JP2010257236A - Cooling stand - Google Patents

Cooling stand Download PDF

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Publication number
JP2010257236A
JP2010257236A JP2009106728A JP2009106728A JP2010257236A JP 2010257236 A JP2010257236 A JP 2010257236A JP 2009106728 A JP2009106728 A JP 2009106728A JP 2009106728 A JP2009106728 A JP 2009106728A JP 2010257236 A JP2010257236 A JP 2010257236A
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cooling
heat
cooling mat
edge frame
mat
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JP2009106728A
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Japanese (ja)
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Joji Maruono
譲治 丸小野
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Sanwa Co Ltd
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Sanwa Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To suppress a rise in a temperature by satisfactorily cooling heat generation equipment such as a notebook-size personal computer by installing a cooling stand at the lower side of the heating equipment. <P>SOLUTION: A plate-shaped cooling mat A is formed of a bag body 1 and an endothermic gel 2 sealed in the bag body, and an edge frame B made of a heat radiation material and configured so that a contact between the upper face of the cooling mat and the lower face of the heat generation equipment can be prevented from being hindered is formed in the peripheral edge of the cooling mat. Also, a bottom plate 5 made of a heat radiation material and configured so as to be brought into contact with the lower face of the cooling mat is formed on the lower face of the edge frame. Thus, it is possible to validly cool the heat generation equipment, and to suppress a rise in temperature. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、ノートパソコンなどの発熱機器の冷却台に関する。   The present invention relates to a cooling table for a heat generating device such as a notebook computer.

パソコンは、その使用中に演算機能を発揮するCPUや記憶装置のハードディスク、電源部分などが発熱し、この発熱を使用可能な温度範囲まで冷却する必要がある。   A personal computer generates heat during operation, such as a CPU that performs a calculation function, a hard disk of a storage device, and a power supply portion, and it is necessary to cool this heat generation to a usable temperature range.

この発熱は、電源部の発熱以外に、CPUが高性能になったり、ハードディスクの記録密度が高くなり、回転速度が速くなればそれに伴って発熱量が増加することなどにより起因する。   In addition to the heat generated in the power supply unit, this heat generation is caused by the fact that the CPU has high performance, the recording density of the hard disk increases, and the rotation speed increases, the heat generation amount increases accordingly.

そこで、発熱機器のノートパソコンの熱を吸収する冷却手段として色々提案がされている(例えば、特許文献1、特許文献2及び特許文献3)。   Therefore, various proposals have been made as cooling means for absorbing heat of a notebook personal computer as a heat generating device (for example, Patent Document 1, Patent Document 2, and Patent Document 3).

WO2005/066740号公報WO2005 / 066740 特開2007−65851号公報JP 2007-65851 A 登録実用新案第3116467号公報Registered Utility Model No. 3116467

ところで、特許文献1の冷却用パッドは、ノートパソコンなどの発熱機器の底面に直近の金属製の伝熱板を接触させて、その熱を伝熱板から下側の吸熱ゲル体に伝わるようにしてある。   By the way, the cooling pad of Patent Document 1 is such that the nearest metal heat transfer plate is brought into contact with the bottom surface of a heat generating device such as a laptop computer, and the heat is transferred from the heat transfer plate to the lower heat absorption gel body. It is.

このような方式によると、機器の熱の影響を受けて伝熱板が歪み、歪みにともない変形するので、伝熱板の下面全部が吸熱ゲル体に接触しない。   According to such a method, the heat transfer plate is distorted by the influence of the heat of the device, and is deformed in accordance with the distortion, so that the entire lower surface of the heat transfer plate does not contact the endothermic gel body.

このため、吸熱効率が100%発揮できず、機器の温度上昇を抑制するのに問題があった。   For this reason, the endothermic efficiency cannot be exhibited 100%, and there is a problem in suppressing the temperature rise of the device.

特に全体を樹脂製の袋で包装してあるので、伝熱板に伝わった熱を放熱することができない、すなわち、吸熱した熱が袋内に隠る問題がある。   In particular, since the whole is packaged in a resin bag, the heat transmitted to the heat transfer plate cannot be dissipated, that is, the absorbed heat is hidden in the bag.

