JP3143089B2 - Electronic components - Google Patents
Electronic componentsInfo
- Publication number
- JP3143089B2 JP3143089B2 JP09318427A JP31842797A JP3143089B2 JP 3143089 B2 JP3143089 B2 JP 3143089B2 JP 09318427 A JP09318427 A JP 09318427A JP 31842797 A JP31842797 A JP 31842797A JP 3143089 B2 JP3143089 B2 JP 3143089B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- electronic component
- solder
- plating
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品、例えば
電気コネクタやリードフレームのコンタクトなどに関
し、特に表面実装工程などにおいて、半田めっきが施さ
れており、或いは半田めっき部分と当接される構成部、
例えば端子部の半田が、他の部分、例えば接触部などに
濡れ上がるなどして移動することを防止するようにした
電子部品とくに超小形の電子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, for example, an electrical connector or a contact of a lead frame, and more particularly to a structure which is subjected to solder plating or is brought into contact with a solder plated portion in a surface mounting step or the like. Department,
For example, the present invention relates to an electronic component that prevents the solder of a terminal portion from moving to another portion, for example, a contact portion or the like, and particularly to a very small electronic component.
【０００２】[0002]
【従来の技術】配線基板の回路端子とその基板に搭載さ
れる電子部品、例えば電気コネクタの電気的な接続は、
半田付けによる場合が多い。上記電気コネクタは、接続
部品としてのコンタクトを有してなり、このコンタクト
は、一般に金属板から打抜きや折曲げ加工などにより形
成され、その接触部には、耐食性や導電性などを考慮し
て電気接触用のめっきが施され、一方、この接触部と連
続して形成された端子部には、後工程での半田付けが、
確実かつ良好に行われるように、つまり半田との馴染み
がよくなるように、半田付けに必要なめっき（通常は半
田めっき、場合によっては、金（Ａｕ）めっき、パラジ
ウム−ニッケル（Ｐｄ・Ｎｉ）めっき、パラジウム（Ｐ
ｄ）めっき、錫めっきなどの場合もある。本明細書では
このめっきを半田付け用めっきという）が施されている
のが一般的である。2. Description of the Related Art Electrical connection between circuit terminals of a wiring board and electronic components mounted on the board, for example, electrical connectors, is performed by:
Often by soldering. The electrical connector has a contact as a connection part, and the contact is generally formed by punching or bending a metal plate, and the contact portion has an electrical contact in consideration of corrosion resistance and conductivity. Contact plating is applied, while soldering in the subsequent process is applied to the terminal part formed continuously with this contact part.
Plating necessary for soldering (usually solder plating, gold (Au) plating, and, in some cases, gold (Au) plating, palladium-nickel (Pd.Ni) plating, so as to be performed reliably and well, that is, to improve the familiarity with solder , Palladium (P
d) In some cases, plating, tin plating, etc. may be used. In this specification, this plating is generally called plating for soldering).
【０００３】また１９９３年４月２日に公開された特開
平５（９３）−８２２０１号には、はんだブリッジの防
止のため銅又は銅合金を酸化溶液による陽極酸化を行っ
て銅の酸化膜を形成することが記載されている。この公
知例では、板厚０．２ｍｍ、幅２０ｍｍのりん青銅が素
材であり、非処理部分はマスキングテープ張り付けやフ
ォトレジストの塗布、もしくはゴム状のマスク等で被覆
して、選択加工して幅４ｍｍの帯状金めっきと幅１０ｍ
ｍの帯状の半田めっきを行い、さらに所要部をマスキン
グテープ張り付けやフォトレジストの塗布、もしくはゴ
ム状のマスク等で被覆して陽極酸化による酸化銅被膜を
形成している。しかし、本発明の対象とする超小形電子
部品では、このような工法は手数が煩雑となって使用で
きない。Japanese Patent Application Laid-Open No. 5 (93) -82201 published April 2, 1993 discloses that copper or copper alloy is anodized with an oxidizing solution to prevent a solder bridge, thereby forming a copper oxide film. It is described to form. In this known example, phosphor bronze having a thickness of 0.2 mm and a width of 20 mm is a material, and a non-processed portion is covered with a masking tape, coated with a photoresist, or covered with a rubber-like mask or the like, and selectively processed to have a width. 4mm band gold plating and 10m width
Then, a copper oxide film is formed by anodic oxidation by applying a band-shaped solder plating of m, and applying a masking tape or applying a photoresist, or covering a required portion with a rubber-like mask. However, in the case of the ultra-small electronic components to which the present invention is applied, such a method is cumbersome and cannot be used.
