JP3164800B2 - Electronic component storage package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for an electronic component, such as a piezoelectric vibrator or a semiconductor element, which is hermetically accommodated in a package comprising an insulating base such as ceramics and a metal cover. It is about packages.

[0002]

2. Description of the Related Art Electronic components such as a piezoelectric vibrator and a semiconductor element are used by being housed in an electronic component housing package for hermetically housing these electronic components.

[0003] Among the electronic component storage packages for hermetically storing electronic components, the most reliable one is made of ceramics such as an aluminum oxide sintered body, and the electronic component is placed at the center of the upper surface. An insulating base having a mounting portion to be mounted and having a metallized wiring conductor extending to the outer surface from the mounting portion; and an iron-nickel alloy or iron-nickel brazed on the upper surface of the insulating base so as to surround the mounting portion. A metal frame for sealing made of a cobalt alloy and a metal lid made of an iron-nickel alloy or an iron-nickel-cobalt alloy directly joined to the metal frame by seam welding; Things.

In the case of this type of electronic component storage package, the electronic component is mounted on the mounting portion of the insulating base, the electrodes of the electronic component are electrically connected to the metallized wiring conductor, and then the sealing metal is formed. A metal lid is placed on the frame, and a pair of roller electrodes of a seam welding machine are rolled while being brought into contact with the outer peripheral edge of the metal lid. By directly seam-welding the frame and the metal lid, the electronic components are hermetically accommodated inside, thereby providing an electronic device as a product.

However, in this type of electronic component storage package, it is necessary to braze a metal frame for sealing as a base metal for seam welding a metal cover to an insulating base. The height of the electronic device is increased by the size of the body, and it has been difficult to respond to the recent demand for thinner electronic devices. In addition, there is a problem that the metal frame is expensive only.

In order to braze the metal frame to the insulating base, a frame-shaped metallized layer as a base metal for brazing is applied to the insulating base, and the metal frame is mounted on the frame-shaped metalized layer. Is brazed through a brazing material such as silver brazing.

Therefore, in order to solve the above-mentioned problems, a ceramic having a mounting portion for mounting an electronic component at the center of the upper surface and a frame-shaped metallization layer for sealing surrounding the mounting portion at the outer peripheral portion of the upper surface. After mounting the electronic component on the mounting portion of the insulating base, the metal cover is seam-welded to the frame-shaped metallized layer via a brazing material such as silver brazing. 2. Description of the Related Art There has been proposed an electronic component housing package in which an insulating base and a metal cover are joined to hermetically seal electronic components therein.

A metal lid is bonded to the sealing frame-shaped metallized layer by seam welding through a brazing material such as silver brazing to allow the electronic components to be hermetically accommodated therein. Since the package is formed by joining the frame-shaped metallized layer and the metal lid body by seam welding via a brazing material, it is not necessary to braze the metal frame body as a base metal for welding to the insulating base. The height can be reduced and it is inexpensive.

In the above-mentioned electronic component housing package, the insulating substrate is usually formed by a ceramic green sheet laminating method, and more specifically, a plurality of ceramic sheets which have been appropriately punched. Prepare the green sheets and print metallized wiring conductors and metal pastes to be the frame-shaped metallized layers on these ceramic green sheets by screen printing, and then laminate these ceramic green sheets and fire at high temperature. Produced by

[0010] Further, in order to facilitate the arrangement of the brazing material, it is general that the brazing material is previously applied to the entire lower surface of the metal lid to a predetermined thickness by a plating method, a rolling method, or the like.

[0011]

However, according to the electronic component housing package in which the metal lid is joined to the frame-shaped metallized layer of the insulating base by seam welding via a brazing material as described above, The frame-shaped metallized layer adhered to the upper surface of the insulating base is formed by printing and applying a metal paste in a predetermined frame shape by a screen printing method, and therefore, in the width direction due to the viscosity of the metal paste. In the cross-sectional shape, the central portion is likely to have a raised shape, or the inner peripheral edge and the outer peripheral edge are likely to have a raised shape, and the central region separated from the inner peripheral edge and the outer peripheral edge by 0.1 mm or more is the largest in the width direction. It has irregularities with a height of about 10 μm. The peripheral region within 0.1 mm from the inner or outer peripheral edge of the frame-shaped metallized layer generally has a shape in which the layer thickness decreases (the height decreases) toward the inner or outer peripheral edge, respectively. ing.

