JP2009123812A - Electronic control device of heat radiating structure - Google Patents

Electronic control device of heat radiating structure Download PDF

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JP2009123812A
JP2009123812A JP2007294282A JP2007294282A JP2009123812A JP 2009123812 A JP2009123812 A JP 2009123812A JP 2007294282 A JP2007294282 A JP 2007294282A JP 2007294282 A JP2007294282 A JP 2007294282A JP 2009123812 A JP2009123812 A JP 2009123812A
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contact
circuit board
electronic control
control device
heat dissipation
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JP4910996B2 (en
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Yasushi Matsumura
靖 松村
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic control device of heat radiating structure that has versatility and assures effective heat radiation. <P>SOLUTION: The device has a structure that a contactor 5 including a plurality of elastically-deformable contact pieces 5b is provided between a bottom surface 2a of housing base 2 and a circuit board 3 mounted with electronic components 4 including a heat generating element 4a. According to this structure, if a height from the rear surfaces of the heat radiating element 4a and the circuit board 3 is fluctuated by the elastic deformation of the contact piece 5b, the fluctuation can be absorbed when the elastic deformation of a sloping part 5c is changed adequately and a fold-back part 5d or the sloping part 5c can be surely be brought into contact with the rear surface of the heat radiating element 4a and the circuit board 3. Accordingly, heat generated by the heat generating element 4a is transferred to the housing base 2 via the contactor 5 and then radiated through the housing base 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、回路基板に実装された電子部品が発する熱の放熱を行うことができる放熱構造を有する電子制御装置に関するものである。   The present invention relates to an electronic control device having a heat dissipation structure capable of radiating heat generated by an electronic component mounted on a circuit board.

近年、電子制御装置では、高機能化と高性能化により、電子部品（素子）からの発熱量が増大し、効率的な放熱が重要になっている。この放熱手法として、筐体から自然対流や輻射熱によって周囲に放散させる手法を用いる場合、発熱素子から如何に効率的に筐体に熱を伝えるかが鍵となり、発熱素子を直接筐体に接触させるのがその早道である。   In recent years, in electronic control devices, the amount of heat generated from electronic components (elements) has increased due to higher functionality and higher performance, and efficient heat dissipation has become important. As a heat dissipation method, when using a method of dissipating from the casing to the surroundings by natural convection or radiant heat, the key is how efficiently heat is transmitted from the heating element to the casing, and the heating element is brought into direct contact with the casing. That is the fastest way.

ただし、発熱素子は一つの電子制御装置に複数個使用されており、その取り付け高さにばらつきがある。このため、図１６に示す従来の電子制御装置の断面図のように、従来では、筐体Ｊ１に発熱素子Ｊ２の取り付け高さに合せた突起部Ｊ３を複数個設置し、各突起部Ｊ３と発熱素子Ｊ２との間隔を小さくする構造を用いている。さらに、放熱効果をより得るためには発熱素子Ｊ２と突起部Ｊ３とを直接接触させるようにするのが好ましいが、回路基板Ｊ４の反りや筐体Ｊ１の加工精度を考慮すると、発熱素子Ｊ２を回路基板Ｊ４に接合しているはんだ付け部に過大な応力が作用するおそれがある。このため、各突起部Ｊ３と発熱素子Ｊ２との間に僅かな隙間を設け、この隙間に熱伝導性の高いゲル状部材Ｊ５を配置することで放熱を行いつつ、応力緩和が行われるようにしている。
特開平０７−２０２０８３号公報 However, a plurality of heating elements are used in one electronic control unit, and the mounting height varies. For this reason, as shown in the cross-sectional view of the conventional electronic control device shown in FIG. 16, conventionally, a plurality of protrusions J3 corresponding to the mounting height of the heating element J2 are installed on the housing J1, and each protrusion J3 and A structure in which the distance from the heating element J2 is reduced is used. Furthermore, in order to obtain a more effective heat dissipation, it is preferable that the heating element J2 and the protrusion J3 are in direct contact with each other. However, considering the warpage of the circuit board J4 and the processing accuracy of the housing J1, the heating element J2 There is a possibility that excessive stress may act on the soldered portion joined to the circuit board J4. For this reason, a slight gap is provided between each protrusion J3 and the heating element J2, and a gel-like member J5 having high thermal conductivity is disposed in the gap so that heat is released and stress relaxation is performed. ing.
Japanese Patent Application Laid-Open No. 07-202083

しかしながら、上記のような構造を採用する場合、電子制御装置の機種ごとに発熱素子Ｊ２の配置や数が異なっているため、筐体Ｊ１もこれに合せて設計し直す必要があり、汎用性に乏しい。また、熱伝導性が高いとは言えゲル状部材Ｊ５を介して各突起部Ｊ３と発熱素子Ｊ２とが接触するような構造となるため、効果的な放熱が行えないという問題がある。   However, when the structure as described above is adopted, the arrangement and number of the heating elements J2 are different depending on the model of the electronic control device. Therefore, the housing J1 also needs to be redesigned in accordance with this, and the versatility is improved. poor. In addition, although the heat conductivity is high, the structure is such that each protrusion J3 and the heating element J2 are in contact with each other through the gel-like member J5.

本発明は上記点に鑑みて、汎用性に富み、かつ、効果的な放熱が行える放熱構造を有する電子制御装置を提供することを目的とする。   In view of the above points, an object of the present invention is to provide an electronic control device having a heat dissipation structure that is versatile and capable of effective heat dissipation.

上記目的を達成するため、請求項１に記載の発明では、回路基板（３）と筐体ベース（２）の底面部（２ｂ）との間には、底面部（２ｂ）側から回路基板（３）側に延び、かつ、回路基板（３）側から底面部（２ｂ）側に向かう方向に弾性変形する複数の接触片（５ｂ）が備えられた接触子（５）が備えられ、複数の接触片（５ｂ）が弾性変形した状態で発熱素子（４ａ）と接触していることを特徴としている。   In order to achieve the above object, according to the first aspect of the present invention, the circuit board (3 b) and the bottom surface part (2 b) of the housing base (2) are arranged from the bottom surface part (2 b) side to the circuit board ( 3) a contact (5) provided with a plurality of contact pieces (5b) extending to the side and elastically deforming in a direction from the circuit board (3) side toward the bottom surface (2b) side; The contact piece (5b) is in contact with the heating element (4a) in an elastically deformed state.

このような構成によれば、接触片（５ｂ）の弾性変形により、筐体ベース（２）の底面部（２ａ）から発熱素子（４ａ）までの距離にバラツキがあっても、接触片（５ｂ）の弾性変形量が適宜変わることでそのバラツキを吸収でき、接触片（５ｂ）が発熱素子（４ａ）と確実に接触するようにできる。このため、発熱素子（４ａ）で発した熱は接触子（５）を介して筐体ベース（２）に伝えられ、筐体べース（２）を通じて放熱される。   According to such a configuration, even if the distance from the bottom surface portion (2a) of the housing base (2) to the heating element (4a) varies due to elastic deformation of the contact piece (5b), the contact piece (5b) ) Can be absorbed as appropriate, and the contact piece (5b) can be surely brought into contact with the heating element (4a). For this reason, the heat generated by the heat generating element (4a) is transmitted to the casing base (2) through the contact (5) and is radiated through the casing base (2).

このとき、発熱素子（４ａ）と筐体ベース（２）とが接触子（５）に直接接触させられた構造となっているため、従来のようにゲル状部材が介される場合と比べて、効果的に放熱を行うことが可能となる。そして、接触子（５）には複数の接触片（５ｂ）が備えられた構造とされており、発熱素子（４ａ）の場所に関わらず、どこかの接触片（５ｂ）が発熱素子（４ａ）と直接接触する。このため、汎用性に富んだ放熱構造とすることが可能となる。したがって、汎用性に富み、かつ、効果的な放熱が行える放熱構造を有する電子制御装置とすることが可能となる。   At this time, since the heating element (4a) and the housing base (2) have a structure in which they are in direct contact with the contact (5), compared to the case where a gel-like member is interposed as in the prior art, It is possible to effectively dissipate heat. The contact (5) has a structure provided with a plurality of contact pieces (5b), and any contact piece (5b) becomes a heating element (4a) regardless of the location of the heating element (4a). ) Directly. For this reason, it becomes possible to set it as the heat dissipation structure rich in versatility. Therefore, it is possible to provide an electronic control device having a heat dissipation structure that is versatile and capable of effective heat dissipation.

例えば、請求項２に示すように、接触子（５）は、筐体ベース（２）の底面部（２ｂ）に配置される平面部（５ａ）を有し、複数の接触片（５ｂ）が平面部（５ａ）から回路基板（３）側に延びるように備えられ、複数の接触片（５ｂ）は平面部（５ａ）に対して傾斜させられた構造とされる。   For example, as shown in claim 2, the contact (5) has a flat surface portion (5a) disposed on the bottom surface portion (2b) of the housing base (2), and a plurality of contact pieces (5b) are provided. It is provided so as to extend from the flat surface portion (5a) to the circuit board (3) side, and the plurality of contact pieces (5b) are inclined with respect to the flat surface portion (5a).

この場合、請求項３に示すように、複数の接触片（５ｂ）を平面部（５ａ）に対して傾斜させられた傾斜面（５ｃ）を有した構造とすることができる。そして、請求項４に示すように、傾斜面（５ｃ）の先端を平面部（５ａ）側に曲げられることで折り返された折返し部（５ｄ）とさすることができる。   In this case, as shown in claim 3, the plurality of contact pieces (5b) can have a structure having an inclined surface (5c) inclined with respect to the flat surface portion (5a). And as shown in Claim 4, the front-end | tip of an inclined surface (5c) can be made into the folding | returning part (5d) folded by bending to the plane part (5a) side.

これらの場合に、請求項５に示すように、接触片（５ｂ）のうち傾斜面（５ｃ）と折返し部（５ｄ）との境界部であって傾斜面の先端の曲げられた内側に切り欠き溝（５ｆ）を形成すると好ましい。   In these cases, as shown in claim 5, the contact piece (5b) is a boundary portion between the inclined surface (5c) and the folded portion (5d), and is cut out at the bent inner side of the inclined surface. It is preferable to form the groove (5f).

