JP3063406B2 - Square chip resistor and method of manufacturing the same - Google Patents
Square chip resistor and method of manufacturing the sameInfo
- Publication number
- JP3063406B2 JP3063406B2 JP4209984A JP20998492A JP3063406B2 JP 3063406 B2 JP3063406 B2 JP 3063406B2 JP 4209984 A JP4209984 A JP 4209984A JP 20998492 A JP20998492 A JP 20998492A JP 3063406 B2 JP3063406 B2 JP 3063406B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electrode
- substrate
- depth
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は一般に電子部品として使
用される角形チップ抵抗器及びその製造方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a square chip resistor generally used as an electronic component and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】近年、実装速度を速めるため、多数のチ
ップ部品を同時に実装する一括マウントが行われるよう
になってきており、一般的には実装された場合の方向性
を考慮しなくても良い円筒チップ部品が使用されている
ことが多いが、現在コストダウンを目的とした円筒チッ
プ部品の代替となる安価な角形チップ部品への要求が高
まりつつある。2. Description of the Related Art In recent years, in order to increase the mounting speed, collective mounting for mounting a large number of chip components at the same time has been performed. In general, it is not necessary to consider the direction in which the components are mounted. Although good cylindrical chip components are often used, there is an increasing demand for inexpensive square chip components that can replace cylindrical chip components for cost reduction.
【０００３】[0003]
【発明が解決しようとする課題】しかし、従来の絶縁基
板により構成された角形チップ部品を一括マウントした
場合、部品の側面電極をペーストの流れ込みによって形
成しているため、側面電極の寸法の管理が難しく、ばら
つきやすくなり、電極寸法が小さい場合にははんだ付け
強度不足になり、また大きい場合には端子間のはんだブ
リッジが発生しやすいという課題があった。However, when a conventional rectangular chip component formed of an insulating substrate is mounted collectively, the side electrode of the component is formed by pouring the paste, so that the size of the side electrode is not managed. There is a problem that when the electrode size is small, the soldering strength is insufficient, and when the electrode size is large, a solder bridge between terminals is easily generated.
【０００４】本発明は上記課題を解決するために、側面
電極寸法のばらつきの小さい角形チップ抵抗器を提供す
ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a square chip resistor having a small variation in the size of a side electrode, in order to solve the above problems.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に本発明による角形チップ抵抗器は、互いに対向する主
面を含めて断面形状がほぼ八角形状の角柱形状の絶縁基
板と、この絶縁基板の両端部における主面及び端面に形
成するとともに前記主面に隣接する４箇所の側面に形成
した電極部と、この電極部に接続されかつ絶縁基板の主
面上に形成した抵抗層とを有し、前記絶縁基板の電極部
が形成される側面において電極部を形成する両端部分の
主面に対する角度を中間部分の角度より小さくすること
により、両端部分と中間部分との間に段差を設けたもの
である。In order to achieve the above object, a square chip resistor according to the present invention comprises a prismatic insulating substrate having a substantially octagonal cross-section including a main surface opposed to each other, and an insulating substrate having the same shape. Electrode portions formed on the main surface and the end surface at both ends of the substrate and formed on four side surfaces adjacent to the main surface, and a resistance layer connected to the electrode portions and formed on the main surface of the insulating substrate. Then, a step was provided between the both end portions and the intermediate portion by making the angle with respect to the main surface of both end portions forming the electrode portion on the side surface on which the electrode portion is formed of the insulating substrate smaller than the angle of the intermediate portion. Things.
【０００６】[0006]
【作用】本発明によれば、角形チップ抵抗器はペースト
の流れ込みにより形成される側面電極寸法が絶縁基板の
分割溝により規制されるため、ばらつきを小さくするこ
とができる。According to the present invention, the size of the side electrode formed by the flow of the paste is regulated by the dividing groove of the insulating substrate, so that the variation can be reduced.
【０００７】[0007]
【実施例】以下、本発明の一実施例の角形チップ抵抗器
について、図１，図２の図面を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A rectangular chip resistor according to an embodiment of the present invention will be described below with reference to FIGS.
