JP3000313B2 - Superconducting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a superconducting device having a superconducting circuit chip such as a Josephson logic circuit, a SQUID, and a voltage standard circuit, and more particularly to a superconducting device in which a superconducting circuit board can be easily attached and detached.

[0002]

2. Description of the Related Art Conventionally, superconducting connection between a superconducting circuit board and a mounting board, such as superconducting connection between a circuit board and a detection coil in SQUID, is performed using a superconducting wire. FIG. 4 is a diagram showing a conventional superconducting device using a superconducting connection, wherein 11 is a superconducting wire, 13 is a superconducting coating, 14
Denotes a wiring pattern, and 15 denotes a superconducting circuit board, on which a superconducting coating 13 is disposed on a wiring pattern 14 to form a superconducting wiring pattern. The wiring pattern 14 is a superconducting film 13
It functions as a buffer layer for plating, and as its material, a resistance material such as copper (Cu) or palladium (Pd) is used, but other high resistance materials can also be used. The material of the superconducting film 13 is, for example, lead (Pb)
-A tin (Sn) plated film is used, but other superconducting materials that can be plated can also be used. Further, the wiring pattern 14 is abolished and the lead (Pb)-
A superconducting film such as an indium (In) -gold (Au) vapor-deposited film wiring may be formed to form a superconducting wiring pattern. For example, a superconducting circuit chip is placed on a superconducting circuit board 15 made of plastic, FRP, glass, or the like, and is superconductively connected to a superconductive wiring pattern. Pb-In, Pb-
The superconducting wire 11 made of Sn or the like is melt-bonded using a soldering iron or the like to perform superconducting connection.

[0003]

In the above-mentioned conventional superconducting device using a superconducting wire, the number of superconducting wires must be connected by the number of the superconducting joining terminals, so that the number of mounting steps is large.
When removing the superconducting circuit board for element replacement, it is necessary to remove the superconducting wires with the same man-hour as the mounting, and there is a problem that the superconducting circuit board cannot be easily attached or detached.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a superconducting circuit chip, a superconducting wiring pattern superconductively connected to the superconducting circuit chip, and an extension of the same pattern. In a superconducting device in which a superconducting circuit board having a superconducting pad is mounted on a mounting substrate having a superconducting wiring pattern and a superconducting pad on the same extension as a superconducting pad which is superconductively connected. ,
A buffer material having superconductivity was arranged at the superconducting connection.

As the cushioning material, for example, a small piece of superconducting material having a small elastic coefficient or a spring material coated with superconductivity is used.

[0006]

In the superconducting device as described above, when mounting the superconducting circuit board, the superconducting connecting portions can be connected at multiple points so that the man-hour can be reduced. By arranging the buffer material, it is possible to prevent connection failure due to deformation of the superconducting circuit board and the mounting board at extremely low temperatures.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial cross-sectional view of a superconducting device showing an embodiment of the present invention, showing a superconducting connection portion. 1 is a buffer material, 3 is a superconducting coating, 4 is a wiring pattern, 5 is a mounting board, and 6 is a superconducting circuit board. A wiring pattern 4 is formed on a mounting substrate 5 and a superconducting circuit board 6, and a superconducting coating 3 is formed on the wiring pattern 4 by plating. The wiring pattern 4 and the superconducting coating 3 form the same pattern. To form a superconducting wiring pattern. As the material of the buffer material 1, for example, a small piece, a wire piece, or a small ball of a superconducting material having a small elastic coefficient such as Pb-In or Pb-Sn, that is, relatively easily deformed is used. The wiring pattern 4 functions as a buffer layer for plating the superconducting coating 3, and the material of the wiring pattern 4 is C
Although a resistance material such as u or Pd is used, another high resistance material can be used. As the material of the superconducting coating 3, for example, a Pb-Sn plating film is used, but other superconducting materials that can be plated can also be used. Further, the wiring pattern 4 can be eliminated to form a superconducting film such as a niobium (Nb) sputtered film wiring or a Pb-In-Au deposited film wiring directly on the substrate to form a superconducting wiring pattern. As a material of the mounting substrate 5 and the superconducting circuit substrate 6, an insulating material such as plastic, FRP, or ceramic is used.