このような切り欠き溝（５ｆ）を形成すると、発熱素子（４ａ）と接触したときに加えられる荷重により、接触片（５ｂ）が発熱素子（４ａ）と接触する前の状態のときと比べて、発熱素子（４ａ）と接触した後に折返し部（５ｄ）をより折り曲げることが可能となる。これにより、発熱素子（４ａ）と接触片（５ｂ）との接触面積を広げることができ、より放熱効率を高くすることが可能となる。   When such a notch groove (5f) is formed, the contact piece (5b) is compared with the state before the contact piece (5b) is in contact with the heating element (4a) due to the load applied when contacting the heating element (4a). The folded portion (5d) can be further bent after coming into contact with the heating element (4a). Thereby, the contact area of a heat generating element (4a) and a contact piece (5b) can be expanded, and it becomes possible to make heat dissipation efficiency higher.

このような接触子（５）は、例えば、請求項６に示すように、一枚の金属板を打ち抜くことにより構成される。この場合、複数の接触片（５ｂ）のうち回路基板（３）側の面には絶縁フィルム（５ｇ）が備えるようにすれば、発熱素子（４ａ）同士の間などの絶縁を確保しなければならない場合に、接触子（５）を通じて電気的に接続されてしまうことを防止することができる。   Such a contact (5) is constituted, for example, by punching out a single metal plate as shown in claim 6. In this case, if the insulating film (5g) is provided on the surface of the plurality of contact pieces (5b) on the circuit board (3) side, insulation between the heating elements (4a) must be ensured. If this is not the case, it is possible to prevent electrical connection through the contact (5).

この場合、請求項８に示すように、絶縁フィルム（５ｇ）を複数の接触片（５ｂ）の先端の端面にも回り込んで配置すると好ましい。   In this case, as shown in claim 8, it is preferable to arrange the insulating film (5g) so as to also wrap around the end surfaces of the tips of the plurality of contact pieces (5b).

このようにすれば、接触片（５ｂ）の先端（具体的には折返し部（５ｄ）の先端）において発熱素子（４ａ）が電気的に接続されてしまうことを防止でき、より確実に絶縁性を確保することが可能となる。   In this way, it is possible to prevent the heating element (4a) from being electrically connected at the tip of the contact piece (5b) (specifically, the tip of the folded portion (5d)), and more reliably insulative. Can be secured.

また、請求項９に示すように、接触子（５）を熱導電性フィラーを混入した樹脂にて構成することもできる。このようにすれば、接触片（５ｂ）に絶縁フィルム（５ｇ）を貼り付けるなどの絶縁処置を不要にすることができる。   In addition, as shown in claim 9, the contact (5) can be made of a resin mixed with a thermally conductive filler. If it does in this way, insulation treatment, such as sticking an insulating film (5g) on a contact piece (5b), can be made unnecessary.

なお、複数の接触片（５ｂ）の配置は任意であるが、例えば、請求項１０に記載したように、平面部（５ａ）の一方向を縦方向とし、該縦方向に垂直な方向を横方向として、縦方向および横方向に所定数ずつ接触片（５ｂ）を配列することができる。   Although the arrangement of the plurality of contact pieces (5b) is arbitrary, for example, as described in claim 10, one direction of the plane portion (5a) is a vertical direction, and a direction perpendicular to the vertical direction is a horizontal direction. A predetermined number of contact pieces (5b) can be arranged in the vertical direction and the horizontal direction as directions.

この場合、請求項１１に記載したように、縦方向および横方向において所定間隔を空けて接触片（５ｂ）を配置しても良いし、請求項１２に示すように、横方向において所定間隔を空けて接触片（５ｂ）を配置し、縦方向において間隔を空けずに接触片（５ｂ）を配置しても良い。   In this case, as described in claim 11, the contact pieces (5b) may be arranged with a predetermined interval in the vertical direction and the horizontal direction, and as shown in claim 12, the predetermined interval in the horizontal direction. The contact piece (5b) may be arranged with a space, and the contact piece (5b) may be arranged without a gap in the vertical direction.

さらに、請求項１３に示すように、複数の接触片（５ｂ）を、それぞれ、複数に分断することもできる。このように各接触片（５ｂ）を複数本に分断することにより、より接触片（５ｂ）を発熱素子（４ａ）の形状に合わせて弾性変形させることが可能となる。これにより、より接触片（５ｂ）が発熱素子（４ａ）と接触する面積を増加させることが可能となる。このため、より放熱効率を高めることが可能となる。   Furthermore, as shown in claim 13, each of the plurality of contact pieces (5b) can be divided into a plurality of pieces. Thus, by dividing each contact piece (5b) into a plurality of pieces, the contact piece (5b) can be more elastically deformed according to the shape of the heating element (4a). Thereby, it becomes possible to increase the area where the contact piece (5b) contacts the heating element (4a). For this reason, it becomes possible to raise heat dissipation efficiency more.

また、請求項１４に示すように、複数の接触片（５ｂ）を針状に構成することもできる。   Moreover, as shown in Claim 14, a several contact piece (5b) can also be comprised in needle shape.

請求項１５に記載の発明では、回路基板（３）と筐体ベース（２）の底面部（２ｂ）との間には、金属板を複数折り返して構成した曲げ加工部（５ｅ）を備えたアコーディオン形状の接触子（５）が備えられ、曲げ加工部（５ｅ）が底面部（２ｂ）側から回路基板（３）側に延び、かつ、回路基板（３）側から底面部（２ｂ）側に向かう方向に弾性変形するように構成され、複数の曲げ加工部（５ｅ）が弾性変形した状態で発熱素子（４ａ）と接触していることを特徴としている。   In the invention described in claim 15, a bent portion (5e) formed by folding a plurality of metal plates is provided between the circuit board (3) and the bottom surface portion (2b) of the housing base (2). The accordion-shaped contact (5) is provided, the bent portion (5e) extends from the bottom surface (2b) side to the circuit board (3) side, and the circuit board (3) side to the bottom surface portion (2b) side. The plurality of bent portions (5e) are in contact with the heating element (4a) in an elastically deformed state.

このように、接触子（５）の形状を複数の曲げ加工部（５ｅ）が備えられたアコーディオン形状としても請求項１と同様の効果を得ることが可能となる。   Thus, even when the shape of the contact (5) is changed to the accordion shape provided with the plurality of bent portions (5e), the same effect as in the first aspect can be obtained.

請求項１６に記載の発明では、回路基板（３）と筐体ベース（２）の底面部（２ｂ）との間のうち発熱素子（４ａ）と対応する位置には、金属バネ部材にて構成された接触子（５）が備えられ、接触子（５）が回路基板（３）側から底面部（２ｂ）側に向かう方向に弾性変形するように構成され、接触子（５）が弾性変形した状態で発熱素子（４ａ）と接触していることを特徴としている。   In the invention described in claim 16, a metal spring member is provided at a position corresponding to the heating element (4a) between the circuit board (3) and the bottom surface portion (2b) of the housing base (2). The contact (5) is provided, and the contact (5) is elastically deformed in a direction from the circuit board (3) side to the bottom surface (2b) side, and the contact (5) is elastically deformed. It is characterized in that it is in contact with the heating element (4a) in the state where

このように、接触子（５）を発熱素子（４ａ）の配置場所と対応した位置に配置するようにすれば、確実に接触子（５）と発熱素子（４ａ）とを接触させることが可能となり、請求項１と同様の効果を得ることができる。   Thus, if the contact (5) is arranged at a position corresponding to the place where the heating element (4a) is arranged, the contact (5) and the heating element (4a) can be reliably brought into contact with each other. Thus, the same effect as in the first aspect can be obtained.

なお、上記各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示すものである。   In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各実施形態相互において、互いに同一もしくは均等である部分には、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

（第１実施形態）
本発明の第１実施形態について説明する。図１は、本実施形態にかかる放熱構造を有する電子制御装置の断面図である。この電子制御装置は、例えば車両に搭載されるエンジン制御装置（エンジンＥＣＵ）などに適用される。以下、この図を参照して本実施形態の電子制御装置の構成について説明する。 (First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of an electronic control device having a heat dissipation structure according to the present embodiment. This electronic control device is applied to, for example, an engine control device (engine ECU) mounted on a vehicle. Hereinafter, the configuration of the electronic control device of the present embodiment will be described with reference to this figure.

図１に示すように、電子制御装置は、筐体蓋１、筐体ベース２、回路基板３、電子部品４および接触子５を有して構成されている。   As shown in FIG. 1, the electronic control device includes a housing lid 1, a housing base 2, a circuit board 3, an electronic component 4, and a contact 5.

筐体蓋１は、例えば四角形状の上面部１ａと、上面部１ａに対して垂直に設けられた側壁部１ｂとを有して構成されている。この筐体蓋１は、例えば鉄などの金属または樹脂により構成され、プレス成形、射出成形などによって形成される。また、筐体蓋１のうち、側壁部１ｂには、側壁部１ｂよりも更に外側に張り出すフランジ部１ｃが備えられている。このフランジ部１ｃには図示しないがネジ穴などが形成されている。   The housing lid 1 includes, for example, a rectangular upper surface portion 1a and a side wall portion 1b provided perpendicular to the upper surface portion 1a. The housing lid 1 is made of, for example, a metal such as iron or a resin, and is formed by press molding, injection molding, or the like. Further, in the case lid 1, the side wall portion 1 b is provided with a flange portion 1 c that projects further outward than the side wall portion 1 b. Although not shown, the flange portion 1c is formed with a screw hole or the like.

