JP2007258285A - Removal device of electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a removal device of an electronic part which is superior in working efficiency because an electronic part can be easily removed alone, melting of a solder welded part of the electronic part and separation of the electronic part from a printed board can be simultaneously conducted through single operation, and there is no possibility of melting of the solder welded part in electronic parts located in the periphery. <P>SOLUTION: The removal device 1 of an electronic part is integrally provided with a melting means 13 for melting a solder welded part 11 of an electronic part 3 mounted to a printed board 9, and a separating means 15 to separate from the printed board 9 the electronic part 3 of which the solder welded part 11 is melted by the melting means 13. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component removing apparatus that can easily and reliably remove an electronic component mounted on a printed circuit board without affecting other electronic components mounted on the periphery of the electronic component. .

When an electronic component incorrectly mounted on an electronic component mounting line is removed from the printed board and replaced with a regular electronic component, or an electronic component damaged at an electronic device repair or support center is removed from the printed board. When replacing with a new electronic component, the electronic component is removed in the following manner.
Most basically, hold the electronic component to be removed directly with one hand, or hold it with tweezers, etc., and solder with another hand using a hot air generator such as a soldering iron, heater or dryer The aspect of melting the part was taken.

However, in such an embodiment, it is difficult for one person to remove the electronic component alone, and a corresponding skill is required. In addition, because there are small electronic parts or electronic parts that are difficult to grasp with tweezers, the worker may not be able to hold the electronic parts by hand. In some cases, the solder welded part of the solder melted together.
Further, when a dryer or the like is used as the melting means, the hot air outlet is large, so that it is extremely difficult to remove only the electronic component from a printed circuit board having a high mounting density.

  Recently, dedicated jigs and devices for removing electronic components have been developed as shown in Patent Documents 1 and 2 below. Among them, in Patent Document 1, an IC removal jig and an IC removal device using hot air as a melting means for melting a solder welded portion of an electronic component and using a suction cup as a means for separating the electronic component from a printed circuit board have been developed. .

However, in Patent Document 1, the heat gun used as the melting means and the suction cup used as the separating means are provided separately and used in different operations. Accordingly, it is difficult to remove the electronic component by one person as in the above-described basic mode, and appropriate skill is required. Even if a heat gun is used, the solder welded part of other peripheral electronic components may be melted together due to camera shake or the like.
Further, Patent Document 2 discloses an IC removal device using a rod-like spring member as a separating means. However, the IC removal device has only a configuration as a separating means, and is used in combination with a separate melting means that is used separately, and has the same problems as in Patent Document 1.

JP-A-6-152124

JP-A-8-330724

  When the problems to be solved by the present invention are arranged based on the above-mentioned background art and the problems of the background art, the removal work of electronic components can be performed easily and reliably by one person, and the surroundings caused by camera shake etc. The object is to provide a device for removing electronic components that has little environmental impact.

  The present invention has been made on the basis of such points, and the object of the present invention is that anyone can easily perform the removal work of the electronic component alone, and the solder welding portion of the electronic component can be easily operated by a single operation. An object of the present invention is to provide an electronic component removing apparatus that can perform melting and separation of an electronic component from a printed circuit board at the same time and has high work efficiency without fear of melting a solder welded portion in an electronic component located in the periphery.

In order to achieve the above object, an electronic component removing apparatus according to claim 1 of the present invention comprises a melting means for melting a solder weld portion of an electronic component mounted on a printed circuit board, and the melting means provided integrally with the melting means. Separating means for separating the electronic component whose solder welded portion has been melted by the means from the printed circuit board.
According to a second aspect of the present invention, there is provided the electronic component removing apparatus according to the first aspect, wherein the melting means includes a blowout port provided so as to face the solder welded portion. On the other hand, the separating means includes a suction port connected to an air suction device, and the electronic component is separated from the printed circuit board by adsorbing the electronic component to the suction port. It is comprised so that it may be comprised.
According to a third aspect of the present invention, there is provided the electronic component removing apparatus according to the second aspect, wherein after the hot air blown from the blowing port acts on the solder welding portion, the solder welding portion The electronic component is melted from the printed circuit board, and is attached to an angle at which air is circulated so that the electronic component can be sucked into the suction port and used as new hot air again.
According to a fourth aspect of the present invention, there is provided the electronic component removing apparatus according to the first aspect, wherein the melting means includes a blowout port provided so as to face the solder welded portion. On the other hand, the separating means is constituted by an adhesive sheet disposed above the electronic component.
According to a fifth aspect of the present invention, there is provided the electronic component removing apparatus according to the first aspect, wherein the melting means includes a blowing port provided so as to face the solder welded portion. On the other hand, the separating means is constituted by a suction disk disposed above the electronic component.
An electronic component removing apparatus according to claim 6 is the electronic component removing apparatus according to claim 1, wherein the melting means is constituted by a heater provided so as to face the solder welded portion. The separating means is constituted by an adhesive material having a small thermal conductivity arranged above the electronic component.

