JP3163574U - タッチパネル用表面保護フィルム - Google Patents
タッチパネル用表面保護フィルム Download PDFInfo
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- JP3163574U JP3163574U JP2010005328U JP2010005328U JP3163574U JP 3163574 U JP3163574 U JP 3163574U JP 2010005328 U JP2010005328 U JP 2010005328U JP 2010005328 U JP2010005328 U JP 2010005328U JP 3163574 U JP3163574 U JP 3163574U
- Authority
- JP
- Japan
- Prior art keywords
- touch panel
- copper
- film
- protective film
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000010410 layer Substances 0.000 claims abstract description 39
- 230000001681 protective effect Effects 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 23
- 239000000057 synthetic resin Substances 0.000 claims abstract description 23
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 7
- 230000000845 anti-microbial effect Effects 0.000 abstract description 16
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 81
- 238000000034 method Methods 0.000 description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 230000008020 evaporation Effects 0.000 description 13
- 239000010409 thin film Substances 0.000 description 12
- 238000007740 vapor deposition Methods 0.000 description 12
- 239000003242 anti bacterial agent Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 230000000844 anti-bacterial effect Effects 0.000 description 7
- 244000005700 microbiome Species 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 241000894006 Bacteria Species 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001883 metal evaporation Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000001603 reducing effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000004599 antimicrobial Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 210000000476 body water Anatomy 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 244000052769 pathogen Species 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Abstract
Description
[1]表示装置のタッチパネル画面の表面に貼り付けられるタッチパネル用表面保護フィルムであって、
光透過性合成樹脂フィルムと、前記光透過性合成樹脂フィルムの一方の片表面に積層された銅金属および/または銅合金からなる半透明の層と、前記光透過性合成樹脂フィルムの他方の片表面に積層された粘着層と、を有するタッチパネル用表面保護フィルム。
[2]銅金属および/または銅合金からなる半透明の層の厚みは、50nm以下である、[1]に記載のタッチパネル用表面保護フィルム。
[3]前記銅合金は銅−錫合金である、[1]に記載のタッチパネル用表面保護フィルム。
本考案のタッチパネル用表面保護フィルムは、図1に示されるように、光透過性合成樹脂フィルム1と、銅金属および/または銅合金からなる半透明の層2と、粘着層3と、を有する。
本考案のタッチパネル用表面保護フィルムは、光透過性合成樹脂フィルムの一方の面に銅金属および/または銅合金からなる半透明の層を成膜し、他方の面に粘着剤を塗布して粘着層を形成することで、製造することができる。
本考案のタッチパネル用表面保護フィルムは、表示装置のタッチパネル画面に、粘着層を貼り付けて用いられる。タッチパネル画面は特に限定されないが、例えば、エレベータのタッチパネル、券売機のタッチパネル、医療用機器のタッチパネルなどが考えられる。エレベータのタッチパネル、券売機のタッチパネルは、不特定多数の者が接触する可能性があるので、抗菌性が求められることが多い。また、医療用機器のタッチパネルは、高い衛生性が必要である。
2 銅金属および/または銅合金からなる半透明の層
3 粘着層
10 エレベータのタッチパネル
11 券売機のタッチパネル
12 医療機器装置のタッチパネル
20 タッチパネル用表面保護フィルム
Claims (3)
- 表示装置のタッチパネル画面の表面に貼り付けられるタッチパネル用表面保護フィルムであって、
光透過性合成樹脂フィルムと、前記光透過性合成樹脂フィルムの一方の片表面に積層された銅金属および/または銅合金からなる半透明の層と、前記光透過性合成樹脂フィルムの他方の片表面に積層された粘着層と、を有するタッチパネル用表面保護フィルム。 - 銅金属および/または銅合金からなる半透明の層の厚みは、50nm以下である、請求項1に記載のタッチパネル用表面保護フィルム。
- 前記銅合金は銅−錫合金である、請求項1に記載のタッチパネル用表面保護フィルム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010005328U JP3163574U (ja) | 2010-08-09 | 2010-08-09 | タッチパネル用表面保護フィルム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010005328U JP3163574U (ja) | 2010-08-09 | 2010-08-09 | タッチパネル用表面保護フィルム |
Publications (1)
Publication Number | Publication Date |
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JP3163574U true JP3163574U (ja) | 2010-10-21 |
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JP2010005328U Expired - Lifetime JP3163574U (ja) | 2010-08-09 | 2010-08-09 | タッチパネル用表面保護フィルム |
Country Status (1)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012135471A (ja) * | 2010-12-27 | 2012-07-19 | Hoya Corp | 内視鏡プロセッサの入力装置 |
WO2012111301A1 (ja) * | 2011-02-18 | 2012-08-23 | 三井化学株式会社 | 抗微生物性材料とその製造方法、および抗微生物性資材 |
JP2017137275A (ja) * | 2016-02-05 | 2017-08-10 | 大成建設株式会社 | 抗微生物部材 |
WO2023063394A1 (ja) * | 2021-10-14 | 2023-04-20 | 三井化学株式会社 | 抗微生物性材料および抗微生物性資材 |
-
2010
- 2010-08-09 JP JP2010005328U patent/JP3163574U/ja not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012135471A (ja) * | 2010-12-27 | 2012-07-19 | Hoya Corp | 内視鏡プロセッサの入力装置 |
WO2012111301A1 (ja) * | 2011-02-18 | 2012-08-23 | 三井化学株式会社 | 抗微生物性材料とその製造方法、および抗微生物性資材 |
US8778408B2 (en) | 2011-02-18 | 2014-07-15 | Mitsui Chemicals, Inc. | Antimicrobial substance, method for producing same, and antimicrobial material |
JP2017137275A (ja) * | 2016-02-05 | 2017-08-10 | 大成建設株式会社 | 抗微生物部材 |
WO2023063394A1 (ja) * | 2021-10-14 | 2023-04-20 | 三井化学株式会社 | 抗微生物性材料および抗微生物性資材 |
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