JP3046670B2 - Component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus,
More specifically, using a substrate conveyor device in the form of a belt conveyor
Parts for mounting the electronic component thereon to transfer the substrate successively with
The present invention relates to a component mounting apparatus in which a substrate is sequentially transported to a mounting position without a waiting time and an electronic component is efficiently mounted.

[0002]

2. Description of the Related Art A component mounting apparatus equipped with a belt-conveyor-type conveying apparatus, which conveys a substrate from an upstream side, waits at a standby station, sends it to a mounting station, mounts necessary electronic components there, and sends the electronic equipment out of line. Is conventionally known, and an example thereof is a technique described in JP-A-3-30496.

[0005] In a conventional transport apparatus of this type, as shown in FIG. 9, the transport path is divided into five blocks A to E, and the mounting of parts is alternately performed by two blocks B and D. By doing so, the loss of operating time of the mounting head due to the transfer of the substrate has been eliminated. More specifically, a substrate is first loaded from block E and sent to block D. A new board is loaded into the block E and kept on standby, and about half of all mounted components are mounted on the board set in the block D and sent to the block B via the block C, where the remaining parts are sent. The board on which half of the components are mounted and the board on which all components are mounted is sent to block A. On the other hand, the substrate on the block E is sent to the block D, a new substrate is carried into the block E, and the substrate waiting at the block C is sent to the block B. While repeating such a procedure, the substrate is sequentially transported and mounted on the mounting block (mounting position).

[0004]

However, in the case of the prior art, since the standby block C is interposed between the blocks B and D in which the components are mounted in half each, the three components are within the operating range of the component mounting head. Blocks, that is, three substrates are arranged side by side, and there is an inconvenience that the substrate size that can be accommodated by the mounting head is limited to about one third of the moving range of the head. Furthermore, in the case of the above-mentioned conventional technology, since components are mounted on one board in two blocks, the recognition operation for positioning the board in each block or correcting after the positioning is performed by one block. This had to be performed twice on the substrate. After the start of operation, half of the components are mounted on the first board in the block D and sent to the block B via the block C, and the waiting time in the block D is sent while the board on the block E is sent to the block D. There was a loss of operating time.

Accordingly, an object of the present invention is to solve the above-mentioned drawbacks, to increase the size of a substrate which can be accommodated by a mounting head, to cope with a substrate having a larger size, and to reduce the loss of operating time. It is another object of the present invention to provide a component mounting apparatus that can be further reduced.

[0006]

The present invention to solve the above object means to provide a process as indicated in item 1 example claims, mounting an electronic circuit on a substrate by sequentially transporting the substrate to the component mounting position
In the component mounting apparatus, at least two component mounting positions are provided along the transport path, and a mechanism for temporarily retracting the first substrate from the transport path near the first component mounting position on the upstream side in the transport direction is provided. while through the transfer path of the substrate after being retracted transport the second substrate to the second component mounting position of the downstream, in the first, each component mounting position of the second, the first, the second All required electronic components were mounted on a substrate.

[0007]

Referring to FIG. 1, two component mounting blocks C and B (component mounting positions) are provided, and the first substrate is retracted in the block C (and block B) from the transport path in the vertical direction ( A mechanism for offsetting is provided, and components are mounted at the retracted position. In the meantime, the second board is transported to the block B under the first board, where it is also retracted upward to mount components. The mounted first substrate is transported to the block A under the second substrate, and a third substrate is newly sent to the block C from the block D.
In this way, only two boards are arranged in the component mounting head movement range, and the board size can be increased to の of the head. In addition, since all the components are mounted at one time in each of the blocks B and C, it is possible to eliminate the loss of the operation time of the first substrate at the start of operation.

[0008]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 to 6 are explanatory views showing the component mounting apparatus according to the present invention in detail.

2 to 6 are explanatory views showing details of the block B (or C) in the electronic circuit board transport device according to the present invention. FIG. 2 is a plan view, FIG. FIG. 4 is a side view, and FIG. 5 is an offset (substrate retreat).
FIG. 6 is a front view similar to FIG. 3 showing a state in which the mechanism is operated, and FIG. 6 is a side view similar to FIG. 4 in a similar state. In addition, part
The whole article mounting apparatus, as shown in FIG. 7, such blocks are linked 2 group, thereon downstream block D, consisting of a concatenation of A.

In FIG. 1, reference numeral 1 denotes a substrate transport mechanism, reference numeral 2 denotes a substrate clamp mechanism, and reference numeral 3 denotes an offset mechanism for offsetting the clamp mechanism above the transport mechanism 1. The transport mechanism 1 includes a belt conveyor 10,
The substrate 4 is placed thereon and moved. As shown in FIG. 4, the substrate clamping mechanism 2 includes a frame 20 extending the block in the horizontal direction, and a reference pin 2 attached to the frame.
2, a plate 24 and an air cylinder 26. The substrate 4 is positioned at a predetermined mounting position by inserting a reference pin 22 driven by the air cylinder 26 from below, and further attached to the frame 20. It is clamped by the backup pin 29 driven by the air cylinder 28 and the plate 24 and firmly fixed at a predetermined position.

