JP3075690U - Endothermic mat - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To efficiently absorb and radiate heat inside a digital electronic device from the external case to the outside of the external case. SOLUTION: A fluid heat absorbing agent 3 is hermetically sealed inside a flat case 2 formed by using a flexible film made of a synthetic resin, and a digital electronic device 4 is mounted thereon. Used.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a heat absorbing mat for digital electronic equipment, and more particularly, to a novel heat absorbing mat effective for heat radiation inside a device particularly required to be miniaturized.

[0002]

[Prior art]

 In recent years, due to high performance and high integration of digital electronic devices of this type, the heat generation density per unit area inside the devices has been extremely increased. For example, in the case of personal computers, as mobile devices are rapidly becoming mobile and a light-weight, flat-type notebook-type structure is adopted, internal equipment becomes overcrowded, and there is no space for cooling fans that could be stored in conventional large-sized computers. is the current situation.

In order to cope with such a situation, there has been proposed a digital electronic device in which an aluminum heat dispersing sheet is provided at a bottom portion in an outer case as an alternative to a fan or a radiation fin. In addition, proposals have been made to promote the heat radiation of individual internal components (see, for example, JP-A-5-235218, JP-A-9-17922, JP-A-9-17923, and JP-A-11-279406). ).

However, the technology using the heat dissipating sheet made of aluminum and the means for promoting the heat radiation of the individual internal components both adopt the form of being enclosed in the external case. It is very difficult to radiate heat out of the outer case. Further, in order to radiate heat to the outside of the external case, further measures are required, which necessitates the provision of a separate heat radiating means, which results in a special structure and higher cost. Further, the usability is not always preferable (for example, see JP-A-11-87959 and JP-A-8-137580).

[0005] Incidentally, when the temperature of the bottom part is 40 degrees Celsius outside the outer case, the internal temperature exceeds 50 degrees Celsius. The internal components that generate high temperatures are the power supply, CPU, and LSI. Normally, the upper limit of the ambient temperature in the equipment is 60 degrees Celsius, and if it exceeds this, equipment troubles frequently occur.

[0006]

[Problems to be solved by the invention]

 In view of the drawbacks of the conventional means, the present invention has examined the conventional technology from various directions, and as a result of intensive studies, came to the following fact. In other words, the heat radiation cooling of this kind of digital electronic equipment is almost or not attained in the countermeasure that heat is radiated from the internal parts to the inside of the equipment or heat of some parts is partially radiated out of the outer case. Turned out not to be achieved. As a result of further study based on this new knowledge, we came up with a means to directly remove heat trapped in the external case of the equipment from this external case. Therefore, as a result of various trials and errors, it has been found that applying the endothermic agent to the surface of the outer case can achieve the desired and desired heat radiation very efficiently. Therefore, an object of the present invention is to efficiently absorb and dissipate heat inside the digital electronic device from the external case to the outside of the external case.

[0007]

[Means for Solving the Problems]

 The invention of claim 1 is such that a fluid heat-absorbing agent is sealed in a flat case formed of a flexible resin film, and a digital electronic device is mounted thereon. It was done.

According to this means, various digital electronic devices are placed on a flat resin film case, that is, a mat. Due to the weight of the various digital electronic devices placed, the fluid heat-absorbing agent moves so as to conform to the shape of the various places at the bottom of the equipment, and moves to the various places at the bottom of the equipment via the resin film case. Contact. As a result, the internal ambient temperature via the resin film case and the heat of the heat-generating components in contact with the bottom of the external case of the digital electronic device are absorbed by the fluid heat-absorbing agent. As a result, the internal ambient temperature of the digital electronic device and the heat of the heat-generating components in contact with the bottom of the outer case of the digital electronic device also decrease. Therefore, it goes without saying that the temperature of the device itself, not to mention the internal heat-generating components, is prevented from rising more than necessary, and troubles due to the heat of the device are prevented. Further, the absorbed heat is radiated into the atmosphere, so that the endothermic effect is more effectively exhibited.

[0009]

[Effect of the invention]

 Therefore, this invention has the following effects. The present invention employs a resin film case, that is, a mat, in which a fluid heat-absorbing agent is encapsulated, and simply places the bottom of the digital electronic device on this mat. Unnecessary temperature rise of the ambient temperature and of the heat-generating components in contact with the bottom of the outer case of the digital electronic device can be prevented. Therefore, unlike the above-mentioned conventional various cooling devices and means, it can be manufactured with a much simpler structure and very simply, so that it can be provided at a much lower cost. Also, it is very easy to use because it is simply matted and simply pulled under the equipment.