Therefore, according to the electronic component removing apparatus of the present invention, the melting means for melting the solder welded portion of the electronic component mounted on the printed circuit board, and the electronic component having the solder welded portion melted by the melting means from the printed circuit board. Since the separation means for separating is integrally provided, it is not necessary to adjust the positions of the melting means and the separation means, and it is possible to easily and reliably perform the removal operation of the electronic component by one person. Further, since the electronic component is not held in an unstable holding posture, camera shake or the like is unlikely to occur, and unnecessary melting of the solder weld portion in other peripheral electronic components caused by camera shake or the like is prevented.
The melting means includes a blowout port provided so as to face the solder welded portion, and is configured by using hot air blown from the blowout port, while the separation means is connected to an air suction device. When the electronic component is separated from the printed circuit board by adsorbing the electronic component to the suction port, the hot air blown from the blowout port is soldered to the electronic component. Since it acts only on the portion and does not affect the surrounding electronic components, it is possible to reliably remove only the electronic components. Further, by sucking air from the suction port, it is possible to prevent the hot air from scattering to the periphery and to minimize the influence on the surrounding environment.
In addition, after the hot air blown out from the blowout port acts on the solder welded portion, the electronic component in which the solder welded portion is melted is lifted from the printed circuit board, and is further sucked into the suction port to be renewed. When the air is circulated at an angle so that it can be used as hot air, an air circulation path is formed between the air outlet and the suction port, so that efficient hot air can be blown out and collected. it can. In addition, the electronic component can be lifted by the action of the hot air so that the effect of facilitating separation from the printed circuit board can be obtained.
The melting means includes a blowout port provided so as to face the solder welding portion, and is configured by using hot air blown from the blowout port, while the separation means is disposed above the electronic component. In the case where it is constituted by an adhesive sheet to be arranged, the separating means can be constituted inexpensively and easily, and when the adhesive force is lowered, it can be used for many years by being replaced with a new adhesive sheet.
The melting means includes a blowout port provided so as to face the solder welding portion, and is configured by using hot air blown from the blowout port, while the separation means is disposed above the electronic component. In the case where the suction plate is arranged, the electronic component is securely held both when the solder welded portion is melted and when the electronic component is separated from the printed circuit board, and the configuration of the separating means is simple and inexpensive. become.
Further, the melting means is constituted by a heater provided so as to face the solder welded portion, while the separating means is constituted by an adhesive material having a small thermal conductivity disposed above the electronic component. Therefore, it is possible to melt only the solder welded portion to be melted locally in a state where the influence on the periphery is extremely small. Further, heat conduction from the heater to the electronic component can be prevented, and damage to the electronic component can be prevented. In addition, since the adhesive material can be freely deformed in accordance with the shape of the electronic component, even an electronic component having a complicated shape and difficult to grasp can be securely held.

Hereinafter, the first embodiment 101 shown in FIGS. 1 and 2, the second embodiment 201 shown in FIG. 3, the third embodiment 301 shown in FIG. 4, and the fourth embodiment shown in FIG. The configuration and operation mode of the electronic component removing apparatus 1 of the present invention will be specifically described by taking the embodiment 401 as an example.
The electronic component 3 to which the present invention is applied is an IC (integrated circuit) package or a QFP (Quad Flat Package) which is a package form for high-density surface mounting in which leads 7 are drawn from four sides of the IC package 5. Is given as an example. Such an electronic component 3 is attached by soldering the lead 7 drawn out from the IC package 5 on the surface side of the printed circuit board 9. The soldered portion is defined and used as a solder welded portion 11 in this specification.

(1) First embodiment (see FIGS. 1 and 2)
The electronic component removing apparatus 1 of the present invention includes a melting means 13 for melting the solder welded portion 11 of the electronic component 3 mounted on the printed circuit board 9, and an electronic component in which the solder welded portion 11 is melted by the melting means 13. 3 is integrally provided with a separating means 15 for separating 3 from the printed circuit board 9.
In the present embodiment 101, the melting means 13 includes a blowout port 17 provided so as to face the solder welded portion 11, and is configured by using hot air 19 blown out from the blowout port 17.

Specifically, the melting means 13 includes a hot air generator (not shown), the outlet 17, and an air guide 21 that guides the hot air 19 supplied from the hot air generator 17 to the outlet 17. .
The outlet 17 is attached at an angle at which the air A circulation path is formed by bending the tip of the hot air 19 somewhat toward the inner electronic component 3 side.
The air A circulation path referred to here means that the hot air 19 blown from the blowout port 17 reaches the solder welded portion 11 and melts the solder welded portion 11, and then the solder welded portion 11 is melted. It means a series of paths in which the electronic component 3 is lifted from the printed circuit board 9 and further sucked into a suction port 23 described later and led again to the blowout port 17 as new hot air 19.

