JP3172335B2 - Method for manufacturing electro-optical element and apparatus for manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION In the present invention, a gap spacer is sandwiched between a pair of opposing substrate pairs, an electro-optical material is filled between the pair of substrates, and the periphery of the pair of substrates is reduced. The present invention relates to a method for manufacturing an electro-optical element sealed with a seal material containing a seal spacer and an apparatus for manufacturing the same. More particularly, a method and a manufacturing apparatus for manufacturing an electro-optical element it is possible to accurately manage the substrate spacing.

[0002]

2. Description of the Related Art Conventionally, in an electro-optical element represented by a liquid crystal element, as shown in FIG. 14, a substrate filled with an electro-optical material 3 and the periphery thereof is sealed by a sealing material 5 containing a sealing spacer 4. It was necessary to keep the distance between pairs 1 and 1 constant. To this end, gap spacers 2 are provided between the substrates to keep the substrate spacing constant. Here, in order to keep the substrate interval constant, it is considered that it is important to control the arrangement of the gap spacers 2 so that the particle size of the gap spacers 2 is uniform, but the number of the spacers is not varied. Was.

Conventionally, the number of arrangements has been managed so that the number per unit area is within the range of (N ± 2N ^0.5 ). Here, the N is about 100 / mm ² in a TN (twisted nematic) liquid crystal element, that is, the arrangement number is 80 / mm ^{2 to} 120 / mm ^2.
Had been considered suitable. Thereafter, as shown in FIG. 15, the substrate 1 is uniformly pressed by the pressure
Was adhered with a sealing material 5 containing a sealing spacer 4.
For this reason, when manufacturing such an electro-optical element 6, it is important to arrange the gap spacers 2 and to make the pressing by the pressing plate 21 uniform, and a method and apparatus for that purpose have been developed. Have been. For example, a gap spacer spraying device 74 as shown in FIG. 16 is used for uniform arrangement of the gap spacers 2. In this apparatus, the gap spacers 2 discharged from the discharge unit 35 are expected to be uniformly dispersed in the gap spacer spraying device 74 and adhere to the surface of the substrate 1. Therefore, it is necessary to increase the distance between the discharge unit 35 and the substrate 1. Also,
Gap spacer 2 in gap spacer spray device 74
Because only a very small portion of the gap spacer adheres to the substrate 1, the utilization efficiency of the gap spacer was about several percent.

[0004]

However, in such a conventional structure, the distance between the pair of substrates caused by the deformation of the substrate warp and surface and the distortion of the substrate generated when the sealing material containing the seal spacer is cured. Cannot be corrected, and the variation in the distance between the substrates has a serious adverse effect on the display quality of the electro-optical element. Therefore, conventionally, warpage and surface deformation of the substrate have been excluded in advance by precision polishing or inspection, and non-standard ones have been excluded, thereby causing a cost increase. Also, for the distortion of the substrate generated when the sealing material containing the seal spacer is cured, perform the bonding treatment at a low temperature as much as possible, or slowly cool after heating and curing and fix it with a mold until it returns to room temperature. It was trying to cope by extending the processing time. In addition, after injecting the electro-optical material between the substrates, sealing the inlet is performed while pressing with a mold (so-called pressure sealing), but a part that cannot be completely handled remains. This has been a factor of deteriorating the display quality.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned disadvantages, and is not affected by warping or deformation of a substrate to be used or distortion of the substrate generated when a sealing material containing a seal spacer is cured. Another object of the present invention is to provide a low-cost manufacturing method for reliably manufacturing an electro-optical element having a constant gap between substrates and excellent display quality, and a manufacturing apparatus used therefor.

[0006]

According to the first aspect of the present invention,
A gap spacer is sandwiched between a pair of opposed substrate pairs, an electro-optical material is filled between the pair of substrates, and the periphery of the pair of substrates is sealed with a sealing material containing a seal spacer. in the method for manufacturing an electro-optical elements are, formic
The gap spacer is intermittently ejected from the ejection section,
Spreading amount of gap spacer depending on the number of ejections of gap spacer
Moving the discharge unit on the substrate while controlling the
Near the sealing material of the high density arrangement part of the gap spacer,
A step of setting a central part as the gap spacer low-density arrangement part
And a step of pressure-bonding the pair of substrates.
It is characterized by that.

