JP3094361U - Ceramic substrate for component mounting - Google Patents

Abstract

(57) [Summary] (Modified) [Problem] To simplify the manufacturing process, reduce the cost, provide extremely good coupling mechanical strength and good signal transmission function, and prolong the life of parts. Provided is a component mounting ceramic substrate capable of improving the yield. SOLUTION: It mainly includes a ceramic substrate for component mounting.
The component mounting ceramic substrate has a predetermined number of receiving holes, and functional electronic components are installed on the ceramic substrate next to the receiving holes. The inside of the receiving hole is filled with a conductive paste. Since the conductive paste and the ceramic substrate have good adhesion and conductive performance, they can be used to connect subsequent electrode projections or electrode pins, thereby reducing the number of steps in the subsequent encapsulation process and reducing costs. A protective layer is provided on the functional electronic component to protect the electronic component and to protect a contact area between an electrode of the electronic component and the conductive paste in the receiving hole. As a result, the life of the component can be prolonged, and the yield can be improved.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

  The present invention relates to a type of component mounting ceramic substrate. Especially a kind of very good A ceramic substrate for component mounting with good coupling mechanical strength and good signal conduction function. It

[0002]

[Prior art]

  In recent years, Taiwan's semiconductor and IT industries have grown remarkably, and PC, mouse , Products such as scanners and monitors have become important in the world.   The electronic products mentioned above are always thinner, lighter and smaller, so various types of products are needed. The demand for precision and size of parts and processing equipment is becoming stricter day by day. Manufacturing technology that develops in the direction of precision, high density, high speed, intelligence, miniaturization, etc. Promoting new. In this way, the "next-generation manufacturing technology" required by the 21st century industry is born. It is rare.

[0003]  Thick film and thin film manufacturing processes using screen printing as an elemental technology are similar to IC manufacturing processes. The semiconductor manufacturing process is adopted, but the biggest difference between the two is in the film thickness to be manufactured. Su The film thickness produced by the clean printing process rule is 5 micron to 10 micron It is manufactured by the semiconductor compatible process rule such as PVD or CVD. The film thickness is 0.01 micron to 1 micron. The difference between the two is 10 times to 1 It is also 00 times, and it is generally classified into thick film and thin film. That is why the manufacturing process is divided.

[0004]   However, the biggest difference between the two is in the film forming technology. Thick film is already manufactured Based on the screen of 1: 1 figure that was made, by etching, pressing, printing The mask is printed directly on the ceramic substrate through the base. Then, dry and bake Completed through steps such as binding.

[0005]  On the other hand, the thin film includes the sputtering technology adopted in the semiconductor manufacturing process and the manufacturing process such as evaporation. Use PVD technology and CVD. These manufacturing processes include screen printing The mask required is typically a post-photomask because it has no area-selective deposition properties. Form by lithography. For example, ICs and other active components are used in semiconductor manufacturing process technology. Manufacturing complex circuits with higher part densities, thin film passive components likewise have electrical resistance Layers, barrier layers, metal conductive layers to create thin film fabrication processes, and combine electrical resistance and It is manufactured by a photomask etching process of a sensor and a resist mask.

[0006]  Therefore, as compared with the thick film process that sinters at high temperature, the thin film process has a temperature of 100 ° C or less. Controllable. Moreover, the manufacturing process can be adjusted depending on the substrate characteristics used. Therefore, thin-film passive components should be manufactured on different substrates for different applications. You can That is, silicon chips, aluminum oxide ceramic substrates, glass substrates A board such as a plate or CB can be adopted. These characteristics also apply to thin-film matched passive components. It has a wide range of uses.

[0007]  Moreover, the surface roughness of the substrate must be Ra <0.3 microns or less, When manufacturing capacitors, if the roughness is too high, the thin film barrier layer will be The lock may be easily penetrated, resulting in a short circuit or voltage being too low. Ku. Similarly, if the roughness of the component board surface is too high, random signals will be generated during high cycles. It tends to occur and deteriorates high cycle characteristics. This should be taken into consideration when selecting the board is necessary.

[0008]   Taking electric resistance as an example, the electric resistance depends on the volume of the known capacitor. The electrical resistance of chips and chips is used, and many electronic products are manufactured to be thinner, lighter and smaller. Therefore, there are naturally similar requirements for the internal parts. Therefore, Kerr is beginning to convert known electrical resistance to chip resistance. Chip resistance is a manufacturing process There is a thick film manufacturing process and a thin film manufacturing process.

