JP3142746U - Semiconductor mounting board - Google Patents

Abstract

A semiconductor mounting board capable of suitably maintaining an electrically insulated state between a board and a screw when being fixed with a screw or the like when a metal having a good thermal conductivity is used as a board for mounting a semiconductor. provide.
A screw mounting portion 7 provided around a screw mounting hole 5 for fixing a substrate 2 with a screw 6 of a metal substrate 2 on which a semiconductor is mounted and an insulating layer is formed on the surface is provided with a screw 6. A buffer portion 8 for protecting the insulating layer 3 is formed by buffering the mounting force between the screw 6 and the insulating layer 3 when tightening.
[Selection] Figure 3

Description

  In the case where a metal having good thermal conductivity is used as a substrate on which a semiconductor is mounted, the present invention keeps the substrate and the screw suitably electrically insulated when the semiconductor mounting substrate is fixed with a screw or the like. The present invention relates to a semiconductor mounting substrate that can be used.

In a high-power LED light source or the like, a metal with good thermal conductivity is used as a substrate for mounting it in consideration of heat dissipation. For example, a conductive metal such as iron or aluminum is used as a substrate. After forming a film with insulating glass on the surface, a circuit pattern is printed and formed with silver, and finally a portion to be protected of the circuit pattern is covered with mask glass. And when attaching this semiconductor component, if the screw is tightened as it is to the screw mounting part of the board, the mask glass on the surface will crack, and it will contact the screw on the board where you want to maintain the electrical insulation originally. As a result, there is a risk of affecting the semiconductor components to be mounted. In view of this, an insulating washer is interposed in the screw mounting portion of the substrate and the fixing is performed using a screw.
JP 2003-264919 A

  However, the use of insulating washers when mounting with screws increases the number of components and may cause human error to forget to install insulating washers, so semiconductor components can be used without using insulating washers. It has been desired to realize a means for screwing.

  Therefore, in the present invention, when using a metal having good thermal conductivity as a substrate on which a semiconductor is mounted, the substrate and the screw can be suitably electrically insulated when being fixed with a screw or the like. An object of the present invention is to provide a semiconductor mounting substrate that can be used.

  In order to achieve the above object, the mounting board between the screw and the insulating layer is buffered at the screw mounting part of the metal board formed by mounting the semiconductor and forming the insulating layer on the surface. A buffer portion for protecting the insulating layer is formed.

  The buffer portion is formed integrally with an insulating layer formed on the surface of the screw attachment portion of the metal substrate.

  The buffer portion is formed on the screw mounting portion of the substrate using the same conductive material as the circuit pattern mounted on the substrate, and is formed in the same process as the circuit pattern forming operation during the semiconductor mounting process. It is characterized by.

  The surface of the buffer portion is coated with the same insulating coating film as that covering the circuit pattern surface, and is formed in the same process as the circuit pattern surface coating operation during the semiconductor mounting process. To do.

  According to the semiconductor mounting substrate of the present invention, in the metal substrate covered with the insulating film for mounting the semiconductor, the screw mounting portion of the metal substrate formed by mounting the semiconductor and forming the insulating layer on the surface is screw-tightened. By buffering the mounting force between the screw and the insulating layer and forming the buffering part to protect the insulating layer, the buffering part exerts the action of buffering the mounting force (torque) between the screw and the insulating layer, The screw can be tightened without destroying the insulating film of the screw mounting portion, and thus the substrate and the screw can be suitably electrically insulated. Further, by providing the buffer portion, it is not necessary to separately attach a buffer member such as an insulating washer as in the prior art, and there is no worry of forgetting to attach it.

  The buffer part is formed integrally with the insulating layer formed on the surface of the screw mounting part of the metal substrate, so that the buffer part is firmly formed and the mounting force (torque) between the screw and the insulating layer is buffered. It is possible to sufficiently exert the effect of In addition, when the insulating layer formed on the surface of the screw mounting portion is provided with a thickness so as to be a buffer portion, it is not necessary to provide a buffer member separately, which simplifies the semiconductor mounting substrate manufacturing process and reduces the manufacturing cost. it can.

  The buffer part is formed on the screw mounting part of the board using the same conductive material as the circuit pattern mounted on the board, so that it is formed in the same process as the circuit pattern forming work during the semiconductor mounting process. This eliminates the need for a separate buffer member, simplifies the substrate manufacturing process, and reduces the manufacturing cost. That is, the buffer portion can be printed and formed simultaneously during the circuit pattern printing process, thereby simplifying the manufacturing process of the semiconductor mounting substrate.