The effect of the present invention is ideally exhibited when applied to a personal computer, particularly a notebook computer. In addition, the present invention can be applied to a charger such as a CD-ROM drive, a color printer, a facsimile, and a mobile phone, and the same effect can be obtained.

[0011]

[Embodiment of the invention]

 An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a partially cutaway sectional view of the heat absorbing mat according to the present invention, and FIG. The heat absorbing mat 1 is formed with a case 2 having a medium thickness of about 1 mm using a flexible film made of synthetic resin. A fluid heat absorbing agent 3 is hermetically sealed inside the case 2. The case 2 has an appropriate size. For example, if it is small, it may be manufactured in a size of 7 to 8 cm square, B5 to A4, and B4 size, or the like, and an appropriate size as needed.

The synthetic resin and flexible film constituting the case 2 is made of, for example, polyimide, polyester having a thermal conductivity of 3 × 10 ⁻⁴ to 8 × 10 ⁻⁴ cal / cm · sec. Further, a polyurethane elastomer having a thermal conductivity of 2.5 × 10 ⁻⁴ cal / cm · sec. ° C. or the like is employed. In order to further enhance the heat absorbing effect, if necessary, the synthetic resin-made flexible film may be a laminated film on which aluminum foil or aluminum sheet is adhered.

The fluid heat absorbing agent 3 used in the present invention is not particularly limited, and can be obtained by employing a known material. For example, it is formed from a water-absorbing polymer having a high water-absorbing property such as sodium polyacrylate, gelatin, and a water-retaining agent (for example, glycerin alkylene glycol). In addition, a heat medium having an endothermic function, an antibacterial agent and a colorant are liquefied, and these are absorbed by a high-molecular gel water retention agent that forms a sphere. Further, instead of the spherical polymer gel water retention agent, a cellulosic adhesive and an organic viscous agent are used. As an example of the cellulose-based adhesive, CMC (carboxyl methyl cellulose) and HPC (hydroxyl propyl cellulose) are employed. In addition, these heat-absorbing agents may include inorganic materials (for example, carlite and zeolite) and metal materials (for example, aluminum powder) having excellent thermal conductivity.

As shown in FIG. 2, the heat-absorbing mat 1 configured as described above is used by placing a digital electronic device (a notebook personal computer is employed in the illustrated example) 4 thereon. Used. Due to the weight of the placed digital electronic device 4, the fluid heat absorbing agent 3 enclosed in the heat absorbing mat 1 moves so as to conform to the shape of the bottom portion of the digital electronic device 4. As a result, the fluid heat absorbing agent 3 comes into contact with various parts of the bottom of the digital electronic device 4 via the resin film case 2.

Therefore, the temperature of the internal atmosphere via the resin film case 2 and the heat of the heat-generating components in contact with the bottom of the external case 5 of the digital electronic device are transferred to the fluid heat-absorbing agent 3. Absorbed. As a result, the temperature of the internal atmosphere of the digital electronic device 4 and the heat of the heat-generating components in contact with the bottom of the outer case 5 of the digital electronic device 4 also decrease. Further, the absorbed heat is radiated into the atmosphere, so that the heat absorbing action is more effectively exhibited.

Therefore, unlike the conventional various cooling devices and means described at the beginning, the heat absorbing mat according to the present invention can be manufactured with a much simpler structure and very simply, so that it can be provided at a much lower cost. Also, it is very easy to use because it is simply matted and pulled under the equipment.

[Brief description of the drawings]

FIG. 1 is a partially cutaway sectional view of a heat absorbing mat according to the present invention.

FIG. 2 is an explanatory diagram of an operation of the heat absorbing mat shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat absorption mat, 2 ... Resin film case, 3 ... Heat absorbing agent, 4 ... Digital electronic equipment, 5 ... External case.

Claims (1)

[Utility model registration claims] An endothermic device characterized in that a fluid heat absorbing agent is hermetically sealed in a flat case made of a flexible resin film, and a digital electronic device is mounted on the flat case. mat.