【０００８】図２（ａ），（ｂ），（ｃ）は本発明の一
実施例の電子部品用絶縁基板を示す上面図及び断面図で
ある。絶縁基板は、複数個の電子部品を形成し個片に分
割するために表面に設けられた縦方向の分割溝１及び横
方向の分割溝２と、表面と相対して裏面に設けられた縦
方向及び横方向の分割溝とを有している。また、基板厚
みｔは縦方向の分割溝１により区画された横方向の分割
溝２の一辺に等しいかあるいはそれに近似した値とし、
図２（ｂ）に示すＢ−Ｂ′断面において表面及び裏面の
縦方向の分割溝の深さｔ′，ｔ″は基板厚みｔの１／３
かあるいはそれに近似した値で、かつ表面の分割溝深さ
ｔ′と裏面の分割溝深さｔ″を合わせた値が基板厚みｔ
の１／２以上になるようにする。また、図２（ｃ）に示
すＡ−Ａ′断面において、分割溝深さｔ3＜ｔ1及びｔ4
＜ｔ2になるようにする。また、分割溝１の形状は基板
の表面及び裏面と接する部分３のみ一定の曲率で丸みを
負わせ、それ以外の部分４は直線状になるように形成す
る。FIGS. 2 (a), 2 (b) and 2 (c) are a top view and a sectional view showing an electronic component insulating substrate according to one embodiment of the present invention. The insulating substrate includes a vertical dividing groove 1 and a horizontal dividing groove 2 provided on a front surface for forming a plurality of electronic components and dividing the same into individual pieces, and a vertical dividing groove 2 provided on a rear surface opposite to the front surface. Directional and lateral dividing grooves. The thickness t of the substrate is equal to or close to one side of the horizontal dividing groove 2 defined by the vertical dividing groove 1,
In the BB 'cross section shown in FIG. 2B, the depths t' and t "of the vertical dividing grooves on the front surface and the back surface are １ ／ of the substrate thickness t.
Or the approximate value thereof, and the value obtained by adding the front surface dividing groove depth t 'and the rear surface dividing groove depth t ″ is the substrate thickness t.
１ ／ or more. Further, in the AA ′ cross section shown in FIG. 2C, the division groove depths t 3 <t 1 and t 4
<T 2 . Also, the shape of the dividing groove 1 is formed such that only the portion 3 in contact with the front and back surfaces of the substrate is rounded at a constant curvature, and the other portions 4 are linear.
【０００９】このような絶縁基板の分割溝１，２により
囲まれた部分に抵抗層及び電極部を形成した後、分割溝
１，２に沿って個片に分割することにより製造される。After the resistance layer and the electrode portion are formed in a portion surrounded by the dividing grooves 1 and 2 of the insulating substrate, the insulating substrate is manufactured by dividing into individual pieces along the dividing grooves 1 and 2.
【００１０】実際に試作した絶縁基板の各部寸法は、縦
方向の分割溝１を０．８mmピッチ、横方向の分割溝２を
１．５mmピッチとし、基板の厚みｔを０．７２mm、表面
の分割溝深さｔ1を０．２４mm、裏面の分割溝深さｔ2を
０．２０mm、また表面及び裏面と接する部分を半径０．
０６mmの円形で丸みをつけた。The dimensions of each part of the actually manufactured insulating substrate are as follows: the vertical dividing groove 1 is 0.8 mm pitch, the horizontal dividing groove 2 is 1.5 mm pitch, the substrate thickness t is 0.72 mm, and the surface The dividing groove depth t 1 is 0.24 mm, the dividing groove depth t 2 on the back surface is 0.20 mm, and the portion in contact with the front and back surfaces has a radius of 0.2 mm.
It was rounded with a circle of 06 mm.
【００１１】次に、以上のように形成した絶縁基板を使
用して構成された角形チップ抵抗器を図１に示す。角形
チップ抵抗器は、互いに対向する主面を含めて断面形状
がほぼ八角形状の角柱形状で絶縁性の９６％アルミナ基
板５の一方の主面上に銀系厚膜の一対の上面電極層６を
設け、また前記９６％アルミナ基板５の他方の主面上に
裏面電極層を設けている。そして、前記上面電極層６の
一部に重なり接続されるようにルテニウム系厚膜の抵抗
層（図示せず）を９６％アルミナ基板５の一方の主面上
に形成している。さらに、この抵抗層上には、抵抗層を
完全に覆うために、保護層７を形成している。そして、
前記上面電極層６と前記裏面電極層の一部に重なるよう
に銀系厚膜の端面電極層８を設け、さらに露出電極面に
ははんだ付け性を向上させるために、ＮｉめっきとＳｎ
−Ｐｂめっきを電解めっきにより施している。また、前
記９６％アルミナ基板５の側面のうち主面に隣接する４
箇所の側面には端面電極層８を形成する際に分割溝が図
２に示した形状をしているため、銀ペーストが流れ込み
側面電極層９が形成されている。Next, FIG. 1 shows a square chip resistor constituted by using the insulating substrate formed as described above. The square chip resistor has a pair of upper electrode layers 6 made of a silver-based thick film on one main surface of an insulating 96% alumina substrate 5 having a substantially octagonal prism shape in cross section including the main surfaces facing each other. And a back electrode layer is provided on the other main surface of the 96% alumina substrate 5. Then, a resistance layer (not shown) of a ruthenium-based thick film is formed on one main surface of the 96% alumina substrate 5 so as to overlap and be connected to a part of the upper electrode layer 6. Further, a protective layer 7 is formed on the resistance layer to completely cover the resistance layer. And
An end electrode layer 8 of a silver-based thick film is provided so as to overlap the upper electrode layer 6 and a part of the back electrode layer, and Ni plating and Sn are applied to the exposed electrode surface in order to improve solderability.
