CN113825319A - Method for removing dry film on copper layer of circuit board - Google Patents
Method for removing dry film on copper layer of circuit board Download PDFInfo
- Publication number
- CN113825319A CN113825319A CN202010564873.0A CN202010564873A CN113825319A CN 113825319 A CN113825319 A CN 113825319A CN 202010564873 A CN202010564873 A CN 202010564873A CN 113825319 A CN113825319 A CN 113825319A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper
- copper layer
- soaking
- dry film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for removing a dry film on a copper layer of a circuit board, and relates to the field of circuit board manufacturing. The method comprises the following steps: providing a circuit board base material, wherein a copper layer is arranged on the surface of the circuit board base material; forming a dry film with a plurality of openings on the copper layer, wherein the copper layer region exposed in each opening is a gold-plated region; forming a metal layer in each gold plating region; soaking the circuit board in an organic film removing solution at the temperature of 50-60 ℃ to remove the film, wherein the organic film removing solution comprises sodium hydroxide, a surfactant, a copper protecting agent and a regenerating agent; after the soaking is finished, the oxidation rate of the copper surface of the copper layer is 0.13-1.25%.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for removing a dry film on a copper layer of a circuit board.
Background
A Printed Circuit Board (PCB) is a Circuit Board formed by patterning electronic wiring connecting Circuit components according to Circuit design and then reproducing electronic conductors on an insulator through processes such as specific machining and processing, and is mainly intended to allow the electronic components disposed on the Circuit Board to function through a Circuit on the Circuit Board.
With the high performance of electronic products, gold plating or gold melting with excellent performance is selected for the surface treatment of the PCB. In order to protect the substrate of the PCB, a dry film is typically used to cover the surface of the substrate of the circuit board prior to gold plating or plating, and selectively expose the copper surface to be plated or plated. After gold plating or gold plating, film removal is performed. Currently, NaOH (sodium hydroxide) is generally used as a stripping solution to strip the circuit board by soaking (generally soaking for 4-5 times). However, when the membrane is removed by NaOH, the following defects exist:
NaOH reacts with the copper surface of PCB to produce Cu (O H)2The copper surface is oxidized; further, the total time required for removing the dry film by NaOH is long (the total time of soaking 4 times is generally 680s), and the oxidation speed and the oxidation area of the copper surface can be accelerated by the long-time film removing time and the characteristics of NaOH per se, which seriously reduces the quality of the whole PCB.
Disclosure of Invention
Aiming at the defects in the prior art, the invention solves the technical problems that: how to avoid the copper surface of the circuit board from being excessively oxidized while remarkably shortening the time required for removing the dry film.
In order to achieve the above object, the present invention provides a method for removing a dry film on a copper layer of a circuit board, comprising the steps of:
s1: providing a circuit board base material, wherein a copper layer is arranged on the surface of the circuit board base material;
s2: forming a dry film with a plurality of openings on the copper layer, wherein the copper layer region exposed in each opening is a gold-plated region;
s3: forming a metal layer in each gold plating region;
s4: soaking and stripping the circuit board in an organic stripping solution at the temperature of 50-60 ℃, wherein the soaking times are 4-5 times, and the soaking time is 83-102 s each time; the organic film removing liquid comprises 4.2-7 wt% of sodium hydroxide, 0.9-1.5 wt% of surfactant, 0.6-1.0 wt% of copper protecting agent and 0.3-0.5 wt% of regenerating agent, wherein the total concentration of the sodium hydroxide, the surfactant, the copper protecting agent and the regenerating agent is 6-10 wt%; after the soaking is finished, the oxidation rate of the copper surface of the copper layer is 0.13-1.25%.
On the basis of the above technical solution, the specific process of S2 includes: and forming a patterned dry film by using a lithography process, baking the copper layer at the temperature of 135 ℃ for 30 minutes, and then attaching the dry film to the surface of the copper layer through a hot pressing wheel.
On the basis of the above technical solution, the metal layer in S3 includes a nickel-containing layer and a gold layer on the nickel-containing layer.
On the basis of the above technical solution, the specific process of S4 includes: soaking the circuit board in an organic membrane removing solution at the temperature of 55 ℃ for 4 times; the soaking time is 90s, 93s, 96s and 99s in sequence, the organic film removing liquid comprises 5.6 wt% of sodium hydroxide, 1.2 wt% of surfactant, 0.8 wt% of copper protecting agent and 0.4 wt% of regenerating agent, and after soaking, the oxidation rate of the copper surface is 0.97%.
