between leads,
Contribute to improvement of yield.

In addition, common fixing pieces are integrated for the lead terminals.
Becomes a board suspension that receives and supports the back of the edge of the circuit board
Because of the pad-down type, the rise between lead terminals
As the resin mold enters between the handle parts and moves around,
The resin mold and the lead terminals are strongly linked to each other
To prevent the lead terminals from slipping out of the resin mold.
Power can be increased. Therefore , it is necessary to increase the solder fixing strength.
At the same time, it also has a retaining strength against the resin mold.
Can be enhanced.

[Brief description of the drawings]

FIG. 1 is a plan view showing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a bottom view of the semiconductor device.

FIG. 3 is a sectional view taken along the line AA ′ of FIG. 1;

FIG. 4 is a schematic circuit diagram illustrating a circuit configuration in a region of four lead frames on which power electronic components are mounted in the semiconductor device.

5A is a perspective view showing a lead terminal having two lead portions in the semiconductor device, and FIG. 5B is a plan view showing a connection state between the lead terminal and a land portion on the substrate side. .

FIGS. 6A and 6B are perspective views respectively showing lead terminals having one lead part in the semiconductor device.

FIGS. 7A and 7B are perspective views respectively showing lead terminals having another lead portion in the semiconductor device.

FIG. 8 is a perspective view showing an unconnected lead terminal for positioning having an abutting portion in the semiconductor device.

FIGS. 9A and 9B are cross-sectional views illustrating non-connection lead terminals for positioning having abutting portions in the semiconductor device, respectively.

10A is a partial plan view showing an example of a conventional semiconductor device, and FIG. 10B is a partial sectional view of the same device.

FIG. 11 is a plan view showing a surface mounting structure in which a hybrid integrated circuit board is sealed with a resin package without using suspension leads.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Integrated circuit board (hybrid integrated circuit board) 15 ... Flip chip 20 ... Lead frame of integrated circuit board 22,22 ', 23,23', 26-29 ... Inner lead (lead terminal) 22a, 22'a, 23a, 23'a, 24a, 26a
... 29a ... board suspension part 24 ... positioning non-connection lead terminal 25 ... non-connection lead terminal (NC pin) 24a, 24b ... butting part 31-34 ... power electronic component lead frame 31a-34a ... fixing part 31b-34b ... wide portions 31c to 34c, 32c '... lead terminals R1 ... shunt resistor chips Q1, Q2 ... power MOS transistor chips D1 ... diode chips 40 ... surface mount type resin seal package (QFP). 50: ceramic plate a, b, c: land portion.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-34746 (JP, U) JP-A-5-36849 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/50 H01L 23/12 H01L 25/04 H01L 25/18

Claims (4)

(57) [Claims] 1. A semiconductor device comprising a land portion of a wiring formed on an integrated circuit substrate and a tip portion of a lead terminal fixedly connected by soldering or the like, conductively connected, and sealed with a resin mold. the above lead terminals of the above have a common fixing pieces coupled to each other at the tip portion of their shank, wherein the integrated circuit substrate is formed wide wider land portion than the combined cost of the common anchoring piece, The lead terminals are
Fixing pieces for receiving and supporting the back surface of the edge of the integrated circuit board.
A pad-down type device serving as a substrate hanging portion . 2. The semiconductor device according to claim 1, wherein
A hook-shaped portion is formed inside the bent portion of the handle portion between the lead terminals.
The semiconductor device characterized by but are formed. 3. The semiconductor device according to claim 1, wherein the group of lead terminals includes a non-positioning lead terminal for positioning having an abutting portion that abuts on a side surface of the integrated circuit board. A semiconductor device characterized by the above-mentioned. 4. The semiconductor device according to claim 1, wherein a width of a tip portion of said lead terminal is wider than a sum of widths of said handle portions. Semiconductor device.