JP3170554U - Circuit board inspection jig - Google Patents
Circuit board inspection jig Download PDFInfo
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- JP3170554U JP3170554U JP2011003935U JP2011003935U JP3170554U JP 3170554 U JP3170554 U JP 3170554U JP 2011003935 U JP2011003935 U JP 2011003935U JP 2011003935 U JP2011003935 U JP 2011003935U JP 3170554 U JP3170554 U JP 3170554U
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Abstract
【課題】各接触ユニットの体積を増加し、構造強度を高め、使用寿命を延長することができる回路板検査治具の提供。【解決手段】座体と、座体に設置され、相互に重ね合わされた第１密度板、第２密度板、第３密度板を含む密度板モジュールと、第２密度板と第３密度板の間に設置された規制薄膜と、密度板モジュール上に設置されたピンボードモジュールを含み、ピンボードモジュールが、第３密度板上に設置された板体と、第２密度板中にそれぞれ設置された接触ユニットと、各接触ユニット底面にそれぞれ接続され、かつ第１密度板から出て延伸された導線と、各接触ユニット上端に可動的に設置され、かつ規制薄膜により位置が規制される付勢ピンと、各付勢ピンにそれぞれ当接され、かつ板体上に設置されたプローブを含む回路板検査治具である。【選択図】図７A circuit board inspection jig capable of increasing the volume of each contact unit, increasing the structural strength, and extending the service life. A seat body, a density plate module including a first density plate, a second density plate, and a third density plate installed on the seat body and overlapped with each other, and a gap between the second density plate and the third density plate. Including a regulated thin film installed and a pinboard module installed on the density plate module, the pinboard module being installed on the third density plate, and the contacts installed in the second density plate, respectively A unit, a conductive wire connected to the bottom surface of each contact unit and extended from the first density plate, a biasing pin that is movably installed at the upper end of each contact unit and whose position is regulated by a regulation thin film; It is a circuit board inspection jig including a probe that is in contact with each urging pin and installed on a plate. [Selection] Figure 7
Description
本考案は、回路板検査治具に関し、特に、各接触ユニットの体積を増加し、構造強度を高め、使用寿命を延長する効果を備えた回路板検査治具に関する。 The present invention relates to a circuit board inspection jig, and more particularly, to a circuit board inspection jig having the effects of increasing the volume of each contact unit, increasing the structural strength, and extending the service life.
一般的な従来の回路板検査治具（図１、図２、及び図３参照）は、主に座体６、密度板モジュール７、ピンボード８、接触ユニット９を含んで構成される。前記座体６上には複数の各測試計器プラグの接続に供する検査ソケット６２が設けられ、各検査ソケット６２には導線６１が接続され、前記ピンボード８は被検査回路板５の回路上の検査対象点に基づいて複数の上下方向に貫通されたプローブ８１を有する。前記密度板モジュール７は、第１密度板７１、第２密度板７２、第３密度板７３、及び規制薄膜７４を含んで構成される。そのうち、前記規制薄膜７４は、第２密度板７２と第３密度板７３の間に設置され、かつ前記第１密度板７１、第２密度板７２、及び第３密度板７３上に複数の相互に連通された孔部７１１、７２１、及び７３１が設けられ、かつ各第２密度板７２と第３密度板７３の孔部７２１、７３１内にそれぞれ接触ユニット９が収容される。各接触ユニット９は、プランジャ９１、プランジャ９１内に設置されたスプリング９２を備えている。前記スプリング９２とプローブ８１の間に付勢ピン９３が設置され、各導線６１が各プランジャ９１底部にそれぞれ接続され、各プランジャ９１が前記規制薄膜７４に穿刺された後、その頚部が規制薄膜７４によって位置規制される。これにより、前記被検査回路板５がプローブ８１、スプリング９２、導線６１、検査ソケット６２を介して外部の検査機器と電気的に接続される。 A general conventional circuit board inspection jig (see FIGS. 1, 2, and 3) mainly includes a seat body 6, a density board module 7, a pin board 8, and a contact unit 9. A test socket 62 for connecting a plurality of test instrument plugs is provided on the seat body 6, a lead wire 61 is connected to each test socket 62, and the pin board 8 is on the circuit of the circuit board 5 to be tested. It has a plurality of probes 81 penetrating in the vertical direction based on the inspection target point. The density plate module 7 includes a first density plate 71, a second density plate 72, a third density plate 73, and a regulation thin film 74. Among them, the regulation thin film 74 is installed between the second density plate 72 and the third density plate 73, and a plurality of mutual ones on the first density plate 71, the second density plate 72, and the third density plate 73. Are provided with holes 711, 721, and 731, and the contact units 