On the other hand, the separating means 15 is means for holding and sucking the electronic component 3 and pulling it away from the printed circuit board 9. Specifically, the separating means 15 is connected to the air suction device via an air suction device (not shown) and a suction path 25. It is configured by including a suction port 23 and a holder portion 27 that holds the separated electronic component 3.
The holder part 27 is located above the electronic component 3, and the suction port 23 is provided in the center of the holder part 27. In a state before the electronic component 3 is removed from the printed circuit board 9, a constant gap 29 is formed between the suction port 23 formed on the upper surface of the holder portion 27 and the electronic component 3 as shown in FIG. ing.
The gap 29 is configured to prevent an unnecessary load from being applied to the electronic component 3 during the detaching operation. The gap 29 maintains a non-contact state between the suction port 23 and the electronic component 3 and has a certain distance that can be sucked. It is provided for the purpose of keeping.

When the electronic component removing apparatus 1 according to the present embodiment 101 configured as described above is used, the electronic component 3 is removed from the electronic component 3 to be removed from the printed board 9 as shown in the figure. The removal device 1 is set. Next, the hot air generator is activated to generate hot air 19, and the hot air 19 is blown out from the outlet 17 through the air guide 21 with a predetermined air volume. The hot air 19 blown out from the blowout port 17 reaches the solder welded portion 11, melts the solder welded portion 11, and releases the joined state between the printed circuit board 9 and the electronic component 3.
A part of the hot air 19 enters the lower surface of the IC package 5 of the electronic component 3, and the electronic component 3 released from the bonded state is lifted above the printed circuit board 9.

  At the same time, the electronic component 3 is drawn to the suction port 23 by an air suction device (not shown). Then, the center of the upper surface of the electronic component 3 is attracted to the suction port 23, and the electronic component 3 is removed from the printed circuit board 9 with the upper surface and the upper portion of the side surface held by the holder portion 27. A part of the hot air 19 also flows into and is discharged from the suction port 23, is heated again by the hot air generator, and is blown out again from the air outlet 17 as hot air 19 having a predetermined temperature.

(2) Second embodiment (see FIG. 3)
In the present embodiment 201, the configuration of the melting means 13 is the same as that of the first embodiment 101. Here, the description will focus on the separating means 15 having a different configuration from that of the first embodiment 101.
That is, in the present embodiment 201, as shown in the figure, the separating means 15 is constituted only by the adhesive sheet 31 disposed above the electronic component 3 in the set state. In this respect, the first embodiment 101 described above. And the configuration is different.

  By applying the adhesive sheet 31 having such a configuration, the separating means 15 can be easily configured at a low cost, and the adhesive sheet 31 can be periodically replaced to withstand long-term use. Become. Further, by using the adhesive sheet 31 having air permeability, the circulation path of the air A is maintained as it is.

(3) Third embodiment (see FIG. 4)
The basic configuration of the present embodiment 301 is the same as that of the first embodiment 101 and the melting means 13. Here, a description will be given focusing on a partial configuration of the melting unit 13 and the separation unit 15 which are different from the configuration of the first embodiment 101.
First, the melting means 13 does not need to form a circulation path of the air A in relation to the configuration of the separating means 15, so that the front end portion of the air guide 21 is not bent inward as shown in the figure, and the outlet 17 Is different from the first embodiment 101 in that it is provided so as to face the solder weld 11 at a right angle from above.
The front end portion of the air guide 21 may be bent inward as in the first embodiment 101, and in this case, the air volume of air A supplied to the lower surface of the electronic component 3 is configured. Therefore, the lifting of the electronic component 3 can be promoted.

On the other hand, the separating means 15 is constituted by a suction plate 32 disposed above the electronic component 3 in the set state. As an example, the suction disk 32 is made of a soft rubber-like elastic body having a shape like a bowl, and exerts an adsorption force when pressed against the upper surface of the electronic component 3.
By using such a separating means 15, the electronic component 3 is reliably held both when the solder welded portion 11 is melted and when the electronic component 3 is separated from the printed circuit board 9, and the structure of the separating means 15 is simple. And it becomes cheaper.

(4) Fourth embodiment (see FIG. 5)
In the present embodiment 401, the melting means 13 includes a heater 33 provided so as to face the solder welded portion 11, a heat generating circuit 35 for generating heat from the heater 33, and the heater 33 at the tip, and the heat generating circuit 35. And a support member 37 provided therein.
On the other hand, the separating means 15 is constituted by an adhesive material 39 having a small thermal conductivity disposed above the electronic component 3. As the adhesive material 39, a viscoelastic body such as silicon gel can be used as an example.