【０００４】このように、従来の電気コネクタのコンタ
クトにあっては、接触部と端子部において、金めっきと
半田付け用めっきが付け分けされていた。ところが、最
近の電子機器の小型化に伴い、電気コネクタの小型化も
要求され、それに伴って、その部品であるコンタクトも
小さくなってきている。本発明はとくに接点長数ミリ
（ｍｍ）の如き超小形の電気部品を対象とする。As described above, in the contacts of the conventional electric connector, gold plating and plating for soldering are separately applied to the contact portion and the terminal portion. However, with the recent miniaturization of electronic devices, miniaturization of electrical connectors is also required, and accordingly, the contact, which is a component thereof, is becoming smaller. The present invention is particularly applicable to ultra-small electrical components having a contact length of several millimeters (mm).
【０００５】したがって、上記従来の付け分けで施した
金めっきと半田付け用めっきのコンタクトでは、例えば
表面実装技術によって、コンタクトの端子部を基板回路
の端子部に電気的に接続する場合、基板側からの熔融半
田や端子部自体に施された半田めっきの熔融半田など
が、当該コンタクトの端子部を通じて、コンタクトの接
触部にまて濡れ上がったり、流動して、上記接触部の金
めっき部分を汚染してしまうという問題があった。この
問題に対して、従来から、金めっきの接触部と半田付け
用めっきを施した端子部との間にニッケル層を設ける
と、表面実装工程時に熔融半田が接触部分に濡れ上がっ
て移動するのを防止できることが知見され、実施化され
ている。[0005] Therefore, in the case of the above-mentioned conventional gold-plated and solder-plated contacts, when the terminal portions of the contacts are electrically connected to the terminal portions of the substrate circuit by, for example, surface mounting technology, the substrate side is not connected. The molten solder from the solder or the molten solder of the solder plating applied to the terminal part itself wets or flows to the contact part of the contact through the terminal part of the contact and contaminates the gold-plated part of the contact part. There was a problem of doing it. Conventionally, if a nickel layer is provided between the gold-plated contact portion and the solder-plated terminal portion, the molten solder may move to the contact portion during the surface mounting process. Has been found to be able to prevent this and has been implemented.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、熔融半
田の上記濡れ上がりや流動を防止するには、ニッケル層
に或る程度の幅が必要とされるのに対して、コンタクト
が小型化し、例えばその長さ（全長）が５ｍｍ程度やそ
れ以下のコンタクトでは、熔融半田の濡れ上がりや流動
を確実に阻止できる幅のニッケル層を確保することが、
スペース的に困難となる。このため、ニッケル層の上述
した熔融半田の移動阻止機能が有効に活用できなくなる
というのが実情であった。However, in order to prevent the molten solder from wetting or flowing, a certain width is required for the nickel layer. For contacts whose length (total length) is about 5 mm or less, it is necessary to secure a nickel layer with a width that can reliably prevent the molten solder from getting wet or flowing.
It becomes difficult in terms of space. For this reason, the fact is that the above-described function of the nickel layer for preventing the movement of the molten solder cannot be effectively utilized.
【０００７】本発明は、このような従来の実情に鑑みて
なされたもので、例えば長さが５ｍｍ程度やそれ以下の
短いコンタクトであっても、表面実装工程などにおい
て、端子部側の熔融半田が、接触部等の他の部分に濡れ
上がりや流動するのを効果的に防止できる層、すなわち
半田移動阻止部を有するコンタクトなどを備えた電子部
品を提供することを目的とする。The present invention has been made in view of such a conventional situation. For example, even in the case of a short contact having a length of about 5 mm or less, the molten solder on the terminal portion side in a surface mounting process or the like. However, it is an object of the present invention to provide an electronic component having a layer capable of effectively preventing the wetting or flowing of another portion such as a contact portion, that is, a contact having a solder movement preventing portion.
【０００８】[0008]
【課題を解決するための手段】本発明の上記目的は、電
気コネクタなどの電子部品において、半田材料に当接さ
れ、半田付け用めっきが施された構成部と、これと連続
して延設された他の構成部との間にアルカリ性の溶液を
主とする陽極酸化によって形成した酸化ニッケル層部を
設けたことによって達成される。SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component, such as an electrical connector, having a component abutted on a solder material and plated with a solder, and a component extending continuously from the component. This is achieved by providing a nickel oxide layer formed by anodic oxidation mainly using an alkaline solution between the other constituents.
