JPH02111011A - Drainage of water and apparatus therefor - Google Patents
Drainage of water and apparatus thereforInfo
- Publication number
- JPH02111011A JPH02111011A JP26285088A JP26285088A JPH02111011A JP H02111011 A JPH02111011 A JP H02111011A JP 26285088 A JP26285088 A JP 26285088A JP 26285088 A JP26285088 A JP 26285088A JP H02111011 A JPH02111011 A JP H02111011A
- Authority
- JP
- Japan
- Prior art keywords
- water
- organic solvent
- blind hole
- boiling point
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 239000003960 organic solvent Substances 0.000 claims abstract description 58
- 238000009835 boiling Methods 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000005192 partition Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 5
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000003125 aqueous solvent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、有機溶剤を用いて被洗浄物に付着した水を除
去するものであり、特に被洗浄物の微細な隙間や小径の
盲孔の中に入り込んだ水をも完全に除去できるように企
図したものである。[Detailed Description of the Invention] <Industrial Field of Application> The present invention uses an organic solvent to remove water adhering to an object to be cleaned. It is designed to completely remove water that has gotten into the tank.
〈従来の技術〉
電子部品、半導体部品、メツキ部品など（以下「ワーク
」と称す）は、最終工程において、汚れ等を取り除くた
め洗浄される。この洗浄では、最初に水により水洗され
、その後、ワークの表面に付着した水を有機溶剤を用い
て水切りして除去する。有機溶剤を几ｉいて水切りをす
るのは、水洗したワークをそのまま自然乾燥すると、水
に溶は込んでいた不純物（微量な塩など）がワークの表
面に残って「シミ」が発生するので、この「シミ」の発
生を防ぐために行なうのである。<Prior Art> Electronic parts, semiconductor parts, plated parts, etc. (hereinafter referred to as "workpieces") are cleaned in the final process to remove dirt and the like. In this cleaning, the workpiece is first washed with water, and then water adhering to the surface of the workpiece is drained and removed using an organic solvent. The reason for rinsing off the organic solvent and draining the water is because if you air-dry the washed workpiece as it is, impurities dissolved in the water (such as trace amounts of salt) will remain on the surface of the workpiece and cause "stains". This is done to prevent this "stain" from occurring.
水切りするために用いる有機溶剤としては次のような性
質が必要である。The organic solvent used for draining water must have the following properties.
（ｉｌ 水よりもワークを濡らしやすい。即ち、表面
張力及び粘度が水よりも小さい。(il) Easily wets the workpiece than water. In other words, the surface tension and viscosity are lower than that of water.
ｆｉｉｌ 自然乾燥しやすい。即ち、沸点及び蒸発潜
熱が小さく蒸発しやすい。fiil Easy to air dry. That is, it has a small boiling point and latent heat of vaporization, and is easily evaporated.
６１０ 水よりも比重が大きく水と溶けない。610 It has a higher specific gravity than water and does not dissolve in water.
上述した性質を持つ有機溶剤としては、フロン１１３（
沸点４７，５℃）、塩化メチレン（沸点３９．８℃）な
どの低沸点の有機溶剤がある。As an organic solvent having the above-mentioned properties, Freon 113 (
There are organic solvents with low boiling points such as (boiling point: 47.5°C) and methylene chloride (boiling point: 39.8°C).
そこで従来では上述した低沸点有機溶剤に微量の界面活
性剤を添加した液中にワークを浸漬して水切をしていた
。つまり、水が表面に付着したワークを上述したような
を機溶剤中に入れると１、ワーク表面の水は、界面張力
作用によりワーク表面から引きはがされ、引きはがされ
た水は、比重差によって有機溶剤の表面に浮き上がる。Therefore, in the past, the workpiece was immersed in a liquid containing the above-mentioned low-boiling point organic solvent and a small amount of surfactant added thereto to drain the water. In other words, when a workpiece with water attached to its surface is placed in a solvent as described above, the water on the workpiece surface is peeled off from the workpiece surface due to interfacial tension action, and the water that is peeled off has a specific gravity of The difference causes it to float on the surface of the organic solvent.
かくて水切ができる。This way you can drain the water.
なお、有機溶剤の表面に浮き上がった水はただちに流し
除かれる。そして水切りされたワークは有機溶剤から取
り出され、更に界面活性剤を取り除くため界面活性剤が
混入されていない有機溶剤を用いて洗浄される。Note that water floating on the surface of the organic solvent is immediately washed away. The drained workpiece is then taken out from the organic solvent and further washed with an organic solvent not mixed with a surfactant to remove the surfactant.
