JP3037303B1 - Semiconductor package mounting method - Google Patents

Abstract

An object of the present invention is to remove and mount a semiconductor package capable of preventing heat generated at the time of replacing a semiconductor package and preventing destruction / damage of adjacent components, and a method of using the same. The purpose is to provide a replacement jig. SOLUTION: Hot air is circulated inside an exchange jig used when exchanging a semiconductor package to prevent heat radiation to the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor package.

[0002]

2. Description of the Related Art In general, in BGA type semiconductor package mounting technology, it has been one important factor to make it possible to replace a component and a package which becomes defective in mounting. Therefore, as a conventional mounting method for a BGA type semiconductor package, a method of removing a BGA package from a printed circuit board and a mounting method disclosed in Japanese Patent Application Laid-Open No. 8-46351 and a nozzle used for the method are shown in FIG. , FIG. 6, FIG. 7, FIG. 8, and FIG. FIG. 5 shows the nozzle. A mounting port 11 is a mounting port provided at one end of the nozzle body 10 and accommodates a heater as disclosed in, for example, Japanese Patent Application Laid-Open Publication No. Sho. B
The solder balls C, C,... Under the GA type semiconductor package 3a
A hot air outlet of a hot air generator that discharges hot air at a temperature suitable for melting, for example, about 270 ° C., which can be attached and detached with screw grooves or bolts;
The tube 12 is a tube having a suction pad 13 at the lower end.
At the upper end, a connection port 12a communicating with a vertically movable negative pressure source provided in the wind generator was provided, and was attached by a support member 14 so as to be vertically movable. The shape of the wall surface 15a of the nozzle opening 15 is determined so as to match the peripheral surface of the BGA type semiconductor package 3a.
Are formed at positions slightly above the surface 3 of the A-type semiconductor package 3a, and a shielding member 17, which is opened upward with a certain gap provided outside thereof,
.. Are attached, and the body 18 shows the connection between the nozzle opening 15 and the attachment opening 11.

[0003] As a conventional detaching method in the above-mentioned conventional device, a nozzle opening 15 having a size corresponding to the peripheral surface of the BGA type semiconductor package 3a to be detached on the printed circuit board 4 is selected, and this is inserted into the discharge port of the hot air generator. Tube 12
When the nozzle opening 15 is put on the upper part of the BGA package 3a to be removed on the printed circuit board 4 in a state where the suction pad 13 can be moved up and down from the hot air generator side by this, The adjacent components 5a and 5b mounted around the die semiconductor package 3a are provided with a wall surface 15 forming a nozzle opening 15.
a cuts off the BGA type semiconductor package 3a.

When hot air is supplied in this state, the hot air flowing in through the body 18 is
While the whole is heated uniformly, it flows out from the through holes 16, 16. The hot air flow is shown in the figure as hot air flow 6 (FIG. 6).

[0005] The hot air that has flowed out is shielded by the shielding member 1.
7, 17,..., The air flows away from the surface of the printed circuit board 4, and therefore, the surrounding adjacent components 5 a, 5 b diffuse into the atmosphere without being directly heated. (FIG. 6)

In this way, when hot air is supplied for a predetermined time, the BGA type semiconductor package 3a and the through holes 16
.. Are heated on average through the stagnant air. Since this heat is transmitted to the solder balls C, C,... Via the BGA type semiconductor package 3a, all the solder balls C, C,. (FIG. 6)

The BGA type semiconductor package 3a is removed from the printed circuit board 4 by raising the suction pad 13 while supplying a negative pressure to the suction pad 13 at the time when all the solder balls C are melted. It was a method that could be. (FIG. 7)

Further, the conventional mounting method in the above-described conventional device is based on the BGA type semiconductor package 3a to be newly mounted.
A spacer 19, which is slightly thinner than the diameter of the solder ball B located at the lower part, is mounted on the surface of the printed circuit board 4 so that two pieces face the lower part of the BGA package 3a, and the suction pad 13 sucks the BGA package 3a. The positioning is performed according to the pattern of the printed circuit board 4. (FIG. 8)

In this state, since the solder balls C, C,... Are not melted, the back surface of the BGA package 3a is not in contact with the spacers 19, 19, and therefore, the solder balls C, C,. Contacts the pattern on the printed circuit board 4. (FIG. 8)

In this state, when hot air is supplied, the heat that has conducted through the BGA package 3a is applied to the solder balls as in the case of melting.
Dissolve C, C, ... Even in this state, since the predetermined position is held by the suction pad 13, the BG
The A package 3a receives a force from the suction pad 13 as a positioning means in addition to its own weight. (FIG. 8)