筐体ベース２は、筐体蓋１と同様、例えば四角形状の底面部２ａと、底面部２ａに対して垂直に設けられた側壁部２ｂとを有して構成されており、例えばアルミなどの金属により構成され、ダイカスト、鍛造などにより形成される。そして、筐体ベース２の側壁部２ｂは、筐体蓋１のフランジ部１ｃを搭載する搭載面が構成される程度の厚みとされており、フランジ部１ｃに形成されたネジ穴と対応する位置に雌ネジ穴が形成されている。そして、筐体蓋１にて筐体ベース２を蓋締めしたのち、ネジ６にてこれらを固定することにより、これらの内部に空間７が構成され、この空間に回路基板３や電子部品４および接触子５が収容されている。このように、筐体蓋１および筐体ベース２により、筐体が構成されている。なお、筐体ベース２における側壁部２ｂの搭載面には、後述する回路基板３に形成されたネジ穴と対応する位置に図示しない雌ネジ穴が形成されており、このネジ穴にネジ８を締結することにより、回路基板３が側壁部２ｂの搭載面に固定される。   The housing base 2 is configured to have, for example, a rectangular bottom surface portion 2a and a side wall portion 2b provided perpendicular to the bottom surface portion 2a, for example, aluminum. It is made of metal and is formed by die casting, forging, or the like. And the side wall part 2b of the housing | casing base 2 is set to the thickness which the mounting surface which mounts the flange part 1c of the housing | casing lid | cover 1 is comprised, and the position corresponding to the screw hole formed in the flange part 1c. The female screw hole is formed in. Then, after closing the housing base 2 with the housing lid 1 and fixing them with the screws 6, spaces 7 are formed inside these, and the circuit board 3, the electronic component 4, and the like are formed in these spaces. A contact 5 is accommodated. In this way, the housing is constituted by the housing lid 1 and the housing base 2. Note that a female screw hole (not shown) is formed at a position corresponding to a screw hole formed in the circuit board 3 to be described later on the mounting surface of the side wall 2b in the housing base 2, and the screw 8 is inserted into this screw hole. By fastening, the circuit board 3 is fixed to the mounting surface of the side wall 2b.

回路基板３は、プリント基板やセラミック基板などのように周知の基板にて構成されており、図示しないパターン配線が形成されている。この回路基板３のパターン配線と電気的に接続されるように各種電子部品４が回路基板３の表裏面に実装されることで電子制御装置の電気回路が構成されている。この回路基板３の形状は任意であるが、筐体ベース２の側壁部２ｂの搭載面に搭載可能な形状、例えば筐体ベース２と同様の四角形状とされる。また、回路基板３の外縁部にはネジ穴が形成されており、上述したように筐体ベース２の側壁部２ｂへの固定に用いられる。本実施形態の場合、回路基板３を筐体ベース２の側壁部２ｂに固定した状態において、回路基板３の裏面から筐体ベース２の底面部２ａまでの距離は筐体ベース２の側壁部２ｂの高さによって決まるため、側壁部２ｂの高さを所望値にすることによりこの距離が調整されている。   The circuit board 3 is formed of a known board such as a printed board or a ceramic board, and pattern wiring (not shown) is formed. Various electronic components 4 are mounted on the front and back surfaces of the circuit board 3 so as to be electrically connected to the pattern wiring of the circuit board 3 to constitute an electric circuit of the electronic control device. The shape of the circuit board 3 is arbitrary, but is a shape that can be mounted on the mounting surface of the side wall portion 2 b of the housing base 2, for example, a rectangular shape similar to the housing base 2. Further, a screw hole is formed in the outer edge portion of the circuit board 3, and is used for fixing the housing base 2 to the side wall portion 2b as described above. In the case of this embodiment, in a state where the circuit board 3 is fixed to the side wall 2b of the housing base 2, the distance from the back surface of the circuit board 3 to the bottom surface 2a of the housing base 2 is the side wall 2b of the housing base 2. This distance is adjusted by setting the height of the side wall 2b to a desired value.

電子部品４は、電子制御装置の回路を構成する様々な素子であり、発熱素子４ａを含んでいる。発熱素子４ａとしては、例えばパワートランジスタ、ツェナーダイオード、パワー素子が混成集積化されたパワーＩＣなどが挙げられ、回路基板３に対して例えばはんだ付け実装されることで回路基板３に形成されたパターン配線と電気的に接続されている。電子部品４のうちの一部、特に発熱素子４ａは回路基板３の裏面に実装されている。発熱素子４ａの高さ、つまり回路基板３の裏面から発熱素子４ａの表面までの距離は発熱素子４ａの種類等によって異なっているため、様々となっている。   The electronic component 4 is various elements constituting a circuit of the electronic control device, and includes a heating element 4a. Examples of the heating element 4a include a power transistor, a Zener diode, and a power IC in which power elements are integrated and integrated. A pattern formed on the circuit board 3 by soldering and mounting the circuit board 3, for example. It is electrically connected to the wiring. A part of the electronic component 4, particularly the heating element 4 a, is mounted on the back surface of the circuit board 3. The height of the heat generating element 4a, that is, the distance from the back surface of the circuit board 3 to the surface of the heat generating element 4a varies depending on the type of the heat generating element 4a and the like.

接触子５は、筐体ベース２の底面部２ａに配置され、底面部２ａと各発熱素子４ａや回路基板３の裏面とを接続し、発熱素子４ａで発した熱を筐体ベース２に伝えて放熱させる役割を果たす。図２は、接触子５の詳細構造を示した図であり、図２（ａ）は接触子５の上面図、図２（ｂ）は接触子５の側面図、図２（ｃ）は接触子５を斜め上方から見たときの斜視図である。   The contact 5 is disposed on the bottom surface 2 a of the housing base 2, connects the bottom surface 2 a to each of the heating elements 4 a and the back surface of the circuit board 3, and transfers heat generated by the heating elements 4 a to the housing base 2. It plays the role of dissipating heat. 2A and 2B are diagrams showing a detailed structure of the contact 5, FIG. 2A is a top view of the contact 5, FIG. 2B is a side view of the contact 5, and FIG. 2C is a contact. It is a perspective view when the child 5 is seen from diagonally upward.

接触子５は、一枚の金属板を打ち抜くことにより形成されており、ネジ止めや接着貼り付けなどにより筐体ベース２の底面部２ａに固定されている。具体的には、接触子５は、図２（ａ）〜（ｃ）に示すように、筐体ベース２の底面部２ａと対向する平面を構成する平面部５ａと、平面部５ａから突出させられた複数の接触片５ｂとを有して構成されている。   The contact 5 is formed by punching a single metal plate, and is fixed to the bottom surface portion 2a of the housing base 2 by screwing or adhesive bonding. Specifically, as shown in FIGS. 2A to 2C, the contact 5 protrudes from the flat surface portion 5 a that forms a flat surface facing the bottom surface portion 2 a of the housing base 2, and the flat surface portion 5 a. And a plurality of contact pieces 5b.

平面部５ａは、筐体ベース２の底面部２ａと同様の形状、つまり四角形状で構成されている。接触子５は、この平面部５ａが筐体ベース２の底面部２ａと接触するように筐体ベース２内に配置されている。   The flat surface portion 5a is configured in the same shape as the bottom surface portion 2a of the housing base 2, that is, a quadrangular shape. The contact 5 is disposed in the housing base 2 so that the flat surface portion 5 a contacts the bottom surface portion 2 a of the housing base 2.

複数の接触片５ｂは、同じ構造とされており、平面部５ａに一端が接続され、かつ、平面部５ａに対して所定角度傾斜させられた傾斜部５ｃと傾斜面と、傾斜部５ｃの他端から延設され、平面部５ａ側に向けて折り返された折返し部５ｄとを有している。そして、複数の接触片５ｂが平面部５ａの縦横の辺に沿ってアレイ状に配列されている。本実施形態では、図２（ａ）の紙面上下方向を縦方向、紙面左右方向を横方向とした場合に、縦方向の辺に７つ、横方向の辺に８つずつ、合計５６個の接触片５ｂが並ぶように配置されている。各接触片５ｂの間には隙間が空けられており、その隙間も平面部５ａとなっている。このような構造の接触片５ｂは、傾斜部５ｃの部分で容易に弾性変形する。このため、図１に示したように電子部品４が実装された回路基板３を筐体ベース２に固定する際に、発熱素子４ａや回路基板３の裏面が折返し部５ｄに接触して更に筐体ベース２の底面部２ａ側に向かって力が加えられると、発熱素子４ａや回路基板３の裏面からの高さに応じて接触片５ｂの傾斜部５ｃが弾性変形させられ、折返し部５ｄもしくは傾斜部５ｃが発熱素子４ａや回路基板３の裏面と確実に接触させられている。したがって、図１に示されるように、発熱素子４ａや回路基板３の裏面からの高さにバラツキがあっても、傾斜部５ｃでの弾性変形量が適宜変わることでそのバラツキが吸収され、折返し部５ｄもしくは傾斜部５ｃが発熱素子４ａや回路基板３の裏面と接触した構造となっている。   The plurality of contact pieces 5b have the same structure, one end of which is connected to the flat surface portion 5a, and an inclined portion 5c and an inclined surface which are inclined at a predetermined angle with respect to the flat surface portion 5a, and the inclined portion 5c. It has a folded portion 5d that extends from the end and is folded back toward the flat surface portion 5a. A plurality of contact pieces 5b are arranged in an array along the vertical and horizontal sides of the flat portion 5a. In the present embodiment, when the vertical direction of the paper surface in FIG. 2A is the vertical direction and the horizontal direction of the paper surface is the horizontal direction, a total of 56 pieces, 7 on the vertical side and 8 on the horizontal side. It arrange | positions so that the contact piece 5b may be located in a line. There is a gap between the contact pieces 5b, and the gap is also a flat portion 5a. The contact piece 5b having such a structure is easily elastically deformed at the inclined portion 5c. For this reason, as shown in FIG. 1, when the circuit board 3 on which the electronic component 4 is mounted is fixed to the housing base 2, the heat generating element 4a and the back surface of the circuit board 3 come into contact with the folded portion 5d and further the housing. When a force is applied toward the bottom surface portion 2a side of the body base 2, the inclined portion 5c of the contact piece 5b is elastically deformed according to the height from the back surface of the heating element 4a or the circuit board 3, and the folded portion 5d or The inclined portion 5 c is reliably brought into contact with the heating element 4 a and the back surface of the circuit board 3. Therefore, as shown in FIG. 1, even if there is a variation in the height from the back surface of the heat generating element 4a or the circuit board 3, the variation is absorbed by changing the amount of elastic deformation at the inclined portion 5c as appropriate. The part 5 d or the inclined part 5 c is in contact with the heating element 4 a and the back surface of the circuit board 3.