When the electronic component removing apparatus 1 according to the present embodiment 401 having such a configuration is used, the electronic component removing apparatus is removed from the electronic component 3 to be removed from the printed board 9 as shown in the figure. Set 1 Next, the heating circuit 35 is operated to heat the heater 33 to a predetermined temperature.
The solder welded portion 11 is melted by the radiant heat of the heater 33, and the electronic component 3 is released from the printed board 9 because the electronic component 3 is released from the joined state with the printed board 9.

  At this time, since the adhesive member 39 having a small thermal conductivity exists between the support member 37 and the electronic component 3, the radiant heat from the heater 33 is transmitted to the electronic component 3 as it is, and the electronic component. 3 is not damaged. In addition, since the adhesive material 39 can be freely deformed in accordance with the shape of the electronic component 3, even when the electronic component 3 is complicated and difficult to grasp, the printed circuit board 9 of the electronic component 3 and the solder welded portion 11 are melted. The electronic component 3 can be reliably held by the adhesive force at both times of separation from the device.

  The present invention is not limited to the embodiment described above. For example, in the case of the fourth embodiment 401, a suction device for adhering an adsorbent to adsorb molten solder on the mounting surface of the heater 33 or forcibly sucking molten solder. It is possible to provide a suction port connected to the. Further, instead of the adhesive material 39 used in the fourth embodiment 401, it is also possible to apply a packing having a small thermal conductivity formed of a soft synthetic resin or synthetic rubber.

  The present invention can be used in a mounting line for electronic components, repair of electronic equipment, a support center, etc., and in particular affects other electronic components mounted on the periphery of electronic components mounted on a printed circuit board. There is no possibility to use it when you want to remove it easily and surely.

It is a figure which shows the 1st Embodiment of this invention and is a perspective view which shows the use condition of the removal apparatus of an electronic component. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the 1st Embodiment of this invention, and is explanatory drawing which shows typically the structure and action | operation aspect of the removal apparatus of an electronic component. It is a figure which shows the 2nd Embodiment of this invention, and is explanatory drawing which shows typically the structure and action | operation aspect of the removal apparatus of an electronic component. It is a figure which shows the 3rd Embodiment of this invention, and is explanatory drawing which shows typically a structure and an operation | movement aspect of the removal apparatus of an electronic component. It is a figure which shows the 4th Embodiment of this invention, and is explanatory drawing which shows typically the structure and action | operation aspect of the removal apparatus of an electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component removal apparatus 3 Electronic component 5 IC package 7 Lead 9 Printed circuit board 11 Solder welding part 13 Melting means 15 Separation means 17 Air outlet 19 Hot air 21 Air guide 23 Suction port 25 Suction path 27 Holder part 29 Gap 31 Adhesive sheet 32 Suction board 33 Heater 35 Heat generation circuit 37 Support member 39 Adhesive material 101 First embodiment 201 Second embodiment 301 Third embodiment 401 Fourth embodiment A Air

Claims (6)

A melting means for melting a solder weld portion of an electronic component mounted on a printed circuit board;
Separating means for separating the electronic component integrally provided in the melting means and having the solder welded portion melted by the melting means from the printed circuit board;
A device for removing an electronic component, comprising: The electronic component removing apparatus according to claim 1,
The melting means includes a blowout port provided so as to face the solder welding portion, and is configured by using hot air blown from the blowout port,
On the other hand, the separating means includes a suction port connected to an air suction device, and the electronic component is configured to separate the electronic component from the printed circuit board by adsorbing the electronic component to the suction port. Removal device. The apparatus for removing an electronic component according to claim 2,
After the hot air blown from the blowout port acts on the solder welded portion, the blowout port floats the electronic component in which the solder welded portion has melted from the printed circuit board, and is further sucked into the suction port to form new hot air again. An electronic component removing apparatus, wherein the apparatus is attached at an angle for circulating air so that it can be used. The electronic component removing apparatus according to claim 1,
The melting means includes a blowout port provided so as to face the solder welding portion, and is configured by using hot air blown from the blowout port,
On the other hand, the separating means is constituted by an adhesive sheet disposed above the electronic component. The electronic component removing apparatus according to claim 1,
The melting means includes a blowout port provided so as to face the solder welding portion, and is configured by using hot air blown from the blowout port,
On the other hand, the separation means is constituted by a suction disk disposed above the electronic component. The electronic component removing apparatus according to claim 1,
The melting means is constituted by a heater provided so as to face the solder welding portion,
On the other hand, the separating means is constituted by an adhesive material having a small thermal conductivity disposed above the electronic component.

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