また、特許文献2の通風隙間形成用シートによると、発熱機器側となる面及びシートの側面に通気口を設けると共に、シートの内方に通気口につながる通風路を形成したもので、放熱を強制するものではない。このため、吸熱効率を有効に助長できない問題があった。   Further, according to the ventilation gap forming sheet of Patent Document 2, a vent is provided on the surface on the heat generating device side and the side surface of the sheet, and a ventilation path connected to the vent is formed on the inner side of the sheet. It is not mandatory. For this reason, there existed a problem which cannot promote endothermic efficiency effectively.

さらに、特許文献3のノートパソコン用冷却台によると、冷却台の冷却材として、パーライトにパラフィンを担持させてなる複合組成物を備え、更に冷却材をアルミラミネートフィルム製の袋に充填したもので、冷却材に吸熱した発熱機器の熱を有効に放熱する手段がない。   Furthermore, according to the cooling stand for notebook computers of Patent Document 3, the cooling material for the cooling stand is provided with a composite composition in which paralite is supported on paralite, and the cooling material is filled in a bag made of an aluminum laminate film. There is no means for effectively dissipating the heat of the heat generating device that has absorbed heat into the coolant.

そこで、この発明は、発熱機器の冷却台に吸熱した熱を極めて良好に放熱するようにした冷却台を提供することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cooling table in which heat absorbed by the cooling table of the heat generating device is radiated extremely well.

上記のような課題を解決するため、この発明は、袋体と、この袋体に封入した吸熱ゲルとで平板状の冷却マットを形成し、この冷却マットの周縁に上記冷却マットの上面と発熱機器の下面との接触を阻害しないような放熱材質の縁枠を設け、また上記縁枠の下面に上記冷却マットの下面に接触する放熱材質の底板を設けた冷却台である。   In order to solve the above-described problems, the present invention forms a flat cooling mat with a bag and an endothermic gel enclosed in the bag, and the upper surface of the cooling mat and heat generation are formed on the periphery of the cooling mat. The cooling table is provided with an edge frame made of a heat radiation material that does not hinder contact with the lower surface of the device, and a bottom plate made of a heat radiation material that contacts the lower surface of the cooling mat on the lower surface of the edge frame.

また、前記縁枠或いは底板の少なくとも片方の下面に載置面に対する空隙形成用の脚を設けた構成を採用することもある。   Moreover, the structure which provided the leg for the space | gap formation with respect to a mounting surface in the lower surface of at least one side of the said edge frame or a baseplate may be employ | adopted.

以上のように、この発明の発熱機器の冷却台によれば、デスク上の冷却台にノートパソコンなどの発熱機器を載置することにより、発熱機器の熱を冷却マットを構成する吸熱ゲルで吸熱するので、発熱機器の動作が安定すると共に、冷却マットの周縁に放熱材質の縁枠が、冷却マットの下面に放熱材質の底板が設けてあるので、冷却マットの昇温を有効に放熱し続けて、冷却マットの冷却機能を効率よく持続する特有の効果がある。   As described above, according to the cooling table of the heat generating device of the present invention, the heat of the heat generating device is absorbed by the heat absorbing gel constituting the cooling mat by placing the heat generating device such as a notebook computer on the cooling table on the desk. As a result, the operation of the heat generating device is stabilized, and the frame of the heat dissipation material is provided on the periphery of the cooling mat, and the bottom plate of the heat dissipation material is provided on the lower surface of the cooling mat. Thus, there is a unique effect of efficiently maintaining the cooling function of the cooling mat.

特に、冷却マットの周縁に縁枠を設ける際、冷却マットの上面と発熱機器の下面との接触を阻害しないようにしてあるので、発熱機器の発熱を冷却マットの上面全体に伝達して吸熱効率を向上させることができる。   In particular, when an edge frame is provided on the periphery of the cooling mat, the contact between the upper surface of the cooling mat and the lower surface of the heat generating device is not hindered. Can be improved.

また、縁枠或いは底板の少なくとも片方の下面に脚を設けてあるので、載置した冷却台(縁枠や底板)とデスクとの間に間隙ができ、この問題が放熱の通路となって有効に放熱することができる。   In addition, since legs are provided on at least one lower surface of the edge frame or bottom plate, there is a gap between the placed cooling table (edge frame or bottom plate) and the desk, and this problem is effective as a heat dissipation path. Can dissipate heat.

この発明の冷却台を示す斜視図である。It is a perspective view which shows the cooling stand of this invention. 冷却台を下から見た斜視図である。It is the perspective view which looked at the cooling stand from the bottom. 同上の縦断拡大正面図である。It is a vertical expansion front view same as the above. 冷却マットの縦断拡大正面図である。It is a vertical expansion front view of a cooling mat.

