JPH0846351A - Mounting and demounting of bga package from printed circuit board, and nozzle used therefor - Google Patents
Mounting and demounting of bga package from printed circuit board, and nozzle used thereforInfo
- Publication number
- JPH0846351A JPH0846351A JP6199113A JP19911394A JPH0846351A JP H0846351 A JPH0846351 A JP H0846351A JP 6199113 A JP6199113 A JP 6199113A JP 19911394 A JP19911394 A JP 19911394A JP H0846351 A JPH0846351 A JP H0846351A
- Authority
- JP
- Japan
- Prior art keywords
- bga package
- circuit board
- package
- printed circuit
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＢＧＡパッケージのプ
リント回路基板への固定、及びプリント回路基板に実装
されているＢＧＡパッケージの取り外し実装技術に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for fixing a BGA package to a printed circuit board and for removing and mounting a BGA package mounted on the printed circuit board.
【０００２】[0002]
【従来の技術】ＢＧＡパッケージは、図４に示したよう
に表面に回路素子や半導体デバイス４０が実装された基
板４１の裏面に半田合金により製作された微小なボール
Ｂ、Ｂ、Ｂ‥‥を接続端子として構成されたデバイス
で、図５に示したように基板４１の裏面全体を接続端子
として使用できるため、側面に接続端子を備えるＱＦパ
ッケージに比較して端子間の間隔が大きく、比較的簡単
な位置合わせにより正確な接続が可能になるという長所
を備えている。2. Description of the Related Art In a BGA package, as shown in FIG. 4, minute balls B, B, B, ... Made of solder alloy are formed on the back surface of a substrate 41 on which circuit elements and semiconductor devices 40 are mounted. In a device configured as a connection terminal, the entire back surface of the substrate 41 can be used as a connection terminal as shown in FIG. It has the advantage of being able to make accurate connections with simple alignment.
【０００３】しかしながら、接続箇所が図６に示したよ
うにプリント回路基板４２に実装された状態では、半田
ボールｂ、ｂ、ｂ‥‥びプリント回路基板４３とパッケ
ージの基板４１とに挟まれているため、プリント回路基
板４３に実装されたＢＧＡパッケージを取り外す場合に
は対象となるデバイスを熱風により加熱したり、プリン
ト回路基板４３の裏面を加熱して半田ボールを溶融させ
る必要がある。However, when the connection points are mounted on the printed circuit board 42 as shown in FIG. 6, the solder balls are sandwiched between the solder balls b, b, b ... And the printed circuit board 43 and the package board 41. Therefore, when removing the BGA package mounted on the printed circuit board 43, it is necessary to heat the target device with hot air or to heat the back surface of the printed circuit board 43 to melt the solder balls.
【０００４】ところが、ＢＧＡパッケージにはＱＦパッ
ケージのように側面にリード端子が無いため、通常パッ
ケージの近傍にまで回路部品が既に実装されてしまって
いて、対象となるＢＧＡパッケージの他に回路部品まで
が加熱されてしまい、これら回路部品を固定している半
田が溶融して脱落したり、また基板が過熱されて破損す
るという問題がある。However, unlike the QF package, the BGA package does not have lead terminals on the side surface, so that circuit components are already mounted near the normal package, and the circuit components other than the target BGA package are already mounted. However, there is a problem in that the solder fixing these circuit components melts and drops off, or the substrate is overheated and damaged.
【０００５】また、新規なプリント回路基板にＢＧＡパ
ッケージを実装する場合には、半田クリームを塗布した
状態で、ＢＧＡパッケージを含む各回路部品を搭載して
リフローによりハンダ付けを実行できるが、単一のＢＧ
Ａパッケージを実装する場合には、位置決め手段により
固定した状態でＢＧＡパッケージの半田ボールを選択的
に加熱するため、位置決め手段の重力までもが作用して
半田ボールが潰れてしまい、短絡等の事故を生じるとい
う問題がある。When a BGA package is mounted on a new printed circuit board, each circuit component including the BGA package can be mounted and soldering can be performed by reflowing with the solder cream applied. BG
When mounting the A package, since the solder balls of the BGA package are selectively heated while being fixed by the positioning means, the gravity of the positioning means also acts and the solder balls are crushed, causing an accident such as a short circuit. There is a problem of causing.
