JP2003188330A - Lead forming device and lead cutting device for semiconductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To keep the upper part of a semiconductor placed on a lower hold free, to surely hold the semiconductor when it is subjected to processing, to shorten a cycle time, to eliminate processing failures, and to improve processing efficiency in a semiconductor lead bending device or a semiconductor disused lead cutting device. <P>SOLUTION: A semiconductor lead bending device is equipped with a mounting plate 2 mounted with a lower hold 1 supporting a semiconductor 10 and links 4 which are each provided in a freely pivoting manner by a pivot 3 on each side of the lower hold 1 of the mounting plate 2. A pressing piece 8 pressing a lead placed on the lower hold 1 and a bending punch 5 (or a cutting punch) pressing and forming the lead are provided to the link 4. A press unit 14 is provided to push up the links 4 from below the mounting plate 2 to make them pivot. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding device for bending an external lead of a semiconductor and a cutting device for cutting an unnecessary portion of the molded lead.

[0002]

2. Description of the Related Art A molding or cutting apparatus of this type has a construction in which a bending die supporting a semiconductor or a die set having a bending punch or a cutting punch attached thereto is moved down from above a semiconductor die.

FIG. 8 is a diagram showing the structure of such a molding apparatus. A bending punch 83 is attached to an upper block 82 provided in an upper die set 81, and a lower die set 84.
The bending die 86 is attached to the lower block 85 provided in the above, and the semiconductor 10 is mounted on the bending die 86. 8
A pressing device 7 is provided on the platen 88 above the upper die set 81, and moves the upper die set 81 up and down. 89
Is a carry-in hand for setting the semiconductor 10 on the bending die 86, and 90 is a carry-out hand for taking out the processed semiconductor 10.

A carrying-in hand 89 in which the semiconductor 10 to be molded is supported by vacuum is carried in from the side of the apparatus and placed on the bending die 86. When the semiconductor 10 is placed, the carry-in hand 89 is moved out of the mold (the upper die set 81 and the lower die set 84), the upper die set 81 is lowered by the pressing device 87, and the leads 10a of the semiconductor 10 are bent. It is bent into a predetermined shape by the die 86 and the bending punch 83. When the bending process is completed, the bending punch 83 is raised,
The carry-out hand 90 is sent into the mold to take out the molded semiconductor 10, and it is sent to the next step, for example, a lead cutting device.

The cutting device is constructed in the same manner as the above-mentioned forming device, and instead of the bending punch 83 and the bending die 86, a cutting punch and a cutting die are used.

[0006] JP-A-62-93967 discloses an IC cutting and bending device for operating an upper die with a crank shaft provided below a base.
The guide plate is provided above the base wall and is attached to a slider. The crank mechanism connected to the crank shaft moves the upper die up and down toward the lower die via the connecting rod. In Japanese Utility Model Laid-Open No. 3-76635, a semiconductor element is sandwiched and held from above and below, and bending punches are provided on both sides of the semiconductor element while being supported by a shaft, and the punch is rotated about the shaft to perform bending work. Although a lead forming mechanism is shown, the roller for rotating the bending punch is also operated by a block that moves up and down from above.

[0007]

As described above, in the conventional molding or cutting apparatus, the upper die and its operating mechanism are provided above the semiconductor placed on the lower die. The upper die moves up and down for processing, or the punches on both sides are operated by blocks that move up and down from above. Therefore, the upper part of the semiconductor supported on the bending die or the cutting die is covered with the upper mold and the operation mechanism, and when the semiconductor is set on the die by the transfer hand, the processing operation must be performed unless the transfer hand is withdrawn. It is not possible to do so, the cycle time is extended and the work efficiency is reduced, and it is difficult to clamp the semiconductor placed on the lower mold at all times during processing. There are drawbacks such as misregistration, defective molding, defective cutting, and damage to mold parts.

In an apparatus that uses upper and lower molds according to the shape and size of a semiconductor, it is necessary to replace the mold for each different semiconductor size, which requires many kinds of molds. There is a problem that not only the cost of the product becomes large, but also the setup time required for replacement becomes long.
The present invention provides a device for molding or cutting a semiconductor lead in a state where an upper portion of a semiconductor placed on a lower die is released,
The purpose is to ensure the holding of the semiconductor during processing, eliminate processing defects, improve processing efficiency, and use a common mold.

