JP3093865B2 - Cleaning water closed system in solder plating equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning water closed system in an electronic component solder plating apparatus,
For example, the present invention relates to a technique that is effective when applied to a cleaning water closed system that closes cleaning water when solder plating an IC lead frame.

[0002]

2. Description of the Related Art As a closed system for washing water in a solder plating apparatus of this kind for electronic parts, there is, for example, the following one.

[0003] That is, the washing water closed system in the solder plating apparatus for electronic parts is applied to a solder plating apparatus for an IC lead frame. , Washing section,
It has a neutralization section, a hot water washing section, and a drying section, and a water treatment device for treating the wastewater from each of the water washing sections is provided, so that the washing water is closed.

[0004]

However, the closed system for washing water in the above-mentioned solder plating apparatus for electronic parts has a structure in which a large amount of chemical solution or plating solution in the previous process is brought into each washing section. There was a problem that water contamination was remarkable and water treatment was difficult.

[0005] For this reason, there has been a problem that it is not possible to achieve a closed level of the washing water at a practical level, and it is difficult to eliminate drainage.

An object of the present invention is to provide a cleaning water closed system in an electronic component solder plating apparatus which can reduce the amount of a chemical solution or the like brought into a cleaning section and reduce the degree of contamination of cleaning drainage. .

Another object of the present invention is to provide a cleaning water closed system in an electronic component solder plating apparatus which can achieve the cleaning water closed at a practical level and can reduce drainage.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the cleaning water closed system in the solder plating apparatus for electronic parts according to the present invention comprises a pre-processing part for performing pre-treatment, a plating part for plating the pre-treated electronic parts, and a plating part for the electronic parts. And a post-processing unit for performing post-processing on the pre-processing unit, a plating unit, and a cleaning unit provided in the post-processing unit. Things.

[0011] In this case, the liquid draining section may have a structure including a rotary liquid draining mechanism that removes liquid adhering to the electronic component by holding and rotating the electronic component at high speed.

Further, in this case, the rotary liquid draining mechanism may have a structure including a motor for rotating the electronic component at a high speed and an encoder for detecting a rotational position and a rotational speed.

[0013]

According to the washing water closed system in the electronic component solder plating apparatus of the present invention described above, the pre-processing unit,
The structure has a liquid drain section that removes liquid adhering to electronic components immediately before the cleaning section provided in the plating section and the post-processing section.This reduces the amount of chemicals brought into the cleaning section and reduces the amount of cleaning drainage. Pollution degree can be reduced.

Therefore, it is possible to achieve the closed level of the cleaning water at a practical level and to reduce drainage.

In this case, the liquid draining section has a structure including a rotary liquid draining mechanism for holding the electronic component and rotating it at a high speed to remove the liquid attached to the electronic component. Can be removed by centrifugal force.

Also, in this case, the rotary liquid draining mechanism has a structure including a motor for rotating the electronic parts at a high speed and an encoder for detecting the rotational position and the rotational speed. And the like can be set freely, and positioning can be easily performed.

[0017]

FIG. 1 is a block diagram showing a cleaning water closed system in an electronic component solder plating apparatus according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a liquid drainage section in FIG.

The closed cleaning water system in the solder plating apparatus for electronic components according to the present embodiment is applied to a solder plating apparatus for an IC lead frame W, and has a structure that enables closed cleaning water.

That is, in this solder plating apparatus, a degreasing section 1 for degreasing with a degreasing liquid and a liquid removing section 2a for removing the degreasing liquid are sequentially arranged on the leftmost side.

A washing section 3a for washing with water is disposed next to the drain section 2a. Following this washing section 3a,
A chemical polishing section 4 for performing chemical polishing with a chemical polishing liquid and a liquid removing section 2b for removing the chemical polishing liquid are sequentially provided. Further, a water washing section 3b for washing with water and a liquid removing section 2c for removing washing water are provided. .

Following the draining section 2c, a plating section 5 composed of a plating tank is disposed.
A drainer 2d for removing the plating solution is provided.

A water washing section 3c for washing with water is provided following the liquid draining section 2d. In the next stage of the water washing section 3c, a neutralizing section 6 for neutralizing with a neutralizing solution, a removal of the neutralizing solution. Are sequentially arranged.

Next to the liquid draining section 2e, a hot water washing section 3d for performing hot water washing is disposed, and further, a liquid draining section 2f for performing hot water draining is disposed. Finally, a drying unit 7 for drying the drained IC lead frame W to remove moisture is provided.

A water treatment apparatus 11 is provided outside the plating apparatus. The water treatment apparatus 11 treats waste water from the water washing sections 3a to 3c with water, and purifies pure water generated by the water treatment with the water washing sections 3a to 3c. It is structured to circulate the water.