【０００６】[0006]
【発明が解決しようとする課題】本発明はこのような問
題に鑑みてなされたものであって、その目的とするとこ
ろは、実相済みのＢＧＡパッケージを簡単、かつ確実に
取り外すとともに、単一のＢＧＡパッケージを確実にプ
リント回路基板にハンダ付けすることができる新規なＢ
ＧＡパッケージのリペア方法を提案することである。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to easily and surely remove a BGA package that has already been used and to remove a single BGA package. A new B that can securely solder the BGA package to the printed circuit board.
It is to propose a repair method for a GA package.
【０００７】また本発明の他の目的は、単一のＢＧＡパ
ッケージのプリント回路基板ヘの着脱に適した熱風発生
装置を提供することである。Another object of the present invention is to provide a hot air generator suitable for mounting and dismounting a single BGA package on a printed circuit board.
【０００８】[0008]
【課題を解決するための手段】このような問題を解消す
るために本発明においては、内面が、ＢＧＡパッケージ
の外周面に一致する開口を備え、前記開口に挿入された
前記ＢＧＡパッケージの表面よりも上部に、通孔を有す
るノズルをプリント回路基板のＢＧＡパッケージに装着
する工程と、前記ノズルに前記ＢＧＡパッケージの半田
ボールを溶融させるに足る温度の熱風を供給する工程
と、前記半田ボールが溶融した段階でＢＧＡパッケージ
を前記プリント回路基板から取り外す工程とを備えるこ
とにより、ＢＧＡパッケージの表面からのみ半田ボール
に熱を供給して、周囲回路部品の加熱を防止する。In order to solve such a problem, according to the present invention, an inner surface is provided with an opening that coincides with an outer peripheral surface of a BGA package, and a surface of the BGA package inserted into the opening is larger than a surface of the BGA package. Mounting a nozzle having a through hole on the BGA package of the printed circuit board on the upper part, supplying the nozzle with hot air having a temperature sufficient to melt the solder ball of the BGA package, and melting the solder ball By including the step of removing the BGA package from the printed circuit board at this stage, heat is supplied to the solder balls only from the surface of the BGA package, and heating of the peripheral circuit components is prevented.
【０００９】[0009]
【実施例】そこで以下に本発明の詳細を図示した実施例
に基づいて説明する。図１は本発明に使用する熱風発生
装置に装着されるノズル１の一実施例を示すもので、図
中符号２は、ノズル本体１の一端に設けられた取付口
で、例えば特開昭号公報に見られるのようなヒータを収
容し、エア源からのエアを受けてＢＧＡパッケージの半
田ボールを溶融させるのに適した温度、たとえば２７０
°Ｃ程度の熱風を吐出する熱風発生装置の熱風吐出口
に、ねじ溝やまたボルトにより着脱できるようになって
いる。３は、下端に吸引パッド４を有する管で、上端に
風発生装置に設けられている上下動可能な負圧源に連通
する接続口３ａを有し、支持部材５により上下動可能に
取り付けられている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the illustrated embodiments. FIG. 1 shows an embodiment of a nozzle 1 mounted on a hot air generator used in the present invention. In the figure, reference numeral 2 is a mounting port provided at one end of a nozzle body 1, for example, Japanese Patent Laid-Open Publication No. Sho. A temperature suitable for accommodating a heater as seen in the publication and receiving air from an air source to melt the solder balls of the BGA package, eg 270.
It can be attached to and detached from a hot air outlet of a hot air generator that discharges hot air of about ° C by a screw groove or a bolt. Reference numeral 3 is a pipe having a suction pad 4 at its lower end, has a connection port 3a communicating with a vertically movable negative pressure source provided in the wind generator at its upper end, and is attached by a supporting member 5 so as to be vertically movable. ing.
【００１０】６は、ノズル開口で、ＢＧＡパッケージの
周面に一致するように壁面６ａの形状が決められてお
り、ＢＧＡパッケージ１０を装着した場合に、ＢＧパッ
ケージ１０ａの表面よりも若干上部となる位置には、通
孔７、７‥‥が穿設され、これの外側には一定の間隙を
設けて上方に開口する遮蔽部材８、８が取り付けられて
いる。なお、図中符号９は、ノズル開口６と取付口１を
接続する胴部を示す。Reference numeral 6 denotes a nozzle opening, and the shape of the wall surface 6a is determined so as to match the peripheral surface of the BGA package. When the BGA package 10 is mounted, the wall surface 6a is slightly above the surface of the BG package 10a. At the positions, through holes 7, 7, ... Are bored, and shielding members 8, 8 that open upward with a certain gap are attached to the outside thereof. In the figure, reference numeral 9 indicates a body connecting the nozzle opening 6 and the mounting opening 1.