【０００９】[0009]
【発明の実施の形態】以下、図面に基づいて、本発明の
実施の形態を説明する。図１は、電子部品、例えば電気
コネクタのコンタクトに本発明を適用した場合を示した
もので、このコンタクトは、通常コネクタのハウジング
やブロック内などに装着される。同図において、１はコ
ンタクトで、これは、金属板から形成され、大まかに言
えば、上述した如き半田付け用めっき（半田との馴染み
をよくするためめっき部分で、極めて薄く施され、通常
は半田めっきとし、上記のように金めっき、パラジウム
−ニッケルめっき、パラジウムめっき、錫めっきなどの
場合もある）の施された端子部２と、これと連続して延
設されかつ金めっきの施された接触部３と、これらの両
者の間に設けられた酸化ニッケル層部４とから構成され
る。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a case where the present invention is applied to a contact of an electronic component, for example, an electric connector. The contact is usually mounted in a housing or a block of the connector. In the figure, reference numeral 1 denotes a contact, which is formed from a metal plate, and roughly speaking, as described above, a plating portion for soldering (a plating portion for facilitating familiarity with solder, which is extremely thinly applied, usually The terminal part 2 is solder-plated, and may be gold-plated, palladium-nickel-plated, palladium-plated, or tin-plated as described above), and the terminal part 2 is extended continuously and gold-plated. Contact portion 3 and a nickel oxide layer portion 4 provided therebetween.
【００１０】上記接触部３の形状は、特に限定されない
が、図１のように、ツインリーフ型であったり、或いは
ピンソケット型などとなっていて、この部分が、相手方
の電気コネクタのコンタクトと接触し合う部分である。
一方、上記端子部２は、通常先端の尖った棒状で、基板
の回路端子部に設けられたスルーホールなどに挿入され
て、半田付けされる場合が多いが、例えば図２〜図３で
示したように、平坦な先端として、基板５上に設けられ
た半田パット６や半田窪部７に当接して、半田付けされ
る場合もある。また、この端子部２は、直線状の場合だ
けでなく、図４に示すように、猫足状などに折曲げ形成
されることもある。Although the shape of the contact portion 3 is not particularly limited, it is a twin-leaf type or a pin socket type as shown in FIG. 1, and this portion is in contact with the contact of the mating electrical connector. These are the parts that touch each other.
On the other hand, the terminal portion 2 is usually in the form of a bar having a sharp tip, and is often inserted into a through hole provided in a circuit terminal portion of a substrate and soldered, for example, as shown in FIGS. As described above, the flat tip may be soldered by contacting the solder pad 6 or the solder recess 7 provided on the substrate 5. The terminal portion 2 may be formed not only in a straight line but also in a cat-like shape as shown in FIG.
【００１１】上記本発明に係るコンタクト１の材質は、
一般の電気コネクタなどに使用されるものであれば、如
何なるものであってもよく、特定の材質に限定されな
い。本発明のコンタクト１では、一般的に上述したよう
に金属板（板状のコンタクト用金属材料）からプレス加
工などにより、所定形状に打ち抜き、これに所定形状の
折り曲げや絞り込み等の加工を施して形成している。The material of the contact 1 according to the present invention is as follows:
Any material may be used as long as it is used for a general electric connector or the like, and is not limited to a specific material. In the contact 1 of the present invention, as described above, a metal plate (a metal material for a plate-like contact) is generally punched into a predetermined shape by press working or the like, and is subjected to processing such as bending or narrowing in a predetermined shape. Has formed.
【００１２】そして、さらに、本発明のコンタクト１で
は、端子部２となる棒状部分には半田付け用めっきが施
され、接触部３となる部分には、通常金めっきなどが施
され、これらの端子部２の半田付け用めっき部分と接触
部３の金めっき部分との間には、酸化ニッケル層部４が
形成される。この酸化ニッケル層部４の形成にあって
は、予めニッケル層を設けておく。このニッケル層は、
上記端子部２への半田付け用めっきと接触部３への金め
っきを施す前に、その下地として、その対応する部分や
コンタクト１の端子部２から接触部３へかけての範囲な
どに設けておく。この下地ニッケル層を、酸化処理する
ことにより、その表面に上記酸化ニッケル層部４が形成
される。Further, in the contact 1 of the present invention, the rod-shaped portion serving as the terminal portion 2 is plated with solder, and the portion serving as the contact portion 3 is usually plated with gold or the like. The nickel oxide layer 4 is formed between the solder plating portion of the terminal portion 2 and the gold plating portion of the contact portion 3. In forming the nickel oxide layer 4, a nickel layer is provided in advance. This nickel layer
Before applying the plating for soldering to the terminal portion 2 and the gold plating to the contact portion 3, a base is provided on a corresponding portion thereof or in a range from the terminal portion 2 to the contact portion 3 of the contact 1. Keep it. By oxidizing the underlying nickel layer, the nickel oxide layer portion 4 is formed on the surface thereof.