Further, the water treatment device 11 performs a water treatment on the discharged hot water from the hot water washing section 3d through the heat exchange section 9 and the cooling section 10 with normal temperature water, and purifies the pure water generated by the water treatment with the heat exchange section. The hot water is circulated and supplied to the hot water washing section 3d as hot pure water via the section 9 and the heater 8.

The liquid draining sections 2a to 2f are constituted by a rotary liquid draining mechanism 18, and the rotary liquid draining mechanism 18
A liquid, such as a chemical solution, attached to the IC lead frame W is removed by holding and rotating the C lead frame W at a high speed. A motor 15 for rotating the IC lead frame W at a high speed is provided.

The motor 15 is provided with an encoder 14. The encoder 14 detects a rotation position and a rotation speed. Based on the detected rotation position and the rotation speed, a drainage condition such as a drainage time and a rotation speed is determined. It has a structure for setting and positioning.

The rotary shaft 12 is directly connected to the motor shaft 13 and extends into the liquid draining chamber 17. A holder 16 is provided on the rotary shaft 12 in the liquid draining chamber 17.
Has a structure for holding an IC lead frame W.

Next, the operation of this embodiment will be described.

When high speed rotation is applied to the IC lead frame W by the motor 15 prior to washing with water or hot water,
A liquid such as a chemical solution attached to the lead frame W for C is blown off to the surroundings by centrifugal force to be drained.

As described above, since the liquid draining sections 2a to 2e are provided immediately before the water washing sections 3a to 3c or the hot water washing section 3d, chemicals and the like are brought into the water washing sections 3a to 3c and the hot water washing section 3d. The amount can be reduced, and the pollution degree of the washing wastewater can be reduced.

Therefore, it is possible to achieve a closed level of the washing water at a practical level, and to reduce drainage.

In this case, the rotary liquid draining mechanism 18
Motor 15 for giving high speed rotation to IC lead frame W
And an encoder 14 for detecting a rotational position and a rotational speed
With the structure provided, the drainage conditions such as the drainage time and the rotation speed can be freely set, and positioning can be easily performed.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist of the invention. Needless to say, there is.

In the above description, the invention made mainly by the present inventor has been described with respect to a cleaning water closed system in an IC lead frame solder plating apparatus, which is a field of application, but the invention is not limited to this. The present invention can also be applied to a cleaning water closed system in a solder plating apparatus for a lead frame-shaped electronic component other than an IC lead frame.

[0036]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) Since a liquid draining section is provided immediately before the cleaning section provided in the pre-processing section, the plating section, and the post-processing section to remove liquid adhering to the electronic component, a chemical solution to the cleaning section is provided. It is possible to reduce the carry-in amount and the like and reduce the pollution degree of the washing wastewater.

(2) By the effect of the above (1), it is possible to achieve a closed level of the cleaning water at a practical level and to reduce drainage.

(3) In the case of the above (1), the liquid draining section has a structure including a rotary liquid draining mechanism for removing the liquid adhering to the electronic component by holding the electronic component and rotating it at a high speed. In addition, the liquid attached to the electronic component can be removed by centrifugal force.

(4) In the case of the above (1), the rotary liquid draining mechanism has a structure including a motor for rotating the electronic parts at a high speed and an encoder for detecting the rotational position and the rotational speed. Liquid draining conditions such as the draining time and the rotation speed can be freely set, and positioning can be easily performed.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a cleaning water closed system in an electronic component plating apparatus according to one embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a liquid drain portion of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Degreasing part 2a Drain part 2b Drain part 2c Drain part 2d Drain part 2e Drain part 2f Drain part 3a Rinsing part 3b Rinsing part 3c Rinsing part 3d Rinsing part 4 Chemical polishing part 5 Plating part 6 Neutralization Part 7 Drying part 8 Heater 9 Heat exchange part 10 Cooling part 11 Water treatment device 12 Rotary shaft 13 Motor shaft 14 Encoder 15 Motor 16 Holder 17 Drain chamber 18 Rotary drain mechanism W IC lead frame

Claims (2)

(57) [Claims] 1. A pre-processing unit, comprising: a pre-processing unit for performing pre-processing; a plating unit for plating a pre-processed electronic component; and a post-processing unit for performing post-processing on the plated electronic component. Section, a plating section and a drain section for removing liquid attached to the electronic component immediately before the cleaning section provided in the post-processing section, and the liquid drain section holds the electronic component and rotates at a high speed.
Rotary type that removes liquid adhering to electronic components by removing
A cleaning water closed system in an electronic component solder plating apparatus, comprising a liquid draining mechanism. Wherein said rotary fluid cutting mechanism, electronic of claim 1 wherein a motor providing a high-speed rotation to the electronic component, that it has to have an encoder for detecting the rotational position and rotational velocity structure wherein Washing water closed system in parts solder plating equipment.