【００１１】この実施例において、プリント回路基板２
０から取り外すべきＢＧＡパッケージ１０の周面に一致
するサイズのノズル開口６を有するノズル１を選択し、
これを熱風発生装置の吐出口に管３が接続、固定され、
これにより熱風発生装置側から吸着パッド４を上下動さ
せることが可能となる。In this embodiment, the printed circuit board 2
Select a nozzle 1 having a nozzle opening 6 sized to match the circumference of the BGA package 10 to be removed from 0,
The pipe 3 is connected and fixed to the discharge port of the hot air generator,
This allows the suction pad 4 to be moved up and down from the hot air generator side.
【００１２】この状態で、プリント回路基板２０上の取
り外すべきＢＧＡパッケージ１０の上部にノズル開口６
を被せると、ＢＧＡパッケージ１０の周囲に実装されて
いる回路部品２１、２２は、ノズル開口６を形成してい
る壁面６ａによりＢＧＡパッケージ１０と遮断される。In this state, the nozzle opening 6 is provided above the BGA package 10 to be removed on the printed circuit board 20.
When covered, the circuit components 21 and 22 mounted around the BGA package 10 are cut off from the BGA package 10 by the wall surface 6 a forming the nozzle opening 6.
【００１３】この状態で熱風Ｈを供給すると、胴部９を
介して流入した熱風は、ＢＧＡパッケージ１０の表面１
０ａに当たり、ＢＧＡパッケージ１０全体を均一に加熱
しつつ、通孔７、７から外部に流出する。When hot air H is supplied in this state, the hot air that has flowed in through the body portion 9 is the surface 1 of the BGA package 10.
At 0a, the entire BGA package 10 is uniformly heated and flows out through the through holes 7, 7.
【００１４】外部に流出した熱風は、遮蔽部材８、８‥
‥によりプリント回路基板２０の表面からかなり離れた
所を流れるため、周囲の回路部品２１、２２を加熱する
こと無く大気に拡散する（図２（イ））。The hot air flowing out to the outside is shielded by the shielding members 8, 8 ...
.. flows in a place far away from the surface of the printed circuit board 20, and diffuses into the atmosphere without heating the surrounding circuit components 21 and 22 (FIG. 2A).
【００１５】このようにして所定時間、熱風を供給する
と、ＢＧＡパッケージ１０と通孔７、７‥‥との間に停
滞する空気を介してＢＧＡパッケージ１０が平均に加熱
される。この熱は、ＢＧＡパッケージ１０を介して半田
ボールＢ、Ｂ、Ｂ‥‥に熱が伝達されるから、全部の半
田ボールＢ、Ｂ、Ｂ‥‥が均一に加熱されてほとんど同
時に溶融する。When the hot air is supplied for a predetermined time in this way, the BGA package 10 is heated on average through the air stagnant between the BGA package 10 and the through holes 7, 7, .... Since this heat is transferred to the solder balls B, B, B ... through the BGA package 10, all the solder balls B, B, B ... Are uniformly heated and melted almost at the same time.
【００１６】全部の半田ボールＢ、Ｂ、Ｂ‥‥が溶融し
た頃合を見計らって吸引パッド４に負圧を供給しながら
管吸引パッド４を引き上げると、ＢＧＡパッケージ１０
をプリント回路基板２０から取りはずすことができる
（図２（ロ））。When all the solder balls B, B, B ... Are melted and the tube suction pad 4 is pulled up while supplying a negative pressure to the suction pad 4, the BGA package 10
Can be removed from the printed circuit board 20 (FIG. 2B).
【００１７】なお、必要に応じてはプリント回路基板２
０の裏面に補助的な加熱手段を設けて、回路部品２１、
２２を固定している半田が溶融しない程度に加熱するよ
うにしてもよい。If necessary, the printed circuit board 2
By providing an auxiliary heating means on the back surface of
You may make it heat to the extent that the solder fixing 22 is not melted.
【００１８】このようにしてＢＧＡパッケージ１０り除
く。In this way, the BGA package 10 is removed.