この発明の実施形態では、図1、図2、図3に示すように、Aは袋体1と、この袋体1に封入した吸熱ゲル2とで平板状に構成した冷却マットである。   In the embodiment of the present invention, as shown in FIGS. 1, 2, and 3, A is a cooling mat configured in a flat plate shape with a bag body 1 and an endothermic gel 2 sealed in the bag body 1.

上記の袋体1は、柔軟性に富んで、袋体1の上面全体がノートパソコンなどの発熱機器Xの下面全体に接する材質を用い、例えば図4に示すように、内側に熱封止の熱溶着性にすぐれたポリエチレンフイルム11を、中間に熱吸収を目的としたアルミシート12を、外側に柔軟性に富んだ(発熱機器Xの下面に密接しやすい)ポリエステルフイルム13の三層構造の上下二枚のシートの重なり全辺縁を熱封止して構成したが、限定されず、上記目的を達成する他のシートであってもよい。   The bag body 1 is rich in flexibility and uses a material in which the entire upper surface of the bag body 1 is in contact with the entire lower surface of the heat generating device X such as a laptop computer. For example, as shown in FIG. A three-layer structure of a polyethylene film 11 excellent in heat-welding property, an aluminum sheet 12 for heat absorption in the middle, and a polyester film 13 that is flexible on the outside (easy to be in close contact with the lower surface of the heating device X). Although it was configured by heat-sealing the entire overlapping edge of the upper and lower two sheets, it is not limited and may be other sheets that achieve the above object.

上記の吸熱ゲル2としては、例えば、水、イソブチレン、無水マレイン酸共重合物のナトリウム塩架橋物、架橋ポリアクリル酸ソーダや、硫酸ナトリウム水溶液とシリカ微粉末とエタノールなどの混合物からなる。   The endothermic gel 2 includes, for example, water, isobutylene, a sodium salt cross-linked product of maleic anhydride copolymer, cross-linked sodium polyacrylate, or a mixture of sodium sulfate aqueous solution, silica fine powder, ethanol, and the like.

また、上記冷却マットAの周縁には、冷却マットAの上面と発熱機器Xの下面との接触を阻害しないような放熱材質の縁枠Bが設けてある。   Further, an edge frame B made of a heat dissipating material is provided at the periphery of the cooling mat A so as not to obstruct the contact between the upper surface of the cooling mat A and the lower surface of the heat generating device X.

上記縁枠Bとしては、内側面が開放する溝形の縁材4が周囲四辺に位置するようにして、縁材4の内側面の開口から内方に袋体1の辺縁熱封止部分を嵌入して、袋体1の上面が縁材4の上面に対し上方にはみ出して、袋体1の上面に対する発熱機器Xの下面全体の良好な接触を保障するようにしてある。   As the edge frame B, the edge-shaped heat sealing portion of the bag body 1 is inward from the opening of the inner side surface of the edge member 4 so that the groove-shaped edge member 4 whose inner side surface is open is located on the four sides. Is inserted so that the upper surface of the bag body 1 protrudes upward with respect to the upper surface of the edge member 4 to ensure good contact of the entire lower surface of the heat generating device X with the upper surface of the bag body 1.

さらに、袋体1の下側には、袋体1の下面に上面を重ね合わせた放熱材質の底板5が設けてある。上記底板5は、各辺縁部分を縁材4の下辺内側に嵌入して保持させてある。   Further, on the lower side of the bag body 1, there is provided a bottom plate 5 made of a heat dissipation material with the upper surface superimposed on the lower surface of the bag body 1. The bottom plate 5 has each edge portion fitted and held inside the lower edge of the edge member 4.

上記放熱材質の縁材4及び底板5としては、例えばアルミを使用したが、同目的の他の材質であってもよい。   For example, aluminum is used as the edge material 4 and the bottom plate 5 of the heat dissipation material, but other materials for the same purpose may be used.

また、縁枠B或いは底板5の少なくとも片方の下面には、載置面(デスク)Yに対する空隙形成用の脚6が設けてある。   Further, at least one lower surface of the edge frame B or the bottom plate 5 is provided with a leg 6 for forming a gap with respect to the mounting surface (desk) Y.