[0009]

To this end, a lower die for supporting a semiconductor is attached to a mounting plate, which is rotatably attached to both sides of the lower die on the mounting plate via pivots. The press device is provided with a bending punch that presses the processed portion of the semiconductor lead to perform the bending process, and rotates the bending punch from the lower side of the mounting plate via an operating mechanism such as an operating rod.

A link rotatably attached via a pivot is provided on the side of the lower die attached to the attachment plate, and this link is provided with a bending punch and prior to pressing the bending punch to the semiconductor lead. It is desirable to provide a pressing piece for pressing and holding the lead against the lower mold.

Further, the lower die and the mounting plate are divided into two pieces facing each other, and are attached to a fixed block so as to be movable in the dividing direction, and the interval of the lower die is adjusted according to the size of the semiconductor and fixed. Support. The cutting device for the molded lead may be provided with a cutting punch instead of the bending punch.

Further, in the cutting device, a slider that moves from the side of a holding table that supports bent leads is provided, and this slider is provided with a cutting die and a cutting punch so that the cutting die contacts the leads. The cutting punch can be pushed up from below to perform the cutting.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment shown in the drawings will be described. 1 to 3 show an embodiment of a molding apparatus according to the present invention, in which 1 is a lower mold which is divided into two, and which has a lead receiving portion 1a (FIG. 2) for supporting a lead 10a of a semiconductor 10,
A bending die 1b is provided on the outside thereof. Reference numeral 2 denotes a divided mounting plate, and the lower mold 1 is attached to each of the opposing end portions. 3 is a pivot provided on the mounting plate 2 at the side of the lower mold, 4 is a link rotatably attached by the pivot 3, 5 is a bending punch attached to the upper surface of the link 4, 6 is a tension spring, and The bending punch 5 is held in a raised state. Reference numeral 7 is a link roller, 8 is a pressing piece supported by the link 4 by a bin 9 and a compression spring 11, 1
2 is a fixed block on which both mounting plates 2 and 2 are placed, 12a, 12b and 12c are position adjusting holes provided in the fixed block, 13 is a positioning pin to be inserted into the position adjusting hole,
Reference numeral 14 denotes a press device which is provided below the fixed block 12 of the base 15 to vertically move the press plate 16 and push up the link roller 7 via the operation rod 17. Reference numeral 18 is a rod hole through which the operation rod 17 is inserted, and 20 is a carrying hand.

First, the positioning bins 13, 13 of the mounting plates 2, 2 on both sides are inserted into one of the position adjusting holes 12a, 12b, 12b (12a in the figure) of the fixed block 12 according to the size of the semiconductor 10. Then, the press plate 16 is pulled down by the press device 14, the operating rod 17 brought into contact with the press plate 16 descends, and the tension spring 6 causes the link 4 to separate the bending punch 5 from the lower die 1 (Fig. 1).

After the semiconductor 10 is adsorbed by the vacuum at the tip of the transfer hand 20 and carried in and placed on the lower molds 1 and 1,
The operation rods 17, 17 are pushed up by the press device 14 via the press plate 16. When the operation rods 17, 17 are pushed up, the link roller 7 is pushed up to rotate the links 4, 4 against the tension spring 6, and the pressing pieces 8,
8 presses the lead 10a against the lead receiving portion 1a of the lower mold 1. Further, when the operating rod 17 is raised, the pressing piece 8 compresses the compression spring 11 to continue pressing the lead, and the link 4 and the bending punch 5 are rotated to move the bending punch 5 to the lead 1a.
Is pressed against the bending die 1b, and as shown in FIG.
0a is bent and formed.

The bending punch 5 and the pressing piece 8 are the lower mold 1
Since it is provided on the side of and is rotated by an operation from below, the upper part of the lower mold 1 is always open, and the transfer hand 20 processes the lead while the semiconductor 10 is pressed against the lower mold 1. The semiconductor can be securely held. Semiconductor 10
If the dimensions are different, the mounting plates 2 and 2 may be moved on the fixed block 12 to adjust the interval of the lower die 1 and fixed by the positioning pin 13.

FIG. 4 shows an example of a cutting device and shows only one of them, and the same reference numerals as those in FIG. 1 denote the same parts.
The entire structure is the same as that of the above-described forming device, and the cutting punch 21 is provided instead of the bending punch 5. Two
2 is a discharge chute for receiving cutting waste. The semiconductor-molded lead 10a held by the lower die 1 is pressed by the pressing piece 8 by the rotation of the link 4 by pushing up the operation rod 17.
It is pressed by, and the cutting punch 21 is rotated by the rotation of the link 4.
Cuts the unnecessary part of the lead tip.