〈発明が解決しようとする課題〉
ところで、第３図に断面図で示すように、ワークｌにね
し孔などの小径の盲孔２がある場合には、上述した低沸
点有機 ／８剤に入れても、ワーク１表面の水切はでき
るものの、盲孔２内に入り込んだ水を取り除くことばで
きない。これは、盲孔２の径が小さくて水の界面張力の
作用が大きくなり、水が盲孔２から外に出にくくなって
おり、有機溶剤がなかなか盲孔２内に入れないからであ
る。このような事態は、ワークに微細な隙間があるとき
にも同様に発生する。<Problems to be Solved by the Invention> By the way, as shown in the cross-sectional view in FIG. Although water can be drained from the surface of the workpiece 1 even if water is poured into the blind hole 2, it is not possible to remove the water that has entered the blind hole 2. This is because the diameter of the blind hole 2 is small and the interfacial tension of the water becomes large, making it difficult for water to come out of the blind hole 2 and making it difficult for the organic solvent to enter into the blind hole 2. This situation also occurs when there are minute gaps in the workpiece.
そこで従来では、盲孔２を有するワーク１などでは、有
機溶剤でワーク表面の水切りをした後、ワークｌを熱風
乾燥室に入れて盲孔２内の水を蒸発させたり、水を吸収
するアルコールの中に何度も漬けて盲孔２内の水を徐々
に吸収させて無くすようにしていた。Therefore, in the past, for a workpiece 1 having a blind hole 2, etc., after draining the surface of the workpiece with an organic solvent, the workpiece 1 is placed in a hot air drying chamber to evaporate the water in the blind hole 2, or an alcohol that absorbs water is used. The water in the blind hole 2 was gradually absorbed and eliminated by immersing it in the water many times.
このように従来では盲孔や微細な隙間があると、その中
に入った水を取り出すのが難がしく、煩雑な作業を別途
行なわなくてはならなかった。In the past, when there were blind holes or minute gaps, it was difficult to remove the water that had entered them, and a complicated work had to be carried out separately.
本発明は、上記従来技術に鑑み、盲孔や隙間の内部の水
をも、簡単且つ確実に取り除くことのできる水切り方法
及び水切り装置を提供するものである。In view of the above-mentioned prior art, the present invention provides a draining method and a draining device that can easily and reliably remove water inside blind holes and gaps.
く課題を解決するための手段〉
上記課題を解決する本発明は、高沸点有機溶剤を加熱し
、この加熱した有機溶剤中に被洗浄物（ワーク）を浸漬
してワーク表面ならびにワークの盲孔内などの水切りを
することを、その要旨とする。Means for Solving the Problems> The present invention solves the above problems by heating a high boiling point organic solvent and immersing an object (work) to be cleaned in the heated organic solvent to clean the surface of the work and the blind holes in the work. The gist of this is to drain the inside of the container.
〈実 施 例〉 以下に本発明の実施例を図面に基づき詳細に説明する。<Example> Embodiments of the present invention will be described in detail below based on the drawings.
第１図は本発明を適用した水切装置を示す。FIG. 1 shows a draining device to which the present invention is applied.
同図に示すように水切槽１０内には金網１１が配置され
、水切槽ｌＯ内が２つの室１０ａ。As shown in the figure, a wire mesh 11 is arranged inside the draining tank 10, and the inside of the draining tank 10 has two chambers 10a.
１０ｂに仕切られている。この水切槽１０内には、界面
活性剤を添加した高沸点の有機溶剤１２、具体的にはト
リクロールエチレン（ＣｌｌＣｆｆ−ＣＣ１ｔ ：沸点
８６．５℃）を入れている。It is partitioned into 10b. This draining tank 10 contains a high boiling point organic solvent 12 to which a surfactant has been added, specifically trichlorethylene (CllCff-CC1t: boiling point 86.5°C).
金ｍｌｌは、水切槽１０の底面から高沸点有機溶剤１２
の液面よりも上方にまで延在しており、その網目は１０
０メツシユ（開度である。ml of gold is removed from the bottom of the draining tank 10 using a high boiling point organic solvent 12.
It extends above the liquid level, and its mesh size is 10
0 mesh (opening degree).
更に一方の室１０ｂの底面にはヒータ１３が設置されて
いる。Furthermore, a heater 13 is installed at the bottom of one of the chambers 10b.
水切槽１０内には有機溶剤、１２が次々と注入され、水
切りして有機溶剤、１２の表面に浮んだ水と有機溶剤１
２は、仕切壁１・１を越流して分離・回収槽２０に流れ
込む。分１雅・回収槽２０では、比重差を利用して有ａ
溶剤１２を水から分離し、分離した有ａ溶剤１２を回収
してフィルタリング等の処理をして再び水切槽１０に送
る。Organic solvents 12 are injected one after another into the draining tank 10, and the water and organic solvent 1 float on the surface of the organic solvents 12 after draining.