【００１３】この酸化ニッケル層部４のコンタクト１の
長さ方向の幅Ｌは、０．２ｍｍ以上とする。ここで、
０．２ｍｍ以上とするのは、この幅が０．２ｍｍ未満で
は、接触部３に金めっきを施すときに金めっき処理液
が、接触部３と端子部２との間の上記下地としてのニッ
ケル層部分に浸入して、当該ニッケル層部分を汚染（金
が析出することがある）し、この汚染があると、当該ニ
ッケル層部分の酸化ニッケル化が良好に行われず、所望
の酸化ニッケル層部４が得られなくなるからである。つ
まり、ニッケル層の酸化が不十分であると、これが原因
になって、後工程である表面実装工程などにおいて、コ
ンタクト１の端子部２を基板の所定の部分に半田付けし
ようとした場合、基板側からの熔融半田を主として、端
子部２の半田付け用めっきが半田めっきの場合、この熔
融半田も含めて、当該端子部２を通じて、接触部３側に
濡れ上がり、流動して、半田の移動阻止機能が低下する
ようになるからである。The width L of the nickel oxide layer 4 in the length direction of the contact 1 is 0.2 mm or more. here,
When the width is less than 0.2 mm, the gold plating treatment liquid is applied to the contact portion 3 when the width is less than 0.2 mm. Infiltration into the nickel layer portion contaminates the nickel layer portion (gold may be deposited). If the nickel layer portion is contaminated, the nickel layer portion is not converted into nickel oxide satisfactorily and a desired nickel oxide layer portion is formed. 4 cannot be obtained. In other words, if the oxidation of the nickel layer is insufficient, this causes the terminal portion 2 of the contact 1 to be soldered to a predetermined portion of the substrate in a subsequent step such as a surface mounting process. When the soldering plating of the terminal portion 2 is solder plating mainly from the side, the solder including the molten solder is wetted to the contact portion 3 side through the terminal portion 2 and flows to move the solder. This is because the blocking function is reduced.
【００１４】この酸化ニッケル層部４を形成するための
下地ニッケル層の厚さは、擦傷などで破損しない程度の
厚さであればよく、例えば０．５μｍ程の極く薄いもの
であってもよい。なお酸化ニッケル層自体の厚さは５０
〜５０００Å程度である。ここで、下地ニッケル層の厚
さが０．５μｍ未満の場合には、部分的に下地の金属面
が露出する恐れがあり、半田の濡れ上がりや流動などの
防止効果が損なわれる恐れがある。また、逆に、厚さが
数μｍと厚くなり過ぎても、半田の濡れ上がりや流動な
どの防止効果がそれほど向上するわけでもなく、材料コ
ストを考慮すると、０．５〜３μｍ程度の厚さが好まし
い。The thickness of the underlying nickel layer for forming the nickel oxide layer 4 may be such that it is not damaged by abrasion or the like. For example, it may be as thin as 0.5 μm. Good. The thickness of the nickel oxide layer itself is 50
５5000 °. Here, if the thickness of the underlying nickel layer is less than 0.5 μm, the underlying metal surface may be partially exposed, and the effect of preventing the solder from wetting or flowing may be impaired. On the other hand, if the thickness is too large as several μm, the effect of preventing the solder from wetting and flowing does not necessarily improve so much, and considering the material cost, the thickness is about 0.5 to 3 μm. Is preferred.
【００１５】本発明では、ニッケル層を酸化して酸化ニ
ッケル層部４を形成するには、アルカリ性の液を主とし
た水溶液による陽極酸化により格別の効果を得た。本発
明者らが実験の結果次の条件で良好な結果が得られた。 (1) アルカリ性溶液は次の各溶液中より選択する。メタ
ケイ酸ナトリウム、水酸化カリウム、水酸化アンモニウ
ム、水酸化カルシウム、水酸化ナトリウム、フッ化ナト
リウム、なお、所望に応じ上の溶液に界面活性剤、酸化
剤、有機酸塩類を加えることもできる。 (2) 電流密度 １．０〜１０．０Ａ／dm2 (3) 処理時間 ２〜３０秒 (4) 液温 ３０〜６０℃In the present invention, in order to form the nickel oxide layer portion 4 by oxidizing the nickel layer, a special effect was obtained by anodic oxidation using an aqueous solution mainly containing an alkaline liquid. As a result of experiments by the present inventors, good results were obtained under the following conditions. (1) The alkaline solution is selected from the following solutions. Sodium metasilicate, potassium hydroxide, ammonium hydroxide, calcium hydroxide, sodium hydroxide, sodium fluoride and, if desired, a surfactant, an oxidizing agent and organic acid salts can also be added to the above solution. (2) Current density 1.0 to 10.0 A / dm 2 (3) Processing time 2 to 30 seconds (4) Liquid temperature 30 to 60 ° C
【００１６】本発明は処理液と、処理条件を上述の如く
選択することによって、不所望のめっき汚染、すなわち
本来半田をはじかなければならないところに、金めっき
等の飛沫等が付着して、ごく薄い汚染物となったもの
で、そのまま放置すると半田付の際のぬれ上りを防止で
きなくなる汚染を除去することが可能となり、同時に酸
化が可能となる。According to the present invention, by selecting the processing solution and the processing conditions as described above, undesirable plating contamination, that is, splashes of gold plating or the like adhere to places where the solder must originally be repelled. It becomes a thin contaminant, and if left as it is, it is possible to remove contamination that cannot prevent wet-up during soldering, and at the same time, oxidization becomes possible.