Compared with the prior art, the invention has the advantages that:
according to the invention, through the matching of the independently developed organic film removing liquid and corresponding parameters, tests and comparison, compared with the film removing mode in the prior art that the average film removing time is 545s and severe copper surface oxidation (the copper surface oxidation rate is 35%) can occur after soaking for 9 minutes, the average time required for removing the dry film of the circuit board by adopting the method is only 341s, and slight copper surface oxidation (the copper surface oxidation rate is 0.13%) can occur after soaking for 10 minutes.
Therefore, the dry film on the circuit board can be quickly removed, the oxidation speed of the copper layer is effectively reduced, and the copper layer is prevented from being excessively oxidized;
drawings
FIG. 1 is a flow chart of a method for removing a dry film on a copper layer of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view corresponding to S1 in the embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view corresponding to S2 in the embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view corresponding to S3 in the embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view corresponding to S4 in the embodiment of the present invention;
FIG. 6A is a photograph of a circuit board after being soaked in a conventional sodium hydroxide solution;
FIG. 6B is a photo of a circuit board soaked with the organic stripping solution in an embodiment of the present invention;
FIG. 7A is a photograph of a metal layer surface of a circuit board after being soaked in a conventional sodium hydroxide solution;
fig. 7B is a photo of the metal layer surface of the circuit board after being soaked in the organic stripping solution in the embodiment of the invention.
In the figure: 10-circuit board substrate, 11-copper layer, 12-dry film, 13-gold plating area, 14-metal layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Referring to fig. 1, a method for removing a dry film on a copper layer of a circuit board according to an embodiment of the present invention includes the steps of:
s1: referring to fig. 2, a circuit board substrate 10 is provided, a copper layer 11 is disposed on a surface of the circuit board substrate 10, and in practical applications, the copper layer 11 may be a conductive layer; may be formed by photolithography and etching, or may be formed using electroplating, electroless plating, or other suitable methods.
S2: referring to fig. 3, a patterned dry film 12 is formed on a copper layer 11, the patterned dry film 12 has a plurality of openings, and a copper layer region exposed in each opening is a gold plating region 13.
Preferably, the specific process of S2 includes: forming a patterned Dry Film 12, otherwise referred to as a DFR (Dry Film Resist), using a photolithography process; baking the copper layer 11 at the temperature of 135 ℃ for 30 minutes, then carrying out baking treatment, and attaching a dry film 12 on the surface of the copper layer 11 through a hot pressing wheel.
The advantages of the design are as follows: the copper layer 11 is baked at the above temperature and time before the dry film 12 is attached, which improves the adhesion between the dry film 12 and the copper layer 11.
S3: referring to fig. 4, a metal layer 14 is formed in each gold-plated region 13, and in practical applications, the metal layer 14 may be formed by electroplating, electroless plating, or other suitable method; the metal layer 14 in this embodiment includes a nickel-containing layer that can improve corrosion resistance, and a gold layer on the nickel-containing layer.
S4: referring to fig. 5, soaking and stripping the circuit board in an organic stripping solution at a temperature of 50-60 ℃, wherein the soaking times are 4-5 times, and the soaking time is 83-102 s each time; the organic film removing liquid comprises 4.2-7 wt% of sodium hydroxide, 0.9-1.5 wt% of surfactant, 0.6-1.0 wt% of copper protecting agent and 0.3-0.5 wt% of regenerating agent, wherein the total concentration of the sodium hydroxide, the surfactant, the copper protecting agent and the regenerating agent is 6-10 wt%; after stripping, each metal layer 14 remains in the corresponding gold-plated region 13.
The sodium hydroxide, the surfactant, the copper protecting agent and the regenerant are matched with each other according to the concentration parameters and the soaking parameters (soaking temperature, times and duration of each time) to achieve the following effects:
4.2-7 wt% of sodium hydroxide can effectively remove dry films;
0.9-1.5 wt% of surfactant can reduce the tension of the organic film removing solution, so that CA (contact angle) of the organic film removing solution on the dry film is reduced, the dry film is quickly wetted, and the decomposition speed of the dry film is accelerated;
0.6-1.0 wt% of copper protecting agent can protect the copper layer of the circuit board, reduce the oxidation speed of the copper layer and avoid excessive oxidation;
0.3-0.5 wt% of a regenerant can prevent the volume expansion of the circuit board and avoid the structure damage of the circuit board due to the volume expansion.
The organic film removing liquid formed by the components in the proportion is matched with the soaking temperature and the soaking time in the S4, so that the dry film can be removed in a short time, and the oxidation speed of copper can be reduced to the maximum extent. The copper surface oxidation rate is 0.13-1.25% after soaking.