According to a second aspect of the present invention, a pair of opposed bases is provided.
A gap spacer is sandwiched between the pair of plates, and
An electro-optic material is filled between the plate pairs, and the substrate
The periphery of the pair is sealed with a seal material containing a seal spacer
In the method of manufacturing an electro-optical element,
Suction holes with a distribution density corresponding to the arrangement of
A step of adsorbing a gap spacer into the adsorption hole,
With the gap spacer from the suction hole.
On the substrate, the vicinity of the substrate sealing material of the substrate
Place the high-density placement part and the center part of the gap spacer
A step of forming a low-density arrangement portion of the
And pressure bonding .

According to a third aspect of the present invention, a pair of substrates is bonded under pressure.
In this case, the pressure is applied while giving a strong or weak surface distribution to the substrate surface .

According to a fourth aspect of the present invention, an electro-optical element is manufactured.
A manufacturing apparatus for manufacturing a substrate, the substrate forming a substrate pair
For measuring warpage and surface deformation of each substrate and each substrate
The distance between the substrate pairs when combining
Calculate the appropriate distribution of gap spacers to be arranged
Means for calculating the gap spacer and the calculated predetermined distribution
Means for arranging the substrates and pressing the substrate pairs to adhere to each other
Is characterized in that at least it has a means,

[0010] The invention according to claim 5 is an electric vehicle according to claim 4.
In a manufacturing apparatus of a magneto-optical element, a pair of substrates is pressurized and mutually
The means for bonding includes hand pressing the substrate with a surface distribution.
Is characterized in that have a stage.

[0011]

[0012]

[0013]

[0014]

[Function] The warpage and surface deformation of the substrate can be measured and grasped before the gap spacer is scattered, and the distortion of the substrate generated when the sealing material containing the seal spacer cures can be measured by simulation experiments and simulations. Although it was possible to estimate and grasp it in advance, conventionally, as for the warpage of the substrate and the deformation of the surface, non-standard ones were excluded by precision polishing and inspection in advance, and seal spacers were included. It has been attempted to cope with distortion of the substrate generated when the sealing material is cured by lengthening the processing time.

On the other hand, according to the first aspect of the present invention, the distribution density of the gap spacer disposed between the pair of substrates is large.
The light and shade are formed . The arrangement of this gap spacer
When the gap spacers are uniformly arranged, the gap spacers are arranged at a high density in the area where the distance between the substrate pairs is likely to be narrow, and conversely, the gap spacers are arranged at a low density in the center of the substrate where the distance between the substrate pairs is likely to be wide. I have. For this reason, even if the gap between the substrates is to be reduced, the gap between the substrates is maintained by a large number of gap spacers.
The distance between the pair of substrates can be kept constant without being affected by warpage or deformation of the substrate to be used or distortion of the substrate generated when the sealing material containing the seal spacer is cured. it can. Such a gap spacer
The gap spacer is intermittently ejected from the ejection section
Gap gap according to the number of gap spacer ejections.
Move the discharge unit on the substrate while controlling the
As a result, a desired amount of the gap spacer is provided on the substrate.
The cloth density can be reliably formed .

The distortion of the substrate generated when the sealing material containing the seal spacer is cured is clarified by simulation. When the gap spacer is arranged uniformly between the pair of substrates, the vicinity of the center of the pair of substrates expands. A phenomenon was found. This phenomenon has been found in actual production. Therefore, conventionally, as described above, the arrangement method of the gap spacer is not changed, and the processing time is increased or the pressure sealing is performed so as to reduce the bulge.

On the other hand, in the invention according to claim 2, the base
The arrangement of the gap spacer that keeps the distance between the plate pairs
Adsorption to the distribution density corresponding to the gap spacer arrangement on the mounting plate
A hole is provided to absorb the gap spacer adsorbed by the suction hole.
By attaching to the substrate through the hole,
Ensuring the desired distribution density of cap spacers
Becomes possible.

[0018]

[0019]

According to a third aspect of the present invention, in the manufacturing method according to the first or second aspect, when bonding the pair of substrates under pressure, the pressure is applied while giving a strong or weak surface distribution to the substrate surface. Therefore, the pressure can be weakened in a portion where the distance between the substrate pairs is likely to be narrow, and conversely, can be increased strongly in a portion where the distance between the substrate pairs is likely to be large.
More efficient placement
Can be formed.