【００１７】本発明では、上記アルカリ性の溶液を主成
分として使用する陽極酸化法を用いる。その理由は、例
えば端子部２の半田付け用めっきや接触部３の金めっき
工程において、金めっき処理液が下地のニッケル層部分
に滲みでて、薄く析出した金の層が陽極酸化工程中に陽
極酸化処理液に溶出してくるのでこれらの不所望の金め
っきが除かれ、純度の高い酸化ニッケル層表面が得ら
れ、半田の濡れ上がりや流動の防止効果が高まるからで
ある。In the present invention, an anodic oxidation method using the above alkaline solution as a main component is used. The reason is that, for example, in the plating step for soldering the terminal section 2 or the gold plating step of the contact section 3, the gold plating treatment liquid bleeds into the underlying nickel layer portion, and a thinly deposited gold layer is formed during the anodic oxidation step. This is because these undesired gold platings are removed because they are eluted into the anodizing solution, a nickel oxide layer surface with high purity is obtained, and the effect of preventing solder wetting and flowing is enhanced.
【００１８】[0018]
【実施例】材質がベリリウム銅（ＪＩＳ−Ｃ−１７２０
Ｒ相当のもの）の厚さ０．１ｍｍの金属板に打抜き、折
曲げ加工を施して、接触部長さ２．０ｍｍ、端子部長さ
２．０ｍｍのコンタクト（形成物）を得た。このコンタ
クトの接触部と端子部にめっきによって厚さ約１．６μ
ｍのニッケル層を施した。次に、このコンタクトの接触
部と端子部との間に、約０．３ｍｍ幅の間隔を空けて、
接触部には厚さ０．４μｍの金めっき層を施すと共に、
端子部には半田付け用めっきとして厚さ０．０５μｍの
金めっき層を施した。この後、接触部と端子部との間に
露出しているニッケル層部分を、上述した陽極酸化法に
よって、その表面を酸化処理して、酸化ニッケル層部
（熔融半田の移動阻止用バリア層）を形成した。[Example] The material is beryllium copper (JIS-C-1720).
A metal plate having a thickness of 0.1 mm (equivalent to R) was punched and bent to obtain a contact (formed product) having a contact portion length of 2.0 mm and a terminal portion length of 2.0 mm. The contact part and the terminal part of this contact are plated to a thickness of about 1.6μ.
m of nickel layer was applied. Next, an interval of about 0.3 mm width is provided between the contact portion of the contact and the terminal portion,
A 0.4μm thick gold plating layer is applied to the contact area,
A gold plating layer having a thickness of 0.05 μm was applied to the terminal portion as plating for soldering. Thereafter, the surface of the exposed nickel layer portion between the contact portion and the terminal portion is oxidized by the above-described anodic oxidation method to form a nickel oxide layer portion (a barrier layer for preventing the movement of the molten solder). Was formed.