[0009]   Currently, many manufacturers use thick film manufacturing processes. Screen printing technology Prints the oxide on an aluminum oxide substrate. This technique is less stable, and The high temperature coefficient necessitates the constant use of high temperature sintering processes. Therefore, the thin film Because the cost is higher than the manufacturing process, the manufacturer develops a thin film manufacturing process that is cheaper Wants

[0010]   On the other hand, electrical resistance is one of the three major passive components and is an important component in electronic and electrical products. . Its main function is the regulation of voltage and current in the circuit. Currently produced by Taiwanese manufacturers The electrical resistance to be applied is carbon film electrical resistance, metal carbide film electrical resistance or metal oxide film electrical resistance. , Ceramic electric resistance, and variable electric resistance.   Among them, ceramic electric resistance is semiconductor electric resistance, semiconductor array resistance, array electric resistance Depending on the difference in manufacturing process, thick film ceramic electrical resistance and thin film ceramic Are classified into electrical resistance.   The thick film ceramic electric resistance is a special conductive paint, insulating paint, electric resistance paint. Printed on a ceramic substrate as a single or wiring diagram, cut at a constant temperature after sintering. To manufacture.

[0011]   The thin film ceramic electrical resistance is made uniform by the vacuum coating technology. Coating on a Lamic substrate. Thin film ceramic electrical resistance is precise and stable It has excellent properties such as high resistance, wide adjustment range of electrical resistivity, and low temperature coefficient. Therefore, it has been adopted by many manufacturers.

[0012]   Aluminum oxide ceramic substrate is mainly applied on ceramic electric resistance, Supporting conductive paint in the resistor pair, the manufacturing process is pure aluminum oxide. Print high quality metal thick film conductors on a lamic substrate. Glass glaze protective film on the exterior Apply and produce uniform chip quality and stability.

[0013]   The aluminum oxide ceramic substrate used is characterized by high temperature resistance and high stability. There is no alternative at the moment because it has sex. However, the table of the ceramic substrate Often the surface is not flat, so functional electronic components should be mounted on a ceramic substrate that is not flat. When installing, the strength of the joining machine is insufficient. Therefore, often other manufacturing It needs to be resealed depending on the process.   In addition to such manufacturing process and cost increase, the encapsulation process as described above is an electronic component. The quality of the product (such as poor signal conduction) and improve the yield rate of the entire product. There is a drawback that you cannot do it.

[0014]

[Problems to be solved by the device]

  In order to solve the above-mentioned drawbacks of the known structure, the present invention provides a ceramic substrate for mounting components. The challenge is to provide.   It can simplify the manufacturing process and reduce the cost. Moreover, it has extremely good coupling mechanical strength and good signal conduction function, The life can be extended and the yield rate can be improved.

[0015]

[Means for Solving the Problems]

  In order to solve the above problems, the present invention provides the following ceramic board for mounting components. To do.   It mainly includes a component mounting ceramic substrate. The component mounting ceramic substrate has a predetermined number of accommodating holes, and a ceramic plate beside the accommodating holes. Install functional electronic components on the board. Conductive paste is placed in the receiving hole. Fill. The conductive paste and the ceramic substrate have good adhesion and conductive performance. Therefore, it is used to connect the subsequent electrode protrusions or electrode pins, and is used for the subsequent encapsulation process. The order can be reduced and the cost can be reduced. Further on the functional electronic component A protective layer is provided to protect the electronic component, and the conductive pace of the electrode of the electronic component and the receiving hole. Protect the contact area of the car. This prolongs the life of parts and improves the yield rate. You can

[0016]   That is, the present invention is as follows. (1) Mainly includes a ceramic substrate, and the ceramic substrate has a predetermined number of accommodation holes. In the accommodation hole, the functional electronic component is installed on the ceramic substrate next to the accommodation hole. Filled with a conductive paste and provided with a protective layer on the functional electronic component. A ceramic substrate for mounting components. (2) A pin metal is installed above the functional electronic component, and the pin metal is made of bare metal. Adhesive bonding or bump electrode fabrication is possible, making complex systems easy The component mounting ceramic according to (1) above, which can be assembled on a single substrate. Board. (3) An unbroken cutting line is provided at the lower end of the accommodation hole of the ceramic substrate. The ceramic board for component mounting according to (1) above. (4) The ceramic substrate may be a glass substrate. The ceramic board for component mounting according to (4).