  The surface of the buffer portion can be formed in the same process as the circuit pattern surface covering operation during the semiconductor mounting process by covering with the same insulating coating film as the insulating coating film covering the circuit pattern surface. This is possible, and it is not necessary to separately cover the insulating coating member on the buffer portion, thereby simplifying the substrate manufacturing process and reducing the manufacturing cost. That is, when the surface insulating coating film of the circuit pattern is formed, the buffer portion can be covered with the insulating coating film at the same time, thereby simplifying the manufacturing process of the semiconductor mounting substrate.

  FIG. 1 and FIG. 2 show a semiconductor mounting substrate 1 of the present embodiment, 2 is an iron, aluminum or the like excellent in thermal conductivity suitable for mounting a high-power LED or the like that requires efficient heat dissipation. A substrate made of metal, 3 is an insulating layer made of glass that covers the entire surface of the substrate in order to electrically insulate the substrate 2, and 4 is a circuit pattern made of a silver film printed on the upper surface of the insulating layer 3, Reference numeral 5 denotes a screw attachment hole for fixing the semiconductor mounting substrate 1 with the screw 6, and 7 denotes a screw attachment portion located around the screw attachment hole 5. The same silver coating as that of the circuit pattern 4 is applied to this portion. Thus, the buffer portion 8 is formed. Reference numeral 9 denotes a mask glass as an insulating coating film having a weather resistance and covering the buffer pattern 8 while being deposited on the circuit pattern 4 in order to protect the circuit pattern 4 having a silver coating.

  In the semiconductor mounting substrate 1 having such a configuration, as shown in FIG. 3, when the screw 6 is inserted into the screw mounting hole 5 of the substrate 2 and tightened, the back surface of the head of the screw 6 is a mask of the screw mounting portion 7. The screw 6 compresses and urges the mask glass 9 and the buffer portion 8 therebelow while the screw 6 rotates while being in contact with the glass 9. The silver film of the buffer 8 is compressed by the tightening torque of the screw to buffer the force, and the screw 6 reaches the predetermined tightening torque without damaging the insulating film 3 of the substrate 2. It will be suitably fixed maintaining the state insulated from 6.

  In the actual formation of the buffer portion 8 of the semiconductor mounting substrate, the buffer portion 8 is simultaneously formed on the screw mounting portion 7 in the process of printing the circuit pattern 5 on the semiconductor mounting substrate 1, and the mask glass 9 is attached to the circuit pattern 8. At the same time as the forming step, the buffer glass 8 is covered with the mask glass 9, and the buffer portion 8 made of an insulator is formed on the surface in contact with the screw 6.

  As another embodiment of the semiconductor mounting substrate of this embodiment, the insulating layer 3 covering the semiconductor mounting base is thick, for example, a convex portion is formed, and this may be used as the buffer portion 8. In this case, the buffer portion 8 can be formed simultaneously with the step of forming the insulating layer 3.

  As still another embodiment of the semiconductor mounting substrate of this embodiment, the buffer portion formed on the screw mounting portion 7 is not formed of the same silver film as the circuit pattern described above, but is formed of an insulator such as a synthetic resin. Is. By using the buffer portion as an insulator, it is preferable that the screw and the buffer portion, and the buffer portion and the substrate can reliably maintain the electrically insulated state. However, as in the above-described embodiment, it is necessary to add the step of forming the buffer portion as a step different from the step of forming the circuit pattern.

It is a top view which shows the semiconductor mounting board of this invention. It is explanatory drawing which shows the principal part cross section of the semiconductor mounting board of this invention. It is explanatory drawing which shows the state which fastens the semiconductor mounting board of this invention with a screw.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor mounting board 2 Board | substrate 3 Insulation film 4 Circuit pattern 5 Screw attachment hole 6 Screw 7 Screw attachment part 8 Buffer part 9 Mask glass

Claims (4)

  The screw mounting part of the metal substrate with the semiconductor layer mounted and the insulating layer formed on the surface shall be provided with a buffer part to buffer the mounting force between the screw and the insulating layer and protect the insulating layer when tightening the screw. A featured semiconductor mounting board.   2. The semiconductor mounting substrate according to claim 1, wherein the buffer portion is formed integrally with an insulating layer formed on the surface of the screw mounting portion of the metal substrate.   The buffer portion is formed on the screw mounting portion of the substrate using the same conductive material as the circuit pattern mounted on the substrate, and is formed in the same process as the circuit pattern forming operation during the semiconductor mounting process. The semiconductor mounting substrate according to claim 1 or 2.   The surface of the buffer portion is coated with the same insulating coating film as that covering the circuit pattern surface, and is formed in the same process as the circuit pattern surface coating operation during the semiconductor mounting process. The semiconductor mounting substrate according to claim 1.

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