However, when a metal lid is placed on the frame-shaped metallized layer with a brazing material of a predetermined thickness interposed therebetween, and the frame-shaped metallized layer and the metal lid are seam-welded via the brazing material, There is a problem that the excess or deficiency of the brazing filler metal tends to occur depending on the shape and size of the unevenness in the central region of the frame-shaped metallized layer. Therefore, for example, when the frame-shaped metallization layer is extremely flat, the amount of brazing material becomes excessive, and the brazing material melted during seam welding scatters inside the package and adheres to the electronic components housed therein. There is a problem that the operation is easily hindered. On the other hand, when the unevenness of the frame-shaped metallized layer is large, the brazing material is insufficient, and the unevenness of the frame-shaped metallized layer cannot be sufficiently filled with the brazing material melted during seam welding. There is a problem that a large amount of voids are formed between the cover and the lid, and the airtight reliability of the package tends to be low. Therefore, as a result, there is a problem to be solved that the electronic components housed therein cannot be normally and stably operated.

The present invention has been devised in view of the above problems, and has as its object to attach a brazing material to an electronic component housed therein when seam welding a frame-shaped metallized layer and a metal lid. No air gaps are formed between the frame-shaped metallized layer and the metal lid, and the airtight reliability is high, and the electronic components housed therein can always operate normally and stably. An object of the present invention is to provide a package for storing electronic components.

[0014]

According to the present invention, there is provided a package for storing electronic components, wherein a mounting portion on which an electronic component is mounted on a top surface, and a frame-like metallization layer for sealing which is mounted so as to surround the mounting portion. An electronic component housing package comprising: an insulating base having: a metal cover body having a lower surface covered with a brazing material and joined to the frame-shaped metallization layer by seam welding via the brazing material. The thickness of the layer in the peripheral region within 0.1 mm from the inner peripheral edge and the outer peripheral edge becomes thinner toward the inner peripheral edge and the outer peripheral edge, respectively, and the unevenness in the width direction of the region away from the inner peripheral edge and the outer peripheral edge by 0.1 mm or more, respectively. The height is 5 μm or less,
In addition, the outer dimensions of the metal lid are smaller than the outer peripheral edge of the frame-shaped metallized layer, and the brazing material applied to the lid has a thickness of 10 mm.
3030 μm.

According to the electronic component housing package of the present invention, the frame-shaped metallized layer is 0.1 mm from the inner peripheral edge and the outer peripheral edge thereof.
Since the layer thickness of the peripheral region within 1 mm becomes thinner toward the inner peripheral edge and the outer peripheral edge, respectively, and the height of the unevenness in the width direction of the region 0.1 mm or more away from the inner peripheral edge and the outer peripheral edge is 5 μm or more, No large gap is formed between the frame-shaped metallized layer to be joined and the metal lid having an outer dimension smaller than the outer peripheral edge. Therefore, the frame-shaped metallized layer and the metal lid are soldered by seam welding. When joining via a material, the unevenness of the frame-shaped metallized layer can be satisfactorily filled with a brazing material having a thickness of 10 to 30 μm attached to the metal lid, and the two can be joined with high airtight reliability.

Since the thickness of the brazing material applied to the metal lid is 10 to 30 μm, the brazing material does not become excessive even when the frame-shaped metallized layer is extremely flat. Therefore, when the frame-shaped metallized layer and the metal lid are joined to each other via the brazing material by seam welding, the brazing material does not scatter inside the package and adhere to the internal electronic components.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electronic component storage package according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an embodiment of an electronic component storage package according to the present invention. In FIG. 1, reference numeral 1 denotes an insulating base, 2 denotes a metal cover, and 3 denotes an electronic component.
Then, an electronic component 3 such as a piezoelectric vibrator or a semiconductor element is placed inside a package including the insulating base 1 and the metal lid 2.
Is hermetically sealed to form an electronic device as a product.