【００１９】新しく実装すべきＢＧＡパッケージ２１’
の半田ボールＢの直径よりも若干薄いスペーサ２５を、
ＢＧＡパッケージ１０の２片に対向するようにプリント
回路基板２０の表面に搭載し、新しく実装すべきＢＧＡ
パッケージ２１を吸着パッド４に吸引させて、プリント
回路基板２０のパターンに合わせて位置決めする。BGA package 21 'to be newly mounted
Spacer 25, which is slightly thinner than the diameter of the solder ball B of
BGA to be newly mounted by being mounted on the surface of the printed circuit board 20 so as to face two pieces of the BGA package 10.
The package 21 is sucked by the suction pad 4 and positioned according to the pattern of the printed circuit board 20.
【００２０】この状態では、半田ボールＢ、Ｂ、Ｂ‥‥
が溶融していないから、ＢＧＡパッケージ２０の裏面
は、スペーサ２５、２５に接触しておらず、したがって
半田ボールＢ、Ｂ、Ｂ‥‥は、プリント回路基板２０の
パターンに接触する（図３（イ））。In this state, the solder balls B, B, B ...
.. are not melted, the back surface of the BGA package 20 is not in contact with the spacers 25, 25, and therefore the solder balls B, B, B ... Contact the pattern of the printed circuit board 20 (see FIG. I)).
【００２１】この状態で、熱風を供給すると、溶融時と
同様にＢＧＡパッケージ２０’を伝導した熱が半田ボー
ルＢ、Ｂ、Ｂ‥‥を溶融させる。この状態においても吸
引パッド４により所定の位置を保持されているため、Ｂ
ＧＡパッケージ２０’は、自重のほかに位置決め手段で
ある吸引パッド４からの力を受けることになる。When hot air is supplied in this state, the heat conducted through the BGA package 20 'melts the solder balls B, B, B ... Even in this state, since the predetermined position is held by the suction pad 4,
In addition to its own weight, the GA package 20 'receives a force from the suction pad 4 which is a positioning means.
【００２２】半田ボールＢ、Ｂ、Ｂ‥‥の溶融が進ん
で、半田ボールＢ、Ｂ、Ｂ‥‥が上部からの圧力に耐え
られなくなると、この圧力により押し潰されるが、一定
の段階まで変形した時点で、ＢＧＡパッケージ１０’の
裏面がスペーサ２５、２５に接触するため、スペーサ２
５、２５の厚み以下に変形するのが防止され、隣接の半
田ボールと接触するまでは変形せず、最適な状態でプリ
ント回路基板２０に固定される（図３（ロ））。When the solder balls B, B, B ... Are melted and the solder balls B, B, B ..... cannot withstand the pressure from above, they are crushed by this pressure, but up to a certain stage. At the time of deformation, the back surface of the BGA package 10 'comes into contact with the spacers 25, 25.
It is prevented from being deformed to a thickness of 5 or less than 25, does not deform until it comes into contact with an adjacent solder ball, and is fixed to the printed circuit board 20 in an optimum state (FIG. 3B).
【００２３】なお、この実施例においては、ノズルの設
けられている吸引パッド等の位置決め手段による力を受
けて半田ボールの表面張力を破壊する場合について説明
したが、予め金属製のヒートシンクが取り付けられて自
重が極めて大きなＢＧＡパッケージに適用しても同様の
作用を奏することは明らかである。In this embodiment, the case where the surface tension of the solder ball is destroyed by receiving the force of the positioning means such as the suction pad provided with the nozzle has been described. However, a metal heat sink is attached in advance. It is obvious that the same effect can be obtained even when applied to a BGA package having an extremely large self-weight.
【００２４】[0024]
【発明の効果】以上、説明したように本発明において
は、内面が、ＢＧＡパッケージの外周面に一致する開口
を備え、開口に挿入されたＢＧＡパッケージの表面より
も上部に、通孔を有するノズルをプリント回路基板のＢ
ＧＡパッケージに装着する工程と、ノズルにＢＧＡパッ
ケージの半田ボールを溶融させるに足る温度の熱風を供
給する工程と、半田ボールが溶融した段階でＢＧＡパッ
ケージをプリント回路基板から取り外す工程とを備える
ことにより、ＢＧＡパッケージの表面からのみ半田ボー
ルに熱を供給するようにしたので、ＢＧＡパッケージの
近傍に実装されている回路部品の無用な加熱を防止し
て、対象とするＢＧＡパッケージだけをプリント回路基
板から確実に取り外すことができる。As described above, in the present invention, a nozzle having an opening whose inner surface corresponds to the outer peripheral surface of the BGA package and having a through hole above the surface of the BGA package inserted into the opening. Printed circuit board B
By including a step of mounting on the GA package, a step of supplying the nozzle with hot air at a temperature sufficient to melt the solder balls of the BGA package, and a step of removing the BGA package from the printed circuit board when the solder balls melt. Since the heat is supplied to the solder balls only from the surface of the BGA package, unnecessary heating of the circuit components mounted in the vicinity of the BGA package is prevented, and only the target BGA package is removed from the printed circuit board. Can be securely removed.
