JP3015080U - Package for electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] An electronic component with excellent moisture absorption as well as a conductor plating layer is formed on the sidewalls to enhance the adhesion strength to prevent interfacial peeling and to be integrated with the circuit around the cavity. Provide the package for. In a package for an electronic component in which a conductor plating layer is formed on a side wall, the conductor plating layer is adhered and formed integrally with a circuit formed around the cavity.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component package that houses electronic components such as semiconductor chips, and more particularly to an electronic component package that is connected to a power supply layer, a ground layer, etc. of the package through a conductor plating layer formed on a sidewall.

[0002]

[Prior art]

 Usually, in order to connect a terminal to a power supply layer, a ground layer, etc., a through hole is provided at a required position, and the terminal and the through hole are connected by a circuit. Connect. On the other hand, a package for an electronic component, which is connected to a power layer, a ground layer, etc. of the package through a conductor plating layer formed on the sidewall, generally has a bonding terminal 80 and a power source as shown in FIGS. 11 and 12. The inner layer circuit 20 such as a layer or an earth layer is connected by a conductor plating layer 65 such as copper plating formed on the sidewall of the cavity. According to this method, it is possible to omit the circuit routing and the through hole for connecting the terminal and the power supply layer or the ground layer, etc. through the through hole. There are advantages such as being able to connect.

[0003]

[Problems to be solved by the device]

 However, in the above package, the bonding terminal 80 and the conductor plating layer 65 formed on the side wall are inferior in adhesiveness because they are connected only by the cross section of the bonding terminal 80, and the base material of the substrate of the package body and the conductor plating layer. Due to the difference in the coefficient of thermal expansion of 65, there is a risk of the interface peeling, so there is a problem with the reliability of the connection. In addition, the end surface of the substrate of the package body easily absorbs moisture, which further increases the risk of interfacial peeling between the end surface on the cavity side and the conductor plating layer 65, and there is also a problem in reliability against moisture absorption. Will also be. The present invention has been made in view of the above problems, and enhances the adhesion of the conductor plating layer formed on the sidewall to prevent the interface between the package body and the substrate to be peeled off. It is an object of the present invention to provide a package for electronic parts (hereinafter referred to as a package) that can properly prevent moisture absorption from the side end surface.

[0004]

[Means for Solving the Problems]

 In order to achieve the above object, the package of the present invention has the following configuration. In other words, the base material on which the circuit is formed in advance around the cavity is used as the inner layer, and this is laminated to form the substrate of the package body, and the inner layer is carved out from the side of the surface that forms the cavity and integrated with the circuit around the cavity. It is characterized in that a conductor plating layer is applied to the side wall. In addition, it is characterized in that a required area for forming a cavity is pre-drilled, a conductor plating layer is applied to a side wall and then a circuit is formed, and this base material is used as an inner layer and bonded to another base material. To do. The conductor plating layer can be formed by electroless plating or electrolytic plating. Further, the conductor plating layer may be subjected to protective plating such as nickel plating and gold plating.

[0005]

[Action]

 Since the conductor plating layer formed on the sidewall is formed integrally with the circuit around the cavity of the substrate, it realizes strong adhesion and prevents interfacial peeling. Further, the conductor plating layer is formed so as to wrap around the cavity-side end surface of the substrate of the package body, so that heat absorption is accurately prevented. In addition, when protective plating is applied to the conductor plating layer, the effect can be further improved.

[0006]

【Example】

 Hereinafter, preferred embodiments of a package and a manufacturing method thereof according to the present invention will be described with reference to the accompanying drawings. For the sake of explanation, only a part is shown in the figure. (Embodiment 1) FIGS. 1 to 5 show a first embodiment of a package manufacturing method according to the present invention. In this example, a base material on which a circuit has been formed in advance around the cavity is used as the inner layer, and this is laminated to form the substrate of the package body.The inner layer is ground from the side of the cavity forming surface, This is an example in which a conductor plating layer is adhered and formed on a sidewall integrally with a circuit. FIG. 1 is a cross-sectional view of a substrate of a package body in which an inner layer circuit such as a bonding terminal at a required location and an inner layer circuit around the cavity are formed in advance as an inner layer and the layers are laminated. Next, the substrate of the package body is subjected to a required punching process and the through-hole plating 50 is performed to form the through-hole. Through-hole plating is performed by electroless copper plating and then electrolytic copper plating. FIG. 2 is a cross-sectional view showing a state in which router processing is performed from the side of the surface on which the cavity is formed, according to the position where the conductor plating layer is formed. At this time, it is important to process the inner layer circuit 20 such as a required power source layer or a ground layer so as to be slightly over. By doing so, the conductor plating layer formed in the subsequent step can be reliably connected to the inner layer circuit 20 such as the power supply layer or the ground layer. FIG. 3 is a cross-sectional view showing a state in which copper plating for forming the conductor plating layer 65 is applied. This copper plating is performed by electroless copper plating and then electrolytic copper plating. At this time, only the electroless copper plating may be thickened and the electrolytic copper plating may be omitted. FIG. 4 is a cross-sectional view in which the required outer layer circuit 35 is formed and then the required inner layer circuit is subjected to shaving. FIG. 5 is a partial plan view thereof. Next, protective plating 90 such as nickel plating and gold plating is applied. Since this protective plating is also applied on the conductor plating layer 65, the adhesion of the conductor plating layer 65 is enhanced and the moisture absorption is improved, which is desirable.