9 are accommodated in the holes 721, 731 of the second density plate 72 and the third density plate 73, respectively. Each contact unit 9 includes a plunger 91 and a spring 92 installed in the plunger 91. An urging pin 93 is installed between the spring 92 and the probe 81, each conductor 61 is connected to the bottom of each plunger 91, and each plunger 91 is punctured into the regulation thin film 74, and then the neck is the regulation thin film 74. The position is regulated by. Thereby, the circuit board 5 to be inspected is electrically connected to an external inspection device via the probe 81, the spring 92, the conducting wire 61, and the inspection socket 62.
しかしながら、各接触ユニット９は設置時に、プランジャ９１の頚部が規制薄膜７４によって位置規制され、各接触ユニット９が規制薄膜７４の規制を受けるため、その体積を増加させることができず、各接触ユニット９の体積が比較的細小となっており、全体の構造強度が比較的弱く、その使用寿命に影響する。 However, when each contact unit 9 is installed, the position of the neck portion of the plunger 91 is restricted by the restriction thin film 74, and each contact unit 9 is restricted by the restriction thin film 74. Therefore, the volume of each contact unit 9 cannot be increased. The volume of 9 is relatively small, and the overall structural strength is relatively weak, affecting its service life.
このため、本考案は、各接触ユニットの体積を増加し、構造強度を高め、使用寿命を延長することができる回路板検査治具を開示するものである。 Therefore, the present invention discloses a circuit board inspection jig that can increase the volume of each contact unit, increase the structural strength, and extend the service life.
上述の従来の回路板検査治具の欠点に鑑みて、考案者は、その不完全な点について研究を重ね、関連産業に従事した長年の経験の蓄積に基づき、回路板検査治具の改良の開発に至ったものであり、各接触ユニットの体積を増加し、構造強度を高め、使用寿命を延長するという目的を達成する。 In light of the shortcomings of the conventional circuit board inspection jig described above, the inventor conducted research on the imperfection, and based on the accumulation of years of experience working in related industries, improved the circuit board inspection jig. It has been developed and achieves the purpose of increasing the volume of each contact unit, increasing the structural strength, and extending the service life.
本考案の主な目的は、各接触ユニットを第２密度板中に設置し、かつ各付勢ピンを規制薄膜で位置規制することにより、各接触ユニットの体積を増加し、構造強度を高め、使用寿命を延長することができる回路板検査治具を提供するところにある。 The main purpose of the present invention is to install each contact unit in the second density plate and position-regulate each urging pin with a regulating thin film, thereby increasing the volume of each contact unit, increasing the structural strength, A circuit board inspection jig capable of extending the service life is provided.
上述の目的を達するため、本考案の回路板検査治具は、座体と、座体の一側に設置され、相互に重ね合わされた第１密度板、第２密度板、及び第３密度板を含む密度板モジュールと、第２密度板と第３密度板の間に設置された規制薄膜と、密度板モジュール上に設置されたピンボードモジュールを含み、前記ピンボードモジュールが、第３密度板上に設置された板体と、第２密度板中にそれぞれ設置された接触ユニットと、各接触ユニット底面にそれぞれ接続され、かつ第１密度板から出て延伸された導線と、各接触ユニット上端に可動的に設置され、かつ規制薄膜により位置が規制される付勢ピンと、各付勢ピンにそれぞれ当接され、かつ板体上に設置されたプローブを含む。 In order to achieve the above-mentioned object, a circuit board inspection jig according to the present invention includes a seat body, a first density plate, a second density plate, and a third density plate that are installed on one side of the seat body and overlapped with each other. A density board module including: a regulation thin film installed between the second density board and the third density board; and a pinboard module installed on the density board module, wherein the pinboard module is disposed on the third density board. The installed plate, the contact unit installed in the second density plate, the conductive wire connected to the bottom surface of each contact unit and extending from the first density plate, and movable to the upper end of each contact unit And an urging pin whose position is regulated by a regulating thin film, and a probe that is in contact with each urging pin and installed on a plate.