以上説明したように、本実施形態では、筐体ベース２の底面部２ａと発熱素子４ａを含む電子部品４が実装された回路基板３の間に、弾性変形可能な接触片５ｂが複数個備えられた接触子５を備えた構造としている。このため、接触片５ｂの弾性変形により、発熱素子４ａや回路基板３の裏面からの高さにバラツキがあっても、傾斜部５ｃでの弾性変形量が適宜変わることでそのバラツキを吸収でき、折返し部５ｄもしくは傾斜部５ｃが発熱素子４ａや回路基板３の裏面と確実に接触するようにできる。このため、発熱素子４ａで発した熱は接触子５を介して筐体ベース２に伝えられ、筐体べース２を通じて放熱される。   As described above, in this embodiment, a plurality of elastically deformable contact pieces 5b are provided between the bottom surface 2a of the housing base 2 and the circuit board 3 on which the electronic component 4 including the heating element 4a is mounted. The contactor 5 is provided with a structure. For this reason, even if there is a variation in the height from the back surface of the heating element 4a or the circuit board 3 due to the elastic deformation of the contact piece 5b, the variation can be absorbed by appropriately changing the elastic deformation amount in the inclined portion 5c, The folded portion 5d or the inclined portion 5c can be reliably in contact with the heating element 4a and the back surface of the circuit board 3. For this reason, the heat generated by the heating element 4 a is transmitted to the housing base 2 through the contact 5 and radiated through the housing base 2.

このとき、発熱素子４ａと筐体ベース２とが接触子５に直接接触させられた構造となっているため、従来のようにゲル状部材が介される場合と比べて、効果的に放熱を行うことが可能となる。そして、接触子５には複数の接触片５ｂが備えられた構造とされており、発熱素子４ａの場所に関わらず、どこかの接触片５ｂが発熱素子４ａと直接接触するような構造となっている。このため、汎用性に富んだ放熱構造とすることが可能となる。したがって、汎用性に富み、かつ、効果的な放熱が行える放熱構造を有する電子制御装置とすることが可能となる。   At this time, since the heat generating element 4a and the housing base 2 are in direct contact with the contact 5, the heat is effectively radiated as compared with the case where a gel-like member is interposed as in the prior art. It becomes possible. The contact 5 has a structure provided with a plurality of contact pieces 5b, and any contact piece 5b is in direct contact with the heating element 4a regardless of the location of the heating element 4a. ing. For this reason, it becomes possible to set it as the heat dissipation structure rich in versatility. Therefore, it is possible to provide an electronic control device having a heat dissipation structure that is versatile and capable of effective heat dissipation.

さらに、このように接触子５の弾性変形によって発熱素子４ａや回路基板３の裏面に折返し部５ｄもしくは傾斜部５ｃが接触した状態となっているため、接触子５の復元力も作用した状態となっている。このため、電子制御装置が車両などの振動が多いものに適用されたとしてもその振動によって発熱素子４ａや回路基板３の裏面から離れてしまうこともない。また、温度変化による熱膨張で発熱素子４ａと平面部５ａの距離が変化しても、同様に発熱素子４ａや回路基板の裏面から離れない。したがって、耐振動性や耐環境性に優れた電子制御装置とすることが可能となる。   Furthermore, since the folded portion 5d or the inclined portion 5c is in contact with the heat generating element 4a and the back surface of the circuit board 3 by the elastic deformation of the contact 5 as described above, the restoring force of the contact 5 is also applied. ing. For this reason, even if the electronic control device is applied to a vehicle having a lot of vibration, the vibration does not leave the heating element 4a and the back surface of the circuit board 3. Further, even if the distance between the heating element 4a and the flat portion 5a changes due to thermal expansion due to temperature change, the heating element 4a and the back surface of the circuit board are not similarly separated. Therefore, it is possible to provide an electronic control device having excellent vibration resistance and environmental resistance.

（第２実施形態）
本発明の第２実施形態について説明する。本実施形態は、第１実施形態に対して接触子５の構造を変更したものであり、その他に関しては第１実施形態と同様であるため、異なる部分についてのみ説明する。 (Second Embodiment)
A second embodiment of the present invention will be described. In the present embodiment, the structure of the contact 5 is changed with respect to the first embodiment, and the others are the same as those in the first embodiment, and therefore only different parts will be described.

図３は、本実施形態にかかる電子制御装置に用いられる接触子５の詳細構造を示した図であり、図３（ａ）は接触子５の上面図、図３（ｂ）は接触子５の側面図、図３（ｃ）は接触子５を斜め上方から見たときの斜視図である。   FIG. 3 is a diagram showing a detailed structure of the contact 5 used in the electronic control device according to the present embodiment, where FIG. 3 (a) is a top view of the contact 5 and FIG. 3 (b) is the contact 5. FIG. 3C is a perspective view of the contact 5 as viewed obliquely from above.

図３（ａ）〜（ｃ）に示すように、本実施形態では、接触子５に備えられた複数の接触片５ｂのうち縦方向に隣り合っているもの同士が互いに間隔無く配置された状態となっており、各接触片５ｂの間が平面部５ａとされていない構造とされている。このような構造によれば、第１実施形態と同じサイズの接触子５に対してより多くの接触片５ｂを備えることが可能となり、より接触片５ｂが発熱素子４ａや回路基板３の裏面と接触する面積を増加させることが可能となる。このため、より放熱効率を高めることが可能となる。   As shown in FIGS. 3A to 3C, in this embodiment, among the plurality of contact pieces 5 b provided in the contactor 5, those adjacent in the vertical direction are arranged without any interval. It is set as the structure which is not made into the plane part 5a between each contact piece 5b. According to such a structure, it becomes possible to provide more contact pieces 5b with respect to the contact 5 having the same size as that of the first embodiment, and the contact pieces 5b are connected to the heating element 4a and the back surface of the circuit board 3 with each other. It is possible to increase the contact area. For this reason, it becomes possible to raise heat dissipation efficiency more.

（第３実施形態）
本発明の第３実施形態について説明する。本実施形態は、第１実施形態に対して接触子５の構造を変更したものであり、その他に関しては第１実施形態と同様であるため、異なる部分についてのみ説明する。 (Third embodiment)
A third embodiment of the present invention will be described. In the present embodiment, the structure of the contact 5 is changed with respect to the first embodiment, and the others are the same as those in the first embodiment, and therefore only different parts will be described.

図４は、本実施形態にかかる電子制御装置に用いられる接触子５の詳細構造を示した図であり、図４（ａ）は接触子５の上面図、図４（ｂ）は接触子５の側面図、図４（ｃ）は接触子５を斜め上方から見たときの斜視図である。   FIG. 4 is a diagram showing a detailed structure of the contact 5 used in the electronic control device according to the present embodiment, where FIG. 4 (a) is a top view of the contact 5 and FIG. 4 (b) is the contact 5. FIG. 4C is a perspective view of the contact 5 as viewed from obliquely above.

図４（ａ）〜（ｃ）に示すように、本実施形態では、接触子５に備えられた各接触片５ｂをさらに横方向に分断することにより、各接触片５ｂを複数本にしている。このように各接触片５ｂを複数本に分断することにより、より接触片５ｂを発熱素子４ａや回路基板３の裏面の形状に合わせて弾性変形させることが可能となる。これにより、より接触片５ｂが発熱素子４ａや回路基板３の裏面と接触する面積を増加させることが可能となる。このため、より放熱効率を高めることが可能となる。   As shown in FIGS. 4A to 4C, in the present embodiment, the contact pieces 5 b provided in the contactor 5 are further divided in the lateral direction, thereby forming a plurality of contact pieces 5 b. . Thus, by dividing each contact piece 5b into a plurality of pieces, the contact piece 5b can be more elastically deformed according to the shape of the heating element 4a and the back surface of the circuit board 3. Thereby, the contact area of the contact piece 5b with the heating element 4a and the back surface of the circuit board 3 can be increased. For this reason, it becomes possible to raise heat dissipation efficiency more.

（第４実施形態）
本発明の第４実施形態について説明する。本実施形態は、第１実施形態に対して接触子５の構造を変更したものであり、その他に関しては第１実施形態と同様であるため、異なる部分についてのみ説明する。 (Fourth embodiment)
A fourth embodiment of the present invention will be described. In the present embodiment, the structure of the contact 5 is changed with respect to the first embodiment, and the others are the same as those in the first embodiment, and therefore only different parts will be described.

図５は、本実施形態にかかる電子制御装置の断面図である。また、図６は、図５に示す電子制御装置に用いられる接触子５の詳細構造を示した図であり、図６（ａ）は接触子５の上面図、図６（ｂ）は接触子５の側面図である。   FIG. 5 is a cross-sectional view of the electronic control device according to the present embodiment. 6 is a diagram showing a detailed structure of the contact 5 used in the electronic control device shown in FIG. 5, FIG. 6 (a) is a top view of the contact 5, and FIG. 6 (b) is a contact. 5 is a side view of FIG.

図５および図６（ａ）、（ｂ）に示すように、本実施形態では、複数の曲げ加工部５ｅを備えるアコーディオン形状により接触子５を構成している。この接触子５は、一枚の金属板を横方向において曲げ加工することにより構成されている。複数の曲げ加工部５ｅを構成する各面は、それぞれ接触子５を上方から見たときの縦横の辺にて構成される平面に対して傾斜させられており、容易に弾性変形する。このため、電子部品４が実装された回路基板３を筐体ベース２に固定する際に、発熱素子４ａや回路基板３の裏面が曲げ加工部５ｅに接触して更に筐体ベース２の底面部２ａ側に向かって力が加えられると、発熱素子４ａや回路基板３の裏面からの高さに応じて曲げ加工部５ｅが弾性変形させられ、曲げ加工部５ｅが発熱素子４ａや回路基板３の裏面と確実に接触させられる。   As shown in FIG. 5 and FIGS. 6A and 6B, in this embodiment, the contactor 5 is configured by an accordion shape including a plurality of bending portions 5e. The contact 5 is configured by bending a single metal plate in the lateral direction. Each surface constituting the plurality of bending portions 5e is inclined with respect to a plane constituted by vertical and horizontal sides when the contact 5 is viewed from above, and is easily elastically deformed. For this reason, when the circuit board 3 on which the electronic component 4 is mounted is fixed to the housing base 2, the heat generating element 4 a and the back surface of the circuit board 3 come into contact with the bent portion 5 e and further the bottom surface portion of the housing base 2. When a force is applied toward the side 2a, the bent portion 5e is elastically deformed according to the height from the back surface of the heat generating element 4a and the circuit board 3, and the bent portion 5e is deformed by the heat generating element 4a and the circuit board 3. Secure contact with the back side.