According to the fourth aspect of the present invention, it is possible to grasp the warpage and the deformation of the surface of the substrate, and based on the measurement results, the gap spacers are arranged so that the distance between the substrate pairs is substantially constant. An appropriate distribution can be calculated. Furthermore, the gap spacers can be arranged with the calculated appropriate distribution, and by functioning as a manufacturing apparatus for implementing the manufacturing method according to the first and second aspects, the substrate pairs are pressed and adhered to each other.

According to a sixth aspect of the present invention, there is provided an apparatus for manufacturing an electro-optical element according to the fifth aspect , further comprising a means for pressing the substrate with a surface distribution in the means for pressing and bonding the pair of substrates to each other. Therefore , it functions as a manufacturing apparatus for carrying out the manufacturing method according to claims 1 and 2 .

[0023]

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. Embodiment 1 FIG. 1A is a schematic plan view of this embodiment. FIG. 1B is a schematic cross-sectional view of an arrow portion in FIG. A glass substrate 1 having a transparent electrode (not shown) formed on the surface thereof is opposed to each other so that the transparent electrode sides face each other, and a gap is maintained between the substrates 1 and 1 by a sealing material 5 containing a sealing spacer 4. Sealed to. A liquid crystal material is sealed as an electro-optical material 3 between the substrates. A polarizing plate (not shown) is disposed on both outer sides of the substrate pair 1 and 1, and an alignment film (not shown) is disposed on a surface in contact with the electro-optic material. A TN (twisted nematic) type liquid crystal is provided. An element is formed.

A gap spacer 2 (micropearl manufactured by Sekisui Chemical Co., Ltd.) having an outer diameter of about 5 μm is arranged between the substrates. However, the arrangement density is not uniform. And a low-density arrangement portion 15. Here, regarding the arrangement of the gap spacer high-density arrangement section 13 and the gap spacer low-density arrangement section 15, the optimal arrangement distribution was derived in advance by simulation and followed. Here, the gap spacer distribution density at the cross section of the arrow in FIG.
The average is about 100 pieces / mm ² , and the maximum is 1 in the gap spacer high-density arrangement portion 13 (13A in FIG. 1C).
50 pieces / mm ² , gap spacer low density arrangement part 15
(15A in FIG. 1C) is 50 particles / mm ² at the minimum, and the distribution width is significantly wider than in the conventional case.

When the gap between the substrates having such a configuration was measured by a gap tester, the gap between the substrates was within a range of 5 ± 0.05 μm, and the gap between the substrates was more uniform than when the conventional gap spacers were uniformly arranged. Therefore, a liquid crystal element having good display quality was obtained.

Next, a method of arranging the gap spacers of this embodiment will be described with reference to the schematic sectional view shown in FIG. The sealed container 31 is provided with a high-pressure fluid introduction part 33 for sending a high-pressure fluid. Here, a gas such as dry air or dry nitrogen is suitable as the fluid, and the pressure is 0.5
２2 kg / cm ² is suitable, but volatile liquids can also be used. The closed container 31 includes a movable valve 41 and a fixed valve 43 whose operations are controlled by a magnet 37 and a coil 39. The movable valve 41 and the fixed valve 43 control the flow of the high-pressure fluid from the high-pressure chamber 45 to the gap spacer holding chamber 47. I can do it. In this embodiment, the coil 39 is fixed to the movable valve 41,
Although the positions of the magnet 37 and the coil 39 may be reversed, the movable valve 41 should preferably have a light structure because the movable valve 41 must operate accurately and at high speed. The movable valve 4
As a method for accurately controlling 1 at high speed, a piezoelectric element can be used instead of using the magnet 37 and the coil 39.

In the gap spacer holding chamber 47, the gap spacers 2b distributed between the substrates are held. If the high-pressure fluid is not allowed to flow into the gap spacer holding chamber 47 in this state, the gap spacer 2b is settled at the bottom of the gap spacer holding chamber 47.
When a high-pressure fluid is caused to flow into the gap spacer 7 for a short time, the gap spacer 2a rises into the gap spacer holding chamber 47, and is simultaneously blown out from the discharge portion 35 having an inner diameter of about 100 μm onto the surface of the substrate 1. By moving the substrate 1 (moving to the left in FIG. 4) while spraying the gap spacer 2 on the surface of the substrate 1, the gap spacer 2 can be spread over the entire surface of the substrate 1.

