JP3078773B2 - Electronic component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a metal die pad on a substrate having a metal wiring layer and covering the same with an insulating layer.
The semiconductor chip is placed on de, Bondin the bonding wire connecting portion of the semiconductor chip and the metal wiring layer on the substrate
TECHNICAL FIELD The present invention relates to an electronic component in which a semiconductor chip , a bonding wire, and a bonding wire connection part are sealed with a resin, and a method of manufacturing the electronic component.

[0002]

Conventionally, without sealing the semiconductor chip, in the case of manufacturing a printed circuit board to directly (bare) implementation,
The surface of the printed circuit board is provided with an insulating layer made of a glass layer except for a portion around which a semiconductor chip and a wire are bonded, and is not configured to control resin spread. Therefore, when mounting a semiconductor chip ,
The following methods are conceivable. The first method is semiconductor
This is a method of mounting the chip without resin. In the second method, mounting is performed using a resin, but in order to avoid a problem that a solder paste for bonding chip components cannot be printed later, an arrangement of other components is determined in consideration of a lateral spread of the resin. That is the method. In the third method, the resin is mounted using a resin. At this time, a high-viscosity resin is carefully dropped with a syringe or the like so that the resin does not spread laterally and the semiconductor chip and the wire are covered neatly. That is the method.

Hereinafter, a conventional electronic component will be described.
FIG. 5A is a plan view of a conventional electronic component mounted without resin, and FIG. 5B is a cross-sectional view taken along line CC ′ of FIG. In this electronic component, as shown in FIG. 5, a metal wiring layer 2 made of AgPt or the like is appropriately formed on a printed circuit board 1. Further, on the printed circuit board 1 is in a state connected to the metal wiring layer 2 and the metal die pad 3 is formed of Au or the like, semi-conductor chip 4 on the metal die pad 3 are mounted is connected die bonding. And the semiconductor chip 4
It is connected between Gabon loading wire 5 between the bonding wire connecting portion 10 connected to the top and the metal wiring layer 2. Further, a solder layer 6 is provided on each of the chip component mounting pads 11 connected to the other two opposing metal wiring layers 2, and the chip component 7 is bonded to the chip component mounting pads 11 by the solder layer 6, and It is electrically connected. The printed circuit board 1 is covered with a glass layer 9 for protecting a metal wiring layer having a thickness of 10 to 15 μm. Glass layer 9
Has an opening 9A surrounding the metal die pad 3, an opening 9B surrounding the bonding wire connecting portion 10 connected to the metal wiring layer 2, and an opening 9C for mounting chip components.

FIG. 6A is a plan view of a conventional electronic component mounted using a resin, and FIG. 6B is a plan view of D in FIG.
It is a sectional view taken along line -D '. The electronic components, as shown in FIG. 6, the sealing the semiconductor chip 4 and bonding wires 5 and the bonding wire connecting portion 10 in the resin 8 ash,
Other configurations are the same as those in FIG.

[0005]

In the conventional example as described above, if the semiconductor chip 4 is formed without a resin as shown in FIG. 5, the reliability of the semiconductor chip 4 such as moisture resistance decreases. When the resin 8 is formed on the semiconductor chip 4 as shown in FIG. 6, the resin 8 spreads laterally on the printed circuit board 1, and
When the solder part 6 spreads to the bonding part, the paste-like solder layer 6 to be printed later for bonding the chip parts is not printed well on the printed circuit board 1 and the chip parts 7 become poorly bonded. There was a disadvantage that the distance had to be at least 2-3 mm.

When the resin 8 having a high viscosity is used, the spread is small, but the resin does not spread well. On the other hand, unless a certain amount of resin is dropped on the printed circuit board 1, the semiconductor chip 4 and the bonding wires 5 are sealed tightly. The workability was also poor because the amount of resin had to be controlled appropriately without being stopped. An object of the present invention is to secure high reliability by performing resin sealing of a semiconductor chip , suppress lateral spread of the resin when sealing with a resin, and improve workability at the time of resin sealing. To provide an electronic component and a method for manufacturing the same.

[0007]

According to a first aspect of the present invention, there is provided an electronic component comprising a substrate , a metal wiring layer, a metal die pad, and a bonder.
Wiring wires and chip component mounting pads
The semiconductor chip is mounted on the metal die pad,
Chip components are mounted on the
The chip and the bonding wire connection are
An electronic component connected by ears, wherein the insulating layer is made of gold.
Surrounds metal die pads and bonding wire connections
A first opening and a second opening for mounting chip components are provided.
Cover the metal wiring layer and allow the resin to
Provided in the first opening so as to seal the wiring wire.
It is characterized by having been done .