本考案の好適な一実施形態において、前記座体上に複数のソケットが設けられ、各ソケットがそれぞれ導線と接続される。 In a preferred embodiment of the present invention, a plurality of sockets are provided on the seat body, and each socket is connected to a conductor.
本考案の好適な一実施形態において、前記第１密度板、第２密度板、及び第３密度板上に複数の相互に対応する通孔が設けられ、各接触ユニットが第２密度板の各通孔中にそれぞれ設置され、各導線が第１密度板の各通孔から出てそれぞれ延伸され、各付勢ピンが第３密度板の各通孔中にそれぞれ設置され、かつ規制薄膜により位置が規制される。 In a preferred embodiment of the present invention, a plurality of mutually corresponding through holes are provided on the first density plate, the second density plate, and the third density plate, and each contact unit corresponds to each of the second density plates. Installed in the through-holes, each lead wire is extended from each through-hole in the first density plate, and each urging pin is installed in each through-hole in the third density plate, and is positioned by the regulation thin film. Is regulated.
本考案の好適な一実施形態において、前記各接触ユニットの下端は導線と接続され、かつ上端が付勢ピンと相互に係合される。 In a preferred embodiment of the present invention, the lower end of each contact unit is connected to a conductor, and the upper end is mutually engaged with a biasing pin.
本考案の回路板検査治具は、各接触ユニットを第２密度板中に設置し、かつ各付勢ピンを規制薄膜により位置規制することができ、これにより、各接触ユニットの体積を増加し、構造強度を高め、使用寿命を延長する効果を達成することができる。 In the circuit board inspection jig of the present invention, each contact unit can be installed in the second density plate, and the position of each urging pin can be regulated by the regulation thin film, thereby increasing the volume of each contact unit. The effect of increasing the structural strength and extending the service life can be achieved.
本考案の目的、特徴及び効果を十分に理解できるように、以下で具体的な実施例を挙げ、添付の図面を参照しながら、本考案について詳細に説明する。 In order that the purpose, features, and effects of the present invention can be fully understood, the present invention will be described in detail with reference to the accompanying drawings and specific examples.
図４は、本考案の回路板検査治具の一例を示す分解図、図５は、本考案の回路板検査治具の一例を示す立体図、図６は、本考案の回路板検査治具の一例を示す断面図、図７は、図６のＢ部分の部分拡大図をそれぞれ示す。これらの図に示すように、本考案の回路板検査治具は、座体１と、密度板モジュール２と、規制薄膜３と、ピンボードモジュール４とを含んで構成される。 4 is an exploded view showing an example of the circuit board inspection jig of the present invention, FIG. 5 is a three-dimensional view showing an example of the circuit board inspection jig of the present invention, and FIG. 6 is a circuit board inspection jig of the present invention. Sectional drawing which shows an example, FIG. 7: shows the elements on larger scale of the B section of FIG. As shown in these drawings, the circuit board inspection jig of the present invention includes a seat body 1, a density board module 2, a regulation thin film 3, and a pin board module 4.
前記座体１上には複数のソケット１１が設置される。 A plurality of sockets 11 are installed on the seat body 1.