上記の脚6は、図示の場合、縁枠Bの下面点在位置に設けたが、限定されず、底板5の下面のみ、或いは縁枠Bと底板5の両方に設けることもでき、取り付けも接着剤などを用いる。   In the illustrated case, the leg 6 is provided at the lower surface dotted position of the edge frame B. However, the leg 6 is not limited and can be provided only on the lower surface of the bottom plate 5 or both the edge frame B and the bottom plate 5. Use an adhesive.

上記のように構成すると、ノートパソコンなどの発熱機器Xの熱は、冷却マットAに吸収されて冷却し、冷却マットAに吸収された熱は、縁枠B及び底板5により有効に放熱され、しかも脚6によりデスクYと縁枠B及び底板5との間に間隙を形成しているので、放熱を助長することになる。   If comprised as mentioned above, the heat | fever of the heat generating apparatus X, such as a notebook personal computer, will be absorbed and cooled by the cooling mat A, and the heat absorbed by the cooling mat A will be effectively thermally radiated by the edge frame B and the bottom plate 5, In addition, since the gap is formed between the desk Y and the edge frame B and the bottom plate 5 by the legs 6, heat dissipation is promoted.

このため、従来の冷却方式と異なり冷却マットAの昇温が著しく軽減され、発熱機器Xに悪影響を与えない利点がある。   For this reason, unlike the conventional cooling method, the temperature rise of the cooling mat A is remarkably reduced, and there is an advantage that the heat generating device X is not adversely affected.

冷却マットに吸熱した熱を有効に放熱するノートパソコンなどの発熱機器の冷却台を提供する。   A cooling stand for heat-generating equipment such as a notebook computer that effectively dissipates heat absorbed by the cooling mat.

X 発熱機器
Y デスク
A 冷却マット
B 縁枠
1 袋体
2 吸熱ゲル
4 縁材
5 底板
6 脚
X Heating device Y Desk A Cooling mat B Edge frame 1 Bag body 2 Endothermic gel 4 Edge material 5 Bottom plate 6 Leg

Claims (2)

袋体と、この袋体に封入した吸熱ゲルとで平板状の冷却マットを形成し、この冷却マットの周縁に上記冷却マットの上面と発熱機器の下面との接触を阻害しないような放熱材質の縁枠を設け、また上記縁枠の下面に上記冷却マットの下面に接触する放熱材質の底板を設けたことを特徴とする冷却台。   A flat cooling mat is formed by the bag body and the endothermic gel enclosed in the bag body, and a heat dissipating material that does not hinder the contact between the upper surface of the cooling mat and the lower surface of the heating device is formed at the periphery of the cooling mat. A cooling stand comprising an edge frame and a bottom plate made of a heat radiation material contacting the lower surface of the cooling mat on the lower surface of the edge frame. 前記縁枠或いは底板の少なくとも片方の下面に載置面に対する空隙形成用の脚を設けたことを特徴とする請求項1に記載の冷却台。   The cooling stand according to claim 1, wherein a leg for forming a gap with respect to the mounting surface is provided on a lower surface of at least one of the edge frame or the bottom plate.
JP2009106728A 2009-04-24 2009-04-24 Cooling stand Pending JP2010257236A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014115885A (en) * 2012-12-11 2014-06-26 Seiji Ichihara Heat absorbing mat and protective cover
JP2014176892A (en) * 2013-03-15 2014-09-25 Uacj Corp Heat exchanger
JPWO2015064240A1 (en) * 2013-10-29 2017-03-09 ポリマテック・ジャパン株式会社 Liquid-filled heat dissipation member
US11140797B1 (en) 2020-07-31 2021-10-05 Tamara Phipps Apparatus for enhancing cooling of an electronic computing device and method of use

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014115885A (en) * 2012-12-11 2014-06-26 Seiji Ichihara Heat absorbing mat and protective cover
JP2014176892A (en) * 2013-03-15 2014-09-25 Uacj Corp Heat exchanger
JPWO2015064240A1 (en) * 2013-10-29 2017-03-09 ポリマテック・ジャパン株式会社 Liquid-filled heat dissipation member
US10356944B2 (en) 2013-10-29 2019-07-16 Sekisui Polymatech Co., Ltd. Liquid-encapsulation heat dissipation member
US11140797B1 (en) 2020-07-31 2021-10-05 Tamara Phipps Apparatus for enhancing cooling of an electronic computing device and method of use

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