Preferably, the specific process of S4 includes: soaking the circuit board in an organic membrane removing solution at the temperature of 55 ℃ for 4 times; the soaking time is 90s, 93s, 96s and 99s in sequence, the organic film removing liquid comprises 5.6 wt% of sodium hydroxide, 1.2 wt% of surfactant, 0.8 wt% of copper protecting agent and 0.4 wt% of regenerating agent, and after soaking, the oxidation rate of the copper surface is 0.97%. Under these conditions, the film removal rate is higher, and the copper surface is better oxidized (i.e., the oxidation rate is lower).
The effects of the present invention are illustrated below by 1 comparative example and a photograph of an actual product, respectively.
Comparative example:
TABLE I comparison of total stripping time of traditional sodium hydroxide and organic stripping solution after 4 soaking times
As can be seen from the table I, the difference between the average stripping time of the conventional sodium hydroxide and the organic stripping solution of the present invention is 545-341 ═ 204s, and the stripping speed is significantly increased.
TABLE II film removing efficacy of traditional sodium hydroxide and organic film removing liquid
As can be seen from the table II, the circuit board can be seriously oxidized on the copper surface (the oxidation rate of the copper surface is 35%) after being soaked in the traditional sodium hydroxide solution for 9 minutes, and the circuit board can be slightly oxidized on the copper surface (the oxidation rate of the copper surface is 0.13%) after being soaked in the organic membrane removing solution for 10 minutes, so that the oxidation can not occur before 10 minutes, namely, the oxidation of the copper surface can be effectively avoided, and the quality of the circuit board is obviously improved.
Photo of actual product:
comparing fig. 6A (the photograph of the circuit board after being soaked in the conventional sodium hydroxide solution) and fig. 6B (the photograph of the circuit board after being soaked in the organic stripping solution of the present invention), it can be seen that the oxidation condition of fig. 6B is far better than that of fig. 6A.
Comparing fig. 7A (a photograph of the metal layer surface of the circuit board after being soaked in the conventional sodium hydroxide solution) and fig. 7B (a photograph of the metal layer surface of the circuit board after being soaked in the organic stripping solution of the present invention), it can be seen that the organic stripping solution of the present invention does not excessively oxidize the surface of the metal layer.
Further, the present invention is not limited to the above-mentioned embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements are also considered to be within the scope of the present invention. Those not described in detail in this specification are within the skill of the art.
Claims (4)
1. A method of removing a dry film from a copper layer of a circuit board, the method comprising the steps of:
s1: providing a circuit board base material (10), wherein a copper layer (11) is arranged on the surface of the circuit board base material (10);
s2: forming a dry film (12) having a plurality of openings on the copper layer (11), the copper layer region exposed in each opening being a gold-plated region (13);
s3: forming a metal layer (14) in each gold-plated region (13);
s4: soaking and stripping the circuit board in an organic stripping solution at the temperature of 50-60 ℃, wherein the soaking times are 4-5 times, and the soaking time is 83-102 s each time; the organic film removing liquid comprises 4.2-7 wt% of sodium hydroxide, 0.9-1.5 wt% of surfactant, 0.6-1.0 wt% of copper protecting agent and 0.3-0.5 wt% of regenerating agent, wherein the total concentration of the sodium hydroxide, the surfactant, the copper protecting agent and the regenerating agent is 6-10 wt%; after the soaking is finished, the oxidation rate of the copper surface of the copper layer (11) is 0.13-1.25%.
2. The method of claim 1, wherein the specific process of S2 comprises: and forming a patterned dry film (12) by using a lithography process, baking the copper layer (11) at the temperature of 135 ℃ for 30 minutes, then carrying out baking treatment, and sticking the dry film (12) on the surface of the copper layer (11) by using a hot pressing wheel.
3. The method of claim 1, wherein the dry film is removed from a copper layer of a circuit board by: the metal layer (14) in S3 includes a nickel-containing layer and a gold layer on the nickel-containing layer.