前記密度板モジュール２は、座体１の一側に設置され、相互に重ね合わされた第１密度板２１、第２密度板２２、及び第３密度板２３を含み、前記第１密度板２１、第２密度板２２、及び第３密度板２３上に複数の相互に対応する通孔２１１、２２１、２３１が形成される。 The density plate module 2 includes a first density plate 21, a second density plate 22, and a third density plate 23 that are installed on one side of the seat body 1 and overlapped with each other, and the first density plate 21, A plurality of mutually corresponding through holes 211, 221, and 231 are formed on the second density plate 22 and the third density plate 23.
前記規制薄膜３は、第２密度板２２と第３密度板２３の間に設置される。 The regulation thin film 3 is installed between the second density plate 22 and the third density plate 23.
前記ピンボードモジュール４は、密度板モジュール２上に設置され、第３密度板２３上に設置された板体４１と、第２密度板２２中にそれぞれ設置された接触ユニット４２と、各接触ユニット４２底面にそれぞれ接続され、かつ第１密度板２１から出て延伸されて、各ソケット１１に接続された導線４３と、各接触ユニット４２上端にそれぞれ可動的に設置され、かつ規制薄膜３により位置が規制された付勢ピン４４と、各付勢ピン４４とそれぞれ当接され、かつ板体４１上に設置されたプローブ４５を含んで構成される。そのうち、各接触ユニット４２は第２密度板２２の各通孔２２１中にそれぞれ設置され、各導線４３は第１密度板２１の各通孔２１１から出てそれぞれ延伸され、各付勢ピン４４は第３密度板２３の各通孔２３１中にそれぞれ設置され、かつ規制薄膜３により位置規制され、かつ各接触ユニット４２の下端が導線４３と接続され、上端が付勢ピン４４と相互に係合される。 The pinboard module 4 is installed on the density plate module 2, a plate body 41 installed on the third density plate 23, a contact unit 42 installed in the second density plate 22, and each contact unit 42 are respectively connected to the bottom surface and extended out of the first density plate 21 and connected to the sockets 11 and are movably installed at the upper ends of the contact units 42, and are positioned by the regulation thin film 3. The urging pins 44 are regulated, and the urging pins 44 are in contact with the respective urging pins 44 and include a probe 45 installed on the plate 41. Among them, each contact unit 42 is installed in each through hole 221 of the second density plate 22, each lead wire 43 is extended from each through hole 211 of the first density plate 21, and each biasing pin 44 is It is installed in each through hole 231 of the third density plate 23 and is regulated by the regulating thin film 3, and the lower end of each contact unit 42 is connected to the conducting wire 43, and the upper end engages with the biasing pin 44. Is done.
本考案の使用時は、前記被検査回路板５をピンボードモジュール４の板体４１上に固定し、被検査回路板５上の検査対象点と各プローブ４５を接触させて、信号を各付勢ピン４４から各接触ユニット４２の導線４３を経由してソケット１１に接続された検査機器上（図示しない）に伝送し、１つの検査回路を形成することができる。本考案の各接触ユニット４２は、第２密度板２２中に設置されており、かつ各付勢ピン４４は規制薄膜３に穿刺された後位置規制されるため、各接触ユニット４２が規制薄膜３の規制を受けず、各接触ユニット４２の体積を増加することができ、各接触ユニット４２の構造強度を高め、使用寿命を延長する効果を奏することができる。 When the present invention is used, the circuit board 5 to be inspected is fixed on the plate body 41 of the pin board module 4, the point to be inspected on the circuit board 5 to be inspected and the probes 45 are brought into contact with each other. A single inspection circuit can be formed by transmitting from the force pin 44 to the inspection device (not shown) connected to the socket 11 via the lead wire 43 of each contact unit 42. Each contact unit 42 of the present invention is installed in the second density plate 22, and each urging pin 44 is regulated in position after being punctured by the regulation thin film 3. Therefore, the volume of each contact unit 42 can be increased, the structural strength of each contact unit 42 can be increased, and the service life can be extended.