The insulating substrate 1 is a support for supporting the electronic component 3 and is made of a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body. To form a concave portion A. The bottom surface of the recess A forms a mounting portion 1a for mounting the electronic component 3, and the electronic component 3 is mounted on the mounting portion 1a.

When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and a solvent are added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide. A ceramic green sheet is formed by adopting a well-known doctor blade method or a calendar roll method, and thereafter, a plurality of ceramic green sheets are subjected to appropriate punching and laminated, It is manufactured by firing at high temperature.

Further, a metallized wiring conductor 4 made of a sintered metal powder such as tungsten or molybdenum, which extends from the upper surface of the mounting portion 1a to the lower surface of the insulating substrate 1, is formed on the insulating substrate 1.

The metallized wiring conductor 4 functions as a conductive path for electrically leading each electrode of the electronic component 3 to the outside. Normally, the exposed surface of the metalized wiring conductor 4 is plated with nickel having a thickness of about 1 to 20 μm. And gold plating having a thickness of about 0.1 to 3.0 μm.

Electrodes of the electronic component 3 are electrically connected to the upper surface of the mounting portion 1a via, for example, a conductive adhesive, and the portion of the metallized wiring conductor 4 that extends to the lower surface of the insulating base 1 is connected to the outside. It is electrically connected to a wiring conductor of an electric circuit board (not shown) via, for example, solder.

If the metallized wiring conductor 4 is made of, for example, a tungsten powder sintered body, a tungsten paste obtained by adding and mixing an appropriate organic binder and a solvent to the tungsten powder is used as a ceramic green for the insulating substrate 1. By printing and applying a predetermined pattern on the sheet by a conventionally known screen printing method, and firing this together with a ceramic green sheet serving as the insulating substrate 1,
The mounting portion 1a of the insulating base 1 is formed in a predetermined pattern from the upper surface to the lower surface.

Further, a metal powder sintered body of tungsten, molybdenum or the like is formed on the outer peripheral portion of the upper surface of the insulating base 1,
A sealing metallization layer 5 having a width of about 0.4 mm and a thickness of about 10 to 50 μm is formed so as to surround the mounting portion 1a.

The frame-shaped metallized layer 5 functions as a base metal for bonding the metal cover 2 to the insulating base 1,
The layer thickness of the peripheral region within 0.1 mm from the inner peripheral edge and the outer peripheral edge is reduced toward the inner peripheral edge and the outer peripheral edge, respectively, and the layer thickness is 0.1 mm from the inner peripheral edge and the outer peripheral edge, respectively.
The height of the unevenness in the width direction of the central region separated by not less than mm is 5 μm or less. Usually, the exposed surface is plated with nickel having a thickness of about 1 to 20 μm and gold plating having a thickness of about 0.1 to 3.0 μm. 6 through seam welding.

Since the height of the unevenness in the width direction of the central portion of each of the frame-shaped metallized layers 5 which is 0.1 mm or more away from the inner peripheral edge and the outer peripheral edge is 5 μm or less, the outer dimensions are formed on the upper surface. When the metal lid 2 smaller than the outer peripheral edge of the frame-shaped metallized layer 5 is seam-welded via the brazing material 6, a large gap is not formed between the frame-shaped metallized layer 5 and the metal lid 2. . Therefore, the gap between the frame-shaped metallized layer 5 and the metal lid 2 can be satisfactorily filled with the brazing material 6 having a thickness of 10 to 30 μm adhered to the metal lid 2 as described later. This makes it possible to impart high airtight reliability to the package.

