JPH09199301A - Connected chip resistors and substrate for mounting connected chip resistors - Google Patents

Abstract

PROBLEM TO BE SOLVED: To strengthen a surface tension and to thereby increase self-alignment effect by increasing the overlap portion of the width or end face electrodes on a back surface and the width of lands of a substrate mounted with the electrodes. SOLUTION: Connected chip resistors have four resistors 16 provided on the upper surface of a rectangular insulating substrate 1 and end face electrodes leading from and electrically connected with the respective resistors 16 and provided from the upper surface to back surface of the insulating substrate 11. The upper surface-side end face electrodes 13a to 13d have an equal pitch to one another. The outermost end face electrodes 15a and 15d on the back surface have pitches 1.3 to 1.6 times as large as those of the end face electrodes 15b and 15c at the center of the back surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple chip resistor used in various electronic circuits and a mounting board for mounting the same.

[0002]

2. Description of the Related Art Conventionally, a multiple chip resistor is disclosed in Japanese Patent Application No.
The thing described in the microfilm of No. 1226 (Jitsukaihei 6-26210) is known.

FIG. 8 is a top view of a conventional multiple chip resistor. In the figure, four resistors 2a to 2d formed on the upper surface of the insulating substrate 1 and both ends of the resistors 2a to 2d are
Terminal electrodes 3a led to the end surface and the back surface of the insulating substrate 1 to
In a multiple chip resistor having 3d, 4a-4d,
Terminal electrodes 3a, 3d formed on the outermost part of the insulating substrate 1,
Disclosed is that the width of 4a, 4d is 1.1 to 1.3 times the width of the central terminal electrodes 3b, 3c, 4b, 4c sandwiched between the outermost terminals. ing.

[0004]

In the above-mentioned conventional multiple chip resistor, the shape of the concave portion is a perfect circle and the concave portions are formed at the four corners as well. If the electrode is formed 1.3 times or more as large as the electrode on the rear surface side of the central portion, the space between the concave portions is naturally narrowed, and the division frequently occurs there. Therefore, the outermost back-side end surface electrode must be 1.3 times or less than the central back-side end surface electrode, which is not sufficient for a small-sized multiple chip resistor where the self-alignment effect is important. There is a demand for a multiple chip resistor having a self-alignment effect higher than conventional ones.

It is generally known that the self-alignment effect increases as the overlap between the width of the terminal electrode of the multiple chip resistor and the width of the land of the mounting board on which it is mounted increases the surface tension.

The present invention aims to satisfy the above requirements.

[0007]

In order to solve this problem, according to the present invention, the width of the end surface electrode on the upper surface side is equal pitch with respect to the longitudinal direction of the insulating substrate, and the width of the back surface side is the outermost central portion. It is configured to be 1.3 to 1.6 times.

Further, the multiple chip resistors are mounted so as to have a land width equal to or larger than the width of the outermost end face electrode on the back surface side of the end face electrodes with respect to the longitudinal direction of the insulating substrate of the multiple face chip resistors. The mounting board is configured as follows.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is
A rectangular insulating substrate, a plurality of resistors provided on the upper surface of the insulating substrate, and from the upper surface to the back surface of the insulating substrate so as to be derived from and electrically connected to each of the plurality of resistors. In a multiple chip resistor having an end face electrode provided, the width of the upper face side of the end face electrode is equal pitch with respect to the longitudinal direction of the insulating substrate, and the width of the rear face side is the outermost part with respect to the central part. 1.3 to 1.6 times.

[0010] The invention described in claim 2 is the same as the claim 1.
In the invention described above, between the end face electrodes provided on the upper surface of the insulating substrate, a rectangular recess is provided from the end of the insulating substrate toward the center, and the top of the recess is rounded. .

The invention described in claim 3 is the same as the claim 2
The invention described above is provided with a protective film that is equal to or apex to the tops of the recesses facing each other on the upper surface of the insulating substrate or that is widened toward the end face side from the tops of the recesses.

Further, in the invention according to claim 4, the widths of the electrodes on the upper surface side are equal pitches and the widths on the back surface side are 1.3 to 1.6 times at the outermost portion at least with respect to the longitudinal direction of the insulating substrate. Mounting for mounting a multiple chip resistor having an end surface electrode and a multiple chip resistor having a land width equal to or larger than the width of the outermost end surface electrode on the back surface side of the end surface electrode of the multiple chip resistor It is composed of a substrate.