The relationship between the high-pressure fluid ejection time for ejecting the high-pressure fluid in a pulsed manner and the discharge amount of the gap spacer 2 is as shown in FIG. 5, and the discharge amount of the gap spacer 2 depends on the high-pressure fluid ejection time. Does not depend on the pressure of the high-pressure fluid. The total application rate of gap spacer 2 were Tsu Oh controllable by the pulse number of the high pressure fluid jetting. That is, it is possible to control the amount of spraying by changing the number of high pressure fluid ejection pulses to a predetermined location. FIG. 6 shows the relationship between the distance D from the tip of the discharge unit 35 to the surface of the substrate 1 and the range in which the gap spacer 2 is sprayed when the pressure of the high-pressure fluid is about 1 kg / cm ² . From this, when the distance D is 10 mm ² and the pressure of the high-pressure fluid is 1 kg / cm ² , the gap spacer height is about eight times for an average arrangement density of about 100 pieces / mm ^2. It can be seen that it is possible to provide a density distribution in the gap spacer arrangement of the present embodiment by spraying about 12 times in the density arrangement section 13 and about 4 times in the gap spacer low-density arrangement section 15.

In this way, a pair of substrates using the substrate 1 provided with the density distribution in the gap spacer arrangement was opposed to each other, and the substrate pairs were bonded under pressure to form a liquid crystal element.

In the present embodiment, the control of the high pressure fluid
Although the valve mechanism using the coil 7 and the coil 39 was used, the present invention is not limited to this, and the effect of the present invention can be obtained with any type as long as opening and closing operations can be performed accurately and in a short time. Needless to say.

For example, it is possible to discharge a fixed amount of the gap spacer 2 in a constant amount even with a mechanism as shown in FIG. In FIG. 18, reference numeral 48 denotes a fixed valve, and reference numeral 49 denotes a movable valve made of a spring material. In the gap spacer holding chamber 47, the gap spacers 2 distributed between the substrates are held. In this state, if the high-pressure fluid is allowed to flow into the gap spacer holding chamber 47 without allowing it to flow, there is a slight gap between the fixed valve 48 and the movable valve 49. Although settled at the bottom, when high-pressure fluid is continuously introduced into the high-pressure chamber 45, the high-pressure fluid flows into the gap spacer holding chamber 47 from the gap between the movable valve 49 and the fixed valve 48, and the gap spacer 2 The ink flows up into the spacer holding chamber 47 and is simultaneously blown out from the ejection portion 35 having an inner diameter of about 100 μm onto the surface of the substrate 1.

At this time, since the high-pressure fluid passes through the gap between the movable valve 49 and the fixed valve 48, the movable valve 49 is attracted to the fixed valve 48 by a phenomenon known as Bernoulli's theorem. The gap between the valve 49 and the fixed valve 48 is narrowed, so that the inflow of the high-pressure fluid is prevented, and the discharge of the gap spacer 2 is stopped. When the inflow of the high-pressure fluid is hindered, the force that has attracted the movable valve 49 to the fixed valve 48 is reduced, and the gap between the movable valve 49 and the fixed valve 48 is widened again. The movable valve 49 is attracted to the fixed valve 48 at the same time when the gap spacer 2 is discharged. As described above, even when the movable valve 49, which is a spring material, vibrates self-excitedly and continuously introduces high-pressure fluid, the gap spacer 2 is intermittently discharged and moves the substrate 1 so that the entire surface of the substrate 1 is moved. The gap spacers 2 can be scattered. In this configuration, the discharge amount can be controlled by the pressure of the high-pressure fluid and the spring pressure of the movable valve.

In this embodiment, in order to provide a density distribution in the gap spacer arrangement, a high-pressure discharge type manufacturing apparatus is used. However, similar effects can be obtained as long as the same arrangement density distribution can be obtained. As an example, the adsorption system shown in FIG. 7 and the sieve system shown in FIG. 9 are effective. The suction method will be described with reference to the schematic sectional view shown in FIG. One of the pressure adjusting chambers 53 of the suction plate 51 in which the suction holes 55 are formed at a predetermined distribution density is set in a reduced pressure state, and the gap spacers 2 are sucked into the suction holes 55.

A method of sucking the gap spacer 2 into the suction hole 55 will be described with reference to FIG. The gap spacer 2 is left in the gap spacer butt 57. In this state, the suction plate 51 is made to face the gap spacer butt 57 (FIG. 8A). In this state, while reducing the pressure in the pressure control chamber 53, an excitation signal is applied from a power supply 59 to the vibrator 58 that is in close contact with the gap spacer butt 57,
Vibrates. Thereby, the gap spacer butt 5
The gap spacers 2 in 7 float and are sucked into the suction holes 55 of the suction plate 51 (FIG. 8B). By maintaining this state, the gap spacer 2 can be sucked into all the suction holes 55 (FIG. 8C).