When the height of the irregularities in the width direction of the region 0.1 mm or more away from the inner peripheral edge and the outer peripheral edge of the frame-shaped metallized layer 5 exceeds 5 μm, the metal cover 2 is attached to the upper surface thereof by the brazing material. When seam welding through 6,
The thickness of the cover 2 attached to the lower surface of the cover 2 is 10 to 30 as described later.
There is a tendency that it is difficult to satisfactorily fill the gap between the frame-shaped metallized layer 5 and the metal lid 2 with the brazing material 6 of μm. Therefore, the height of the unevenness in the width direction of the region 0.1 mm or more away from the inner peripheral edge and the outer peripheral edge of the frame-shaped metallized layer 5 is specified to be 5 μm or less.

When the thickness of the nickel plating applied to the frame-shaped metallized layer 5 is 5 μm or more, when the metal lid 2 is joined to the frame-shaped metallized layer 5 via the brazing material 6 by seam welding. In addition, the thermal shock applied to the insulating substrate 1 by the heat of the seam welding can be favorably absorbed by the nickel plating, thereby effectively preventing the insulating substrate 1 from being cracked or cracked by the thermal shock. Therefore, it is desirable that the nickel plating applied to the frame-shaped metallized layer 5 has a thickness of preferably 5 μm or more, more preferably 8 μm or more.

When the frame-shaped metallized layer 5 is made of, for example, a tungsten powder sintered body, a tungsten paste obtained by adding an appropriate organic binder and solvent to the tungsten powder is mixed with a ceramic to be used as the insulating base 1. Conventionally, the screen printing method is applied on the green sheet in a predetermined thickness and a predetermined pattern by printing, and this is dried by a hot-air drier or an infrared drier to remove the solvent. Is pressed so as to be flat, and then fired together with a ceramic green sheet serving as the insulating substrate 1, so that the mounting portion 1a is surrounded on the upper surface of the insulating substrate 1 by 0.1 mm or more from the inner peripheral edge and the outer peripheral edge thereof. It is formed so that the height of the unevenness in the width direction of the separated region is 5 μm or less.

On the other hand, the metal lid 2 has a thickness of an iron-nickel alloy plate or an iron-nickel-cobalt alloy plate.
It is a flat plate having a thickness of about 0.1 mm and an outer dimension smaller than the outer peripheral edge of the frame-shaped metallized layer 5. ing. Then, the electronic component 3 is hermetically sealed with the insulating base 1 by being joined to the frame-shaped metallized layer 5 of the insulating base 1 through the brazing material 6 by seam welding.

The joining of the metal cover 2 and the frame-shaped metallized layer 5 of the insulating base 1 via the brazing material 6 is performed by connecting the metal cover 2 to the frame of the insulating base 1 as shown in a sectional view of FIG. The metal cover 2 is placed on the metallized layer 5 with a brazing material 6 interposed therebetween.
Rolling while contacting a pair of roller electrodes 20 of the seam welding machine to the outer peripheral edge of the seam welding machine, a large current for welding is passed between the roller electrodes 20, and a contact portion between the roller electrode 20 and the metal lid 2 is formed. Joule heat is generated, and this heat is transmitted to the lower surface side of the metal lid 2 to melt a part 6 a of the brazing material 6.

At this time, since the thickness of the brazing material 6 attached to the lower surface of the metal lid 2 is 10 to 30 μm, the metal lid 2 is seam-welded to the frame-shaped metallized layer 5 of the insulating base 1 via the brazing material 6. When joining, even if the frame-shaped metallized layer 5
Does not become excessive even when the surface is extremely flat, so that the molten brazing material 6a does not scatter inside the package and adhere to the electronic components 3 inside. In addition, even when the frame-shaped metallized layer 5 has irregularities, since the irregularities have a height of 5 μm or less, the irregularities can be satisfactorily filled with the brazing material 6 having a thickness of 10 to 30 μm. As a result, a package having high airtight reliability can be obtained.

If the thickness of the brazing material 6 attached to the lower surface of the metal lid 2 is less than 10 μm, the metal lid 2 is connected to the frame-shaped metallized layer 5 of the insulating base 1 via the brazing material 6. When joining by seam welding, the brazing material 6 lacks the brazing material 6 and melts irregularities having a height of 5 μm or less in a region 0.1 mm or more away from the inner peripheral edge and the outer peripheral edge of the frame-shaped metallized layer 5.
Therefore, there is a great danger that the package cannot be satisfactorily filled, and the hermetic reliability of the package becomes low. On the other hand, if the thickness exceeds 30 μm, the brazing material 6 becomes excessive and the brazing material 6a melted due to the excessive amount of There is a great danger that the electronic components will be scattered and hinder the function of the electronic components housed inside. Therefore, the thickness of the brazing material 6 attached to the lower surface of the metal lid 2 is specified in the range of 10 to 30 μm.

The metal lid 2 is made of an iron-nickel alloy sheet or an iron-nickel alloy sheet or an iron-nickel-cobalt alloy sheet by rolling a brazing material foil such as silver-copper solder on the lower surface of the iron-nickel-cobalt alloy sheet. Obtaining a composite metal plate having a brazing material having a thickness of 10 to 30 μm crimped on the lower surface of the cobalt alloy plate, and punching the composite metal plate with a punching die to form a brazing material 6 having a thickness of 10 to 30 μm on the lower surface;
Is manufactured in a predetermined shape to which is adhered.

Thus, according to the electronic component housing package of the present invention, the electronic component 3 is mounted on the mounting portion 1a of the insulating base 1, and the metal lid 2 is mounted on the metal frame layer 5 for sealing. 6 by means of seam welding, the molten brazing material 6a can satisfactorily fill the irregularities of the metallizing layer 5 for sealing, and does not scatter into the package. It is possible to provide an electronic component storage package that can always operate normally.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the present invention.

[0038]

According to the electronic component housing package of the present invention, the frame-shaped metallized layer is formed from the inner peripheral edge and the outer peripheral edge thereof.
Since the thickness of the layer in the peripheral region within 0.1 mm decreases toward the inner peripheral edge and the outer peripheral edge, respectively, and the height of the unevenness in the width direction of the region separated from the inner peripheral edge and the outer peripheral edge by 0.1 mm or more is 5 μm or more. Therefore, no large gap is formed between the frame-shaped metallized layer and the metal lid body whose outer dimensions are smaller than the outer peripheral edge.
When joining the frame-shaped metallized layer and the metal lid through a brazing material by seam welding, the thickness of the brazed material having a thickness of 10 to 30 μm adhered to the metal lid can improve the unevenness of the frame-shaped metallized layer. By burying, both can be joined with high airtight reliability.

Since the thickness of the brazing material applied to the metal lid is 10 to 30 μm, even if the frame-shaped metallized layer is extremely flat, the brazing material does not become excessive. Therefore, when joining the frame-shaped metallized layer and the metal lid through a brazing material by seam welding,
The brazing material does not scatter inside the package and adhere to the internal electronic components.

As a result, the hermetic sealing of the container is completed without impairing the function of the electronic components housed therein, and the electronic component housing can always operate normally and stably. Package can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of an electronic component storage package according to the present invention.

FIG. 2 is a cross-sectional view for explaining joining of the insulating base 1 and the metal lid 2 of the electronic component housing package shown in FIG. 1 by seam welding.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Mounting part 2 ... Metal cover 3 ... Electronic components 5 ... Frame-shaped metallized layer 6 ... Brazing material

Claims (1)

(57) [Claims] 1. An insulating base having a mounting portion on which an electronic component is mounted on an upper surface, a frame-like metallization layer for sealing applied so as to surround the mounting portion, and a brazing material on a lower surface. An electronic component storage package comprising: a metal lid joined to the frame-shaped metallized layer by seam welding via the brazing material, wherein the frame-shaped metallized layer is within 0.1 mm from an inner peripheral edge and an outer peripheral edge thereof. Layer around the area
The thickness decreases toward the inner and outer edges, respectively
In addition, the height of the unevenness in the width direction of each of the regions 0.1 mm or more from the inner peripheral edge and the outer peripheral edge is 5 μm or less, and the outer dimensions of the metal lid are the frame-shaped meta.
Smaller than the outer periphery of the rise layer, the brazing material has a thickness
An electronic component storage package having a thickness of 10 to 30 μm.