5 and 6 show another embodiment of the cutting device, and the same parts as those in FIG. 1 are designated by the same reference numerals. Reference numeral 30 is a holding base that is attached to the mounting plates 2 and 2 to support the semiconductor, 31 is symmetrically provided on both sides of the holding base 30, and is a slider that moves laterally along a guide rail (not shown). The sliders on both sides are held at positions separated from the holding table 30 by the tension springs 32 attached to the. 33 is a lead retainer provided at the tip of the slider 31, 34 is a cutting die having a width that matches the required length of the bent end of the lead, and 35 is attached to the slider 31 so as to rotate by a pivot pin 36. The cutting punch, 37 is a compression spring separating the cutting punch from the cutting die, 38 is the roller of the cutting punch, 39 is a guide roller attached to the side surface of the slider 32, and 40 is a pair of operating rods 17, 17. With the operating member, the cam portion 41 that contacts the guide roller 39 of the slider 31
And a push-up portion 42 that pushes up the cutting punch 35 in contact with the roller 38.

The semiconductor 10 whose leads are bent and formed by the carrying hand 20 is placed on the holding tables 30, 30. This state is shown in FIG. When the operating device 17 is pushed up by the press device 14 via the press plate 16, the operating member 40 is pushed up together with the operating rod,
The cam portion 41 presses the guide roller 39 to push the slider 3
6 is moved toward the holding table 30, and as shown in FIG. 6B, the lead holder 33 holds the top of the lead and the cutting die 34 contacts the upper surface of the bent portion of the lead. When the operating member 40 is further raised,
As shown in (c), the push-up portion 42 pushes up the cutting punch 35 against the compression spring 37 via the roller 38, and cuts the unnecessary portion of the lead end against which the cutting die 34 is applied from below.

The lower die 1, the holding table 30 and the mounting plate 2 in the above embodiment are divided into left and right and are symmetrically provided, and the intervals are adjusted according to the size of the semiconductor. When only one-dimensional semiconductor is processed, it can be installed without dividing. The link 4 is pushed up by the operation rod 17, but
The lower die 1 side together with the operating rod 17 is the press plate 1
When the operating rod 17 is pulled down, the bending punch 5 of the link 4 or the cutting punch 21 is connected to the lead 1.
0a may be processed.

FIG. 7 shows an example of the arrangement of molding and cutting devices.
The semiconductor 10 individually separated from the lead frame by the individual die 51 is adsorbed by the transfer hand 20a of the transfer device 52 arranged above and sent to the forming device 53, and the leads on the opposite two sides are bent and formed. To do. When the molding is completed, the conveying device 52 is advanced by one pitch while the semiconductor is adsorbed to the conveying hand 20a and sent to the next cutting device 54, and the semiconductor adsorbed by the next conveying hand 20b is transferred to the forming device 53.
Sent to. The semiconductor cut and processed with the lead end aligned by the cutting device 54 is turned 90 degrees by the turning base 55 arranged at equal intervals and sent to the forming device 56, where the other two opposite sides are formed and cut. It is sent to the device 57 and the unnecessary portion of the lead is cut and sent out. In this way, each of the transfer hands of the transfer device can sequentially send the semiconductors to the devices while adsorbing the semiconductor, and continuously perform the processing.

[0022]

As described above, according to the present invention, a bending punch or a cutting punch is rotatably provided on both sides of a mounting plate on which a lower die for supporting a semiconductor is mounted, and is rotated by an operation from the lower side of the mounting plate. Since the semiconductor leads are molded or cut by moving the semiconductor leads, the upper part of the lower die on which the semiconductor is placed is released, and it is easy to carry in and hold the semiconductors with the transfer hands, and the transfer hands can be used even during processing. There is no need to move out, and the conductor can be processed while being held by the transfer hand, which has the effect of reliably holding the conductor and enabling high-speed processing, shortening the cycle time, and improving work efficiency. It improves and eliminates the risk of defective molding and damage to mold parts.

The link provided rotatably on the mounting plate can be provided with a bending piece and a cutting punch together with a pressing piece for pressing and holding the lead in the lower die prior to processing, so that the semiconductor can be held more reliably. Can be If the lower mold and the mounting plate are divided into two pieces facing each other and are movably mounted on the fixed block, the distance between the lower molds can be adjusted according to the size of the semiconductor, and the mold There is an effect that the cost can be reduced and the die can be easily changed according to the size of the semiconductor, and the setup time can be shortened.