When the melting of the solder balls C, C... Progresses and the solder balls C, C... Cannot withstand the pressure from above, they are crushed by this pressure. Since the back surface of the BGA package 3a contacts the spacers 19, 19, it is prevented from being deformed to a thickness equal to or less than the spacers 19, 19, and is not deformed until it comes into contact with an adjacent solder ball. This is a mounting method of being fixed to the printed circuit board 19. (FIG. 9)

[0012]

However, there are the following problems in the method of removing and mounting the BGA package from the printed circuit board in the above-mentioned prior art and the nozzle used for the method. When the method of mounting a semiconductor package using the nozzle as described above is performed, when the removal jig sends hot air, the hot air is sent out as a flow 6 of hot air in FIG.
In other words, in this mounting method, since hot air is emitted around the nozzle, there is no possibility of directly heating or destroying an adjacent component or an adjacent soldered portion, but a large amount of BGA
The more frequently the package is mounted and used within a short period of time, the higher the temperature around the nozzle will be, and indirectly the adjacent parts will be severely damaged or destroyed by the heat, and the soldered parts will be destroyed. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to make it possible to mount a BGA type semiconductor package without destroying components around the package due to hot air in a mounting operation. It is an object of the present invention to provide a method for mounting a BGA type semiconductor package.

[0014]

[Means for Solving the Problems]

A semiconductor package according to the first invention of the present application
The mounting method is to attach a semiconductor package to the suction nozzle in advance by bringing a vertically movable suction nozzle provided inside the replacement jig into a suction state before the replacement jig descends, and After positioning the semiconductor package with the semiconductor package, lowering the replacement jig in a state where the semiconductor package is sucked onto the printed board, stopping the suction operation, and mounting the semiconductor package at a predetermined position on the printed board. Then, after raising the suction nozzle to a position where the semiconductor package is not sucked, hot air is sent out through the replacement jig, and at the same time, the suction nozzle is operated again. And reflowing the soldering to mount the semiconductor package.

Therefore, the first invention of the present application provides a method in which the vertically movable suction nozzle provided inside the replacement jig is set in a suction state before the replacement jig descends, whereby the semiconductor package is previously suctioned. Attaching to a nozzle, positioning the land on the printed board and the semiconductor package, lowering the replacement jig holding the semiconductor package onto the printed board, and then stopping the suction operation, Is mounted at a predetermined position on the printed circuit board, and after raising the suction nozzle to a position where the semiconductor package is not sucked, hot air is sent out through the replacement jig, and at the same time, the suction nozzle is operated again, and the suction is performed. The hot air is circulated in the jig by the suction operation of the nozzle to reflow soldering, and Has the step of mounting, realizing an improvement in reliability and safety in the mounting of the semiconductor package, shortening the time for actually performing the mounting, preventing hot air from being released outside the jig, There is an advantage that adjacent parts can be protected from hot air.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for mounting a semiconductor package according to an embodiment of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 shows a BGA type semiconductor package according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view showing an exchange jig used in a method of mounting a chip. The semiconductor package shown in FIG. 1 is a BGA type semiconductor package 3 a, and a suction nozzle 2 a that can move up and down is provided inside the exchange jig 1. The inner peripheral surface A at the tip of the replacement jig 1 is larger than the outer peripheral surface B of the BGA type semiconductor package 3a.

Next, a method of removing the semiconductor package will be described with reference to FIG. First, the replacement jig 1 is lowered from above so as to be in contact with the printed circuit board 4, and is mounted so as to cover the entire BGA type semiconductor package 3a. Next, hot air is blown through the exchange jig 1 to the entire BGA type semiconductor package 3a and heated. The flow of hot air at this time is sucked by the suction nozzle 2a as indicated by the arrow of the flow 6 of hot air. As a result, hot air (heat) is constantly circulated, so that the entire BGA type semiconductor package 3a is uniformly heated, and the solder joints 9 located at the lower portion of the BGA type semiconductor package 3a are melted almost simultaneously in a short time. This is a method in which the BGA type semiconductor package 3a is detached by lowering the BGA type semiconductor package 3a in an airtight manner with the suction nozzle 2a and pulling up the BGA type semiconductor package 3a. In addition, the suction nozzle 2
The hot air is stopped when the BGA type semiconductor package 3a is sucked and pulled up by a.