このように、接触子５の形状を複数の曲げ加工部５ｅが備えられたアコーディオン形状としても第１実施形態と同様の効果を得ることが可能となる。また、第１〜第３実施形態のように、接触子５を一枚の金属板を打ち抜いて形成する場合、曲げ加工部５ｅの配置密度に制限があるが、本実施形態の場合には、接触子５を一枚の金属板を打ち抜いて形成していないため、曲げ加工部５ｅの配置密度をより密集させることが可能となる。これにより、より放熱効果を高めることが可能となる。   Thus, even if the shape of the contactor 5 is changed to the accordion shape provided with the plurality of bending portions 5e, the same effect as that of the first embodiment can be obtained. In addition, when the contactor 5 is formed by punching a single metal plate as in the first to third embodiments, the arrangement density of the bent portions 5e is limited, but in the case of this embodiment, Since the contact 5 is not formed by punching a single metal plate, it is possible to make the arrangement density of the bent portions 5e denser. Thereby, it is possible to further enhance the heat dissipation effect.

さらに、本実施形態の場合、曲げ加工部５ｅの幅、つまり接触子５のうち筐体ベース２の平面部５ａと接触する側から発熱素子４ａや回路基板３の裏面と接触する側までの長さを適宜調整できるため、筐体ベース２の平面部５ａと回路基板３との距離が長くなったとしても、確実に接触子５を発熱素子４ａや回路基板３の裏面に接触させることが可能となる。   Furthermore, in the case of the present embodiment, the width of the bending portion 5e, that is, the length from the side of the contact 5 that contacts the flat portion 5a of the housing base 2 to the side that contacts the heating element 4a and the back surface of the circuit board 3 Since the height can be adjusted as appropriate, even when the distance between the flat portion 5a of the housing base 2 and the circuit board 3 is increased, the contact 5 can be reliably brought into contact with the heating element 4a and the back surface of the circuit board 3. It becomes.

なお、図６（ａ）に破線で記載したが、接触子５の複数の曲げ加工部５ｅを複数に分断するように、縦方向にスリットを入れることもできる。このようなスリットを入れると、より各曲げ加工部５ｅを発熱素子４ａの形状に沿って弾性変形させられる。このため、より曲げ加工部５ｅが発熱素子４ａや回路基板３の裏面と接触する面積を増加させることが可能となり、より放熱効率を高めることが可能となる。   In addition, although described with the broken line in Fig.6 (a), a slit can also be put in the vertical direction so that the some bending process part 5e of the contactor 5 may be divided | segmented into plurality. When such a slit is inserted, each bending portion 5e can be elastically deformed along the shape of the heating element 4a. For this reason, it is possible to increase the area where the bent portion 5e is in contact with the heating element 4a and the back surface of the circuit board 3, thereby further improving the heat dissipation efficiency.

（第５実施形態）
本発明の第５実施形態について説明する。本実施形態は、第１実施形態に対して接触子５の構造を変更したものであり、その他に関しては第１実施形態と同様であるため、異なる部分についてのみ説明する。 (Fifth embodiment)
A fifth embodiment of the present invention will be described. In the present embodiment, the structure of the contact 5 is changed with respect to the first embodiment, and the others are the same as those in the first embodiment, and therefore only different parts will be described.

図７は、本実施形態にかかる電子制御装置の断面図である。また、図８は、図７に示す電子制御装置に用いられる接触子５の側面図である。   FIG. 7 is a cross-sectional view of the electronic control device according to the present embodiment. FIG. 8 is a side view of the contact 5 used in the electronic control device shown in FIG.

図７および図８に示すように、本実施形態では、接触子５を平面部５ａに無数の針状の接触片５ｂを建植した構成としている。無数の針状の接触片５ｂは平面部５ａに対して傾斜させられており、容易に弾性変形するようになっている。このため、電子部品４が実装された回路基板３を筐体ベース２に固定する際に、発熱素子４ａや回路基板３の裏面が接触片５ｂに接触して更に筐体ベース２の底面部２ａ側に向かって力が加えられると、発熱素子４ａや回路基板３の裏面からの高さに応じて接触片５ｂが容易に弾性変形させられ、接触片５ｂが発熱素子４ａや回路基板３の裏面と確実に接触させられる。   As shown in FIGS. 7 and 8, in the present embodiment, the contactor 5 has a configuration in which an infinite number of needle-like contact pieces 5b are erected on the flat surface portion 5a. The innumerable needle-like contact pieces 5b are inclined with respect to the flat surface portion 5a, and are easily elastically deformed. For this reason, when the circuit board 3 on which the electronic component 4 is mounted is fixed to the housing base 2, the back surface of the heating element 4 a or the circuit board 3 comes into contact with the contact piece 5 b and further the bottom surface portion 2 a of the housing base 2. When a force is applied toward the side, the contact piece 5b is easily elastically deformed according to the height from the back surface of the heat generating element 4a or the circuit board 3, and the contact piece 5b becomes the back surface of the heat generating element 4a or the circuit board 3. Can be contacted securely.

このように、接触子５の形状を無数の針状の接触片５ｂが備えられた形状としても第１実施形態と同様の効果を得ることが可能となる。また、第１〜第３実施形態のように、接触子５を一枚の金属板を打ち抜いて形成する場合、接触片５ｂの配置密度に制限があるが、本実施形態の場合には、接触子５に形成する無数の針状の接触片５ｂの配置密度をより密集させることが可能となる。これにより、より放熱効果を高めることが可能となる。   Thus, even if the shape of the contactor 5 is a shape provided with innumerable needle-like contact pieces 5b, the same effects as those of the first embodiment can be obtained. Moreover, when the contactor 5 is formed by punching a single metal plate as in the first to third embodiments, the arrangement density of the contact pieces 5b is limited. It becomes possible to make the arrangement density of the countless needle-like contact pieces 5b formed on the child 5 denser. Thereby, it is possible to further enhance the heat dissipation effect.

さらに、本実施形態の場合、無数の針状の接触片５ｂの高さを適宜調整できるため、筐体ベース２の平面部５ａと回路基板３との距離が長くなったとしても、確実に接触子５を発熱素子４ａや回路基板３の裏面に接触させることが可能となる。   Furthermore, in the case of this embodiment, since the height of the innumerable needle-like contact pieces 5b can be adjusted as appropriate, even if the distance between the flat portion 5a of the housing base 2 and the circuit board 3 is increased, the contact is surely made The child 5 can be brought into contact with the heating element 4a and the back surface of the circuit board 3.

（第６実施形態）
本発明の第６実施形態について説明する。本実施形態は、第１実施形態に対して接触子５の構造を変更したものであり、その他に関しては第１実施形態と同様であるため、異なる部分についてのみ説明する。 (Sixth embodiment)
A sixth embodiment of the present invention will be described. In the present embodiment, the structure of the contact 5 is changed with respect to the first embodiment, and the others are the same as those in the first embodiment, and therefore only different parts will be described.

図９は、本実施形態にかかる電子制御装置の断面図である。また、図１０は、図９に示す電子制御装置の回路基板３を筐体ベース２に固定する前の様子を示した断面図である。   FIG. 9 is a cross-sectional view of the electronic control device according to the present embodiment. FIG. 10 is a cross-sectional view showing a state before the circuit board 3 of the electronic control device shown in FIG. 9 is fixed to the housing base 2.

図９および図１０に示されるように、接触子５は、Ｕ字状の金属バネ部材で構成されており、各接触子５は、それぞれ各発熱素子４ａの配置場所と対応した位置に接着固定されている。接触子５の高さは、回路基板３を筐体ベース２に固定したときに最も筐体ベース２の底面部２ａから遠くなる発熱素子４ａまでの距離より高くしてある。   As shown in FIG. 9 and FIG. 10, the contact 5 is formed of a U-shaped metal spring member, and each contact 5 is bonded and fixed at a position corresponding to the location of each heating element 4 a. Has been. The height of the contact 5 is higher than the distance from the bottom surface portion 2a of the housing base 2 to the heat generating element 4a farthest when the circuit board 3 is fixed to the housing base 2.

このように、接触子５を各発熱素子４ａの配置場所と対応した位置に配置するようにすれば、確実に接触子５と発熱素子４ａとを接触させることが可能となり、上記第１実施形態と同様の効果を得ることができる。また、接触子５が弾性変形するため、発熱素子４ａに過大な荷重が掛からないようにできる。   Thus, if the contactor 5 is arranged at a position corresponding to the place where each heating element 4a is arranged, the contactor 5 and the heating element 4a can be reliably brought into contact with each other, and the first embodiment described above. The same effect can be obtained. Further, since the contact 5 is elastically deformed, it is possible to prevent an excessive load from being applied to the heating element 4a.

ただし、この場合、機種ごとに接触子５の場所を調整しなければならないが、接触子５の場所については、自動設置装置を用いて予め設定しておいたプログラムにしたがって適切な位置に接着できるため、発熱素子４ａの場所が異なる機種に対しても共通の筐体ベース２を用いて対応することが可能となる。このため、筐体ベース２に突起を設ける場合のように筐体ベース２の形状を機種ごとに変更しなければならない場合と比較すれば、汎用性に富み、かつ、効果的な放熱が行える放熱構造を有する電子制御装置にできる。   However, in this case, the location of the contact 5 must be adjusted for each model, but the location of the contact 5 can be adhered to an appropriate position according to a program set in advance using an automatic installation device. Therefore, it is possible to cope with models having different locations of the heating elements 4a by using the common housing base 2. For this reason, compared with the case where the shape of the housing base 2 has to be changed for each model as in the case where the housing base 2 is provided with a protrusion, the heat radiation is more versatile and can effectively dissipate heat. An electronic control device having a structure can be obtained.