2 overflows the partition walls 1 and 1 and flows into the separation/recovery tank 20. In the collection tank 20, the difference in specific gravity is used to
The solvent 12 is separated from the water, and the separated aqueous solvent 12 is recovered, subjected to filtering, etc., and sent to the draining tank 10 again.
仕上処理槽３０は仕切壁３１により２つの室３０ａ、３
０ｂに分けられており、各室３０ａ、３０ｂには、界面
活性剤を添加していない有機溶剤３０、具体的にはトリ
クロールエチレンを入れている。また室３０ｂにはヒー
タ３２を設置しており、ヒータ３２で有ａ溶剤３０が加
熱されて、有機溶剤ガス３３が発生している。The finishing treatment tank 30 is divided into two chambers 30a and 3 by a partition wall 31.
Each chamber 30a and 30b contains an organic solvent 30 to which no surfactant is added, specifically trichlorethylene. Further, a heater 32 is installed in the chamber 30b, and the aqueous solvent 30 is heated by the heater 32, and an organic solvent gas 33 is generated.
この装置では、水切槽１０のヒータ１３により有機溶剤
１２がその沸点ないし沸点近くまで加熱される。そこで
水が付着した第３回に示すようなワークｌを、室１０ａ
内の有機溶剤１２中に浸漬すると、水はワークｌから取
り除かれて水切される。In this device, the organic solvent 12 is heated by the heater 13 of the draining tank 10 to its boiling point or close to its boiling point. Then, the work l shown in the third example with water attached was placed in the chamber 10a.
When immersed in the organic solvent 12 in the workpiece 1, water is removed from the workpiece 1 and drained.
つまりワーク１の表面に付着した水は、有機溶剤１２の
界面張力作用によりワーク１表面から引きは、がされ、
引きはがされた水は有機溶剤１２の表面に浮き上がるの
である。この場合、室ｆｏｂ内ではヒータ１３により加
熱された有機溶剤１２が激しく沸き立ち有機溶剤１２が
上下に乱流となって対流し渦や波などが発生し、この渦
や波により、浮き上がった水が有機溶剤１２中に細かな
水滴となって混入することがある。しかし室ｌＯｂ内で
生した渦や彼は、網目の細かい金網１１で減衰・消去さ
れるため、室１０ａ内では波などは生ぜず浮き上がった
水が有機溶剤１２中に混入することはない。この結果、
室１０ａ内に浸漬したワークに水が再付着することはな
い。もちろん、金網１１があっても、室１０ａ１０ｂ間
で有機溶剤１２が流通できるので、室１０ａ内の有機溶
剤１２の温度は沸点ないし沸点に近くなる。In other words, water adhering to the surface of the workpiece 1 is pulled off from the surface of the workpiece 1 by the interfacial tension effect of the organic solvent 12.
The stripped water floats to the surface of the organic solvent 12. In this case, in the chamber fob, the organic solvent 12 heated by the heater 13 boils violently, and the organic solvent 12 becomes a turbulent flow up and down, generating convective eddies and waves, and these eddies and waves cause the floating water to It may be mixed into the organic solvent 12 in the form of fine water droplets. However, since the vortices and waves generated in the chamber lOb are attenuated and eliminated by the fine wire mesh 11, no waves are generated in the chamber 10a, and the floating water does not mix into the organic solvent 12. As a result,
Water will not re-adhere to the workpiece immersed in the chamber 10a. Of course, even with the wire mesh 11, the organic solvent 12 can flow between the chambers 10a and 10b, so the temperature of the organic solvent 12 in the chamber 10a is at or near the boiling point.
