JP3157414U - Led設置の基板 - Google Patents
Led設置の基板 Download PDFInfo
- Publication number
- JP3157414U JP3157414U JP2009008484U JP2009008484U JP3157414U JP 3157414 U JP3157414 U JP 3157414U JP 2009008484 U JP2009008484 U JP 2009008484U JP 2009008484 U JP2009008484 U JP 2009008484U JP 3157414 U JP3157414 U JP 3157414U
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- sections
- functional
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009434 installation Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 45
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Mounted Technology, SMT)は、電子部品をプリント回路版に溶接するものか、もしくは基板の表面のパッケージング組立技術で電子部品組立技術の一種に属する。この方法によって、軽薄短小に製造して良好な電子製品にする事ができる。そのため、従来の人の手によって部品を差し込む方法から取って代わりつつあり、現在の電子組立産業の主流となっている。
11 金属回路
12 LED
13 LEDライトバー
14 スクラップ
2 基板
2´ 子基板
21 機能セクション
22 第一連接セクション
23 第二連接セクション
24 LED
25 折線
26 固定孔
3 ライトボックス
4 固定部品
41 本体
42 差込柱
Claims (6)
- LED設置の基板において、
該基板には複数の平行に排列した機能セクションを設置し、且つ各機能セクションの端面には連接セクションを設置し、また各機能セクションは間隔をあけて隣り合うもので、そのうち、該連接セクション箇所には折線を設置し、且つ該折線は各機能セクションの間に位置することを特徴とするLED設置の基板。 - 前記折線は、両側にそれぞれ少なくとも一固定孔を設置し、該固定孔は固定部品で固定し、該固定部品は本体及び固定孔内に差し込む差込柱から構成され、該本体が折線の両側を横に跨ぐことを特徴とする請求項1記載のLED設置の基板。
- 前記基板上は、回路及び複数のLEDを設置し、該固定孔は導電材でもよく、該機能セクションの回路と電気連接を形成し、且つ該本体の差込柱も導電材でもよいことを特徴とする請求項2記載のLED設置の基板。
- LED設置の基板において、
該基板は、複数の平行に排列した機能セクションを設置し、且つ各機能セクションの両端には第一、第二連接セクションを設置し、また相互に隣り合う二個の機能セクションは相互に分離し、且つそれぞれ異なる連接セクションと相互に連接するもので、そのうち、該第一、第二連接セクション箇所には折線を設置し、且つ該折線は各機能セクションの間に位置することを特徴とするLED設置の基板。 - 前記折線は、両側にそれぞれ少なくとも一固定孔を設置し、該固定孔は固定部品で固定し、該固定部品は本体及び固定孔内に差し込む差込柱から構成され、該本体は折線の両側を横に跨ぐことを特徴とする請求項4記載のLED設置の基板。
- 前記基板上には、回路及び複数のLEDを設置し、また該固定孔は導電材でもよく、該機能セクションの回路と電気連接し、且つ該本体の差込柱も導電材でもよいことを特徴とする請求項5記載のLED設置の基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098206307U TWM366267U (en) | 2009-04-16 | 2009-04-16 | LED substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3157414U true JP3157414U (ja) | 2010-02-18 |
Family
ID=42055641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009008484U Expired - Fee Related JP3157414U (ja) | 2009-04-16 | 2009-11-30 | Led設置の基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8152335B2 (ja) |
JP (1) | JP3157414U (ja) |
DE (1) | DE202009016396U1 (ja) |
TW (1) | TWM366267U (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
US8592847B2 (en) * | 2011-04-15 | 2013-11-26 | Epistar Corporation | Light-emitting device |
WO2014009906A1 (en) * | 2012-07-12 | 2014-01-16 | Koninklijke Philips N.V. | Optimized printed circuit board |
DE102012213046A1 (de) | 2012-07-25 | 2014-01-30 | Trilux Gmbh & Co. Kg | Leuchte zum Mischen von Lichtfarben, insbesondere von ww- und tw-Licht aus LED-Elementen, sowie Platine und LED-Modul hierfür |
KR102098590B1 (ko) * | 2012-12-11 | 2020-04-09 | 삼성전자주식회사 | 발광모듈 및 이를 구비한 면 조명장치 |
US9482410B2 (en) | 2012-12-11 | 2016-11-01 | Samsung Electronics Co., Ltd. | Light emitting module and surface lighting device having the same |
DE102013206728A1 (de) * | 2013-04-15 | 2014-11-06 | Osram Gmbh | Leuchtsystem |
TWI601909B (zh) * | 2014-02-11 | 2017-10-11 | 晶元光電股份有限公司 | 發光裝置及其製造方法 |
DE102014203589A1 (de) * | 2014-02-27 | 2015-08-27 | Osram Gmbh | Leuchtmodul, Leuchtmodulanordnung und Leuchte |
JP6731354B2 (ja) | 2014-06-05 | 2020-07-29 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | 照明デバイス、照明器具及び製造方法 |
US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11085591B2 (en) | 2014-09-28 | 2021-08-10 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
US11073248B2 (en) | 2014-09-28 | 2021-07-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
JP2018525792A (ja) | 2015-08-20 | 2018-09-06 | フィリップス ライティング ホールディング ビー ヴィ | ボードに設けられるledアレイ |
WO2017220847A1 (en) * | 2016-06-21 | 2017-12-28 | Ledfoil Finland Oy | Led screen or illumination means with a flexible film structure |
CN106981253B (zh) * | 2017-03-28 | 2024-02-27 | 联想(北京)有限公司 | 一种基板及显示面板、电子设备 |
US20190049077A1 (en) * | 2017-08-11 | 2019-02-14 | Elemental LED, Inc. | Flexible Power Distribution System |
CN214332357U (zh) * | 2017-12-26 | 2021-10-01 | 嘉兴山蒲照明电器有限公司 | 发光二极管灯丝及发光二极管球泡灯 |
JP7197765B2 (ja) * | 2018-08-03 | 2022-12-28 | 日亜化学工業株式会社 | 発光装置 |
US11458328B2 (en) | 2018-10-22 | 2022-10-04 | Joovv, Inc. | Photobiomodulation therapy device accessories |
US10478635B1 (en) | 2018-10-22 | 2019-11-19 | Joovv, Inc. | Photobiomodulation therapy systems and methods |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5404282A (en) * | 1993-09-17 | 1995-04-04 | Hewlett-Packard Company | Multiple light emitting diode module |
JP2007311561A (ja) * | 2006-05-18 | 2007-11-29 | Showa Denko Kk | 表示装置、発光装置、および固体発光素子基板 |
KR100786096B1 (ko) * | 2006-09-26 | 2007-12-21 | 엘지전자 주식회사 | 백라이트 유닛 및 그 인쇄회로기판 |
-
2009
- 2009-04-16 TW TW098206307U patent/TWM366267U/zh not_active IP Right Cessation
- 2009-11-19 US US12/622,036 patent/US8152335B2/en active Active
- 2009-11-30 JP JP2009008484U patent/JP3157414U/ja not_active Expired - Fee Related
- 2009-11-30 DE DE202009016396U patent/DE202009016396U1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20100265711A1 (en) | 2010-10-21 |
DE202009016396U1 (de) | 2010-03-25 |
US8152335B2 (en) | 2012-04-10 |
TWM366267U (en) | 2009-10-01 |
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