It is also effective to use the high-pressure discharge method as shown in FIG. The gap spacer 2 is allowed to stand still in the gap spacer placement device 73, and the suction plate 5
1 is opposed to the gap spacer arrangement device 73. In this state, when the high-pressure gas is introduced into the gap spacer arrangement device 73 while depressurizing the pressure adjustment chamber 53, the gap spacer 2 in the gap spacer arrangement device is ejected from the ejection portion 35, and the suction hole of the suction plate 51 is sucked. 55 (FIG. 17 (A)). By maintaining this state, the gap spacer 2 can be sucked into all the suction holes 55 (FIG. 17B).

The suction plate 51 is opposed to a predetermined position of the substrate 1 in a state where the gap spacer 2 is sucked in the suction hole 55 in this manner. After that, when the inside of the pressure adjusting chamber 53 is made equal to or slightly pressurized to the external pressure, the suction state of the gap spacer 2 sucked in the suction hole 55 is released,
Drops and adheres to a predetermined surface of the substrate 1 arranged opposite to the substrate. By repeating this, the gap spacer 2 can be arranged on the entire surface of the substrate 1. here,
If necessary, the suction plates 5 having different formation densities of the suction holes 55 can be used.
By using 1, the gap spacers 2 can be adsorbed at different densities, and the gap spacers 2 can be arranged on the surface of the substrate 1 at different densities. That is, the suction plate 51 having the suction holes 55 of about 100 / mm ² is used at the position of the average arrangement, and the suction plate 51 of about 150 / mm ² is used in the high-density arrangement section 13. Adsorption plates 51 of about 50 pieces / mm ² are used for the density arrangement section 15. It was confirmed that the liquid crystal element shown in FIG. 1 can be manufactured by the method using the present apparatus.

Next, the sieving method will be described with reference to the schematic sectional view shown in FIG. A large number of gap spacers 2 are arranged above the sieve 61 having a hole diameter of about 1.5 times the outer diameter of the gap spacer 2 to be used and having a predetermined density of the drop holes 65 (FIG. 9A). Thereafter, the squeegee 63 is moved to rub the gap spacer 2 on the sieve 61 into the drop hole 65 (FIG. 9B). Here, the gap spacer 2 does not fall and is held in the fall hole 65. Although the details are unknown, it is preferable that the squeegee 63 is charged because the gap spacer 2 is held in the drop hole 65 without excess or shortage, so that the gap spacer 2 has a fine outer diameter of 5 μm. Therefore, it is considered that static electricity generated during the rubbing operation is retained on the surface of the sieve. In this state, the sieve 61 is opposed to a predetermined position on the substrate 1 (FIG. 9).
(C)). Thereafter, by applying a shock or vibration to the sieve 61, or removing generated static electricity or charging a predetermined charge, the suction state of the gap spacer 2 that has been sucked in the drop hole 65 is released, and Drops and adheres to a predetermined surface of the substrate 1 placed. By repeating this, the gap spacer 2 is formed over the entire surface of the substrate 1.
Can be arranged.

Here, if necessary, the gap spacers 2 can be adsorbed at different densities by using the sieves 61 having different formation densities of the drop holes 65, and the gap spacers 2 can be adsorbed at different densities on the surface of the substrate 1. Can be arranged. In other words, the position of the average arrangement using a sieve 61 fall hole 65 is about 100 / mm ^2, the high-density arrangement unit 13 a screen 61 is about 150 / mm ^2, further low-density arrangement The part 15 has a sieve 6 of about 50 pieces / mm ^2.
Use 1. It has been confirmed that the liquid crystal device shown in FIG. 1 can be manufactured by this method.

In this embodiment, a high-pressure discharge system, an adsorption system or a sieve system is used to dispose the gap spacers 2 as described above. According to this method, conventionally, only a few% of the gap spacers can be arranged on the substrate, and the utilization efficiency of the material is extremely low, which causes a cost increase. Since they can be arranged, the utilization efficiency of the gap spacers 2 is remarkably improved to about 90%.