一方、ワーク１内の盲孔２内に入った水も容易に取り除
かれる。このことを第２図を参照して説明する。第２図
（ａ）に示すように、盲孔２内に水３が入ったワークｌ
を、高温（例えば８６℃）となった有機溶剤１２中に入
れると、水３も加熱されて沸き立ってくる。水３が沸き
立つと水３の動きが激しくなり水３が盲孔２内で振動し
たり流動する。そうすると第２図℃）に示すように水３
の一部が盲孔２外に飛び出すことがあり、水３が盲孔２
外に出た分だけ有機溶剤１２が盲孔２内に入り込む。−
旦を機溶剤１２が盲孔１２内に入ると、界面張力の均衡
状態が破れ、第２図（Ｃ）に示すように有機溶剤１２が
盲孔１２内に入りやすくなる。こうすると、水３の振動
と有機溶剤１２の流入とが相俟って、水３が盲孔２内か
ら出ていくと同時に有機溶剤１２が盲孔２内に入り、つ
いには水３は完全に盲孔２内から排除されてしまう。か
くて、盲孔２内の水切も行なわれる。On the other hand, water that has entered the blind hole 2 in the workpiece 1 is also easily removed. This will be explained with reference to FIG. As shown in Fig. 2(a), a work l containing water 3 in a blind hole 2
When the water 3 is placed in the organic solvent 12 at a high temperature (for example, 86° C.), the water 3 is also heated and comes to a boil. When the water 3 boils, the movement of the water 3 becomes intense and the water 3 vibrates and flows within the blind hole 2. Then, as shown in Figure 2 (°C), water 3
A part of the water may jump out of the blind hole 2, and the water 3
The organic solvent 12 enters into the blind hole 2 by the amount that comes out. −
Once the organic solvent 12 enters the blind hole 12, the equilibrium state of interfacial tension is broken, and the organic solvent 12 easily enters the blind hole 12, as shown in FIG. 2(C). In this way, the vibration of the water 3 and the inflow of the organic solvent 12 combine to cause the water 3 to exit from the blind hole 2 and at the same time the organic solvent 12 enters the blind hole 2, and finally the water 3 is completely removed. It will be expelled from the blind hole 2. In this way, the blind hole 2 is also drained.
上述した如くしてワーク表面及び盲孔２内の水が取り除
かれたワークｌは、水切槽１０から引き上げられ、仕上
処理槽３０にて界面活性剤が洗い流される。つまり、ワ
ークｌは一旦、室３０ａ中の有機溶剤３０（これには界
面活性剤が含まれていない）に浸漬された後、有機溶剤
ガス３３にさらされて洗浄される。盲孔２内に入った有
機溶剤は、水と異なり、ただちに蒸発する。The work l from which the water on the work surface and in the blind hole 2 has been removed as described above is lifted from the draining tank 10, and the surfactant is washed away in the finishing treatment tank 30. That is, the work l is once immersed in the organic solvent 30 (which does not contain a surfactant) in the chamber 30a, and then exposed to the organic solvent gas 33 to be cleaned. The organic solvent that enters the blind hole 2 evaporates immediately, unlike water.
なお高沸点有ａ溶剤１２としては、トリクロールエチレ
ンの他、沸点が７０℃〜１３０℃のａ機ン容斉り、例え
ばパークレン（ＣＣ４’ ｚ ＝ ＣＣｊ！ ｔ：沸点
１２１．２℃）、１・ｌ・１トリクロールエタン（ＣＬ
ＣＣｌｚ ’沸点７４．１″Ｃ）、ダイクロンＳ２０
（Ｒ−１１２＋イソオクタン：沸点９２．５℃）、ダ・
イフロンＳ （Ｒ−１１２；沸点９２．８℃）などを用
いてもよい。In addition to trichlorethylene, the high boiling point solvent 12 may include trichlorethylene, a solvent having a boiling point of 70° C. to 130° C., for example, percrene (CC4' z = CCj! t: boiling point 121.2° C.), 1・l・1 trichloroethane (CL
CClz 'boiling point 74.1''C), Dicron S20
(R-112+isooctane: boiling point 92.5°C), da.
Iflon S (R-112; boiling point 92.8°C) or the like may be used.
〈発明の効果〉
以上実施例とともに具体的に説明したように本発明によ
れば、高沸点（７０°ｃ−１３０℃）の有機溶剤をその
沸点ないし沸点近くまで加熱し、その中に被洗浄物を浸
漬するため、被洗浄物の微細な隙間や小径の盲孔の中に
入った水も加熱されて外部に出てしまうので、隙間や盲
孔内の水をも完全に取り除いて水切りすることができる
６しかも本発明を実現するには、有機溶剤として高沸点
のものを用いこれを加熱するというきわめて簡単な手段
を採用するだけでよい。<Effects of the Invention> As specifically explained above in conjunction with the examples, according to the present invention, an organic solvent with a high boiling point (70°C to 130°C) is heated to its boiling point or close to its boiling point, and the to-be-cleaned solvent is heated to the boiling point or close to the boiling point. Since the items are immersed, any water that gets into the minute gaps or small diameter blind holes of the object to be cleaned is heated and flows out, so the water in the gaps and blind holes is completely removed and drained. Moreover, in order to realize the present invention, it is only necessary to employ an extremely simple method of using a high boiling point organic solvent and heating it.