（他の実施形態）
（１）上記第１〜第３実施形態では、接触片５ｂを傾斜部５ｃと折返し部５ｄにて構成するものについて説明したが、接触片５ｂに更に構造的な特徴を加えることも可能である。これについて、図１１〜図１２を参照して説明する。 (Other embodiments)
(1) In the first to third embodiments described above, the contact piece 5b is configured by the inclined portion 5c and the folded portion 5d. However, further structural features can be added to the contact piece 5b. . This will be described with reference to FIGS.

図１１（ａ）、（ｂ）は、接触片５ｂおよび発熱素子４ａの部分拡大図であり、図１１（ａ）は、接触片５ｂが発熱素子４ａと接触する前の状態、図１１（ｂ）は、接触片５ｂが発熱素子４ａと接触した後の状態を示している。図１１（ａ）、（ｂ）に示すように、傾斜部５ｃと折返し部５ｄとの境界位置、具体的には傾斜部５ｃに対して折返し部５ｄを曲げたときの曲げ内側に切り欠き溝５ｆを形成してある。このような切り欠き溝５ｆを形成すると、発熱素子４ａと接触したときに加えられる荷重により、接触片５ｂが発熱素子４ａと接触する前の状態のときと比べて、発熱素子４ａと接触した後に折返し部５ｄをより折り曲げることが可能となる。これにより、発熱素子４ａと接触片５ｂとの接触面積を広げることができ、より放熱効率を高くすることが可能となる。   11A and 11B are partial enlarged views of the contact piece 5b and the heating element 4a. FIG. 11A shows a state before the contact piece 5b comes into contact with the heating element 4a, and FIG. ) Shows a state after the contact piece 5b comes into contact with the heating element 4a. As shown in FIGS. 11 (a) and 11 (b), the boundary position between the inclined portion 5c and the folded portion 5d, specifically, a notch groove on the inner side when the folded portion 5d is bent with respect to the inclined portion 5c. 5f is formed. When such a notch groove 5f is formed, the load applied when contacting the heating element 4a causes the contact piece 5b to contact the heating element 4a as compared with the state before the contact piece 5b contacts the heating element 4a. It is possible to further fold the folded portion 5d. Thereby, the contact area of the heat generating element 4a and the contact piece 5b can be expanded, and it becomes possible to make heat dissipation efficiency higher.

図１２（ａ）〜（ｄ）は、接触片５ｂに対して絶縁処理を施した場合の部分断面図である。   12A to 12D are partial cross-sectional views when the contact piece 5b is insulated.

図１２（ａ）に示すように、少なくとも接触片５ｂの表面を含む接触子５の表面に絶縁材料にて構成された絶縁フィルム５ｇを貼り付けてある。このような構造とすれば、発熱素子４ａ同士の間や発熱素子４ａと回路基板３の裏面との間の絶縁を確保しなければならない場合に、接触子５を通じて電気的に接続されてしまうことを防止することができる。   As shown to Fig.12 (a), the insulating film 5g comprised with the insulating material is affixed on the surface of the contactor 5 including the surface of the contact piece 5b at least. With such a structure, when insulation between the heat generating elements 4a and between the heat generating elements 4a and the back surface of the circuit board 3 must be ensured, they are electrically connected through the contactor 5. Can be prevented.

この場合において、図１２（ｂ）に示すように、絶縁フィルム５ｇを接触片５ｂの先端に回り込ませるようにすると好ましい。このようにすれば、接触片５ｂの先端（具体的には折返し部５ｄの先端）において発熱素子４ａや回路基板３の裏面が電気的に接続されてしまうことを防止でき、より確実に絶縁性を確保することが可能となる。   In this case, as shown in FIG. 12B, the insulating film 5g is preferably wrapped around the tip of the contact piece 5b. In this way, it is possible to prevent the heat generating element 4a and the back surface of the circuit board 3 from being electrically connected at the front end of the contact piece 5b (specifically, the front end of the folded portion 5d), thereby ensuring more reliable insulation. Can be secured.

また、図１２（ｃ）に示すように、接触片５ｂの先端をさらに平面部５ａ側に向けて屈曲させ、その屈曲部５ｈにも絶縁フィルム５ｇを貼り付けるようにすれば、更に確実に絶縁性を確保することが可能となる。同様に、図１２（ｄ）に示すように、接触片５ｂの先端に段差加工し、その段差加工部５ｉにも絶縁フィルム５ｇを貼り付けるようにすれば、更に確実に絶縁性を確保することが可能となる。   Further, as shown in FIG. 12 (c), if the tip of the contact piece 5b is further bent toward the flat portion 5a side, and the insulating film 5g is attached to the bent portion 5h, the insulation can be more reliably performed. It becomes possible to ensure the sex. Similarly, as shown in FIG. 12 (d), if the step is processed at the tip of the contact piece 5b and the insulating film 5g is attached to the step processed portion 5i, the insulating property can be ensured more reliably. Is possible.

なお、ここでは絶縁フィルム５ｇを貼り付ける場合について説明したが、接触子５のうち少なくとも接触片５ｂに対して絶縁性の塗装を行うことによっても、絶縁性を確保することができる。   In addition, although the case where the insulating film 5g was affixed was demonstrated here, insulation can be ensured also by performing an insulating coating with respect to at least the contact piece 5b among the contacts 5. FIG.

さらに、絶縁フィルム５ｇの代わりに、熱伝導性が良く、かつ、厚みと柔軟性のあるシート（図示せず）を貼り付けるようにすることも可能である。このようにすれば、発熱素子４ａの表面に微細な凹凸があったとしても、その凹凸に追従して接触片５ｂを密着させることができる。これにより、より接触面積を広げることができ、より放熱効率を高くすることが可能となる。この場合、シートは導電性材料と絶縁性材料のいずれで構成されていても構わないが、シートを絶縁性材料で構成すれば、上記した絶縁フィルム５ｇを用いる場合の効果も得ることができる。   Furthermore, instead of the insulating film 5g, it is possible to attach a sheet (not shown) having good thermal conductivity and thickness and flexibility. In this way, even if there are fine irregularities on the surface of the heating element 4a, the contact pieces 5b can be brought into close contact with the irregularities. Thereby, a contact area can be expanded more and it becomes possible to make heat dissipation efficiency higher. In this case, the sheet may be made of either a conductive material or an insulating material. However, if the sheet is made of an insulating material, the effect of using the above-described insulating film 5g can also be obtained.

（２）上記第１〜第３実施形態では、平面図上において接触片５ｂを見たときの打ち出し形状を四角形状とし、折返し部５ｄの先端が角張った形状としているが、図１３に示す接触片５ｂの上面図に示すように、折返し部５ｄの先端が丸められた形状となるようにしても良い。   (2) In the first to third embodiments, the launch shape when the contact piece 5b is viewed on the plan view is a quadrangular shape, and the tip of the folded portion 5d is angular, but the contact shown in FIG. As shown in the top view of the piece 5b, the tip of the folded portion 5d may be rounded.

（３）上記第１〜第３実施形態では、接触片５ｂを傾斜部５ｃおよび折返し部５ｄによって構成したが、接触片５ｂの形状も適宜変更可能である。図１４は、接触片５ｂの形状の一例を示した側面図である。図１４（ａ）は、第１〜第３実施形態で示した接触片５ｂ、図１４（ｂ）、（ｃ）は、その変形例を示している。   (3) In the said 1st-3rd embodiment, although the contact piece 5b was comprised by the inclination part 5c and the folding | returning part 5d, the shape of the contact piece 5b can also be changed suitably. FIG. 14 is a side view showing an example of the shape of the contact piece 5b. FIG. 14A shows the contact piece 5b shown in the first to third embodiments, and FIGS. 14B and 14C show modifications thereof.

図１４（ａ）、（ｂ）に示すように、傾斜部５ｃに対して先端部を折り返すことで折返し部５ｄを構成する場合、折返しの形状は任意であり、図１４（ａ）に示したように折返し部５ｄが丸まるように折り返しても良いし、図１４（ｂ）に示したように折返し部５ｄが平坦面となるようにしても良く、折返し部５ｄが傾斜部５ｃに対して鋭角状に折り返されるようにしても良い。また、図１４（ｃ）に示したように傾斜部５ｃ自体が平面部５ａ側に向かって湾曲していく形状であっても構わない。   As shown in FIGS. 14 (a) and 14 (b), when the folded portion 5d is formed by folding the tip portion with respect to the inclined portion 5c, the folded shape is arbitrary, as shown in FIG. 14 (a). The folded portion 5d may be folded so as to be round, or the folded portion 5d may be a flat surface as shown in FIG. 14B, and the folded portion 5d has an acute angle with respect to the inclined portion 5c. It may be folded back into a shape. Moreover, as shown in FIG.14 (c), the inclination part 5c itself may be a shape which curves toward the plane part 5a side.

（４）上記各実施形態では、接触子５の材質を金属とした場合について説明したが、金属に代えて熱導電性が良く導電性のないフィラー（シリカやアルミナなど）を混入した樹脂とすることもできる。このようにすれば、上述したように接触片５ｂに絶縁フィルム５ｇを貼り付けたり、絶縁性の塗装を施すなどの絶縁処置を不要にすることができる。   (4) In each of the above embodiments, the case where the contactor 5 is made of metal has been described. However, instead of metal, a resin having good thermal conductivity and non-conductive filler (silica, alumina, etc.) is used. You can also. In this way, as described above, it is possible to eliminate the need for insulation treatment such as attaching the insulating film 5g to the contact piece 5b or applying insulating coating.

（５）また、上記実施形態では、接触子５を筐体ベース２の底面部２ａにネジ止めや接着貼り付けなどにより固定しているが、回路基板３と筐体ベース２と間に挟み込むことで固定することも可能である。図１５は、この構造の一例を示した電子制御装置の断面図である。   (5) Moreover, in the said embodiment, although the contactor 5 is being fixed to the bottom face part 2a of the housing | casing base 2 by screwing or adhesion | attachment sticking, it is pinched | interposed between the circuit board 3 and the housing | casing base 2. FIG. It is also possible to fix with. FIG. 15 is a cross-sectional view of an electronic control device showing an example of this structure.