-Pb plating is performed by electrolytic plating. Further, of the side surfaces of the 96% alumina substrate 5, 4
Since the dividing groove has the shape shown in FIG. 2 when the end face electrode layer 8 is formed on the side face of the location, the side face electrode layer 9 is formed by flowing the silver paste.
【００１２】以上のように構成した角形チップ抵抗器
を、円筒チップ抵抗器用の一括実装機によりマウントし
たところ、分割溝に銀ペーストが流れ込んで形成された
側面電極寸法が絶縁基板の分割溝により規制されるた
め、寸法小による電極強度不足及び寸法大によるはんだ
ブリッジが発生しなかった。When the rectangular chip resistor configured as described above is mounted by a package mounting machine for a cylindrical chip resistor, the size of the side electrode formed by flowing silver paste into the dividing groove is regulated by the dividing groove of the insulating substrate. Therefore, insufficient electrode strength due to small dimensions and no solder bridge due to large dimensions did not occur.
【００１３】よって本実施例の電子部品用絶縁基板を用
いれば、角形チップ抵抗器の側面電極寸法ばらつきを小
さくすることができる。Therefore, if the insulating substrate for an electronic component of the present embodiment is used, it is possible to reduce the variation in the side electrode dimensions of the rectangular chip resistor.
【００１４】なお、本実施例においては、側面の一部に
側面電極を設けているが、側面全体に設けても良い。In this embodiment, the side electrode is provided on a part of the side surface, but may be provided on the entire side surface.
【００１５】また、本実施例においては、縦方向の分割
溝のみの場合について説明したが、部品に丸みを帯びさ
せるため、縦方向または横方向の分割溝のどちらを本実
施例の分割溝１の形状のように形成しても良い。In this embodiment, the case where only the vertical dividing groove is used has been described. However, in order to round the parts, either the vertical dividing groove or the horizontal dividing groove is used in the present embodiment. It may be formed like the shape shown in FIG.
【００１６】[0016]
【発明の効果】以上のように本発明によれば、角形チッ
プ抵抗器の側面電極寸法のばらつきを小さくすることが
でき、一括マウント方式で側面側ではんだ付けされた場
合の固着強度のばらつきを低減でき、またはんだブリッ
ジの発生も防止できる。また、製造工程での側面電極寸
法はずれによる歩留低下を防止できる。As described above, according to the present invention, it is possible to reduce the variation in the size of the side electrode of the rectangular chip resistor, and to reduce the variation in the fixing strength when soldering is performed on the side by the batch mounting method. It is possible to reduce or prevent the occurrence of a bridge. Further, it is possible to prevent the yield from being reduced due to the deviation of the side electrode size in the manufacturing process.
【図１】本発明の一実施例による角形チップ抵抗器を示
す斜視図FIG. 1 is a perspective view showing a square chip resistor according to an embodiment of the present invention.