Further, in place of the rotatable link, a slider that reciprocates by pushing up from below is provided, and this slider is provided with a cutting die and a cutting punch operated by the pushing up, thereby holding the semiconductor. It is not necessary to provide the table with a cutting die, and the structure can be simplified, and the cutting die and the cutting punch are collectively provided on the slider, and the position adjustment can be easily performed.

[Brief description of drawings]

FIG. 1 is a side view of a molding apparatus showing an embodiment of the present invention, a part of which is shown in cross section.

FIG. 2 is an enlarged partial view of a part of FIG.

FIG. 3 is a side view showing a state at the time of forming processing in FIG.

FIG. 4 is a partial view showing an embodiment of a cutting device of the present invention.

FIG. 5 is a side view showing another embodiment of the cutting apparatus of the present invention, a part of which is shown in section.

FIG. 6 is a partial view showing the operation of the embodiment shown in FIG.

FIG. 7 is an explanatory diagram showing an example of arrangement of molding and cutting devices.

FIG. 8 is a side view showing an example of a conventional molding apparatus.

[Explanation of symbols]

1 Lower mold 1a Lead receiving part 1b Bending die 2 Mounting plate 3 Axis 4 links 5 Bending punch 7 Link roller 8 holding piece 10 Semiconductor 10a lead 12 fixed blocks 12a, 12b, 12c Position adjustment hole 13 Positioning pin 14 Press equipment 16 Press plate 17 Operation rod 20 Transport hand 21 cutting punch 22 Discharge chute 30 holding table 31 slider 33 Reed holder 34 cutting die 35 cutting punch 39 Guide roller 40 Operation member 41 Cam 42 Push-up part 51 piece mold 52 Conveyor 53,56 Molding equipment 54, 57 cutting device 55 swivel base

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Claims (9)

[Claims] 1. A bending punch that attaches a lower die supporting a semiconductor to a mounting plate, is rotatably attached to both sides of the lower die on the mounting plate, and presses a processed portion of a semiconductor lead by the rotation. The semiconductor lead forming apparatus is characterized in that the bending punch is rotated from below the mounting plate via an operating mechanism. 2. The bending punch is provided on a link that is rotatably attached via a pivot provided on an attachment plate, and a retainer that presses and holds a lead on a lower die prior to press-forming the bending punch on the link. 2. The semiconductor lead forming apparatus according to claim 1, which is provided with a piece. 3. The lower die and the mounting plate are divided into two pieces facing each other and are movably mounted on a fixed block, and the lower die is adjusted so as to be fixedly supported. Alternatively, the semiconductor lead forming apparatus according to the item 2. 4. A cutting punch that mounts a lower die supporting a semiconductor on a mounting plate and is rotatably mounted on both sides of the lower die on the mounting plate, and cuts an unnecessary portion of a semiconductor lead by rotation. A semiconductor lead cutting device, wherein the cutting punch is rotated from the lower side of the mounting plate via an operating mechanism. 5. A pressing piece which is provided on a link rotatably attached to the cutting punch via a pivot provided on an attachment plate, and which presses and holds a lead on a lower die prior to cutting the cutting punch. The semiconductor lead cutting device according to claim 4, further comprising: 6. The lower die and the mounting plate are separately movably mounted on a fixed block in two pieces facing each other, and the intervals between the lower dies are adjusted so as to be fixedly supported. Alternatively, the semiconductor lead cutting device according to item 5. 7. A holder for supporting a semiconductor is attached to a mounting plate, and sliders reciprocating toward the holder are provided on both sides of the holder on the mounting plate, and the slider is rotatable with a cutting die. A cutting punch that is attached to the cutting punch for cutting an unnecessary portion of the semiconductor lead by rotation, and the movement of the slider and the rotation of the cutting punch are operated from the lower side of the attachment plate via an operation mechanism. And semiconductor lead cutting equipment. 8. The semiconductor lead cutting apparatus according to claim 7, wherein the slider is provided with a lead retainer for pressing and holding the lead on a holding table prior to the rotation of the cutting punch. 9. The holding base and the mounting plate are divided into two pieces facing each other and are movably mounted on a fixed block, and the distance between the holding bases is adjusted for fixed support. Or the semiconductor lead cutting device according to item 8.