Next, a method of mounting a semiconductor package will be described with reference to FIG. First, the replacement jig 1 is connected to the printed circuit board 4.
The BGA type semiconductor package 3a is attached by bringing the suction nozzle 2a into a suction state before being lowered, and the land on the printed circuit board 4 and the BGA type semiconductor package 3a are attached.
Perform positioning. It is assumed that the tip of the suction nozzle 2a at this time is located below the tip of the replacement jig 1 (not shown). Next, the replacement jig 1 is lowered, and the suction nozzle 2a
Turn off the suction. Then, the suction nozzle 2a is raised to a position where the BGA type semiconductor package 3a is not sucked, and hot air is blown through the exchange jig 1 to the entire BGA type semiconductor package 3a to be heated. The flow of hot air at this time is sucked by the suction nozzle 2a as indicated by the arrow of the flow 6 of hot air. For this reason, hot air (heat) is always used, just like when removing
Circulates, the entire BGA type semiconductor package 3a is uniformly heated, and the solder joints 9 under the BGA type semiconductor package 3a are melted almost simultaneously in a short time, and the BGA type semiconductor package 3a is mounted on the printed circuit board 4. Is the way.

As shown in FIG. 2, the inner peripheral surface A (tip shape) of the exchange jig of the exchange jig 1 is located on the outer peripheral surface B of the semiconductor package 3b to be exchanged or on the outer side of the outer peripheral surface B. The replacement jig 1 of the present invention is not limited to the BGA type semiconductor package 3a but is designed to be located outside the connection terminal to be connected to the LGA type semiconductor package 3b as shown in FIG. The same removal method or mounting method as described above can be applied, and even when the connection terminal is located outside the outer peripheral surface of the semiconductor package such as a QFP semiconductor package or an SOP semiconductor package.

Second Embodiment Next, a method of mounting a semiconductor package according to a second embodiment of the present invention will be described with reference to FIG. As shown in FIG. 2, in the semiconductor package mounting method according to the present embodiment, unlike the semiconductor package mounting method according to the first embodiment, suction is applied to the tip of a suction nozzle 2 b provided inside the replacement jig 1. It has a hole 7. Thus, for example, when removing the BGA type semiconductor package 3 a, first, the replacement jig 1 is lowered from above so as to be in contact with the printed circuit board 4, and the BGA
After the replacement jig 1 is mounted so as to cover the die semiconductor package 3a, the suction nozzle 2b is brought into the suction state, and the suction nozzle 2b is air-tightly adsorbed on the BGA type semiconductor 3a. Next, hot air is blown through the exchange jig 1 to the entire BGA type semiconductor package 3a and heated. The flow of the hot air at this time is sucked by the suction hole 7 of the suction nozzle 2b as indicated by the arrow of the flow 6 of the hot air. Because of this, hot air (heat) always circulates even in the suction state, so that the entire BGA type semiconductor package 3a is uniformly heated, and the solder joint 9 located below the BGA type semiconductor package 3a is almost completely removed in a short time. It can be dissolved at the same time and pulled up as it is. Therefore, since the suction and the suction can be performed simultaneously, the BGA type semiconductor package 3a
Time when removing the BGA
There is an advantage that the step of removing the mold semiconductor package 3a can be simplified.

Also, in the mounting method, as shown in FIG. 2, by using a suction nozzle 2b having a suction hole 7 capable of simultaneously performing suction and suction, the above-mentioned [002] is obtained.
9] can be further simplified. That is,
Since the suction nozzle 2b is provided with the suction hole 7, when mounting the BGA type semiconductor package 3a on the printed circuit board 4, the suction nozzle 2b does not stop the suction of the suction nozzle 2b and is airtight with the BGA type semiconductor package 3a. The BGA-type semiconductor package 3a is mounted on the printed circuit board 4 while being in a state of being adsorbed, and the replacement jig 1 is
Hot air is blown onto the entire BGA type semiconductor package 3a and heated. The flow of the hot air at this time is sucked by the suction hole 7 of the suction nozzle 2b as indicated by the arrow of the flow 6 of the hot air. Therefore, the hot air (heat) always circulates even in the suction state, so that the BGA type semiconductor package 3a
The whole is heated uniformly, and the solder joints 9 located below the BGA type semiconductor package 3a can be reflowed almost simultaneously in a short time, and the BGA type semiconductor package 3a can be mounted at a predetermined position on the printed circuit board 4. The implementation method.