この図に示されるように、筐体ベース２の側壁部２ｂのうち筐体蓋１のフランジ部１ｃを搭載する搭載面に至るように、つまり筐体ベース２の側壁部２ｂの壁面に沿って接触子５の外縁部５ｊを曲げ加工し、接触子５の外縁部５ｊが回路基板３と筐体ベース２と間に挟み込まれるようにする。そして、回路基板３を筐体ベース２にネジ８にて固定することで、これらの間に挟み込まれるようにして接触子５を固定することが可能となる。   As shown in this figure, the side wall 2b of the housing base 2 reaches the mounting surface on which the flange portion 1c of the housing lid 1 is mounted, that is, along the wall surface of the side wall 2b of the housing base 2. The outer edge portion 5j of the contactor 5 is bent so that the outer edge portion 5j of the contactor 5 is sandwiched between the circuit board 3 and the housing base 2. Then, by fixing the circuit board 3 to the housing base 2 with the screws 8, the contact 5 can be fixed so as to be sandwiched between them.

（６）さらに、上記各実施形態において、空間７のうち回路基板３と筐体ベース２との間を埋めるように熱導電性が良く導電性のないシリカやアルミナなどのフィラーなどを混入したゲル状材料を充填しても良い。このようにすれば、ゲル状材料を介しても熱伝導を行えるため、熱伝導の経路を増やすことができ、より放熱効率を高めることが可能となる。   (6) Further, in each of the above-described embodiments, a gel containing a filler such as silica or alumina having good thermal conductivity and no conductivity so as to fill the space 7 between the circuit board 3 and the housing base 2. The material may be filled. If it does in this way, since heat conduction can be performed also through a gel-like material, the path | route of heat conduction can be increased and it becomes possible to improve heat dissipation efficiency more.

（７）なお、上記各実施形態では、放熱効果をより高めるために、発熱素子４ａだけでなく回路基板３の裏面にも接触子５を接触させるようにしているが、少なくとも発熱素子４ａに接触するようにしていれば良い。   (7) In each of the above embodiments, the contactor 5 is brought into contact with not only the heat generating element 4a but also the back surface of the circuit board 3 in order to further enhance the heat dissipation effect. I just want to do it.

本発明の第１実施形態にかかる放熱構造を有する電子制御装置の断面図である。It is sectional drawing of the electronic control apparatus which has the thermal radiation structure concerning 1st Embodiment of this invention. 図１に示す電子制御装置に備えられた接触子５の詳細構造を示した図であり、（ａ）は接触子５の上面図、（ｂ）は接触子５の側面図、（ｃ）は接触子５を斜め上方から見たときの斜視図である。It is the figure which showed the detailed structure of the contactor 5 with which the electronic control apparatus shown in FIG. 1 was equipped, (a) is a top view of the contactor 5, (b) is a side view of the contactor 5, (c) is It is a perspective view when the contact 5 is seen from diagonally upward. 本発明の第２実施形態にかかる電子制御装置に用いられる接触子５の詳細構造を示した図であり、（ａ）は接触子５の上面図、（ｂ）は接触子５の側面図、（ｃ）は接触子５を斜め上方から見たときの斜視図である。It is the figure which showed the detailed structure of the contactor 5 used for the electronic controller concerning 2nd Embodiment of this invention, (a) is a top view of the contactor 5, (b) is a side view of the contactor 5, (C) is a perspective view when the contactor 5 is viewed obliquely from above. 本発明の第３実施形態にかかる電子制御装置に用いられる接触子５の詳細構造を示した図であり、（ａ）は接触子５の上面図、（ｂ）は接触子５の側面図、（ｃ）は接触子５を斜め上方から見たときの斜視図である。It is the figure which showed the detailed structure of the contactor 5 used for the electronic control apparatus concerning 3rd Embodiment of this invention, (a) is a top view of the contactor 5, (b) is a side view of the contactor 5, (C) is a perspective view when the contactor 5 is viewed obliquely from above. 本発明の第４実施形態にかかる放熱構造を有する電子制御装置の断面図である。It is sectional drawing of the electronic control apparatus which has a thermal radiation structure concerning 4th Embodiment of this invention. 図５に示す電子制御装置に用いられる接触子５の詳細構造を示した図であり、（ａ）は接触子５の上面図、（ｂ）は接触子５の側面図である。It is the figure which showed the detailed structure of the contactor 5 used for the electronic controller shown in FIG. 5, (a) is a top view of the contactor 5, (b) is a side view of the contactor 5. 本発明の第５実施形態にかかる放熱構造を有する電子制御装置の断面図である。It is sectional drawing of the electronic control apparatus which has a thermal radiation structure concerning 5th Embodiment of this invention. 図７に示す電子制御装置に用いられる接触子５の側面図である。It is a side view of the contactor 5 used for the electronic controller shown in FIG. 本発明の第６実施形態にかかる放熱構造を有する電子制御装置の断面図である。It is sectional drawing of the electronic controller which has a heat dissipation structure concerning 6th Embodiment of this invention. 図９に示す電子制御装置の回路基板３を筐体ベース２に固定する前の様子を示した断面図である。FIG. 10 is a cross-sectional view illustrating a state before the circuit board 3 of the electronic control device illustrated in FIG. 9 is fixed to the housing base 2. 他の実施形態にかかる接触片５ｂおよび発熱素子４ａの部分拡大図であり、は、接触片５ｂが発熱素子４ａと接触する前の状態、（ｂ）は、接触片５ｂが発熱素子４ａと接触した後の状態を示す図である。It is the elements on larger scale of the contact piece 5b and heat generating element 4a concerning other embodiment, and is the state before the contact piece 5b contacts the heat generating element 4a, (b) is the contact piece 5b contacting the heat generating element 4a. It is a figure which shows the state after having performed. 他の実施形態で説明する接触片５ｂに対して絶縁処理を施した場合の部分断面図である。It is a fragmentary sectional view at the time of performing insulation processing to contact piece 5b explained in other embodiments. 他の実施形態にかかる接触片５ｂの上面図である。It is a top view of contact piece 5b concerning other embodiments. （ａ）は、第１〜第３実施形態で示した接触片５ｂの側面図、（ｂ）、（ｃ）は、他の実施形態で説明する接触片５ｂの変形例を示した側面図である。(A) is the side view of the contact piece 5b shown by 1st-3rd embodiment, (b), (c) is the side view which showed the modification of the contact piece 5b demonstrated by other embodiment. is there. 他の実施形態にかかる電子制御装置の断面図である。It is sectional drawing of the electronic control apparatus concerning other embodiment. 従来の電子制御装置の断面図である。It is sectional drawing of the conventional electronic control apparatus.

符号の説明Explanation of symbols

１…筐体蓋、１ａ…上面部、１ｂ…側壁部、１ｃ…フランジ部、２…筐体ベース、
２ａ…底面部、２ｂ…側壁部、３…回路基板、４…電子部品、４ａ…発熱素子、
５…接触子、５ａ…平面部、５ｂ…接触片、５ｃ…傾斜部、５ｄ…折返し部、
５ｅ…曲げ加工部、５ｆ…切り欠き溝、５ｇ…絶縁フィルム、５ｈ…屈曲部、
５ｉ…段差加工部、５ｊ…外縁部、６、８…ネジ、７…空間 DESCRIPTION OF SYMBOLS 1 ... Housing lid, 1a ... Upper surface part, 1b ... Side wall part, 1c ... Flange part, 2 ... Housing base,
2a ... bottom part, 2b ... side wall part, 3 ... circuit board, 4 ... electronic component, 4a ... heating element,
5 ... contact, 5a ... flat part, 5b ... contact piece, 5c ... inclined part, 5d ... folded part,
5e ... bending portion, 5f ... notch groove, 5g ... insulating film, 5h ... bent portion,
5i ... Stepped portion, 5j ... Outer edge, 6, 8 ... Screw, 7 ... Space

Claims (16)