【００１９】このようにして得られた、本発明に係るコ
ンタクトのサンプル（試料）１００本の端子部を、半田
浴中に浸して、熔融半田の上昇具合を観察した。その結
果は、表１に示した如くであった。なお、同表には、ニ
ッケル層が酸化処理されていなかったり、ニッケル層自
体もない、従来例（比較例１〜２）も併せて示した。ま
た、同表での試験方法において、ＭＩＬ−ＳＴＤとは、
被試験物にフラックスを塗布し、２３０℃前後で熔融し
ている半田に被試験物を浸漬させ、半田の濡れ性を評価
する方法をいう。上記表１によると、本発明によって得
たコンタクトのサンプルにあっては、全てのサンプルに
おいて、熔融半田が酸化ニッケル層部を越えて、接触部
の金めっき部分に到達するものはなかった。これに対し
て、酸化ニッケル層部のない、従来例（比較例１〜２）
では、熔融半田の濡れ上がりや流動の防止効果が小さ
く、ほぼ全て（１００本）のサンプルにおいて、熔融半
田の濡れ上がりが見られた。The terminal portions of 100 contact samples (samples) according to the present invention thus obtained were immersed in a solder bath, and the rise of the molten solder was observed. The results were as shown in Table 1. In addition, the same table also shows conventional examples (Comparative Examples 1 and 2) in which the nickel layer was not oxidized or had no nickel layer itself. In the test methods in the table, MIL-STD is
A method in which a flux is applied to a test object, the test object is immersed in solder melted at about 230 ° C., and the wettability of the solder is evaluated. According to Table 1, none of the samples of the contact obtained by the present invention had the molten solder reach the gold-plated portion of the contact portion beyond the nickel oxide layer portion. On the other hand, the conventional example without the nickel oxide layer portion (Comparative Examples 1 and 2)
In Table 2, the effect of preventing the molten solder from wetting and flowing was small, and almost all (100 pieces) of the samples showed the molten solder from being wet.
【００２０】[0020]
【表１】 [Table 1]
【００２１】なお、上記本発明の実施の態様では、電気
コネクタのコンタクトの場合についての説明であった
が、本発明は、これに限定されず、熔融半田の濡れ上が
りや流動が問題となる同種の部材を有する電子部品にも
勿論適用することができる。Although the embodiment of the present invention has been described with reference to the case of a contact of an electrical connector, the present invention is not limited to this. Of course, the present invention can be applied to an electronic component having the above member.
【００２２】[0022]
【発明の効果】本発明は、以上詳細に述べたように、電
気コネクタなどの電子部品において、実装工程などの
際、半田付を施すための構成部と、これと連続して延設
された他の構成部との間に酸化ニッケル層部を設けた部
材（コンタクトなど）を有すると共に、この酸化ニッケ
ル層部が、従来の単なるニッケル層に比較して、小さな
幅（面積）でも、より高い熔融半田の移動阻止機能が得
られるため、上記部材が５ｍｍ程度やそれ以下とかなり
小さくとも、表面実装工程などにおいて、熔融半田の濡
れ上がりや流動を効果的に防止することができる。言い
換えれば、本発明によると、従来技術では、熔融半田の
移動をうまくコントロールできなかったような、極めて
小型の電子部品を提供することができる。According to the present invention, as described in detail above, in an electronic component such as an electric connector, a component for soldering at the time of a mounting process and the like, and a component extending continuously from the component. It has a member (a contact or the like) in which a nickel oxide layer portion is provided between other components, and this nickel oxide layer portion has a higher height even with a small width (area) as compared with a conventional simple nickel layer. Since the function of preventing the movement of the molten solder is obtained, even if the above-mentioned member is as small as about 5 mm or less, it is possible to effectively prevent the molten solder from getting wet or flowing in the surface mounting step or the like. In other words, according to the present invention, it is possible to provide an extremely small electronic component in which the movement of the molten solder could not be controlled well in the prior art.
【００２３】さらに付言すると、本発明ではめっきのご
く薄い膜（汚染物）を取り除きながら、Ｎｉ表面を酸化
することができる。ここで、めっきのごく薄い膜とは、
本来めっきをつけるべきところでない箇所（はんだをは
じかなければいけない場所）についたＮｉめっきと違う
めっき（例：金めっき、パラジウムめっき、半田めっき
など）を言う。コンタクトが極小化してくると、接触部
とテール部に付け分けしていためっきの間隔が非常に隣
接するため、その中間部にも接触部あるいはテール部の
めっきがつきやすく、汚染される。In addition, in the present invention, the Ni surface can be oxidized while removing a very thin film (contaminant) of plating. Here, the very thin film of plating is
A plating (eg, gold plating, palladium plating, solder plating, etc.) different from Ni plating on a place where plating should not be applied (a place where solder must be repelled). When the contact becomes extremely small, the plating between the contact portion and the tail portion is very close to each other, so that the plating of the contact portion or the tail portion is apt to be applied to the intermediate portion, and the contact portion is contaminated.