According to this structure, since the semiconductor chip or the like is sealed with a resin, high reliability can be ensured. Further, when the semiconductor chip is sealed with the resin, the resin is laid sideways due to a step in the opening of the insulating layer. Spreading can be suppressed. In addition, a resin having a relatively low viscosity can be used, and workability is good. Electronic component according to claim 2, wherein, in the electronic component according to claim 1, wherein the insulating layer is Ru glass layer der.

According to this configuration, the operation is the same as that of the first aspect.

[0010]

[0011]

[0012]

[0013]

[0014]

[0015] Claim3The manufacturing method of the described electronic component is gold
Metal wiring layerAnd metal die pad and bonding wire connection
Metal on the substrate on which
A second portion surrounding the die pad and the bonding wire connection portion
1 opening and a second opening for mounting chip components.
To provide an insulating layer covering the metal wiring layer, On metal die pad
Mounted with semiconductor chips, Semiconductor chip and bonding wire
Connect to the ear connection with a bonding wire, resin
To seal the semiconductor chip and the bonding wire
Provided in the first opening, Chip component in the second opening
After solder is printed on the mounting pad, the chip component mounting
A chip component is mounted on a chip.

According to this method, the reliability such as moisture resistance is superior to the conventional mounting without resin, and the resin can be prevented from spreading laterally. However, it is not necessary to determine the arrangement of other components in consideration of the lateral spread of the resin. Further, the resin having a relatively low viscosity can be used without having to finely control the amount of the resin to be dropped, and the workability is good. 5. Production of the electronic component according to claim 4.
The manufacturing method is the same as the method for manufacturing an electronic component according to claim 3.
Wherein the insulating layer is a glass layer. This one
According to the method, it works in the same way as claim 3.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1A is a plan view of an electronic component according to a first embodiment of the present invention, and FIG. 1B is an AA ′ line of FIG.
It is a line sectional view. This electronic component, as shown in FIG.
On the printed circuit board 1, a metal wiring layer 2 is appropriately formed of AgPt or the like. Further, on the printed circuit board 1, Au lead to the metal interconnection layer 2, AgPt, etc. are metal die pad 3 is formed with AgPd, semi <br/> conductor chip 4 is connected die-bonded on the metal die pad 3 It is installed.
Metal die pad 3 above, serves as element this part, when the bottom surface, i.e. bonding surface of the semiconductor chip 4 is Au is composed of Au, AgPt or AgPd when bonding surface of the semiconductor chip 4 is solder It consists of.

[0018] Then, between the bonding wire connecting portion 10 connected to the upper surface and the metal wiring layer 2 of the semiconductor chip 4 are connected in Bonn loading wire 5. Each of the chip component mounting pads 11 connected to the other two opposing metal wiring layers 2 is provided with a solder layer 6, and the chip component 7 is attached to the chip component mounting pad 11 by the solder layer 6.
And are electrically connected.

Further, the printed circuit board 1 is covered with a glass layer 9 for protecting a metal wiring layer having a thickness of 10 to 15 μm, which functions as an insulating layer. The glass layer 9 has an opening 9D that comprehensively surrounds the metal die pad 3 on the printed circuit board 1 and the bonding wire connection portion 10 connected to the semiconductor chip 4 by the bonding wire 5, and a chip component mounting portion. and an opening 9C of. in this case,
The opening 9 </ b> D of the glass layer 9 is formed in a circular or elliptical shape from about 0.5 mm from the bonding wire connection part 10 except for the periphery of the semiconductor chip 4 and the bonding wire connection part 10 . That is, the opening 9D
Are formed such that the opening edge is about 0.5 mm apart from the outer peripheral edge (particularly, a corner portion) of each of the metal die pad 3 and the bonding wire connecting portion 10.

Then, the semiconductor chip 4, the bonding wires 5, and the bonding wire connecting portions 10 are
It is sealed with a resin 8 made of a silicon rubber-based material of about Pa · s. In this case, the step of the opening 9 </ b> D suppresses the spread of the resin 8. Hereinafter, referring to FIG.
A method for manufacturing this electronic component will be described.