上述のように、本考案は、新規性、進歩性、及び産業上の利用可能性という三要件を完全に満たしている。新規性と進歩性についてみると、本考案は各接触ユニットを第２密度板中に設置し、かつ各付勢ピンを規制薄膜で位置規制することで、各接触ユニットの体積を増加することができ、構造強度を高め、使用寿命を延長するという効果を奏することができる。産業上の利用可能性についてみると、本考案を利用して派生する製品は、充分に現在の市場ニーズを満たすことができる。 As described above, the present invention completely satisfies the three requirements of novelty, inventive step, and industrial applicability. In terms of novelty and inventive step, the present invention can increase the volume of each contact unit by installing each contact unit in the second density plate and restricting the position of each urging pin with a restriction thin film. This can increase the structural strength and extend the service life. In terms of industrial applicability, products derived using the present invention can fully meet current market needs.
６ 座体
６１ 導線
６２ 検査ソケット
７ 密度板モジュール
７１ 第１密度板
７１１、７２１、７３１ 孔部
７２ 第２密度板
７３ 第３密度板
７４ 規制薄膜
８ ピンボード
８１ プローブ
９ 接触ユニット
９１ プランジャ
９２ スプリング
９３ 付勢ピン
１ 座体
１１ ソケット
２ 密度板モジュール
２１ 第１密度板
２１１、２２１、２３１ 通孔
２２ 第２密度板
２３ 第３密度板
３ 規制薄膜
４ ピンボードモジュール
４１ 板体
４２ 接触ユニット
４３ 導線
４４ 付勢ピン
４５ プローブ
５ 被検査回路板
6 Seat body 61 Conductor 62 Inspection socket 7 Density board module 71 1st density board 711, 721, 731 Hole part 72 2nd density board 73 3rd density board 74 Restriction thin film 8 Pin board 81 Probe 9 Contact unit 91 Plunger 92 Spring 93 Energizing pin 1 Seat 11 Socket 2 Density board module 21 1st density board 211, 221, 231 Through hole 22 2nd density board 23 3rd density board 3 Regulating thin film 4 Pin board module 41 Board body 42 Contact unit 43 Conductor 44 Energizing pin 45 Probe 5 Circuit board to be inspected
Claims (4)
座体と、
前記座体の一側に設置され、相互に重ね合わされた第１密度板、第２密度板、及び第３密度板を含む密度板モジュールと、
前記第２密度板と第３密度板の間に設置された規制薄膜と、
前記密度板モジュール上に設置され、前記第３密度板上に設置された板体と、前記第２密度板中にそれぞれ設置された接触ユニットと、前記各接触ユニット底面にそれぞれ接続され、かつ前記第１密度板から出て延伸された導線と、前記各接触ユニットの上端に可動的に設置され、かつ前記規制薄膜により位置が規制される付勢ピンと、前記各付勢ピンとそれぞれ当接され、かつ前記板体上に設置されたプローブを含むピンボードモジュールと、
を有することを特徴とする回路板検査治具。 A circuit board inspection jig,
A sitting body,
A density plate module including a first density plate, a second density plate, and a third density plate installed on one side of the seat body and superposed on each other;
A regulating thin film installed between the second density plate and the third density plate;
Installed on the density plate module, connected to the plate body installed on the third density plate, the contact unit respectively installed in the second density plate, and the bottom surface of each contact unit; and A conductive wire extending out from the first density plate, an urging pin that is movably installed at the upper end of each contact unit and whose position is regulated by the regulating thin film, and abuts on each of the urging pins, And a pin board module including a probe installed on the plate,
A circuit board inspection jig characterized by comprising:
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99213187U TWM399575U (en) | 2010-07-09 | 2010-07-09 | Improved PC board testing jig |
| TW099213187 | 2010-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3170554U true JP3170554U (en) | 2011-09-22 |
Family
ID=45075954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011003935U Expired - Fee Related JP3170554U (en) | 2010-07-09 | 2011-07-08 | Circuit board inspection jig |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3170554U (en) |
| TW (1) | TWM399575U (en) |
-
2010
- 2010-07-09 TW TW99213187U patent/TWM399575U/en not_active IP Right Cessation
-
2011
- 2011-07-08 JP JP2011003935U patent/JP3170554U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWM399575U (en) | 2011-03-01 |
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