JP3107037B2 - Lead frame degate device and lead frame degate method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame degate device and a lead frame degate method for degate (separation and removal) of unnecessary resin adhering to a lead frame, and more particularly to a lead frame and unnecessary resin. The present invention relates to a lead frame degate apparatus and a lead frame degate method which can degate an unnecessary resin without remaining on the lead frame even when the adhesion is high.

[0002]

2. Description of the Related Art As shown in FIG. 5, a lead frame 20a, 20b immediately after resin molding has not only a resin 31 for sealing a semiconductor element (not shown) but also a cull portion and a runner portion of a mold. Resin 21a, 21 solidified by
b is also connected. Unnecessary resin 21a solidified in the cull portion of the mold protrudes from the upper surface between two lead frames 20a and 20b arranged in parallel,
The lower surface of the unnecessary resin 21a and the lead frames 20a, 20b are formed by the unnecessary resin 21b solidified in the runner portion.
Is connected to the lower surface.

A conventional lead frame degate device for degates these unnecessary resins 21a and 21b will be described with reference to FIGS. Unnecessary resins 21a and 21b are provided in the degate device of this lead frame.
Two parallel lead frames 2 connected by
Two parallel rocking tables 11 on which 0a and 20b are placed, respectively.
a and 11b are arranged on the base 23. Rocking table 1
Opposite inner sides of 1a and 11b are formed in a comb-like shape having a cutout portion into which unnecessary resin 21b solidified in the runner portion enters.

[0004] Positioning pins 19, 19, 19, 19 are provided on the surfaces of the swing tables 11a, 11b at positions sandwiching both ends of the lead frames 20a, 20b. As shown in FIG. 6, hinge pins 12, 12, 12, 12 are provided on both ends of the swing tables 11a, 11b opposite to each other, and the hinge pins 12, 12, 12, 12 are provided at both ends of the base 23. By being attached to the blocks 13, 13, the swing tables 11 a, 11 b can swing about the opposite side bottom as a fulcrum. Each swing table 11a,
The bottom of the opposite side of 11b is formed in an arc shape as shown in FIGS. 7 and 8, and serves as a fulcrum so that the swing tables 11a and 11b can easily swing.

[0005] Each swing table 11a, 11b has a roller 14a, 14
It swings as b moves in and out of the width direction. That is, the rollers 14a, 14b of the push-up unit
Is reciprocating in the width direction of the rocking tables 11a and 11b, and the upper surfaces of the rocking tables 11a and 11b are in a horizontal state if they do not enter between the bottom surfaces of the rocking tables 11a and 11b and the base 23. By entering the bottoms of the rocking tables 11a and 11b, the upper surfaces of the rocking tables 11a and 11b are tilted so that the outer sides are lifted about the hinge pins 12, 12, 12, and 12 as rotation axes. Outer bottoms of the swing tables 11a and 11b are provided with rollers 14a and 1 of a cylindrical push-up unit.
A chamfered portion is formed to make it easy for the base 4b to enter the bottom surfaces of the swing tables 11a and 11b.

[0006] Lead frame holders 17a, 17b constituting a hand are provided on the upper surface side of the swing tables 11a, 11b. The lead frame holders 17a and 17b are fixed to the hand via hinges (not shown), and the lead frames 20a and 20b are not mounted on the swing tables 11a and 11b until the lead frames 20a and 20b are mounted on the swing tables 11a and 11b. When the lead frames 20a and 20b are placed on the rocking tables 11a and 11b, the lead frames 20a and 20b are pressed by the rocking tables 11a and 11b. On the lower surfaces of the lead frame pressers 17a and 17b, concave portions for receiving the resin 31 (see FIG. 5) sealing the semiconductor elements on the upper surfaces of the lead frames 20a and 20b are formed at regular intervals.

Further, between the lead frame holders 17a and 17b in a state where the lead frames 20a and 20b are fixed to the swing tables 11a and 11b, an unnecessary resin holder 25 constituting a hand is disposed. The unnecessary resin retainer 25 is also retracted until the lead frames 20a and 20b are mounted on the rocking tables 11a and 11b. When the lead frames 20a and 20b are mounted on the rocking tables 11a and 11b, the unnecessary resin holder 25 is placed on the upper surface of the unnecessary resin 21. Abut

A lead frame 20 mounted on the swing tables 11a and 11b is provided between the swing tables 11a and 11b.
Unnecessary resin cooling means 24 is disposed in contact with the lower surface of unnecessary resin 21a solidified at a cull portion between a and 20b.