[0017]

[Embodiment of device]

  As shown in FIG. 1, the present invention is mainly applied to a component mounting ceramic substrate (including a glass substrate). Yes) including 1. The component mounting ceramic substrate 1 has a predetermined number of accommodation holes 2 and the accommodation holes 2. The functional electronic component 3 is installed on the ceramic substrate 1 on the two sides. The functional electric The child part 3 is an electric resistance, a capacitor, or the like, and is a thick film electronic part or a thin film electronic part. The manufacturing process differs depending on the type of electronic component.

[0018]   A conductive paste 4 is filled in the accommodation hole 2, and the conductive paste 4 is silver. Has a conductive and fixing action such as paste, metal paste, and glass conductive paste. Of. The conductive paste 4 and the ceramic substrate 1 are in a good fixed state and have a conductive property. To be used for subsequent electrode protrusions or electrode pin connections. Pre-established The use of the conductive paste 4 for the receiving hole 2 reduces the procedure of the subsequent encapsulation process, The cost can be reduced.

[0019]   By filling the inside of the accommodation hole 2 with a conductive paste 4, the functional electronic component 3 And the adhesion of the ceramic substrate 1 is strengthened, and the functional electronic component 3 further transmits the signal. It can be sent. A protective layer 5 is provided on the functional electronic component 3, and the electronic component is 3 to protect the contact area between the electrode of the electronic component 3 and the conductive paste 4 in the housing hole 2. Protect. This prolongs the life of parts and improves the yield rate.

[0020]   That is, the functional electronic component 3 and the ceramic substrate 1 are adhesively bonded to the conductive paste 4. Strengthens the sticking force by combining. Further, the functional electronic component 3 has a conductive function. Good signal conduction is achieved by being adhesively bonded by the conductive paste 4.

[0021]   Next, as shown in FIGS. 2 and 3, above the functional electronic component 3, a pin metal 6 (sol Ruder ball, etc.) is installed, and the pin metal 6 is attached to the bearing by adhesion or the protruding electrode. The fabrication can be done and, furthermore, does not require any other encapsulation.   Today's complex electronic systems offer high performance, low cost, speed, small size, light weight, and high performance. High reliability and a lot of things are required, but the present invention simplifies the complicated system described above. It can be assembled on a single substrate.

[0022]   Further, as shown in FIG. 4, the ceramic substrate 1 of the present invention is not attached to the lower end of the accommodation hole 2. A tear line 7 is provided. After mounting the functional electronic component 3 on the ceramic substrate 1. The ceramic substrate 1 is torn from the accommodation hole 2 at the cutting line 7. Then the said The rupture portion is processed to form an electronic component having conductive electrodes on both left and right ends.   In the same manner as described above, this example also strengthens the mechanical strength of the product and improves the signal transmission capacity and the non-defective rate. Can be improved.

[0023]

[Effect of device]

  As described above, the present invention can simplify the manufacturing process and reduce the cost. You can Furthermore, it has very good coupling mechanical strength and good signal conduction function, It is possible to prolong the life of parts and improve the yield rate.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a cross-sectional view of an embodiment of the present invention in an implementation state.

FIG. 3 is a front view and a side view of an implementation state of an embodiment of the present invention.

FIG. 4 is a sectional view of another embodiment of the present invention.

[Explanation of symbols]

1 Ceramic board for component mounting 2 accommodation hole 3 Functional electronic components 4 Conductive paste 5 protective layer 6 pin metal 7 cutting line

Claims (4)

[Scope of utility model registration request] 1. A ceramic substrate is mainly included, and the ceramic substrate has a predetermined number of accommodating holes. Functional electronic components are installed on the ceramic substrate beside the accommodating holes, and a conductive paste is provided in the accommodating holes. A ceramic substrate for component mounting, which is filled with a protective layer on the functional electronic component. 2. A pin metal can be installed above the functional electronic component, and a bearing adhesive bond of the pin metal or a projection electrode can be manufactured, so that a complicated system can be easily mounted on a single substrate. The ceramic substrate for component mounting according to claim 1, which can be assembled. 3. The component mounting ceramic substrate according to claim 1, wherein an unruptured cutting line is provided at a lower end of the accommodation hole of the ceramic substrate. 4. The component mounting ceramic substrate according to claim 1, wherein the ceramic substrate may be a glass substrate.