An embodiment of the present invention will be described below with reference to the drawings. 1 is a cutaway top view of a multiple chip resistor according to an embodiment of the present invention, FIG. 2 is a rear view of the same, and FIG. 3 is a sectional view thereof. In the figure, 11 is a rectangular insulating substrate made of 96% alumina or glass ceramic. Reference numeral 12 denotes a rectangular concave portion provided in the longitudinal direction of the insulating substrate 11 from the end portion of the insulating substrate 11 toward the central portion thereof. The top portion 12a of the concave portion 12 has a roundness. 13a to 13d, 14a to 14d,
15a to 15d are four upper surface side end surface electrodes, an end surface side end surface electrode and a rear surface side end surface electrode, which are provided from the upper surface to the rear surface of the insulating substrate 11 in a region having no recess 12 in the longitudinal direction of the insulating substrate 11. And the back side is gold, silver, copper,
The upper surface side end surface electrode 1 is made of silver palladium or the like as a main component, and the end face side is made of a nickel-based conductive resin material or silver, silver palladium or the like as a main component.
3a to 13d have equal widths in the longitudinal direction of the insulating substrate 11, and the rear surface side end surface electrodes 15a to 15d are the outermost rear surface side end surface electrodes 15a and 15d from the central rear surface side end surface electrodes 15b and 15c. It has a width of 3 to 1.6 times. Reference numeral 16 is a resistor made of ruthenium oxide or the like which is provided so as to straddle and electrically connect the upper surface side end surface electrodes 13a to 13d facing each other in the longitudinal direction of the insulating substrate 11. Reference numeral 17 is a pre-coated glass layer made of glass or the like provided so as to cover at least the resistor 16. 18
Is the top 12a of the recess 12 facing the upper surface of the insulating substrate 11.
Or a protective film containing epoxy resin, glass, or the like as a main component, which is spread from the top 12a of the recess 12 toward the end surface of the insulating substrate 11.

A method of manufacturing the multiple chip resistor according to the embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIG. 4, FIG. 5 and FIG. 6 are process diagrams of a multiple chip resistor in one embodiment of the present invention.

First, as shown in FIG. 4A, silver is the main component on the back surface of an insulating substrate 22 made of 96% alumina having a recess 21 in the longitudinal direction and a rounded top 21a of the recess 21. After screen-printing the paste to be burned at about 850 ° C., the back side end face electrodes 23a-23
forming d. At this time, the outermost back surface side end surface electrode 23
a and 23d are rear surface side end face electrodes 23b and 23c of the central portion.
The width of the insulating substrate 22 in the longitudinal direction is 1.3 to 1.6 times as wide.

Next, as shown in FIG. 4B, a paste containing silver as a main component is screen-printed on the upper surface of the insulating substrate 22 and then baked at about 850.degree.
a to 24d are formed. At this time, the upper surface side end surface electrode 24a
24d are formed to have an equal pitch width in the longitudinal direction of the insulating substrate 22.

Next, as shown in FIG. 4C, a paste made of ruthenium oxide is screen-printed so as to straddle the opposing upper surface side end surface electrodes 24a to 24d on the upper surface of the insulating substrate 22, and then at about 850 ° C. 4 resistors 25 after firing
To form

Next, as shown in FIG. 5A, a glass paste is screen-printed so as to cover at least four resistors 25 and then baked at about 600 ° C. to form a pre-coated glass layer 26.

Next, as shown in FIG. 5B, a groove is cut 27 by a laser to obtain a desired resistance value, and the resistance value is corrected.

Next, as shown in FIG. 5 (c), the epoxy-based insulating property is equal to the top 21a of the recess 21 facing the upper surface of the insulating substrate 22 or is wider than the top 21a of the recess 21 toward the end face. After screen-printing a paste containing a resin as a main component, it is cured at about 200 ° C. to form a protective film 28.

Next, as shown in FIG. 6A, the primary substrate is divided in the longitudinal direction of the insulating substrate 22.

Next, as shown in FIG. 6B, a nickel-based material is used to electrically connect the upper surface side end surface electrodes 24a to 24d and the rear surface side end surface electrodes 23a to 23d to the end surface side of the insulating substrate 22. After applying a paste containing a conductive resin as a main component with a roller, the paste is cured at about 200 ° C. to form the end face side end face electrodes 29a to 29d.

Next, as shown in FIG. 6 (c), the secondary substrate is divided at the opposing surfaces of the insulating substrate 22 on which the concave portions 21 are not formed.

Finally, as shown in FIG. 6D, the upper surface side end surface electrodes 24a to 24d and the upper surface side end surface electrodes 29a to 29 are formed.
d is plated with nickel so as to cover the end electrodes 23a to 23d on the back side and the solder plating 30 is then coated so as to cover the nickel plating (not shown) to manufacture a multiple chip resistor.

The present invention is not limited to the manufacturing method described only in the manufacturing method of the present embodiment.

Further, in the present embodiment, the outermost back surface side end surface electrodes 15a and 15d are the back surface side end surface electrodes 15 in the central portion.
The reason why the width is 1.3 to 1.6 times wider than that of b and 15c is as follows. In the conventional multiple chip resistors, the shape of the recess is a perfect circle, and the recesses are formed at the four corners as well. Therefore, the outermost back surface side end electrode is the central back surface side end surface electrode. If it is formed by 1.3 times or more, the space between the concave portions is naturally narrowed, and the division frequently occurs there. However, in the multiple chip resistor according to the present embodiment, since the recesses 12 are rectangular and the recesses are not formed at the four corners, the recesses 12 can be widened and the outermost back surface side end surface electrode 1 can be formed.
5a and 15d are the end face electrodes 15b and 15c on the back side of the central portion.
Even if the width is 1.3 times or more, it is possible to increase the self-alignment effect as compared with the prior art without increasing the incidence of division between the recesses 12. In addition, 1.
It is physically impossible to make the number 6 times or more in terms of manufacturing the insulating substrate 11.