A conventional lead frame degate device is configured as described above. Next, a degate method will be described.

[0010] The semiconductor element is sealed with a resin 31.
The lead frames 20a and 20b are connected with unnecessary resins 21a and 21b solidified at a cull portion and a runner portion of a mold, respectively, and are positioned on rocking tables 11a and 11b by positioning pins 19, 19, 19 and 19, respectively. It is positioned and placed. Then, as shown in FIG. 7, the unnecessary resin cooling means 24 comes into contact with the lower surface of the unnecessary resin 21a, and the unnecessary resins 21a, 2a
1b and the lead frames 20a, 20b are cooled.
By this cooling, a force is generated such that the unnecessary resins 21a and 21b and the lead frames 20a and 20b are warped in the longitudinal direction.

However, at the same time, the lead frame presser 17
a and 17b move the lead frames 20a and 20b to the swing table 1.
The unnecessary resin presser 25 is brought into contact with the upper surfaces of the unnecessary resins 21a and 21b while being pressed by 1a and 11b. Therefore,
Unnecessary resin 21a, 21b and lead frame 20a, 2
Ob does not warp when cooled.

Next, as shown in FIG. 8, the swing table 11a, 1
The rollers 14a and 14b of the push-up unit enter between the bottom surface of the base 1b and the base 23, and the swing tables 11a and 11b are inclined with the inner bottom serving as a fulcrum. Then, the lead frames 20a and 20b placed on the upper surfaces of the swing tables 11a and 11b are moved to the lead frame pressers 17.
a and 17b, it is inclined. However, the unnecessary resin 21a solidified in the cull portion is pressed by the unnecessary resin presser 25, and the unnecessary resin 21b solidified in the runner portion is in the cutout portions of the swing tables 11a and 11b. , 21b maintain a horizontal posture.

Therefore, as shown in FIG.
When the outside of 1a, 11b is tilted to a state of being lifted,
The lead frames 20a and 20b are in an inclined posture,
The unnecessary resin retainers 25 maintain the horizontal posture of the unnecessary resins 21a and 21b, so that the lead frames 20a and
Unnecessary resin 21b solidified at the runner portion attached to the inner lower surface of 20b is dedated from the lower surfaces of lead frames 20a and 20b all at once. Unnecessary resin 21b solidified in the runner part and unnecessary resin 21a solidified in the cull part
And the rocking tables 11a and 11b are in the inclined posture, so that the lead frames 20a and 2b are simultaneously
The unnecessary resins 21a and 21b are completely dedated from 0b.

Thereafter, the roller 14 of the push-up unit is
a and 14b are discharged from the lower surfaces of the rocking tables 11a and 11b, and the rocking tables 11a and 11b are returned to the horizontal posture. At the same time, the lead frame retainers 17a and 17b are retracted from above the lead frames 20a and 20b, and the unnecessary resin retainer 25 is retracted from above the unnecessary resin 21a. And unnecessary resin 21
lead frames 20a, 20a degated from a, 21b
0b is sent to a post process, and the unnecessary resins 21a and 21b are discarded.

The lead frame degate method and the lead frame degate apparatus are designed to depress unnecessary resin from the lead frame by pushing up the resin sealing the semiconductor element from below by a rolling roller. It is disclosed in JP-A-2-165925. Further, a method and an apparatus for removing an unnecessary resin molded portion of a lead frame which reliably removes unnecessary resin without applying an impact to a lead frame moving in a longitudinal direction are disclosed in JP-A-7-297216. Have been.

[0016]

In the conventional lead frame degate device and degate method, unnecessary resin 2 is used.
1a and 21b maintain the horizontal posture, and the lead frame 20
The unnecessary resins 21 and 20b are tilted.
a and 21b are degated simultaneously over the entire length. Therefore, the adhesive force between the unnecessary resin 21b solidified in the runner portion and the lead frames 20a and 20b is smaller than the bonding force at the boundary between the unnecessary resin 11b solidified in the runner portion and the unnecessary resin 21a solidified in the cull portion. At this time, the unnecessary resin 21b is reliably degated from the lead frames 20a, 20b without cutting off the boundary between the unnecessary resins 21b, 21a.

However, the lead frames 20a and 20b may be plated with palladium or the like in order to increase the adhesion between the resin 31 for sealing the semiconductor element and the lead frames 20a and 20b. The adhesive strength between the unnecessary resins 20a and 20b and the unnecessary resin 21b also increases. Then, even if the unnecessary resin 21 is to be degated simultaneously over the entire length, the boundary between the unnecessary resin 21a solidified in the cull portion and the unnecessary resin 21b solidified in the runner portion is cut, and the unnecessary resin 21b is removed from the lead frame 2.
0a, 20b.