FIG. 2 is a sectional view showing a mounted state of a superconducting device according to an embodiment of the present invention. A glass epoxy substrate was used as the mounting substrate 5 and the superconducting circuit substrate 6, and a Pb-Sn plating film was formed as the superconducting coating 3 on the Cu wiring pattern 4 to form a superconducting wiring pattern. A Pb-In wire piece having a diameter of 0.5 mm was arranged as the buffer material 1 between the four pairs of superconducting pads, and the small screws 7 were mounted so that the buffer material 1 was evenly crushed. Each superconducting connection showed good superconducting connectivity in liquid helium (He). Although the figure shows a structure in which the superconducting circuit board 6 is directly screwed, a structure in which a holding part is disposed on the superconducting circuit board 6 and the holding part is screwed, or the superconducting circuit board 6 is mounted with a spring material There is also a structure for mounting so as to press against the substrate 5.

In the superconducting device as described above, when mounting the superconducting circuit board, the superconducting connecting portion is connected at multiple points, so that the man-hour can be reduced, and the superconducting connecting portion has superconductivity. By arranging the buffer material, it is possible to prevent connection failure due to deformation of the superconducting circuit board and the mounting board at extremely low temperatures. Therefore, the superconducting circuit board can be easily attached and detached, and a superconducting device having a highly reliable superconducting connection can be configured.

FIG. 3 is a partial sectional view of a superconducting device according to a second embodiment of the present invention, showing a superconducting connection portion. 2
Is a spring material, and phosphor bronze or the like is used as the material, but other conductive spring materials can also be used. The difference from the embodiment shown in FIG. 1 is that a superconducting coating 3 is formed on a spring material 2 made of phosphor bronze with a Pb-Sn plating film to be used as a buffer material. The operation and effect of the structure of the superconducting device as described above are not different from the previous embodiment.

[0011]

As described above, according to the present invention, when mounting the superconducting circuit board, the superconducting connecting portions can be connected at multiple points, so that the man-hour can be reduced. By arranging the buffer material having superconductivity, it is possible to prevent connection failure due to deformation of the superconducting circuit board and the mounting board at cryogenic temperatures. Therefore, the superconducting circuit board can be easily attached and detached at the time of maintenance and inspection, element replacement, and the like, and a superconducting device having a highly reliable superconducting connection without connection failure can be configured.

[Brief description of the drawings]

FIG. 1 is a partial sectional view of a superconducting device showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a mounted state of a superconducting device according to an embodiment of the present invention.

FIG. 3 is a partial sectional view of a superconducting device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a superconducting device according to a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 buffer material 2 spring material 3 superconducting coating 4 wiring pattern 5 mounting board 6 superconducting circuit board 7 small screw 11 superconducting wire 13 superconducting coating 14 wiring pattern 15 superconducting circuit board

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Shigeki Odawara 6-31-1, Kameido, Koto-ku, Tokyo Seiko Electronic Industry Co., Ltd. (56) References JP-A-3-12941 (JP, A) JP-A-4-58573 (JP, A) JP-A-5-102538 (JP, A) JP-A-5-251750 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 39 / 02 H01L 39/00 H01L 39/22 H01L 39/24 H01R 4/68

Claims (2)

(57) [Claims] 1. A superconducting circuit chip, a first superconducting wiring pattern superconductingly connected to the superconducting circuit chip, and a first superconducting line extending on the same pattern as the first superconducting wiring pattern. A superconducting circuit board having a conductive pad, a second superconducting wiring pattern, and a mounting board having a second superconducting pad on the same extension as the second superconducting pattern; And a superconducting device mounted in superconducting connection via a second superconducting pad, wherein a buffer material having superconductivity is arranged in the superconducting connection portion, and the superconducting circuit board and the mounting board The buffer between
Superconducting connection by sandwiching the material and pressing with screws
A superconducting device characterized by being connected . 2. A superconducting circuit chip, A first superconducting device superconductively connected to the superconducting circuit chip;
Wiring pattern, On the same pattern extension as the first superconducting wiring pattern
A superconducting circuit board having a first superconducting pad, A second superconducting wiring pattern; A second superconductor which is coextensive with the second superconducting pattern.
On a mounting board having a conductive pad, Via the first and second superconducting pads facing each other
Superconducting device mounted and connected by superconductivity
hand, A buffer material having superconductivity is disposed at the superconducting connection part.
Between the superconducting circuit board and the mounting board.
Superconducting by sandwiching the material and pressing with a spring material
A superconducting device characterized by being connected.