【図２】（ａ），（ｂ），（ｃ）はそれぞれ本発明の一
実施例による角形チップ抵抗器に用いる絶縁基板の構造
を示す上面図及びＢ−Ｂ′線の断面図及びＡ−Ａ′線の
断面図FIGS. 2A, 2B, and 2C are a top view, a cross-sectional view taken along a line BB ', and a cross-sectional view, respectively, showing the structure of an insulating substrate used in a rectangular chip resistor according to an embodiment of the present invention. Sectional view along line A '
１ 縦方向の分割溝 ２ 横方向の分割溝 ４ Ｖ溝状 ５ ９６％アルミナ基板 ６ 上面電極層 ７ 保護層 ８ 端面電極層 ９ 側面電極層 REFERENCE SIGNS LIST 1 vertical dividing groove 2 horizontal dividing groove 4 V-groove 5 96% alumina substrate 6 upper electrode layer 7 protective layer 8 end electrode layer 9 side electrode layer
Claims (2)
ぼ八角形状の角柱形状の絶縁基板と、この絶縁基板の両
端部における主面及び端面に形成するとともに前記主面
に隣接する４箇所の側面に形成した電極部と、この電極
部に接続されかつ絶縁基板の主面上に形成した抵抗層と
を有し、前記絶縁基板の電極部が形成される側面におい
て、電極部を形成する両端部分の主面に対する角度を中
間部分の角度より小さくすることにより、両端部分と中
間部分との間に段差を設けた角形チップ抵抗器。1. An insulating substrate in the form of a prism having a substantially octagonal cross-section including a main surface facing each other, and four main portions formed on the main surface and end surfaces at both ends of the insulating substrate and adjacent to the main surface. An electrode portion formed on a side surface of the insulating substrate, and a resistive layer connected to the electrode portion and formed on a main surface of the insulating substrate. The electrode portion is formed on a side surface of the insulating substrate on which the electrode portion is formed. A square chip resistor having a step between both end portions and the intermediate portion by making the angle of both end portions with respect to the main surface smaller than the angle of the intermediate portion.
た縦方向及び横方向の分割溝を有し、前記基板の厚み
は、前記縦方向の分割溝により区画された前記横方向の
分割溝の一辺に等しいかあるいはそれに近似した値であ
って、前記縦方向の分割溝のうち側面電極が形成される
部分の深さは、前記基板の厚みの１／３かあるいはそれ
に近似した値で、それ以外の分割溝の深さは、側面電極
を形成する部分よりも浅くし、かつ前記表面の縦方向の
分割溝の深さ及び前記裏面の縦方向の分割溝の深さを合
わせた値を基板厚みの１／２以上とするとともに前記分
割溝の形状をＶ溝状とし、かつこのＶ溝状の前記基板の
表面及び裏面につながる部分に丸みを持たせるように形
成した絶縁基板を用い、前記絶縁基板の分割溝により囲
まれた部分に抵抗層及び電極部を形成した後、分割溝に
沿って個片に分割することを特徴とする角形チップ抵抗
器の製造方法。2. A semiconductor device according to claim 1, further comprising vertical and horizontal dividing grooves provided on the front and back surfaces of the substrate so as to face each other. The depth of the portion where the side surface electrode is formed in the vertical dividing groove is equal to or close to one side of the groove, and the depth of the portion where the side surface electrode is formed is a value equal to or close to 1/3 of the thickness of the substrate. The depth of the other divided grooves is shallower than the portion forming the side electrode, and is a value obtained by combining the depth of the vertical divided grooves on the front surface and the depth of the vertical divided grooves on the back surface. The thickness of the divided groove is V-shaped and the substrate connected to the front surface and the back surface of the V-shaped groove is rounded. A resistive layer on a portion of the insulating substrate surrounded by the dividing groove. After forming the fine electrode portion, the manufacturing method of the rectangular chip resistor, characterized by divided into pieces along the dividing grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209984A JP3063406B2 (en) | 1992-08-06 | 1992-08-06 | Square chip resistor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209984A JP3063406B2 (en) | 1992-08-06 | 1992-08-06 | Square chip resistor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0661003A JPH0661003A (en) | 1994-03-04 |
| JP3063406B2 true JP3063406B2 (en) | 2000-07-12 |
Family
ID=16581937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4209984A Expired - Fee Related JP3063406B2 (en) | 1992-08-06 | 1992-08-06 | Square chip resistor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3063406B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8020238B2 (en) * | 2002-01-31 | 2011-09-20 | Colgate-Palmolive Company | Powered toothbrush |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006024767A (en) * | 2004-07-08 | 2006-01-26 | Koa Corp | Manufacturing method of chip resistor |
| JP4867325B2 (en) * | 2005-12-13 | 2012-02-01 | パナソニック株式会社 | Manufacturing method of chip-type network electronic component |
-
1992
- 1992-08-06 JP JP4209984A patent/JP3063406B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8020238B2 (en) * | 2002-01-31 | 2011-09-20 | Colgate-Palmolive Company | Powered toothbrush |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0661003A (en) | 1994-03-04 |
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| LAPS | Cancellation because of no payment of annual fees |