Accordingly, the present invention provides a lead frame degate apparatus and a lead frame which can degate an unnecessary resin or the like without remaining on the lead frame even if the adhesion between the lead frame and the unnecessary resin is high. It is an object of the present invention to provide a degate method.

[0019]

According to the present invention, there is provided a lead frame degate apparatus comprising: an unnecessary resin adhered to a lower surface on the inner side opposite to two lead frames arranged in parallel; A lead frame degate device for degateting both unnecessary resin and unnecessary resin protruding from the upper surface between the two lead frames, comprising two parallel swinging tables on which two lead frames are respectively mounted, and a length of the lead frame. A center roller that moves in the direction and side rollers on both sides of the lead frame, and the two rocking tables rock with the bottom on the opposite side as a fulcrum, and hold both outer edges of the lead frame in an inclined posture. The center roller is configured to support the unnecessary resin in a floating state, and the center roller removes the unnecessary resin protruding from the upper surface between two lead frames in one longitudinal direction. The side roller presses the upper surface of the two inner sides of the two lead frames, the outer edges of which are supported by a rocking table. The lead frame is sequentially joined to the upper surface of the inclined rocking table from one end in the longitudinal direction from the other end in synchronization with the tilted rocking table.

According to the present invention, the unnecessary resin is not degated all at once. Instead, the center roller and the side roller extend longitudinally between the unnecessary resin projecting from the upper surface between the lead frames and the opposing inner side of the lead frame. The center roller pushes down unnecessary resin protruding from the upper surface of the lead frame between the lead frame joined to the upper surface of the rocking table by the side roller by sequentially pushing down from one end side to the other end side in the direction. Unnecessary resin adhering to the back surface of the lead frame can be sequentially degated.

It is preferable that a cooling means for contacting the bottom surface of the unnecessary resin between the two lead frames and cooling the unnecessary resin is disposed between the two rocking tables.

It is preferable that the cooling means is for blowing an air blow to the unnecessary resin.

The center roller and the side rollers on both sides of the center roller are penetrated by a coaxial shaft at the center, and a block which is guided and moved by a linear motion guide is fixed to both ends of the shaft, and a piston is mounted on one of the blocks. Is preferred.

According to the lead frame degate method of the present invention, the unnecessary resin adhered to the lower surface of the inside of the two lead frames facing in parallel is connected to the unnecessary resin,
What is claimed is: 1. A lead frame degate method for degateting both unnecessary resin and unnecessary resin protruding from an upper surface between lead frames, comprising: (1) each of two rocking tables that rock around a bottom portion on an opposite side as a fulcrum; (2) a step of placing two parallel lead frames on the table, (2) setting the rocking table in an inclined position, supporting both end edges of the lead frame to float unnecessary resin, and (3) centering. (4) a step in which the center roller presses down the upper surface of the unnecessary resin between the lead frames while the side rollers on both sides of the roller press the inner end of the lead frame and join the upper surface of the rocking table in an inclined posture; Moving the center roller and the side roller from one end to the other end in the longitudinal direction of the unnecessary resin and the lead frame, and performing the steps in the order of (1) to (4). It is intended to.

According to the present invention, the side roller presses the inner end of the lead frame and moves from one end to the other end while joining to the upper surface of the rocking table having an inclined posture, and at the same time, the center roller is moved by the lead. By pushing down the unnecessary resin projecting from the upper surface between the frames from one end to the other end, the unnecessary resin is sequentially degated.

Mounting the two parallel lead frames on the two rocking tables that rock on the opposite side bottom as a fulcrum; setting the rocking tables in an inclined position, It is preferable that a step of cooling the unnecessary resin adhering to the lead frame mounted on the rocking table be provided between the step of supporting and bringing the unnecessary resin into a floating state.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. However, the same parts as those in the related art are denoted by the same reference numerals, and description thereof will be omitted.

The degate device for a lead frame according to the present invention comprises a center roller 1a which moves in the longitudinal direction of the lead frames 20a and 20b and side rollers 1b and 2b on both sides thereof.
1b. The center roller 1a pushes down the unnecessary resin 21a projecting from the upper surface between the two lead frames 20a and 20b. The side rollers 1b, 1b press the opposing inner upper surfaces of the two lead frames 20a, 20b, and join the lead frames to the inclined upper surfaces of the swing tables 11a, 11b.