The present embodiment relates to a TN type liquid crystal element. However, unless the distance between substrates such as a TFT driven liquid crystal element / STN (super twisted nematic) type liquid crystal element and a ferroelectric liquid crystal type liquid crystal element is strictly controlled. This embodiment can be applied to an electro-optical element that does not need to be operated, and the same operation and effect can be obtained.

(Embodiment 2) A schematic plan view of this embodiment is shown in FIG.
(A). FIG. 2B is a schematic cross-sectional view of an arrow portion in FIG. This embodiment is different from the first embodiment in that the gap spacers 2 are arranged at about 150 pieces / mm ² in the high-density arrangement section 13 in the central portion of the substrate and in the low-density arrangement section 15 in the vicinity of the sealing material. The point is 50 / mm ² . As shown in FIG. 2C, the gap spacer distribution density at the arrow portion in FIG. 2A is about 150 / m in the gap spacer high-density arrangement portion 13 (13A in FIG. 2C).
m ² , gap spacer low density arrangement portion 15 (FIG. 2C)
In 15A), the number was about 50 pieces / mm ² .

By doing so, the phenomenon in which the substrate spacing near the center of the substrate pair has been widened in the past has been completely suppressed, and when the substrate spacing was measured with a gap tester, the substrate spacing was 5 ± 0. The liquid crystal element was in the range of 05 μm, and the liquid crystal element was more uniform in the substrate spacing than in the case where the conventional gap spacers were uniformly arranged, and thus had good display quality. This effect is obtained when the distribution density of the gap spacers 2 in the gap spacer low-density arrangement portion 15 is 75 pieces / m.
m ² or less. Further, the method of arranging the gap spacers 2 of this embodiment uses a high-pressure discharge type manufacturing apparatus as in the case of the first embodiment.
It can also be placed in a sieve scheme shown in FIG.

(Embodiment 3) A schematic plan view of this embodiment is shown in FIG.
(A). FIG. 3B is a schematic cross-sectional view of an arrow part in FIG. This embodiment differs from the second embodiment in that the gap spacers 2 are arranged such that a low-density arrangement portion 15 exists near the center of a high-density arrangement portion 13 in the center of the substrate. As shown in FIG. 3C, the gap spacer distribution density at the arrow portion in FIG. 3A is about 150 in the gap spacer high-density arrangement portion 13 (13A in FIG. 3C).
Pieces / mm ² , gap spacer low-density arrangement portion 15 (FIG. 3
In 15A) of (C), the number was about 50 pieces / mm ² .

By doing so, the phenomenon in which the distance between the pair of substrates is conventionally changed in a complicated manner is completely suppressed. When the distance between the substrates is measured with a gap tester, the distance between the substrates is in the range of 5 ± 0.05 μm. The gap between the substrates is more uniform than when the conventional gap spacers are evenly arranged.
Therefore, a liquid crystal element having good display quality was obtained. The method of arranging the gap spacer 3 of the present embodiment is the same as that of the first embodiment.
Similar to, but using the manufacturing apparatus of high pressure ejection method, adsorption method shown similarly in FIG. 7, it is also positionable in a sieve scheme shown in FIG.

(Embodiment 4) In Embodiments 1 to 3, the distribution of the arrangement density of the gap spacers (which part is arranged at a high density and which part is arranged at a low density) depends on simulation results. The distribution of the same arrangement density was the same under the same part conditions and working conditions. On the other hand, in the present embodiment, the deformation of the warp and the surface of the substrate to be used is measured, the optimal gap spacer arrangement density distribution is calculated, and the gap spacers are arranged. FIG. 10 shows a configuration example of a manufacturing apparatus used in this embodiment. The substrate is introduced from the substrate loading section. The substrate loading section is not special, but may be a known one. Then, the surface shape of the substrate is measured by the displacement measuring device 71 in the surface shape measuring unit. For the measurement, a laser displacement meter (for example, LD2500 manufactured by KEYENCE CORPORATION) suitable for non-contact measurement is suitable.
When measuring the displacement of each part of the substrate, it is suitable to measure while moving the substrate 1 under a plurality of (three in FIG. 11) displacement measuring devices 71 as shown in FIG. FIG. 11A is a schematic side view of the measurement system, and FIG.
Shows a schematic plan view.