【図１】本発明のプリント回路基板からのＢＧＡパッケ
ージを取り外し時、及び実装時の状態でノズルの一実施
例を示す図である。FIG. 1 is a diagram showing an embodiment of a nozzle when a BGA package is removed from a printed circuit board according to the present invention and when it is mounted.
【図２】図（イ）、（ロ）は、それぞれ本発明のＢＧＡ
パッケージの取り外し方法を示す図である。2A and 2B are BGA of the present invention, respectively.
It is a figure which shows the removal method of a package.
【図３】図（イ）、（ロ）は、それぞれ本発明のＢＧＡ
パッケージの実装方法の一実施例を示す図である。3A and 3B are BGA of the present invention, respectively.
It is a figure which shows one Example of the mounting method of a package.
【図４】ＢＧＡパッケージの一例を示す断面図である。FIG. 4 is a sectional view showing an example of a BGA package.
【図５】ＢＧＡパッケージの裏面構造を示す斜視図であ
る。FIG. 5 is a perspective view showing a back surface structure of a BGA package.
【図６】プリント回路基板に取り付けられた状態を示す
図である。FIG. 6 is a view showing a state where the printed circuit board is attached.
１ ノズル本体 ２ 取付口 ４ 吸引パッド ６ ノズル開口 ７、７ 通孔 ８ 遮蔽部材 １０ ＢＧＡパッケージ ２０ プリント回路基板 ２１、２２ 回路部品 Ｂ、Ｂ 半田ボール 1 Nozzle Main Body 2 Mounting Port 4 Suction Pad 6 Nozzle Opening 7, 7 Through Hole 8 Shielding Member 10 BGA Package 20 Printed Circuit Board 21, 22 Circuit Parts B, B Solder Ball
Claims (8)
致する開口を備え、前記開口に挿入された前記ＢＧＡパ
ッケージの表面よりも上部に、通孔を有するノズルをプ
リント回路基板のＢＧＡパッケージに装着する工程と、 前記ノズルに前記ＢＧＡパッケージの半田ボールを溶融
させるに足る温度の熱風を供給する工程と、 前記半田ボールが溶融した段階でＢＧＡパッケージを前
記プリント回路基板から取り外す工程とからなるプリン
ト回路基板からのＢＧＡパッケージの取り外し方法。1. A BGA package of a printed circuit board, wherein a nozzle having a through hole is provided on an inner surface of the BGA package, the nozzle having an opening corresponding to an outer peripheral surface of the BGA package, the nozzle having a through hole above the surface of the BGA package inserted into the opening. And a step of supplying hot air having a temperature sufficient to melt the solder balls of the BGA package to the nozzle, and a step of removing the BGA package from the printed circuit board when the solder balls are melted. How to remove the BGA package from the board.
する領域のプリント回路基板を、周囲の回路部品の半田
を溶融させない程度に加熱する請求項１のプリント回路
基板からのＢＧＡパッケージの取り外し方法。2. The method for removing a BGA package from a printed circuit board according to claim 1, wherein at least a printed circuit board in a region where the BGA package is mounted is heated to such an extent that solder of surrounding circuit components is not melted.
りも薄く、かつ前記ＢＧＡパッケージをプリント回路基
板に最適に接続されたときの前記半田ボールのサイズよ
りも厚い耐熱性を備えたスペーサを、少なくとも前記Ｂ
ＧＡパッケージの対向する２辺に対向するように前記回
路基板の表面に配置する工程と、 前記ＢＧＡパッケージを前記プリント回路基板に位置決
めする工程と、 前記ＢＧＡパッケージを少なくとも前記半田ボールが溶
融する温度まで加熱する工程とからなるＢＧＡパッケー
ジの実装方法。3. A spacer having heat resistance that is thinner than the diameter of the solder balls of the BGA package and thicker than the size of the solder balls when the BGA package is optimally connected to a printed circuit board. B
Arranging the BGA package on the surface of the circuit board so as to face two opposite sides of the GA package, positioning the BGA package on the printed circuit board, and at least up to a temperature at which the solder balls melt. A method of mounting a BGA package, which comprises a heating step.