The results of measuring the self-alignment effect with the conventional multiple chip resistors produced in the multiple chip resistors described in the present embodiment are shown in Table 1 below. As the measuring method, the outermost back surface side end surface electrode 15a,
15d is one of the back surface side end surface electrodes 15b and 15c in the central part.
A multi-chip resistor having a width of 1 to 1.6 times was prototyped, and each of them was mounted on a mounting board at a position of 0.05 mm, 0.
Mounting was performed by shifting by 10 mm and 0.15 mm.

[0029]

[Table 1]

From Table 1, it can be seen that the present invention has a large self-alignment effect and boasts high mountability.

An example of use of the multiple chip resistor having the above structure and manufactured according to the embodiment of the present invention will be described below.

FIG. 7 is a diagram showing an example of use of the multiple chip resistors in one embodiment of the present invention. In the figure, 4
Reference numeral 1 is a mounting board for mounting the multiple chip resistor 42 described above. The mounting substrate 41 includes a land 4 corresponding to an end surface electrode (not shown) on the back surface side of the multiple chip resistor 42.
3 and at least the outermost back surface side end surface electrode is larger than the width of this back surface side end surface electrode.
Will be implemented in.

As described above, by providing the lands 44 at least larger than the width of the back surface side end surface electrode, it is advantageous in terms of the self-alignment effect when the mounting deviation occurs.

The land 44 is a multiple chip resistor 42.
Although the width is larger than the width of the back surface side end surface electrode of the above, it may be the same.

[0035]

As described above, according to the present invention, the following advantageous effects can be obtained.

(1) The width of the rear surface side of the end face electrode in the longitudinal direction of the insulating substrate of the multiple chip resistor is 1.3 to 1.6 times the outermost part of the central part. And has a land width equal to or larger than the width of the outermost end face electrode on the back face side of the end face electrode with respect to the longitudinal direction of the insulating substrate of the multiple chip resistor. And the width of the land of the mounting substrate on which it is mounted are large, so that the surface tension is strong and the self-alignment effect is large.

(2) Between the end face electrodes of the multiple chip resistor,
Since the rectangular concave portion is provided from the end of the insulating substrate toward the center, the width of the back surface side of the end face electrode with respect to the longitudinal direction of the insulating substrate of the multiple chip resistor is the outermost part with respect to the central part. It is possible to increase 1.3 times to 1.6 times. Moreover, since the top of the recess is rounded, cracks can be prevented due to stress during formation of the recess, and the product strength is improved.

(3) Migration between terminals can be prevented by providing a protective film which is equal to the top of the recess facing the upper surface of the insulating substrate of the multiple chip resistor or which is widened toward the end face side from the top of the recess.

[Brief description of drawings]

FIG. 1 is a cutaway top view of a multiple chip resistor according to an embodiment of the present invention.

[Fig. 2] Rear view of the same

FIG. 3 is a sectional view of the same.

[Fig. 4]

[Fig. 5]

FIG. 6

FIG. 7 is a diagram showing the same usage example.

FIG. 8 is a top view of a conventional multiple chip resistor.

[Explanation of symbols]

 11 Insulating Substrate 12 Recess 12a Top 13a to 13d Top Surface End Electrode 14a to 14d End Surface End Electrode 15a to 15d Back Side End Electrode 16 Resistor 17 Precoat Glass Layer 18 Protective Film

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Norio Kawabata 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Akio Fukuoka, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (4)

[Claims] 1. A rectangular insulating substrate, a plurality of resistors provided on an upper surface of the insulating substrate, and the insulating substrate which is derived from and electrically connected to each of the plurality of resistors. In a multiple chip resistor having an end surface electrode provided from the upper surface to the back surface of the end surface electrode, the width of the end surface electrode on the upper surface side is equal pitch and the width on the back surface side is outermost with respect to the longitudinal direction of the insulating substrate. Is 1.3 to the center
Multiple chip resistor with 1.6 times. 2. The multiple chip resistor according to claim 1, wherein between the end face electrodes, a rectangular recess is provided from the end of the insulating substrate toward the center, and the top of the recess is rounded. 3. The multiple chip resistor according to claim 2, further comprising a protective film which is equal to or apex to the tops of the recesses facing each other on the upper surface of the insulating substrate, and which is widened toward the end face side from the tops of the recesses. 4. A multiple chip resistor having an end face electrode in which the widths of the upper surface side electrodes are at equal pitches at least with respect to the longitudinal direction of the insulating substrate, and the outermost width of the rear surface side is 1.3 to 1.6 times. And a mounting substrate for mounting a multiple chip resistor having a land width equal to or larger than the width of the outermost end face electrode on the back surface side of the end face electrode of the multiple chip resistor.