A coaxial shaft 3 passes through the center of the center roller 1a and the side rollers 1b, 1b on both sides thereof via a bearing 2. Blocks 4 and 5 which are guided by linear motion (LM) guides 9 and reciprocate are fixed to both ends of the shaft 3. The piston rod 7b of the piston 7 is connected to one block 5 via a joint 6 having a floating structure. The piston 7 is arranged in parallel with the swing tables 11a and 11b, and the cylinder 7a of the piston 7 is fixed to the base 15 by the fixing bracket 8.

The blocks 4 and 5 are guided by the LM guides 9 and 9 by extension and retraction of the piston rod 7b, and the center roller 1a and the side rollers 1b and 1b through which the shaft 3 to which the blocks 4 and 5 are attached pass are formed. Reciprocate. Base 1 on the extension of extension of piston rod 7b
5 is provided with a stopper 10.

Further, while the center roller 1a and the side rollers 1b, 1b are located on one end side in the longitudinal direction of the lead frames 20a, 20b, the unnecessary resin holding member 18a solidified at the cull portion is placed on the upper surface of the unnecessary resin holder 18a. Is made to abut. The unnecessary resin holder 18 is moved up and down by a cylinder (not shown). While the unnecessary resin holder 18 is in contact with the upper surface of the unnecessary resin 21a, the unnecessary resin 21
a and 21b are cooled by, for example, air blow, and a cooling means 1 for supporting the center roller 1a.
6 is arranged between the two rocking tables 11a and 11b. The cooling means 16 is moved up and down by a cylinder (not shown).

The lead frame degate device according to the present invention is configured as described above. Next, a lead frame degate method will be described.

The two lead frames 20a and 20b in which the semiconductor element is sealed with the resin 31 (see FIG. 5) are made of unnecessary resin 21a and 21 solidified at the cull and runner portions.
In a state where b is connected, they are positioned and mounted on the rocking tables 11a and 11b by the positioning pins 19, 19, 19 and 19, respectively. At this time, the center roller 1a and the side rollers 1b, 1b are connected to the lead frame 2 as shown in FIG.
0a and 20b are retracted to positions away from one end in the longitudinal direction.

Then, as shown in FIG. 2, the lead frames 20a, 20b are pressed by the rocking tables 11a, 11b by the lead frame pressers 17a, 17b, and the unnecessary resin press 18 comes into contact with the upper surface of the unnecessary resin 21a. Then, the lower surfaces of the unnecessary resins 21a and 21b are air blown by the unnecessary resin cooling means 16 to be cooled. At this time, the lead frames 20a and 20b and the unnecessary resin 21
a and 21b are lead frame holders 17a and 17b, respectively.
b and unnecessary resin presser 18,
No warping in the longitudinal direction.

Next, as shown in FIG. 3, the swing table 11a, 1
The rollers 14a and 14b of the push-up unit enter between the bottom surface of the base 1b and the base 23, and the rocking tables 11a and 11b
b has an inclined posture with the inner bottom serving as a fulcrum. Then, the lead frames 20a and 20b placed on the upper surfaces of the swing tables 11a and 11b support both outer edges,
The unnecessary resins 21a and 21b are in a floating state.

Next, as shown in FIG.
The center roller 1a pushes down the upper surface of the unnecessary resin 21a while the inner rollers b and 1b press the inner ends of the lead frames 20a and 20b and join the upper surfaces of the inclined swing tables 11a and 11b. As the piston rod 7b of the piston 7 extends, the side rollers 1b, 1b and the center roller 1a sequentially push down the lead frames 20a, 20b and the unnecessary resin 21a from one longitudinal end to the other longitudinal end. Therefore, the lead frames 20a, 20b
Even if the adhesion between the unnecessary resin 21b and the unnecessary resin 21b is high, a concentrated load is applied to the joint, and the unnecessary resin 21a,
21b is reliably gated.

The tip of the piston rod 7b is the stopper 1
0, the piston rod 7b retracts and the side rollers 1b, 1b and the center roller 1a
Returns to its original position. Then, the rollers 14a and 14b of the push-up unit are discharged from the lower surfaces of the swing tables 11a and 11b, and the swing tables 11a and 11b are returned to the horizontal posture. Then, the lead frames 20a and 20b degated from the unnecessary resins 21a and 21b are sent to a subsequent process, and the unnecessary resins 21a and 21b are discarded.

It should be noted that the present invention is not limited to the above-described embodiment, and various changes can be made within the technical scope described in the claims. For example, the reciprocation of the center roller and the side roller can be performed by a combination of a pinion and a rack that is rotated by a motor instead of a piston.