【００２４】この原理は、ニッケルめっきは本来酸化さ
れやすく、はんだをはじく傾向にあるが、上記のめっき
の薄い膜がニッケル表面に析出していると、ニッケル自
体は酸化されずにそのめっき被膜と結合している。この
部分が加熱され溶融したはんだに接すると、このめっき
の薄い皮膜がはんだ中に拡散してしまい、この現象によ
ってはんだとニッケルが結合し濡れた状態となり不所望
の結果となる。本発明は上記の如き酸化工程でこの汚染
的めっき部分を除去しうる効果を併せて備えている。This principle is based on the principle that nickel plating is easily oxidized and tends to repel solder. However, if a thin film of the above-mentioned plating is deposited on the nickel surface, nickel itself is not oxidized and the plating film is not oxidized. Are combined. When this part comes into contact with the heated and melted solder, the thin film of this plating diffuses into the solder, and this phenomenon causes the solder and nickel to combine and become wet, which is an undesirable result. The present invention also has the effect of removing the contaminated plated portion in the oxidation step as described above.
【図１】本発明に係る電子部品であるコネクタのコンタ
クトを示した斜視図である。FIG. 1 is a perspective view showing a contact of a connector which is an electronic component according to the present invention.
【図２】本発明に係る他のコンタクトの端子部と基板と
の半田付け状態を示した部分縦断面図である。FIG. 2 is a partial longitudinal sectional view showing a state of soldering a terminal portion of another contact and a substrate according to the present invention.
【図３】本発明に係る別のコンタクトの端子部と基板と
の半田付け状態を示した部分縦断面図である。FIG. 3 is a partial longitudinal sectional view showing a soldered state between a terminal portion of another contact and a substrate according to the present invention.
【図４】本発明に係るさらに別のコンタクトの端子部と
基板との半田付け状態を示した部分斜視図である。FIG. 4 is a partial perspective view showing a soldering state between a terminal portion of still another contact according to the present invention and a substrate.
【符号の説明】 １ コンタクト ２ 端子部 ３ 接触部 ４ 酸化ニッケル層部 ５ 基板[Description of Signs] 1 Contact 2 Terminal 3 Contact 4 Nickel oxide layer 5 Substrate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 窪井 貞夫 東京都品川区西五反田２丁目11番20号 第一電子工業株式会社内 (72)発明者 松井 清 神奈川県秦野市堀山下１番地 株式会社 日立製作所 汎用コンピュータ事業部 内 (72)発明者 尾野 孝之 神奈川県秦野市堀山下１番地 株式会社 日立製作所 汎用コンピュータ事業部 内 (72)発明者 鈴木 盛夫 神奈川県秦野市堀山下１番地 株式会社 日立製作所 汎用コンピュータ事業部 内 (56)参考文献 特開 平５−82201（ＪＰ，Ａ) 特開 平３−225854（ＪＰ，Ａ) 実開 昭56−93976（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 12/32 H01R 4/02 H05K 1/18 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Sadao Kubo 2-11-11, Nishigotanda, Shinagawa-ku, Tokyo Dai-ichi Electronics Industry Co., Ltd. (72) Inventor Kiyoshi Matsui 1st Horiyamashita, Hadano-shi, Kanagawa Hitachi, Ltd.General-purpose Computer Division (72) Inventor: Takayuki Ono 1st Horiyamashita, Hadano-shi, Kanagawa Prefecture Hitachi, Ltd.General-purpose Computer Division (72) Inventor: Morio Suzuki 1st, Horiyamashita, Hadano-shi, Kanagawa (56) References JP-A-5-82201 (JP, A) JP-A-3-225854 (JP, A) JP-A-56-93976 (JP, U) (58) Fields surveyed ( Int.Cl. 7 , DB name) H01R 12/32 H01R 4/02 H05K 1/18
Claims (6)
構成部分と、この構成部分に連続して延設された他の構
成部分の間に、アルカリ性の液を主とした水溶液による
陽極酸化により、厚さ５０〜５０００Å程度、幅０．３
〜２．８ｍｍ程度の酸化ニッケル層部を設けた部材を有
することを特徴とする接点長数ミリメータ程度の超小形
電子部品。An anode made of an aqueous solution mainly composed of an alkaline liquid is provided between a component for soldering and a component extending continuously from the component during a mounting process or the like. Oxidation, thickness about 50-5000mm, width 0.3
An ultra-small electronic component having a contact length of about several millimeters, comprising a member provided with a nickel oxide layer portion of about 2.8 mm.
よる陽極酸化は、溶液を次の群中の１とし、 メタケイ酸ナトリウム、 水酸化カリウム、 水酸化アンモニウム、 水酸化カルシウム、 水酸化ナトリウム、 フッ化ナトリウム、 かつ、次の条件、（１）〜（３） (1) 電流密度 -----１．０〜１０．０Ａ／dm2 (2) 処理時間 -----２〜３０秒 (3) 液温 ---------３０〜６０℃ の範囲である請求項１記載の電子部品。2. The anodic oxidation using an aqueous solution mainly containing an alkaline liquid, the solution is set to 1 in the following group, and sodium metasilicate, potassium hydroxide, ammonium hydroxide, calcium hydroxide, sodium hydroxide, hydrofluoric acid, etc. Sodium chloride and the following conditions (1) to (3) (1) Current density ----- 1.0 to 10.0 A / dm 2 (2) Processing time ----- 2 to 30 seconds (3) The electronic component according to claim 1, wherein the liquid temperature is in the range of 30 to 60 ° C.