As shown in FIGS. 4 and 5, the offset mechanism 3 includes a second frame 30 extending in parallel with the above-described frame 20. The first frame 20 and the second frame 30 are connected to a rod 32. Are linked by More specifically, the rod 32 is pivotally connected to the first frame 20 at one end, and is connected to the air cylinder 34 at the other end.
The cylinder portion 38 of the air cylinder 34 is connected to the second frame 30. Therefore, by driving the piston, the first frame 20
Is vertically movable between a position (non-offset position) shown in FIG. 3 and a position (offset) position shown in FIG. 5 with respect to the second frame 30, and is thus a clamp mechanism attached to the first frame. The substrate 4 fixed to 2 is also configured to be vertically movable between a non-offset position and an offset position.
Then, as shown in FIG. 7, two substrates 4 are arranged side by side at the offset position above, and all the components are mounted on each of the blocks B and C via the head 40 at one time.

Returning to FIG. 1, the first substrate 4a is transported from the block D to the block C, where it is clamped by the substrate clamping mechanism 2 (not shown) and driven to the upper offset position. You. Then, all necessary electronic components are mounted. Meanwhile, the second substrate 4
b is conveyed to the block B under the first substrate 4a, where it is similarly clamped and driven upward to the offset position, where all the necessary electronic components are likewise mounted. Block C while components are mounted in Block B
The first substrate 4a on which all the components have been mounted is sent to the block A under the second substrate 4b and transported out of the row, and the third substrate 4c is moved from the block D to the block C.
Arrives and gets clamped.

In this embodiment, as described above, the substrate is temporarily offset (retracted) from the transport path. Therefore, first, only two substrates can be placed in the moving range of the component mounting head. Can be increased from 1/3 to 1/2, and components can be sequentially mounted on a substrate having a larger size. Further, in addition to the above configuration, the mounting of the required components is completed in each of the blocks B and C, so that the mounted components can be immediately transported to the block A, and the first board that has started the operation starts from the first board. The waiting time of the block C can be eliminated, and the loss time can be further reduced.

FIG. 8 shows a second embodiment of the present invention, and is a plan view of the transfer apparatus as viewed from above, in which the substrate is offset in the horizontal direction. According to this example, the next substrate can be sent using the transport path after the substrate is retracted.

In the above embodiment, an example is shown in which B and C two component mounting blocks are provided. However, the present invention is not limited to this, and three or more component mounting blocks may be provided continuously.

[0016]

Effects of the Invention Claim 1 wherein, in the component mounting apparatus sequentially transporting the substrate to the component mounting position for mounting the electronic component on the substrate, provided at least two positions along the conveying path of the component mounting position, the transport A mechanism for temporarily retracting the first substrate from the transport path near the first component mounting position on the upstream side in the direction ,
Together through the conveying path after retracting the first substrate carrying the second substrate follows the second component mounting position of the downstream, in the first, each component mounting position of the second, the first , Second
On to the substrate to respectively mounted all of the required electronic components
Since it is configured in earthenware pots, it is possible to reduce the number of substrates to be juxtaposed to the component mounting head moving range to two sheets, it is possible to increase the size of the substrate to 1/2 of the head movement range, the working It is possible to eliminate the loss of operating time from the beginning, and to further improve the work efficiency.

[Brief description of the drawings]

FIG. 1 is an explanatory view schematically showing an electronic circuit board transport device according to the present invention.

FIG. 2 is a plan view showing details of a block B or C in the apparatus of FIG. 1;

FIG. 3 is a front view of the block in FIG. 2;

FIG. 4 is a side view of the block in FIG. 2;

FIG. 5 is a front view of the block shown in FIG. 2;
FIG. 9 is an explanatory diagram illustrating a state in which the mechanism is operated to retract the substrate from the transport path.

FIG. 6 is a side view of the block in FIG. 2 and is an explanatory view showing a state in which an offset mechanism is operated as in FIG. 5;

FIG. 7 is an explanatory front view showing a state in which two blocks shown in FIGS. 2 to 6 are connected to transfer a substrate while operating an offset mechanism.

FIG. 8 is an explanatory plan view showing a second embodiment of the present invention.

FIG. 9 is an explanatory view schematically showing a conventional electronic circuit board transport device.

[Explanation of symbols]

First transport mechanism 2 the clamping mechanism 3 offset mechanism 4 substrate 10 belt conveyor 20 frame 24 plates 26,28,34 air cylinder 29 backup pins 32 rod de 3 6 piston 38 cylinder section 40 component mounting head

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/00

Claims (1)

(57) [Claims] 1. A component mounting apparatus for mounting electronic components to the substrate on the component mounting position to sequentially transported to the substrate, provided at least two positions along the conveying path of the component mounting position, transportable
A mechanism for temporarily retreating the first substrate from the transport path is provided near the first component mounting position on the upstream side in the transport direction, and after retreating the first substrate, the second substrate is moved downstream via the transport path. conveys the second component mounting position, in the first, each component mounting position of the second, and characterized in that said first, all of the required electronic components on the second substrate to be mounted respectively Component mounting equipment.