る内周面を有する開口を備えたノズルを使用して前記Ｂ
ＧＡパッケージを加熱する請求項３のＢＧＡパッケージ
の実装方法。4. A nozzle having an opening having an inner peripheral surface corresponding to an outer peripheral surface of the BGA package, wherein the B
The method for mounting a BGA package according to claim 3, wherein the GA package is heated.
する領域のプリント回路基板を、周囲の回路部品の半田
を溶融させない程度に加熱する請求項３のＢＧＡパッケ
ージの実装方法。5. The method for mounting a BGA package according to claim 3, wherein at least the printed circuit board in a region where the BGA package is mounted is heated to such an extent that the solder of surrounding circuit components is not melted.
致する内周面を有する開口を備え、前記開口に挿入され
た前記ＢＧＡパッケージの表面よりも上部に、通孔が穿
設され、かつ前記通孔から吐出される流体を前記プリン
ト回路基板よりも上部に拡散させる遮蔽手段を有するノ
ズル。6. An inner surface is provided with an opening having an inner peripheral surface coinciding with an outer peripheral surface of the BGA package, and a through hole is formed above the surface of the BGA package inserted into the opening, and A nozzle having a shielding means for diffusing the fluid discharged from the through hole above the printed circuit board.
に設けられている請求項６のノズル。7. The nozzle according to claim 6, wherein the through holes are provided on at least wall surfaces facing each other.
ＢＧＡパッケージを吸着するとともに、上下動可能なＢ
ＧＡパッケージ固定手段が設けられている請求項６のノ
ズル。8. A BGA package that can be vertically moved while being attracted to the tip of the nozzle by negative pressure inside the nozzle.
The nozzle according to claim 6, wherein a GA package fixing means is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6199113A JPH0846351A (en) | 1994-08-01 | 1994-08-01 | Mounting and demounting of bga package from printed circuit board, and nozzle used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6199113A JPH0846351A (en) | 1994-08-01 | 1994-08-01 | Mounting and demounting of bga package from printed circuit board, and nozzle used therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0846351A true JPH0846351A (en) | 1996-02-16 |
Family
ID=16402352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6199113A Withdrawn JPH0846351A (en) | 1994-08-01 | 1994-08-01 | Mounting and demounting of bga package from printed circuit board, and nozzle used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0846351A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303546A (en) * | 1997-04-24 | 1998-11-13 | Marcom:Kk | Device for heating and fusing welding member for connecting electronic component |
| US6062460A (en) * | 1996-11-27 | 2000-05-16 | Sharp Kabushiki Kaisha | Apparatus for producing an electronic circuit |
| KR100811117B1 (en) * | 2006-02-28 | 2008-03-06 | 방상돈 | Electronic circuit board repair device |
| US8434670B2 (en) | 2008-06-26 | 2013-05-07 | Fujitsu Limited | Repair apparatus and repair method |
| US10520219B2 (en) | 2016-05-18 | 2019-12-31 | Hakko Corporation | Hot air nozzle and its production method |
| CN114260688A (en) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | Vacuum elbow box |
-
1994
- 1994-08-01 JP JP6199113A patent/JPH0846351A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6062460A (en) * | 1996-11-27 | 2000-05-16 | Sharp Kabushiki Kaisha | Apparatus for producing an electronic circuit |
| JPH10303546A (en) * | 1997-04-24 | 1998-11-13 | Marcom:Kk | Device for heating and fusing welding member for connecting electronic component |
| KR100811117B1 (en) * | 2006-02-28 | 2008-03-06 | 방상돈 | Electronic circuit board repair device |
| US8434670B2 (en) | 2008-06-26 | 2013-05-07 | Fujitsu Limited | Repair apparatus and repair method |
| US10520219B2 (en) | 2016-05-18 | 2019-12-31 | Hakko Corporation | Hot air nozzle and its production method |
| CN114260688A (en) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | Vacuum elbow box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20011002 |