Further, as shown in FIG. 4, the suction nozzle 2c provided inside the replacement jig 1 has a double structure, and the outer shell 8a and the inner shell 8b are relatively operated, so that the suction hole 7 is formed. Outer shell 8a provided and inner shell 8b not provided with suction hole 7
Can be switched arbitrarily. When sucking the BGA type semiconductor package 3a, the inner shell 8 having no suction hole 7 is used.
Since b has a larger suction force than the outer shell 8a in which the suction hole 7 is provided, it is effective when airtight suction with the BGA type semiconductor package 3a is more surely performed.

For example, as a method of removing the BGA type semiconductor package 3a, first, the replacement jig 1 is lowered to the semiconductor package 3a on the printed circuit board 4, and the outer shell 8a provided with the suction hole 7 is placed on the upper part of the BGA type semiconductor package 3a. Hot air is blown to the entire BGA type semiconductor package 3a through the exchange jig 1 by air-tight suction. The flow of the hot air is indicated by the arrow of the flow 6 of the hot air. Next, after the solder joint 9 is melted, the BGA type semiconductor package 3
a rises the outer shell 8a to which it is adsorbed, and lowers the inner shell 8b which operates relatively to the outer shell 8a to suck the BGA type semiconductor package 3a (the hot air is sucked by the suction nozzle 2c having a double structure).
Is stopped at the time of operation). Next, there is a method in which the replacement jig 1 is pulled up to remove the BGA type semiconductor package 3a.

The method of mounting the BGA type semiconductor 3a at a predetermined position on the printed circuit board 4 is such that the tip of the outer shell 8a and the inner shell 8b are adjusted to the same height, and then the BGA type semiconductor package 3a is sucked. Then, the lands on the printed circuit board 4 are positioned, the suction nozzle 2c is moved down the outer shell 8a while adsorbing the BGA type semiconductor package 3a, and the BGA type semiconductor is adsorbed airtightly to the BGA type semiconductor package 3a. The package 3a is mounted on the printed circuit board 4, and hot air is blown over the entire BGA type semiconductor package 3a through the exchange jig 1 as it is to heat it. The flow of hot air at this time is sucked by the suction hole 7 of the suction nozzle 2c as indicated by the arrow of the flow of hot air 6. Therefore, the hot air (heat) is always circulated even in the suction state, so that the entire BGA type semiconductor package 3a is uniformly heated, and the BGA type semiconductor package 3a is quickly heated.
And the BGA type semiconductor package 3a is mounted at a predetermined position on the printed circuit board 4 by reflowing the solder joints 9 located at the lower portion of the printed circuit board almost simultaneously.

[0027]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an exchange jig used for a method of mounting a BGA type semiconductor package according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating an example of a replacement jig used in a method of mounting an LGA type semiconductor package according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an example of an exchange jig used for a method of mounting a BGA type semiconductor package according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing an example of an exchange jig used in a method for mounting a BGA type semiconductor package according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a nozzle used in a conventional method for mounting a BGA package from a printed circuit board.

FIG. 6 is a sectional view showing a method of removing a conventional BGA package.

FIG. 7 is a cross-sectional view illustrating a method of removing a conventional BGA package.

FIG. 8 is a cross-sectional view showing a mounting method of a conventional BGA package.

FIG. 9 is a cross-sectional view illustrating a mounting method of a conventional BGA package.

[Explanation of symbols]

 Reference Signs List 1 exchange jig 2a suction nozzle 2b suction nozzle with suction hole 2c double structure suction nozzle 3 BGA type semiconductor package surface 3a BGA type semiconductor package 3b LGA type semiconductor package 4 printed circuit board 5a adjacent component 5b adjacent component 6 hot air Flow 7 Suction hole 8a Outer shell 8b Inner shell 9 Solder connection part 10 Nozzle body 11 Mounting port 12 Tube 12a Connection port 13 Suction pad 14 Support member 15 Nozzle opening 15a Wall surface 16 Through hole 17 Shielding member 18 Body 19 Spacer A Inner surface B Outer surface of semiconductor package C Solder ball

Claims (1)

(57) [Claims] 1. A vertically movable suction nozzle provided inside the replacement jig is set in a suction state before the replacement jig descends, so that the semiconductor package is attached to the suction nozzle in advance, and the semiconductor package is mounted on a printed circuit board. After positioning the land and the semiconductor package, lowering the replacement jig holding the semiconductor package onto the printed board, stopping the suction operation, and positioning the semiconductor package at a predetermined position on the printed board. After the suction nozzle is raised to a position where the semiconductor package is not sucked, hot air is sent out through the replacement jig, and at the same time, the suction nozzle is operated again. Circulating in the tool, reflowing the soldering, and mounting the semiconductor package. Implementation method of a semiconductor package that.