First, as shown in FIG. 2A, a metal wiring layer 2, a metal die pad 3, a bonding wire connection portion 10, a chip component mounting pad 11, etc. are formed on a printed board 1, and an opening is further formed thereon. A glass layer 9 having portions 9C, 9D and the like is formed. Next, as shown in FIG. 2B, the semiconductor chip 4 is bonded onto the metal die pad 3, and the semiconductor chip 4 and the bonding wire connection portion 10 are connected by the bonding wires 5.

Next, as shown in FIG. 2C, a resin 8 is applied on the opening 9D and cured, so that the semiconductor chip 4, the bonding wire connection portion 10, and the bonding wire 5 are bonded with the resin 8. Seal. In this case, when the resin 8 is dropped in such an amount that the semiconductor chip 4 and the bonding wires 5 are buried, the resin 8 stops spreading laterally due to the step of the protective glass layer 9, and the height of the resin 8 is 1 to 1 from the chip surface. It can be adjusted as thin as 5 mm.

The size of the step of the glass layer 9 is generally about 10 to 15 μm, and when the resin 8 having a viscosity of about 6 to 8 Pa · S is used, the height of the resin becomes the semiconductor chip 4 and the bonding wire 5. Is just high enough to be covered
mm. Next, as shown in FIG. 2D, the solder layer 6 is applied to the chip component mounting pad 11 by printing.

Next, as shown in FIG. 2 (e), the chip component 7 is mounted on the solder layer 6 of the chip component mounting pad 11, and then baked in a reflow furnace.
Is cured, a printed wiring board on which a circuit composed of the semiconductor chip 4 and the chip component 7 is mounted is formed. After connecting leads and packaging, a desired electronic component is completed.

According to the electronic component of this embodiment, since the semiconductor chip 4 is sealed with resin, high reliability can be ensured. Die pad 3 and bonding wire connection 1
The resin can be prevented from spreading laterally due to the step of the opening 9D that comprehensively surrounds the zero . In addition, the resin 8 having a relatively low viscosity can be used, and the workability is good. In addition, since the opening 9D of the glass layer 9 is substantially circular (circular or oval), when the resin 8 is dropped, the spreading force of the resin 8 is applied substantially uniformly around the resin 8, and the substantially circular portion The lateral spread of the resin 8 can be effectively suppressed by the step of the opening 9D of the glass layer 9.

As described above, by utilizing the step of the glass layer 9 on the printed circuit board 4, a desired resin shape can always be stably obtained even if the amount of the resin 8 to be dropped slightly varies. As a result, another chip component 7 can be mounted nearby in a later process, that is, integrated, and the soldering resistance in the subsequent steps of solder application, chip component mounting, and cleaning process is improved. Furthermore, since the moisture resistance of the semiconductor element can be improved, the effect of improving the moisture resistance of the printed circuit board can be obtained.

According to the method for manufacturing an electronic component of this embodiment, the printed circuit board 1 on which the metal wiring layer 2 is formed
A glass layer 9 having an opening 9D surrounding a metal die pad 3 connected to the metal wiring layer 2 and a bonding wire connecting portion 10 connected to the metal wiring layer 2;
The semiconductor chip 4 is placed on the metal die pad 3 in D,
The semiconductor chip 4 and the bonding wire connection portion 10 are connected with the bonding wire 5, the semiconductor chip 4, the bonding wire 5 and the bonding wire connection portion 10 are sealed with the resin 8, and the chip components mounted on the metal wiring layer 2 are mounted. Since the chip component 7 is mounted by printing the solder layer 6 on the pad 11, the reliability such as moisture resistance is superior to the conventional mounting without resin, and the resin 8 is prevented from spreading laterally. Therefore, it is not necessary to determine another component arrangement in consideration of the lateral spread of the resin as compared with the case where the conventional resin is used. Further, the resin having a relatively low viscosity can be used without having to finely control the amount of the resin to be dropped, and the workability is good.

[0028] (Second Embodiment) FIG. 3 (a) is a plan view of an electronic component according to the second embodiment of the present invention, B in FIG. 3 (b) FIG. (A) - B '
It is a line sectional view. This electronic component, as shown in FIG.
So as to surround the entire periphery of the opening 9D of the glass layer 9, a feature is that the annular groove 9E is formed, otherwise 1
Is the same as that shown in FIG. That is, in this embodiment, the opening 9D and the groove 9E have a double circular shape or a double elliptical shape.

