JP3132604B2 - Semiconductor integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a standard cell type semiconductor integrated circuit device incorporating a switching circuit for selecting a connection combination of a plurality of input circuits and output circuits.

[0002]

2. Description of the Related Art FIG. 3 is a plan view showing a semiconductor chip for explaining an example of a conventional semiconductor integrated circuit device. Conventionally, as shown in FIG. 3, for example, this type of semiconductor integrated circuit device has standard cell groups 3a, 3b, which are configured by arranging a plurality of standard cells including logic circuits in one direction.
3c, a plurality of input circuits 5a and 5b and input and output circuits 4a and 4b for inputting and outputting signals to and from a standard cell via wiring.
And the input circuits 5a and 5b and the output circuits 4a and 4
The semiconductor chip 1 is a semiconductor substrate on which a switching circuit 8 having a plurality of through-hole forming regions for selecting a connection combination of b is formed. In the inter-block wiring regions 2a, 2b, 2c, and 2d between the standard cell groups 3a, 3b, and 3c, wires connecting the blocks composed of the standard cells are formed.

The switching circuit 8 is a circuit for selecting a connection combination of the input circuits 5a and 5b and the output circuits 4a and 4b in advance. If the connection combination is determined, the input circuits 5a and 5b are switched.
Automatic wiring design is performed by a computer for the wiring connecting the circuit and the output circuits 4a and 4b, and then the through hole setting position 7
a to 7d were selected and the wiring was designed.

[0004] For example, as shown in FIG.
And the output circuit 4b, and the input circuit 5b and the output circuit 5a, the information of the wirings L1 and L2 connecting the output circuits 4a and 4b and the fixed through-hole 6a in the area of the switching circuit 8, and the switching circuit 8 When the connection information between the input circuit 5a and the input circuit 5b is entered, the computer automatically designs and
The positions of the through holes of the switching circuit 8 are set at the set positions 7d and 7d.
a is selected, and wirings L3 and L4 are designed.

As described above, in the standard cell type semiconductor integrated circuit device, the arrangement and wiring of the switching circuit 8 and the various standard cells are automated by computer processing, and the combination of the output circuit and the input circuit is combined in the switching circuit. It was easy to design by changing the position of the through hole.

[0006]

However, in the conventional semiconductor integrated circuit device described above, the connection between the input / output circuit and the switching circuit is caused by the restriction of software for automatic placement and wiring design and the scatter of input circuits to be changed. Has the disadvantage of producing redundant wiring. In other words, the length is several times to several tens of times as long as the shortest connection between the input and output circuits as in an integrated circuit device without a switching circuit. This leads to an increase in the wiring area between the blocks, and the increase in the wirings input into the switching circuit increases the wiring density of the wiring area between the blocks adjacent to the switching circuit. There was a problem that the area became large.

[0007]

According to a first aspect of the present invention, there is provided a semiconductor integrated circuit device comprising: a plurality of columns of a plurality of standard cells each including a logic circuit arranged in one direction; A plurality of input circuits and output circuits for inputting and outputting signals via wiring, and a switching circuit having a plurality of through-hole forming regions for selecting a combination of connection of these input circuits and output circuits are formed. In a semiconductor integrated circuit device having a semiconductor substrate, a plurality of the input circuits are arranged adjacent to each other in any one row of the standard cell group, and a part of the switching circuit area is included in the input circuit area. It is characterized by:

According to a second semiconductor integrated circuit device of the present invention, a plurality of columns of standard cells including a plurality of standard cells including a logic circuit are arranged in one direction, and signals are transmitted to the standard cells via wiring. Semiconductor integrated circuit having a semiconductor substrate on which a plurality of input circuits and output circuits for inputting and outputting and a switching circuit having a plurality of through-hole forming regions for selecting a combination of connections of these input circuits and output circuits are formed. The circuit device has at least two wiring layers, and the plurality of input circuits are arranged adjacent to each other on an upper first wiring layer corresponding to any one column of the standard cell group, and the switching is performed. The circuit region is arranged in a region of the second wiring layer above the input circuit region.

[0009]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing a semiconductor chip for explaining one embodiment of a semiconductor integrated circuit device according to the present invention. In this semiconductor integrated circuit device, as shown in FIG. 1, in a semiconductor chip 1, input circuits 5a and 5b are adjacent to one of the standard cell groups 3c of the standard cell groups 3a, 3b and 3c. Set position 7a where the position of the through-hole is selected by the arrangement and connection combination
The switching circuit area having .about.7d is the inter-block wiring area 2c.
In the input circuits 5a and 5b.