Based on this measurement result, when the gap spacer arrangement calculation unit arranges the gap spacers uniformly, the gap between the substrate pairs is likely to be narrow, and the gap between the substrate pairs is likely to be large. Appropriate distribution of gap spacers is calculated so that the portions have low density and the spacing between substrates is constant. This calculation is performed based on the dimensional relationship, thermal and mechanical properties of the materials used, the results of preliminary experiments and simulations. According to the calculation result, the gap spacer placement device 7
3, the gap spacer is arranged on the substrate surface at the optimum density at the gap spacer arrangement portion. As the gap spacer arrangement device used here, the high-pressure discharge type manufacturing device shown in FIG. 4, the suction type manufacturing device shown in FIG.
Are suitable. A seal material containing the seal spacer is formed at a predetermined position of the substrate on which the gap spacer is formed on the surface at the seal forming portion, and is bonded to the opposing substrate at the pressure bonding portion. The seal forming method and the pressure bonding method used here are not special, but are well known.

The pair of substrates bonded in this manner is carried out of the substrate carry-out portion and proceeds to a post-process such as inspection. In this way, the substrate interval, which has been complicatedly changed due to the warpage and surface deformation of the substrate, is completely suppressed. When the substrate interval is measured with a gap tester, the substrate interval is 5.
The liquid crystal element was in the range of ± 0.05 μm, and a liquid crystal element having a more uniform substrate spacing than the conventional case where the gap spacers were uniformly arranged, and thus having a good display quality was obtained.

This embodiment will be described more clearly with reference to FIG. Even if the substrate 1 is deformed as shown in FIG. 12A, the deformation of the substrate can be measured and grasped by the surface shape measuring section before the gap spacer is arranged. Based on this measurement result, as shown in FIG. 12 (B), by providing the gap spacer high-density arrangement section 13 and the gap spacer low-density arrangement section 15, when the substrate pair is bonded under pressure, the distance between the substrates is reduced. It is possible to make it uniform. By using this embodiment, even a warped or deformed one that has been conventionally excluded as a nonstandard board can be used as a normal part, and the specifications for the board can be loosened. Cost reduction becomes possible.

(Embodiment 5) This embodiment is different from the above-described embodiment 1 in a portion where a pair of substrates is bonded under pressure. Example 1
In this example, the pressing was performed with a uniform force over the entire surface of the substrate. In this example, when the substrate was pressed, the substrate was pressed and bonded using a manufacturing apparatus capable of pressing the substrate with the surface distribution shown in FIG. . In FIG. 13, reference numeral 21 denotes a pressing plate, reference numeral 23 denotes a distributed pressing plate, the pressing plate 21 presses the entire surface of the substrate, and the distributed pressing plate 23 is composed of a large number of piezoelectric elements. Can be independently controlled, and can be partially or strongly pressurized according to a predetermined portion of the substrate 1.

According to this method, the distance between the substrates, which has been complicatedly changed due to warpage and deformation of the surface of the substrate, is completely suppressed. When the distance between the substrates is measured by a gap tester, the distance between the substrates is 5 ± 0.03 μm. Thus, a liquid crystal element having a much more uniform spacing between the substrates and thus a higher display quality than that obtained when a conventional substrate is uniformly pressed was obtained. Further, if the pressure bonding method of this embodiment is applied to the fourth embodiment, it is more effective.

[0052]

According to the method of manufacturing an electro-optical element according to the present invention, the gap spacer disposed between the substrates is
Since they are properly arranged with light and shade,
Variations in the substrate-to-substrate spacing caused by surface deformation and distortion of the substrate caused when the sealing material containing the seal spacers cures are corrected, realizing an electro-optic element with a uniform display gap and excellent display quality. It is possible to do. Further, it is possible to relax the standard of the substrate, and it is possible to reduce the cost. Further, since the quality is stable, the production yield is improved. Apparatus for manufacturing an electro-optical element according to the present invention
According to the method for manufacturing an electro-optical element according to the present invention,
It is possible to implement it reliably.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a structure of an electro-optical element described in Example 1.

FIG. 2 is a diagram illustrating a structure of an electro-optical element according to a second embodiment.

FIG. 3 is a diagram illustrating the structure of an electro-optical element according to a third embodiment.

FIG. 4 is a view for explaining a method of arranging the density of the gap spacer by the high-pressure discharge method described in the first embodiment.

FIG. 5 is a diagram illustrating a relationship between a high-pressure fluid ejection time and a gap spacer ejection amount.

FIG. 6 is a diagram showing the relationship between the height of the tip of the discharge unit and the range of spraying the gap spacer.