発熱素子（４ａ）と、
表面および裏面を有し、前記発熱素子（４ａ）が前記裏面に実装された回路基板（３）と、
底面部（２ａ）および該底面部（２ａ）の側壁部（２ｂ）とを有する筐体ベース（２）および該筐体ベース（２）の蓋となる筐体蓋（１）とを有し、前記筐体ベース（２）を前記筐体蓋（１）にて蓋閉めすることにより、前記発熱素子（４ａ）が実装された回路基板（３）が配置される空間（７）を構成する筐体（１、２）と、を有し、
前記回路基板（３）の前記裏面側を前記筐体ベース（２）の前記底面部（２ａ）側に向けて配置した電子制御装置において、
前記回路基板（３）と前記筐体ベース（２）の前記底面部（２ｂ）との間には、前記底面部（２ｂ）側から前記回路基板（３）側に延び、かつ、前記回路基板（３）側から前記底面部（２ｂ）側に向かう方向に弾性変形する複数の接触片（５ｂ）が備えられた接触子（５）が備えられ、前記複数の接触片（５ｂ）が弾性変形した状態で前記発熱素子（４ａ）と接触していることを特徴とする放熱構造を有する電子制御装置。 A heating element (4a);
A circuit board (3) having a front surface and a back surface, the heating element (4a) being mounted on the back surface;
A housing base (2) having a bottom surface portion (2a) and a side wall portion (2b) of the bottom surface portion (2a), and a housing lid (1) serving as a lid of the housing base (2); The casing base (2) is closed with the casing lid (1), thereby forming a casing (7) in which the circuit board (3) on which the heating element (4a) is mounted is disposed. A body (1, 2),
In the electronic control device in which the back surface side of the circuit board (3) is arranged toward the bottom surface portion (2a) side of the housing base (2),
Between the circuit board (3) and the bottom surface part (2b) of the housing base (2), the circuit board (3) side extends from the bottom surface part (2b) side, and the circuit board (3) A contact (5) provided with a plurality of contact pieces (5b) elastically deforming in a direction from the side toward the bottom surface (2b) side is provided, and the plurality of contact pieces (5b) are elastically deformed. An electronic control device having a heat dissipation structure, wherein the electronic control device is in contact with the heat generating element (4a) in a state of being heated. 前記接触子（５）は、前記筐体ベース（２）の前記底面部（２ｂ）に配置される平面部（５ａ）を有し、前記複数の接触片（５ｂ）が前記平面部（５ａ）から前記回路基板（３）側に延びるように備えられており、前記複数の接触片（５ｂ）は前記平面部（５ａ）に対して傾斜させられていることを特徴とする請求項１に記載の放熱構造を有する電子制御装置。 The contact (5) has a flat surface portion (5a) disposed on the bottom surface portion (2b) of the housing base (2), and the plurality of contact pieces (5b) include the flat surface portion (5a). The said contact piece (5b) is inclined with respect to the said plane part (5a), and is provided so that it may extend to the said circuit board (3) side from Claim 1 characterized by the above-mentioned. An electronic control device having a heat dissipation structure. 前記複数の接触片（５ｂ）は前記平面部（５ａ）に対して傾斜させられた傾斜面（５ｃ）を有していることを特徴とする請求項２に記載の放熱構造を有する電子制御装置。 The electronic control device having a heat dissipation structure according to claim 2, wherein the plurality of contact pieces (5b) have an inclined surface (5c) inclined with respect to the flat surface portion (5a). . 前記傾斜面（５ｃ）の先端は前記平面部（５ａ）側に曲げられることで折り返された折返し部（５ｄ）とされていることを特徴とする請求項３に記載の放熱構造を有する電子制御装置。 The electronic control having a heat dissipation structure according to claim 3, wherein a tip of the inclined surface (5c) is a folded portion (5d) that is folded by being bent toward the flat surface portion (5a). apparatus. 前記接触片（５ｂ）のうち前記傾斜面（５ｃ）と前記折返し部（５ｄ）との境界部であって前記傾斜面の先端の曲げられた内側に切り欠き溝（５ｆ）が形成されていることを特徴とする請求項４に記載の放熱構造を有する電子制御装置。 A notch groove (5f) is formed in the contact piece (5b) at the boundary between the inclined surface (5c) and the folded portion (5d) and on the bent inner side of the tip of the inclined surface. An electronic control device having a heat dissipation structure according to claim 4. 前記接触子（５）は、一枚の金属板を打ち抜くことにより構成されていることを特徴とする請求項３ないし５のいずれか１つに記載の放熱構造を有する電子制御装置。 6. The electronic control device having a heat dissipation structure according to claim 3, wherein the contact (5) is formed by punching a single metal plate. 前記複数の接触片（５ｂ）のうち前記回路基板（３）側の面には絶縁フィルム（５ｇ）が備えられていることを特徴とする請求項３ないし６に記載の放熱構造を有する電子制御装置。 The electronic control having a heat dissipation structure according to any one of claims 3 to 6, wherein an insulating film (5g) is provided on a surface of the plurality of contact pieces (5b) on the side of the circuit board (3). apparatus. 前記絶縁フィルム（５ｇ）は、前記複数の接触片（５ｂ）の先端の端面にも回り込んで配置されていることを特徴とする請求項７に記載の放熱構造を有する電子制御装置。 The electronic control device having a heat dissipation structure according to claim 7, wherein the insulating film (5g) is disposed so as to also wrap around an end surface of a tip of the plurality of contact pieces (5b). 前記接触子（５）は、熱導電性フィラーを混入した樹脂にて構成されていることを特徴とする請求項３ないし５のいずれか１つに記載の放熱構造を有する電子制御装置。 The electronic control device having a heat dissipation structure according to any one of claims 3 to 5, wherein the contact (5) is made of a resin mixed with a thermally conductive filler. 前記複数の接触片（５ｂ）は、前記平面部（５ａ）の一方向を縦方向とし、該縦方向に垂直な方向を横方向として、前記縦方向および前記横方向に所定数ずつ配列されていることを特徴とする請求項３ないし９のいずれか１つに記載の放熱構造を有する電子制御装置。 The plurality of contact pieces (5b) are arranged in a predetermined number in the vertical direction and the horizontal direction, with one direction of the plane portion (5a) being a vertical direction and a direction perpendicular to the vertical direction being a horizontal direction. An electronic control device having a heat dissipation structure according to any one of claims 3 to 9. 前記複数の接触片（５ｂ）は、前記縦方向および前記横方向において所定間隔を空けて配置されていることを特徴とする請求項１０に記載の放熱構造を有する電子制御装置。 The electronic control device having a heat dissipation structure according to claim 10, wherein the plurality of contact pieces (5b) are arranged at predetermined intervals in the vertical direction and the horizontal direction. 前記複数の接触片（５ｂ）は、前記横方向において所定間隔を空けて配置されており、前記縦方向において間隔を空けずに配置されていることを特徴とする請求項１０に記載の放熱構造を有する電子制御装置。 11. The heat dissipation structure according to claim 10, wherein the plurality of contact pieces (5 b) are arranged at a predetermined interval in the horizontal direction and are arranged at no interval in the vertical direction. An electronic control device. 前記複数の接触片（５ｂ）は、それぞれ、複数に分断されていることを特徴とする請求項３ないし１２のいずれか１つに記載の放熱構造を有する電子制御装置。 The electronic control device having a heat dissipation structure according to any one of claims 3 to 12, wherein each of the plurality of contact pieces (5b) is divided into a plurality of pieces. 前記複数の接触片（５ｂ）は針状に構成されていることを特徴とする請求項２に記載の放熱構造を有する電子制御装置。 The electronic control device having a heat dissipation structure according to claim 2, wherein the plurality of contact pieces (5b) are formed in a needle shape. 発熱素子（４ａ）と、
表面および裏面を有し、前記発熱素子（４ａ）が前記裏面に実装された回路基板（３）と、
底面部（２ａ）および該底面部（２ａ）の側壁部（２ｂ）とを有する筐体ベース（２）および該筐体ベース（２）の蓋となる筐体蓋（１）とを有し、前記筐体ベース（２）を前記筐体蓋（１）にて蓋閉めすることにより、前記発熱素子（４ａ）が実装された回路基板（３）が配置される空間（７）を構成する筐体（１、２）と、を有し、
前記回路基板（３）の前記裏面側を前記筐体ベース（２）の前記底面部（２ａ）側に向けて配置した電子制御装置において、
前記回路基板（３）と前記筐体ベース（２）の前記底面部（２ｂ）との間には、金属板を複数折り返して構成した曲げ加工部（５ｅ）を備えたアコーディオン形状の接触子（５）が備えられ、前記曲げ加工部（５ｅ）が前記底面部（２ｂ）側から前記回路基板（３）側に延び、かつ、前記回路基板（３）側から前記底面部（２ｂ）側に向かう方向に弾性変形するように構成され、前記複数の曲げ加工部（５ｅ）が弾性変形した状態で前記発熱素子（４ａ）と接触していることを特徴とする放熱構造を有する電子制御装置。 A heating element (4a);
A circuit board (3) having a front surface and a back surface, the heating element (4a) being mounted on the back surface;
A housing base (2) having a bottom surface portion (2a) and a side wall portion (2b) of the bottom surface portion (2a), and a housing lid (1) serving as a lid of the housing base (2); The casing base (2) is closed with the casing lid (1), thereby forming a casing (7) in which the circuit board (3) on which the heating element (4a) is mounted is disposed. A body (1, 2),
In the electronic control device in which the back surface side of the circuit board (3) is arranged toward the bottom surface portion (2a) side of the housing base (2),
Between the circuit board (3) and the bottom surface part (2b) of the housing base (2), an accordion-shaped contactor (5e) provided with a bent portion (5e) formed by folding a plurality of metal plates. 5), the bent portion (5e) extends from the bottom surface portion (2b) side to the circuit board (3) side, and from the circuit board (3) side to the bottom surface portion (2b) side. An electronic control device having a heat dissipation structure, wherein the electronic control device is configured to be elastically deformed in a direction toward which the plurality of bent portions (5e) are in elastic deformation and are in contact with the heat generating element (4a). 発熱素子（４ａ）と、
表面および裏面を有し、前記発熱素子（４ａ）が前記裏面に実装された回路基板（３）と、
底面部（２ａ）および該底面部（２ａ）の側壁部（２ｂ）とを有する筐体ベース（２）および該筐体ベース（２）の蓋となる筐体蓋（１）とを有し、前記筐体ベース（２）を前記筐体蓋（１）にて蓋閉めすることにより、前記発熱素子（４ａ）が実装された回路基板（３）が配置される空間（７）を構成する筐体（１、２）と、を有し、
前記回路基板（３）の前記裏面側を前記筐体ベース（２）の前記底面部（２ａ）側に向けて配置した電子制御装置において、
前記回路基板（３）と前記筐体ベース（２）の前記底面部（２ｂ）との間のうち前記発熱素子（４ａ）と対応する位置には、金属バネ部材にて構成された接触子（５）が備えられ、前記接触子（５）が前記回路基板（３）側から前記底面部（２ｂ）側に向かう方向に弾性変形するように構成され、前記接触子（５）が弾性変形した状態で前記発熱素子（４ａ）と接触していることを特徴とする放熱構造を有する電子制御装置。 A heating element (4a);
A circuit board (3) having a front surface and a back surface, the heating element (4a) being mounted on the back surface;
A housing base (2) having a bottom surface portion (2a) and a side wall portion (2b) of the bottom surface portion (2a), and a housing lid (1) serving as a lid of the housing base (2); The casing base (2) is closed with the casing lid (1), thereby forming a casing (7) in which the circuit board (3) on which the heating element (4a) is mounted is disposed. A body (1, 2),
In the electronic control device in which the back surface side of the circuit board (3) is arranged toward the bottom surface portion (2a) side of the housing base (2),
In a position corresponding to the heating element (4a) between the circuit board (3) and the bottom surface portion (2b) of the housing base (2), a contact ( 5), the contact (5) is elastically deformed in a direction from the circuit board (3) side toward the bottom surface (2b) side, and the contact (5) is elastically deformed. An electronic control device having a heat dissipation structure, wherein the electronic control device is in contact with the heating element (4a) in a state.
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