用めっきが施されている請求項１記載の電子部品。3. The electronic component according to claim 1, wherein the other extending component is plated with an electric contact.
めっきが施された端子部と、これと連続して延設され電
気接触用めっきの施された接触部との間に酸化ニッケル
層部を設けたコンタクトを有することを特徴とする請求
項１，２または３記載の電子部品。4. Nickel oxide is provided between a terminal portion which is in contact with a solder material and is plated for soldering and a contact portion which extends continuously from the terminal portion and is plated with an electric contact. 4. The electronic component according to claim 1, further comprising a contact provided with a layer portion.
さ方向の幅が0.2 mm以上、とくに０．３〜２．８ｍｍで
あることを特徴とする請求項３記載の電子部品。5. The electronic component according to claim 3, wherein the width of the nickel oxide layer portion in the length direction of the contact is 0.2 mm or more, particularly 0.3 to 2.8 mm.
を用いた回路装置。6. A circuit device using the electronic component according to claim 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09318427A JP3143089B2 (en) | 1996-12-31 | 1997-11-19 | Electronic components |
| US08/987,196 US5957736A (en) | 1997-11-19 | 1997-12-08 | Electronic part |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35833796 | 1996-12-31 | ||
| JP8-358337 | 1996-12-31 | ||
| JP09318427A JP3143089B2 (en) | 1996-12-31 | 1997-11-19 | Electronic components |
| US08/987,196 US5957736A (en) | 1997-11-19 | 1997-12-08 | Electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10247535A JPH10247535A (en) | 1998-09-14 |
| JP3143089B2 true JP3143089B2 (en) | 2001-03-07 |
Family
ID=27339652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09318427A Expired - Lifetime JP3143089B2 (en) | 1996-12-31 | 1997-11-19 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3143089B2 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60134108D1 (en) | 2000-10-25 | 2008-07-03 | Japan Aviation Electron | An electronic component and related manufacturing process |
| JP2004152750A (en) * | 2002-10-10 | 2004-05-27 | Matsushita Electric Works Ltd | Soldering terminal and treatment method of surface of soldering terminal |
| TWI227579B (en) * | 2002-10-10 | 2005-02-01 | Matsushita Electric Works Ltd | Contact used in a connector, and method for manufacturing an element to be soldered |
| JP4003705B2 (en) * | 2003-06-27 | 2007-11-07 | 松下電工株式会社 | Method for manufacturing soldering terminal |
| JP2004315941A (en) * | 2003-04-18 | 2004-11-11 | Matsushita Electric Works Ltd | Method of producing terminal for soldering |
| JP2006164594A (en) * | 2004-12-03 | 2006-06-22 | Molex Inc | Substrate-to-substrate connector |
| US7632112B2 (en) | 2004-12-03 | 2009-12-15 | Murata Manufacturing Co., Ltd. | Electrical contact component, coaxial connector, and electrical circuit device including the same |
| JP4384073B2 (en) * | 2005-03-17 | 2009-12-16 | 第一電子工業株式会社 | Manufacturing method of electronic parts |
| WO2007024005A1 (en) * | 2005-08-23 | 2007-03-01 | Ddk Ltd. | Microminiature contact and method for manufacturing same, and electronic component |
| JP5060146B2 (en) * | 2007-03-29 | 2012-10-31 | Ｊｘ日鉱日石金属株式会社 | TERMINAL HAVING SOLDER SUCTION BARRIER AND ITS MANUFACTURING METHOD |
| JP2011100805A (en) * | 2009-11-05 | 2011-05-19 | Murata Mfg Co Ltd | Electrode for redox capacitor |
| JP5479406B2 (en) * | 2011-06-30 | 2014-04-23 | 日本航空電子工業株式会社 | connector |
| JP6814031B2 (en) * | 2016-11-24 | 2021-01-13 | 日本航空電子工業株式会社 | Coaxial connector and connector assembly |
| JP2023080647A (en) * | 2021-11-30 | 2023-06-09 | 株式会社鷺宮製作所 | Terminal structure and manufacturing method thereof |
-
1997
- 1997-11-19 JP JP09318427A patent/JP3143089B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10247535A (en) | 1998-09-14 |
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