Second Embodiment FIGS. 6 to 10 show a second embodiment of the package manufacturing method according to the present invention. In this example, a window is formed in advance at a required location to form a cavity, a conductor plating layer is deposited on the side wall to form a circuit, and this base material is used as an inner layer and bonded to another base material. Here is an example. First, the base material 15 on which the copper foils 10 are adhered on both sides is subjected to a window opening 40 process at a position where a cavity is to be formed to form sidewalls (FIG. 6). Next, when the inner via 45 is required, the required perforating process is performed and the through hole plating is performed. Through-hole plating forms a plating layer on the inner wall surface of the hole and the copper foil surface, and also forms a conductor plating layer 65 on the sidewall (FIG. 7). Next, the conductor plating layers 65 of the inner vias and the sidewalls are protected with ink or the like, and the surface of the copper foil is ground and flattened. Then, a required circuit to be an inner layer is formed. At this time, it is important to form the circuit 25 around the cavity and integrate the circuit and the conductor plating layer 65 of the sidewall (FIG. 8). Next, similarly, another substrate having a window-opening process or another substrate not having a window-opening process is attached to the substrate, and the cavity 70 is protected by using ink or the like. As the ink and the like, one that will not be removed in the subsequent etching resist removing process is used (FIG. 9). Next, perforation processing is performed and through-hole plating is performed to form a required outer layer circuit. Next, the ink or the like that protected the cavity is removed, and protective plating such as nickel plating or gold plating is applied (FIG. 10).

[0008]

[Effect of device]

 In the package according to the present invention, as described above, the conductor plating layer is formed on the side wall integrally with the circuit of the board, so that strong adhesion can be achieved and interface peeling can be prevented, and the board of the package body can be prevented. Since it is formed so as to enclose the end surface of the cavity side, it can be provided as a product that accurately prevents moisture absorption. Further, according to the method of manufacturing a package according to the present invention, the inner layer of the substrates of the laminated package bodies is subjected to the shaving process, so that high reliability of the multilayer substrate is realized. Further, since the conductor plating layer is formed on the sidewall integrally with the circuit of the substrate, the adhesion strength is excellent and the reliability against moisture absorption is remarkably effective. Further, when the conductor plating layer is subjected to protective plating such as nickel plating and gold plating, the effect can be further improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a substrate of a package body in which layers are stacked.

FIG. 2 is a cross-sectional view showing a state where a router process for forming a conductor plating layer is performed.

FIG. 3 is a cross-sectional view showing a state in which copper plating for a conductor plating layer is applied.

FIG. 4 is a cross-sectional view of a state in which a circuit is formed on the outer layer and the inner layer is carved out.

5 is a partial plan view of FIG.

FIG. 6 is a cross-sectional view showing a state where a side wall is formed by performing window opening processing.

FIG. 7 is a cross-sectional view showing a state where a conductor plating layer is formed on the sidewall.

FIG. 8 is a cross-sectional view showing a state in which a circuit around the cavity is formed and integrated with a conductor plating layer of a sidewall.

FIG. 9 is a cross-sectional view of a state in which a cavity portion is protected by ink or the like.

FIG. 10 is a cross-sectional view of a state in which ink or the like that has protected the cavity is removed.

FIG. 11 is a sectional view of a conventional package.

FIG. 12 is a partial plan view of FIG.

[Explanation of symbols]

 10 Copper Foil 15 Base Material 20 Inner Layer Circuit such as Power Supply Layer or Ground Layer 25 Circuit around Cavity 30 Other Inner Layer Circuit 35 Outer Layer Circuit 40 Opening Window 45 Inner Via 50 Through Hole Plating 60 Conductor Plating Layer Forming Drilling 65 Conductor Plating layer 70 Cavity protection 80 Bonding terminals 85 Other bonding terminals 90 Protection plating

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[Procedure amendment]

[Submission date] January 10, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 2

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 3

[Correction method] Change

[Correction content]

Claims (3)

[Scope of utility model registration request] 1. In a package for electronic parts, which is connected to a power supply layer, an earth layer, etc. of a package through a conductor plating layer formed on a sidewall, the conductor plating layer covers the sidewall integrally with a circuit formed around the cavity. A package for electronic parts, which is characterized by being formed. 2. A base material on which a circuit has been formed in advance around the cavity is used as an inner layer, and the base is laminated to form a substrate of a package body. The method of manufacturing an electronic component package according to claim 1, wherein a conductor plating layer is applied to the sidewall integrally with the side wall. 3. A base material is formed by forming a circuit around the cavity by integrally forming a cavity with a conductor plating layer by subjecting a side wall to a conductor plating layer by subjecting a window to a desired portion where a cavity is to be formed. The method for manufacturing an electronic component package according to claim 1, wherein the substrate is an inner layer and the substrate is attached to another substrate.