For example, considering the case where the input circuit 5a is connected to the output circuit 4a and the input circuit 5b is connected to the output circuit 4b, the output circuits 4a and 4b are connected to the input circuits 5a and 5b.
The wirings L5 and L6 connecting the unique through-hole 6a of b are set, the setting positions 7c and 7a connected to the internal circuit are selected, and the through-hole is formed at this position, whereby the two circuits described above are formed. Will be.

As described above, the wiring connecting the input circuit and the switching circuit only needs to have a length within the range of the input circuit area, and the wiring that has conventionally been routed in the inter-block wiring area is eliminated.

FIG. 2 is a plan view showing a semiconductor chip for explaining another embodiment of the semiconductor integrated circuit device of the present invention. The semiconductor integrated circuit device in this embodiment has a multilayer wiring structure and has at least two wiring layers.

In such a semiconductor integrated circuit device, the input circuit 5 is provided on the upper wiring layer corresponding to the standard cell group 3c.
a and 5b are arranged, and through-holes are provided in upper wiring layers corresponding to the input circuits 5a and 5b.
That is, a switching circuit area including 10h is arranged.

In this embodiment, since the switching circuit is not arranged over the inter-block wiring area, the set through-hole does not intersect with the wiring in the inter-block wiring area, and the degree of freedom of the wiring is reduced. It is much more advantageous than the embodiment.

[0016]

As described above, according to the present invention, a plurality of input circuits are arranged adjacent to each other in one standard cell row, and a switching circuit is formed in or within an input circuit area by a through hole whose position is selected by a connection combination. The wiring from the input circuit to the switching circuit requires only the length of the through hole, reducing redundant wiring routed from the output circuit to the input circuit, and reducing the wiring area. This has the effect that the semiconductor chip can be made smaller.

[Brief description of the drawings]

FIG. 1 is a plan view showing a semiconductor chip for explaining one embodiment of a semiconductor integrated circuit device of the present invention.

FIG. 2 is a plan view showing a semiconductor chip for explaining another embodiment of the semiconductor integrated circuit device of the present invention.

FIG. 3 is a plan view showing a semiconductor chip for explaining an example of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2a, 2b, 2c, 2d Inter-block wiring area 3a, 3b, 3c Standard cell group 4a, 4b Output circuit 5a, 5b Input circuit 6a Through hole 7a, 7b, 7c, 7d, 10a, 10b, 10c, 1
0d, 10e, 10f10g, 10h Set position 8 Switching circuit

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-198760 (JP, A) JP-A-3-160747 (JP, A) JP-A-4-1377651 (JP, A)

Claims (2)

(57) [Claims] 1. A standard cell type semiconductor integrated circuit device, comprising: a standard cell arrangement area in which a plurality of standard cells are arranged; an inter-block wiring area in which wiring for connecting the plurality of standard cells is formed; It has a first and a second output circuit provided in the standard cell layout region, and first and second input circuits arranged adjacent to each other is provided in the standard cell arrangement region, the first and In the second input circuit area
Are connected to the first and second output circuits, respectively.
Connected to a wiring and the first and second input circuits, respectively.
Switching circuit to select the combination of wiring and connection
And each of the first and second input circuits is connected to the first
Select which of the first and second output circuits to connect to
A connection method for an input / output circuit of a semiconductor integrated circuit device. 2. The switching circuit according to claim 1, wherein the first and second switching circuits are connected to each other.
The first and second wirings are connected to the wiring connected to the output circuit of
First and second wires connected via a through hole
Connecting the first and second wirings and the first input circuit.
The first and second switches provided at the intersection with the continued wiring
A through hole forming region, the first and second wirings,
Provided at the intersection with the wiring connected to the second input circuit.
Third and fourth through-hole formation regions, and a through hole is formed in the first or second through-hole formation region.
And a wiring connected to the first input circuit.
Connecting one of the first and second wirings,
Alternatively, form a through hole in the fourth through hole formation area.
A wiring connected to the second input circuit and the first and second input circuits.
2. A connection method for an input / output circuit of a semiconductor integrated circuit device according to claim 1, wherein the connection is made to one of the second wiring and the other of the second wiring .