FIG. 7 is a view for explaining a method of arranging the density of the gap spacer by the adsorption method described in Example 1.

FIG. 8 is a view for explaining a method of adsorbing a gap spacer.

FIG. 9 is a view for explaining a method of arranging the density of the gap spacer by the sieving method described in Example 1.

FIG. 10 is a diagram illustrating a configuration example of a manufacturing apparatus according to a fourth embodiment.

FIG. 11 is a view for explaining an arrangement of a displacement measuring device according to a fourth embodiment.

FIG. 12 is a diagram illustrating a fourth embodiment.

FIG. 13 is a view for explaining a manufacturing apparatus capable of pressing a substrate with a surface distribution as described in Example 5;

FIG. 14 illustrates a structure of a conventional electro-optical element.

FIG. 15 is a diagram illustrating a conventional method for manufacturing an electro-optical element.

FIG. 16 is a view for explaining a conventional method of dispersing a gap spacer of an electro-optical element.

FIG. 17 is a view for explaining a method of adsorbing a gap spacer.

FIG. 18 is a view for explaining a method of arranging the density of the gap spacer by the high-pressure discharge method described in the first embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Gap spacer 3 Electro-optical material 4 Seal spacer 5 Seal material 6 Electro-optical element 11 Near seal material 13 Gap spacer high density arrangement part 15 Gap spacer low density arrangement part 17 Gap spacer average density arrangement part 21 Pressure plate 23 Distribution Platen 31 Closed container 33 High pressure fluid introduction part 35 Discharge part 37 Magnet 39 Coil 41 Movable valve 43 Fixed valve 45 High pressure chamber 47 Gap spacer holding chamber 51 Suction plate 53 Pressure control chamber 55 Suction hole 57 Gap spacer butt 58 Vibrator 59 Power supply 61 Sieve 63 squeegee 65 drop hole 71 displacement measuring device 73 gap spacer placement device

Continued on the front page (72) Inventor Masahiro Mori 1-7 Yukitani Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd. (72) Inventor Masami Igarashi 1-7 Yukitani-Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd. In-house examiner Yoshiyuki Fujioka (56) References JP-A-62-134626 (JP, A) JP-A-1-289915 (JP, A) JP-A-2-139518 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G02F 1/1339 500

Claims (5)

(57) [Claims] 1. A gap spacer is sandwiched between a pair of opposed substrate pairs, an electro-optical material is filled between the pair of substrates, and the periphery of the pair of substrates is a seal containing a seal spacer. manufacturing an electro-optical element sealed with the wood
In the method , the gap spacer is intermittently moved from the discharge portion.
Discharge and gap
Move the discharge unit on the substrate while controlling the amount of spacers sprayed.
And a gap spacer near the sealing material of the substrate.
The high density arrangement part, the center part is the gap spacer low density
A step of forming an arrangement portion, and a step of pressure-bonding the substrate pair
The production of an electro-optical element characterized by having at least
Construction method. 2. A gap between a pair of opposed substrates.
A pacer is sandwiched, and an electro-optic
The material is filled, and the area around the pair of substrates is sealed
Of an electro-optical element sealed with a sealing material containing
The gap spacer on the suction plate
Provide suction holes with a distribution density corresponding to the
The step of sucking the pacer and the suction plate facing the substrate
A cap spacer is attached to the substrate from the suction hole, and
High-density placement of gap spacers near the seal material of the plate
Part, the center part is the gap spacer low density arrangement part
And a step of pressure bonding the pair of substrates.
A method for manufacturing an electro-optical element, comprising: 3. The method according to claim 1, wherein when the substrate pair is bonded under pressure, the substrate surface is bonded to the substrate.
It is characterized by having a strong and weak surface distribution and pressurizing
A method for manufacturing an electro-optical element according to claim 1. 4. Deformation of warpage and surface of a substrate constituting a substrate pair.
Combining the means to measure the shape and each substrate
In such a way that the spacing between the substrate pairs
Means for calculating proper distribution of gap spacers and gap
Means for arranging spacers in the calculated predetermined distribution
And means for pressing the substrate pair and bonding them to each other are reduced.
An apparatus for manufacturing an electro-optical element, comprising: 5. An apparatus for manufacturing an electro-optical element according to claim 4.
In the means for pressing and bonding the substrate pair to each other,
Features that have means to pressurize the substrate with distribution
Manufacturing apparatus for an electro-optical element.