[0039]

According to the present invention, the side rollers are sequentially pushed down from the one end side to the other end side in the longitudinal direction on the rocking table having the lead frame inclined, and the center roller leads the lead frame in synchronization with the side rollers. By sequentially pushing down the unnecessary resin projecting from the upper surface between the frames, the unnecessary resin can be reliably degated even if the adhesion between the lead frame and the unnecessary resin is high. Therefore, the trouble of removing unnecessary resin adhering to the lead frame after degate is eliminated, and productivity is improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame degate device according to the present invention.

FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 and is a cross-sectional view before degate by the degate device of the lead frame according to the present invention.

FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1 and is a cross-sectional view of a stage during degate by the degate device of the lead frame according to the present invention.

FIG. 4 is a cross-sectional view taken along the line AA of FIG. 1 and is a cross-sectional view of a stage during degate by the degate device of the lead frame according to the present invention.

FIG. 5 is a side view of a lead frame molded with resin.

FIG. 6 is a plan view of a conventional lead frame degate device.

FIG. 7 is a cross-sectional view taken along the line BB of FIG. 6, which is a cross-sectional view before a degate is performed by a conventional lead frame degate device.

FIG. 8 is a cross-sectional view taken along the line BB of FIG. 6, which is a cross-sectional view during degate by a conventional lead frame degate device.

[Explanation of symbols]

 1a: Center roller 1b: Side roller 3: Shaft 4: Block 5: Block 7: Piston 9: LM guide 11a: Swing table 11b: Swing table 16: Cooling means 17a: Lead frame holder 17b: Lead frame holder 18: Unnecessary resin holder 20a: Lead frame 20b: Lead frame 21a: Unnecessary resin 21b: Unnecessary resin

Claims (6)

(57) [Claims] An unnecessary resin adhered to the lower surface on the inner side opposite to two lead frames arranged in parallel, and an unnecessary resin continuous with the unnecessary resin and protruding from the upper surface between the lead frames are unnecessary. What is claimed is: 1. A lead frame degate device for degate resin, comprising: two parallel swing tables on which two lead frames are respectively mounted; a center roller moving in the length direction of the lead frame; and side rollers on both sides thereof. The two rocking tables are rocked with their opposing bottoms as fulcrums, and support both outer edges of the lead frame in an inclined position to float the unnecessary resin. The center roller sequentially pushes down an unnecessary resin projecting from the upper surface between two lead frames from one end side to the other end side in the longitudinal direction. The roller presses the upper surfaces on the inside of the two lead frames, the outer edges of which are supported by the rocking table, and synchronizes with the center roller to vertically move the lead frame on the upper surface of the tilting rocking table. A degate device for a lead frame, which is sequentially joined from one end to the other end in the direction. 2. A bottom surface of a depressed unnecessary resin between two lead frames is supported between the two rocking tables,
2. The degate device for a lead frame according to claim 1, wherein cooling means for cooling unnecessary resin is arranged. 3. The degate device for a lead frame according to claim 2, wherein said cooling means blows air blow on unnecessary resin. 4. The center roller and the side rollers on both sides of the center roller are penetrated by a coaxial shaft at the center, and a block which is guided and moved by a linear motion guide is fixed to both ends of the shaft, and a piston is mounted on one of the blocks. The degate device for a lead frame according to any one of claims 1 to 3, wherein the degate device is attached. 5. An unnecessary resin attached to a lower surface on the inside of each of two lead frames arranged in parallel and an unnecessary resin continuous with the unnecessary resin and projecting from the upper surface between the lead frames. A lead frame degate method for degate of a resin, comprising: (1) placing two parallel lead frames on each of two swing tables that swing about a bottom of an opposite side as a fulcrum; (2) A step of setting the rocking table in an inclined position and supporting both ends of the lead frame to float the unnecessary resin; and (3) side rollers on both sides of the center roller press the inner end of the lead frame. The center roller presses down the upper surface of the unnecessary resin between the lead frames while being joined to the upper surface of the rocking table in a tilted position; and (4) the center roller and the side rollers are A step of moving from one end side to the other end side in the longitudinal direction of the lead frame, wherein the steps are performed in the order of (1) to (4). 6. A step of placing the two parallel lead frames on two rocking tables that rock with the bottom on the opposite side as a fulcrum. A step of cooling the unnecessary resin adhered to the lead frame mounted on the rocking table between the step of supporting the edge and bringing the unnecessary resin into a floating state. 6. The method of deleading a lead frame according to 5.