In this case, the opening 9D and the groove 9
E, the width of the annular glass layer 9 is 0.1 to 0.3 m.
m, and the width of the groove 9E is preferably about 0.1 to 0.3 mm. Thus, the groove 9 is formed outside the opening 9D.
By forming E, if the step of the glass layer 9 becomes double, even if the resin 8 gets over the inner step (protruding portion 8A), the lateral spread of the resin 8 can be stopped at the outer step. it can. The number of grooves 9E may be two or more.

The method of manufacturing the electronic component is the same as that shown in FIG. 2 except that a groove 9E is formed in the glass layer 9 as shown in FIG. According to the electronic component of this embodiment, the opening 9 is formed in the glass layer 9 around the opening 9D.
Since the annular groove 9E extending along the periphery of D is provided, even when the resin 8 is dropped, even if the resin 8 overflows from the opening 9D, the resin 8 spreads horizontally due to the step of the groove 9E. Can be suppressed. Other effects are the same as those of the first embodiment.

[0031]

[0032]

According to the electronic component of the first aspect, the semiconductor component
Since the body chip is sealed with a resin, high reliability can be ensured. Further, when the chip is sealed with the resin, the resin can be prevented from spreading laterally due to a step in an opening of the insulating layer. In addition, a resin having a relatively low viscosity can be used, and workability is good.

According to the electronic component of the second aspect, the same effect as that of the first aspect is obtained.

[0034]

[0035]

[0036] Claim3According to the manufacturing method of the described electronic component
Is better than conventional mounting without resin.
Excellent reliability and restrains the resin from spreading laterally
And the width of the resin is wider than when using the conventional resin.
The other parts arrangement must be determined in consideration of
I can't say that. In addition, the amount of resin dripping is delicately controlled.
Relatively low viscosity without having to
Resin can be used and workability is good. Contract
According to the method of manufacturing an electronic component according to claim 4, claim 3 and
There is a similar effect.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component according to a first embodiment of the present invention and a cross-sectional view taken along line AA ′ thereof.

FIG. 2 is a cross-sectional view illustrating a method of manufacturing the electronic component according to the first embodiment of the present invention in order of steps.

Plane of the electronic component diagram of the second embodiment of the present invention; FIG and its B - B 'line cross-sectional views.

FIG. 4 is a cross-sectional view illustrating a method of manufacturing an electronic component according to a second embodiment of the present invention in the order of steps.

FIG. 5 is a plan view of a conventional electronic component and a cross-sectional view taken along line CC ′ of the electronic component.

FIG. 6 is a plan view of another conventional electronic component, and FIG.
It is D 'line sectional drawing.

[Explanation of symbols]

 1 printed circuit board 2 metal wiring layer 3 metal die pad  4 Semiconductor chip  5 Bonding wire  Reference Signs List 6 solder layer 7 chip component 8 resin 9 glass layer (insulating layer) 9A opening 9B opening 9C opening 9D opening 9E groove 10 bonding wire connection portion 11 chip component mounting pad

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/56 H01L 21/60

Claims (4)

(57) [Claims] A metal wiring layer and a metal die pad are provided on a substrate.
And bonding wire connection parts and chip component mounting pads
Is provided, and a semiconductor chip is provided on the metal die pad.
The chip component is mounted on the chip component mounting pad.
Mounted, the semiconductor chip and the bonding wire
Electronic part whose connection part is connected by bonding wire
An insulating layer formed between the metal die pad and the bonding wire.
A first opening surrounding the chip connection portion and the chip component housing.
A second opening for mounting, covering the metal wiring layer , wherein a resin is provided between the semiconductor chip and the bonding wire.
Is provided in the first opening so as to seal
Electronic components characterized by the following . 2. The electronic component according to claim 1 insulating layer is a glass layer. 3. A metallization layer , a metal die pad, and a bondy.
Wiring wire connection parts and chip component mounting pads are provided.
The metal die pad and the bonding wire
A first opening surrounding the ear connection and the chip component
Covering the metal wiring layer with a second opening for mounting
An insulating layer is provided, a semiconductor chip is mounted on the metal die pad, and the semiconductor chip and the bonding wire connection portion are connected to each other.
The semiconductor chip and the bonding wire are connected by a bonding wire.
Solder is provided in the first opening so as to be sealed and soldered to the chip component mounting pad in the second opening.
After printing, the chip is placed on the chip component mounting pad.
A method for manufacturing an electronic component, comprising mounting a component. 4. The method according to claim 3, wherein the insulating layer is a glass layer.
Electronic component manufacturing method.