第１図は本発明を適用した水切装置を示す構成図、第２
図（ａ） （ｂ） （Ｃ）は盲孔内の水を取り除いて水
切する様子を示す説明図、第３図は盲孔を有するワーク
を示す断面図である。
図 面 中
ｌはワーク（被洗浄物）、
２は盲孔、
３は水、
１０は水切槽、
１０ａ、’ｌｏｂは室、
１１は金網（網材）、
１２は高沸点の有機溶剤、
１３はヒータ、
１４は仕切壁、
２０は分離・回収槽、
３０は仕上処理槽、
３０ａ、３０ｂは室、
３１は仕切壁、
３２はヒータ、
３３は有機溶剤ガスである。Fig. 1 is a configuration diagram showing a draining device to which the present invention is applied;
Figures (a), (b), and (c) are explanatory diagrams showing how water in the blind hole is removed and drained, and Fig. 3 is a sectional view showing a workpiece having a blind hole. In the drawing, l is the workpiece (object to be cleaned), 2 is the blind hole, 3 is water, 10 is the draining tank, 10a and 'lob are the chambers, 11 is the wire mesh (mesh material), 12 is the high boiling point organic solvent, 13 is a heater, 14 is a partition wall, 20 is a separation/recovery tank, 30 is a finishing treatment tank, 30a and 30b are chambers, 31 is a partition wall, 32 is a heater, and 33 is an organic solvent gas.
Claims (2)
いし沸点近くまで加熱しておき、微細な隙間や小径の盲
孔を有する水洗された被洗浄物を、加熱された前記有機
溶剤中に浸漬して水切りすることを特徴とする水切り方
法。(1) An organic solvent with a boiling point of 70°C to 130°C is heated to the boiling point or close to the boiling point, and the washed object having fine gaps and small diameter blind holes is placed in the heated organic solvent. A draining method characterized by soaking in water and draining.
水切槽と、水切槽の底面から有機溶剤の液面上方にまで
配置されて水切槽内を二つの室に仕切るとともに有機溶
剤の流通を許容する一方で有機溶剤の急激な流勢を減衰
させる程度の網目となっている網材と、網材で仕切られ
た一方の室に設置されて前記有機溶剤をその沸点ないし
沸点近くまで加熱するヒータと、を有することを特徴と
する水切り装置。(2) A draining tank that stores organic solvents with a boiling point of 70°C to 130°C, and a draining tank that is arranged from the bottom of the tank to above the liquid level of the organic solvent to partition the inside of the tank into two chambers and to remove the organic solvent. A mesh material having a mesh that allows the flow of the organic solvent while attenuating the rapid flow of the organic solvent, and a mesh material installed in one chamber partitioned by the mesh material to bring the organic solvent to its boiling point or close to its boiling point. A draining device characterized by having a heater for heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26285088A JPH02111011A (en) | 1988-10-20 | 1988-10-20 | Drainage of water and apparatus therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26285088A JPH02111011A (en) | 1988-10-20 | 1988-10-20 | Drainage of water and apparatus therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02111011A true JPH02111011A (en) | 1990-04-24 |
Family
ID=17381490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26285088A Pending JPH02111011A (en) | 1988-10-20 | 1988-10-20 | Drainage of water and apparatus therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02111011A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235813A (en) * | 2007-03-23 | 2008-10-02 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
| JP2015015450A (en) * | 2013-06-04 | 2015-01-22 | 三ツ星ベルト株式会社 | Hole filling substrate having conductive film, manufacturing method thereof, and discoloration or ooze restraining method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5628684A (en) * | 1979-08-03 | 1981-03-20 | Daikin Ind Ltd | Method of washing and drying article |
| JPS57209676A (en) * | 1981-06-20 | 1982-12-23 | Daikin Ind Ltd | Washing and drying device |
| JPS6362234A (en) * | 1986-09-02 | 1988-03-18 | Daikin Ind Ltd | Method and apparatus for removing adhering water on surface of article |
-
1988
- 1988-10-20 JP JP26285088A patent/JPH02111011A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5628684A (en) * | 1979-08-03 | 1981-03-20 | Daikin Ind Ltd | Method of washing and drying article |
| JPS57209676A (en) * | 1981-06-20 | 1982-12-23 | Daikin Ind Ltd | Washing and drying device |
| JPS6362234A (en) * | 1986-09-02 | 1988-03-18 | Daikin Ind Ltd | Method and apparatus for removing adhering water on surface of article |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235813A (en) * | 2007-03-23 | 2008-10-02 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
| JP2015015450A (en) * | 2013-06-04 | 2015-01-22 | 三ツ星ベルト株式会社 | Hole filling substrate having conductive film, manufacturing method thereof, and discoloration or ooze restraining method |
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