4. The method of claim 1, wherein the specific process of S4 comprises: soaking the circuit board in an organic membrane removing solution at the temperature of 55 ℃ for 4 times; the soaking time is 90s, 93s, 96s and 99s in sequence, the organic film removing liquid comprises 5.6 wt% of sodium hydroxide, 1.2 wt% of surfactant, 0.8 wt% of copper protecting agent and 0.4 wt% of regenerating agent, and after soaking, the oxidation rate of the copper surface is 0.97%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010564873.0A CN113825319B (en) | 2020-06-19 | 2020-06-19 | Method for removing dry film on copper layer of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010564873.0A CN113825319B (en) | 2020-06-19 | 2020-06-19 | Method for removing dry film on copper layer of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113825319A true CN113825319A (en) | 2021-12-21 |
| CN113825319B CN113825319B (en) | 2023-04-25 |
Family
ID=78912079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010564873.0A Active CN113825319B (en) | 2020-06-19 | 2020-06-19 | Method for removing dry film on copper layer of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113825319B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04116997A (en) * | 1990-09-07 | 1992-04-17 | Asahi Chem Ind Co Ltd | Manufacture of printed circuit board |
| CN1527747A (en) * | 2000-09-19 | 2004-09-08 | ϣ | Process for treating adhesion promoted metal surfaces |
| TW200712255A (en) * | 2005-09-13 | 2007-04-01 | Amia Co Ltd | Method for fabricating circuit |
| CN101071278A (en) * | 2006-05-12 | 2007-11-14 | 湖南省科学技术研究开发院 | Photo resist film removing agent |
| TW201509921A (en) * | 2013-09-11 | 2015-03-16 | Shikoku Chem | Surface treating agent for copper or copper alloy and its applications |
| CN107278039A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of organic base dry film stripping technique for printed wiring board |
| CN110597026A (en) * | 2019-09-26 | 2019-12-20 | 上海富柏化工有限公司 | Dry film removing process for flexible circuit board |
-
2020
- 2020-06-19 CN CN202010564873.0A patent/CN113825319B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04116997A (en) * | 1990-09-07 | 1992-04-17 | Asahi Chem Ind Co Ltd | Manufacture of printed circuit board |
| CN1527747A (en) * | 2000-09-19 | 2004-09-08 | ϣ | Process for treating adhesion promoted metal surfaces |
| TW200712255A (en) * | 2005-09-13 | 2007-04-01 | Amia Co Ltd | Method for fabricating circuit |
| CN101071278A (en) * | 2006-05-12 | 2007-11-14 | 湖南省科学技术研究开发院 | Photo resist film removing agent |
| TW201509921A (en) * | 2013-09-11 | 2015-03-16 | Shikoku Chem | Surface treating agent for copper or copper alloy and its applications |
| CN107278039A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of organic base dry film stripping technique for printed wiring board |
| CN110597026A (en) * | 2019-09-26 | 2019-12-20 | 上海富柏化工有限公司 | Dry film removing process for flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113825319B (en) | 2023-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI395531B (en) | Printed circuit board, manufacturing method thereof, and semiconductor device | |
| JP2005191524A (en) | Printed-wiring board, manufacturing method thereof, and circuit device | |
| JP4695675B2 (en) | Method for manufacturing printed wiring board | |
| CN110402020B (en) | Flexible printed circuit board and manufacturing method thereof | |
| JP3143089B2 (en) | Electronic components | |
| US20240102174A1 (en) | Etch Chemistry For Metallic Materials | |
| US6780520B2 (en) | Metal/ceramic bonding article and method for producing same | |
| JP2002343931A (en) | Wiring board, manufacturing method thereof, multi-chip module, manufacturing method thereof, and multi-chip module mounting structure body | |
| KR100797708B1 (en) | Fabricating method of printed circuit board | |
| CN113825319A (en) | Method for removing dry film on copper layer of circuit board | |
| CN111315148A (en) | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit | |
| US6063481A (en) | Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate | |
| JP3540887B2 (en) | Selective nickel stripping solution and stripping method using the same | |
| JP2003078234A (en) | Printed wiring board and its manufacturing method | |
| TWI726760B (en) | Method of fabricating circuit board structure | |
| CN109788658B (en) | Circuit board and manufacturing method thereof | |
| JP2008004959A (en) | Printed wiring board and circuit device | |
| JP3815429B2 (en) | Manufacturing method of tape carrier for semiconductor device | |
| KR102531702B1 (en) | Method of manufacturing printed circuit board | |
| JP4168798B2 (en) | Method for manufacturing printed wiring board | |
| JP2002368380A (en) | Method of manufacturing double-sided flexible circuit board | |
| CN115474350A (en) | Circuit board surface treatment method and gold finger manufacturing method | |
| CN118102608A (en) | Optical communication packaging substrate and processing method thereof | |
| JP3076950B2 (en) | Method for manufacturing lead frame for semiconductor device | |
| JP3439779B2 (en) | Manufacturing method of printed wiring board and printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |