JP2976293B1 - Manufacturing method of wiring board inspection contact pin and wiring board inspection device - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To produce a conductive polymer having high conductivity and capable of forming a pattern by light, to produce a highly conductive and flexible contact pin, and to be used for electrical inspection of a printed wiring board and the like. To provide a wiring board inspection device. SOLUTION: A conductive polymer which performs a polymerization reaction by using pyrrole or ethylenedioxythiophene as a monomer and a naphthalenesulfonic acid anion or a cupric salt of a derivative thereof as an oxidizing agent and bringing them into contact in the presence of an alcohol solvent. It is a manufacturing method. A step of forming a mixture layer 4 made of a photosensitive resin and an oxidizing agent on a support plate 3 having an electrode pad 2; a step of forming a pattern by a photochemical reaction; a step of developing the pattern; a method of manufacturing a contact pin 1 comprising a step of polymerizing a monomer sex polymer, the oxidizing agent is a manufacturing method of a wiring circuit board inspection contact pin is the molar extinction coefficient of 100 to 2000 at a wavelength of 360 nm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to the wiring substrate, a method of manufacturing a suitable contact pin to particular wiring board inspection apparatus used for conducting electrical inspection of printed wiring board, and a wiring board inspecting apparatus. The present invention is, in particular, relates to a manufacturing method and a wiring board inspecting apparatus of the contact pins rich adaptable flexibility in fine wiring pads.

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic devices, the density of wiring has been increasing on printed wiring boards. For this reason, there is an increased risk of disconnection of fine wiring, poor connection, and the like, and a demand for a simple and reliable printed wiring inspection method is increasing. As an inspection method that meets such a demand, a method of directly connecting a contact pin to an electrode pad of a wiring pattern and performing a failure analysis can be considered.
It is one of the important technical elements to use contact pins that can be stably connected to electrode pads having a connection surface height of not more than 00 μm. That is, there is a need for a conductive contact pin that can be finely processed and has high flexibility, and a simple manufacturing method thereof.

However, it is difficult to form a stable electrical connection with electrode pads having different heights because a contact pin mainly made of a conductive metal or ceramic is rigid and poor in flexibility. Also, in order to solve this problem, in a contact pin in which fine particles of conductive metal, ceramic, carbon, or the like are dispersed in a flexible polymer material, a conductive path (conductive path) is formed throughout the pin. In order to form the conductive powder, at least 20% by weight or more of the conductive powder is required, depending on the particle size of the fine powder. In such a case, flexibility is lost. Furthermore, even if a material having sufficient conductivity and flexibility including a conductive powder is obtained, these conductive powders usually have a particle size of several tens of μm or more. It is difficult to process the substrate into a shape that can be connected to an electrode pad with a spacing of 100 μm or less used for the substrate.

For this reason, inspection of a high-density printed wiring board employs a method such as visual observation or image analysis.
However, in this method, since only the electrical connection is indirectly observed, it is difficult to reliably detect a minute disconnection or a defect. For this reason, at present, highly reliable electrical inspection has not been performed on electrode pads having an interval of 100 μm or less used for high-density printed wiring boards.

On the other hand, conductive polymers such as polypyrrole and polyaniline have been developed as polymers themselves having electrical conductivity, and are used for electrodes and the like of electronic parts.
As a method for polymerizing a conductive polymer such as polypyrrole, oxidative cationic polymerization using an expensive number of transition metal salts as an oxidizing agent is known, and synthesis using ferric chloride or cupric chloride is performed. . For example, Japanese Unexamined Patent Publication (Kokai) No. 3-46214 discloses a solid having a conductive polypyrrole as an electrode, in which a ferric dodecylbenzenesulfonate solution and a methanol solution of pyrrole are mixed at a temperature of -30 ° C or lower and heated to -20 ° C or higher to polymerize. A method for manufacturing an electrolytic capacitor is disclosed. Japanese Patent No. 2601207 discloses a sponge-like conductive polymer in which a solution containing aniline, pyrrole and the like and an oxidizing agent is cooled to freeze the solvent, and the conductive polymer is polymerized at a temperature lower than the melting temperature of the solvent. A method for producing a molded article is disclosed.

Further, Japanese Patent No. 2,657,956 discloses a conductive polymer composition containing polyparaphenylenevinylene, polyaniline, polypyrrole and the like and a precursor which generates a dopant by exposure to energy, and an energy-saving polymer composition. A method of forming a conductive polymer structure that exposes a source to decompose a dopant precursor to produce a dopant and render the exposed area conductive, and exposing the conductive polymer structure to a solvent and exposing to an energy source A method for forming a conductive polymer structure that dissolves and removes a region other than the formed region is disclosed. Japanese Patent Application Laid-Open No. 61-209225 discloses that an electrolytic polymerization reaction is carried out at an electric potential of 1 V or less using an electrolytic solution containing a 5-membered heterocyclic compound and a sulfonate having a molecular weight of 300 or less, so that a high electrode surface is obtained. A method for forming a conductive polymer is disclosed. Since these technologies are methods of forming conductive moldings using organic polymers, they are more flexible than metals, ceramics, etc., even when applied to contact pins for inspection of high-density printed wiring boards, and provide stable electrical connections. Is considered to have a certain effect.

[0007]

As described above, the inspection of a high-density printed wiring board has conventionally been carried out by visual inspection or image analysis. It is difficult to detect the electric current at a time, and at present the electric inspection with high reliability has not been performed.

Although various methods for polymerizing a conductive polymer with an organic polymer have been developed, no method for producing a conductive polymer having high conductivity and capable of forming a pattern by a photochemical reaction has been developed. That is, in the reaction of a conductive polymer using an expensive transition metal salt as an oxidizing agent, when the oxidizing agent is a ferric salt, the oxidizing agent has a large absorbance in a wavelength region of 500 nm or less, so that it is combined with a photosensitive resin to perform photochemical reaction. When the pattern is formed by the reaction, there is a problem that the degree of the reaction differs in the depth direction. Further, when a cupric salt is used as an oxidizing agent, a problem arises in that the obtained conductive polymer has a remarkably small electric conductivity in cupric chloride or cupric paratoluenesulfonate. Further, various methods for forming a conductive polymer molded body have been developed, but it is difficult to form a contact pin for inspection of a high-density printed wiring board using these methods. That is, in a method in which a solution in which the reaction is suppressed at a low temperature is polymerized by raising the temperature or a method in which the conductive polymer is polymerized at a temperature lower than the melting temperature of the solvent, a conductive polymer is formed on the entire surface of the substrate, and It is not a shape and it can not cope with a fine electrode pad.

Further, a composition containing a conductive polymer and a precursor that generates a dopant by exposure to energy is exposed to an energy source to decompose the dopant precursor to generate a dopant, thereby forming an exposed region of the conductive material. In the method of forming a conductive polymer structure, and exposing it to a solvent to dissolve and remove the area other than the area exposed to the energy source, the compound that can be used as a dopant is limited to a special molecular structure such as an onium salt. In addition, since the number of conductive polymers soluble in a solvent is small, it is difficult to manufacture a polymer in which performance such as conductivity and flexibility is arbitrarily controlled. Furthermore, it is difficult to grow the conductive polymer to a sufficient height by suppressing the spread in the electrode surface direction by the electrolytic polymerization method.

In addition, considering the application of a conductive polymer to a contact pin for inspection of a high-density printed wiring board, a conductive polymer generally has a conjugated system that extends in the main chain direction of the polymer, so that it is rigid. However, there are many insoluble and infusible materials, and when used alone, there arises a problem that it is difficult to form a stable electrical connection by being in close contact with electrode pads having poor flexibility and different heights.

[0011] The main purpose of the present invention, high-density printed wiring board electrical inspection apparatus also available in fine wiring pad used in the contact <br/> rich in flexibility highly conductive and to provide a manufacturing method and a wiring substrate inspection device pin.

[0012]

[Means for Solving the Problems]

The method for manufacturing a contact pin for inspecting a printed wiring board according to the present invention comprises the steps of forming a mixture layer comprising a photosensitive resin and an oxidizing agent on a support plate provided with electrode pads; An oxidizing agent comprising a step of patterning an image, a step of developing a corrosion-resistant image, and a step of polymerizing a monomer of a conductive polymer, wherein the oxidizing agent has a molar absorption coefficient of 10 nm at 360 nm.
It is characterized by being 0 or more and 2000 or less. According to this manufacturing method, a lithography method using a photochemical reaction can be applied, so that electrode pads having an interval of 100 μm or less used for a high-density printed wiring board can also be manufactured. Can be performed reliably.

[0014]

DETAILED DESCRIPTION OF THE INVENTION In the present onset Ming, the conductive polymer
The monomer is pyrrole or ethylenedioxythiophene having pyrrole or ethylenedioxythiophene as a main component, but a derivative having a substituent other than the 2,5-position of the pyrrole ring or thiophene ring is substantially used. Are included because they have the same effect.

The naphthalene sulfonic acid anion or a derivative thereof is an anion such as α-naphthalene sulfonic acid, β-naphthalene sulfonic acid, butyl naphthalene sulfonic acid, highly condensed formaldehyde of β-naphthalene sulfonic acid, and polyvinyl naphthalene sulfonic acid. However, from the viewpoint of synthesizing a conductive polymer having high conductivity, an anion of an alkylnaphthalenesulfonic acid such as butylnaphthalenesulfonic acid or a formaldehyde highly condensed product of naphthalenesulfonic acid is particularly preferable.

In the method for manufacturing a contact pin for inspecting a wiring board (hereinafter, may be simply referred to as a contact pin) according to the present invention, the oxidizing agent having a molar extinction coefficient of not less than 100 and not more than 2,000 at a wavelength of 360 nm is defined as an oxidizing agent. When the agent is diluted with an appropriate solvent and the absorbance at 360 nm is measured, the molar extinction coefficient is 100 or more and 2000 or less, and typical examples thereof include cupric salts of various anions. . According to the study of the present inventors, an oxidizing agent having a molar extinction coefficient at 360 nm of more than 2000, such as dodecylbenzenesulfonic acid secondary
Even if iron is used in combination with a photosensitive resin, the photochemical reaction cannot be performed uniformly. An oxidizing agent having a molar extinction coefficient of 100 or less, such as hydrogen peroxide, cannot provide a highly conductive conductive polymer. In the present invention, the oxidizing agent is not particularly limited as long as the molar extinction coefficient is 100 or more and 2,000 or less, but a salt composed of a cupric cation and an anion is preferable from the viewpoint of uniformity and high conductivity of the obtained conductive polymer, Among them, a salt composed of a cupric cation and a naphthalenesulfonic acid anion or a derivative thereof is particularly preferable.

In the method for producing a contact pin of the present invention, the photosensitive resin is a resin capable of forming a corrosion-resistant image by a usual photochemical reaction method, and a resin obtained by a photochemical reaction method. Resist,
Positive photoresists, dry film resists, and multilayer resists are used, but a photosensitive resin containing an acrylic compound as a main component is preferable from the viewpoint of ease of production, and particularly, a urethane bond is formed from the viewpoint of flexibility of the obtained resin. Acrylic compounds having at least 4 carbon atoms and 2
Acrylic compounds having two or less linear alkylene groups and urethane bonds are preferred. A straight-chain alkylene group having 4 carbon atoms
Below, the produced acrylic compound becomes rigid and poor in flexibility, and when the carbon number is 22 or more, on the contrary, it is too soft to obtain elasticity required as a contact pin.

In the method for manufacturing a contact pin according to the present invention,
At least a polyfunctional acrylate monomer or oligomer may be included for the purpose of introducing a crosslinked structure into a part of the molecular structure. Such polyfunctional acrylate compounds include, for example, bifunctional acrylates such as ethylene glycol diacrylate and their methacrylate compounds, polyfunctional acrylates such as trimethylolpropane triacrylate and their methacrylate compounds.

In the present invention, a polymerization initiator can be added to the photocurable resin as required. Examples of the polymerization initiator include, for example, acetophenone compounds such as diethoxyacetophenone, benzoin compounds such as benzoin methyl ether and benzoin isobutyl ether, benzophenone compounds, and thioxanthone compounds.

In the method for producing a contact pin according to the present invention, the conductive polymer is a polymer itself which is a conductive polymer compound and a π-electron conjugated polymer such as polyacetylene or polyparaphenylene containing a dopant. However, polypyrrole or polyethylenedioxythiophene is preferred from the viewpoint of easy formation of a complex with the photosensitive resin and stability of the conductive state.

The electrode pad is used as a lead electrode of a contact pin for inspection, and its shape and material are not particularly limited, and have a shape corresponding to a wiring board to be inspected. The electrode pad can be manufactured using a conductive material such as copper, gold, titanium, indium and various alloys.

The support plate supports the electrode pads, and can be manufactured by using a conventionally known electric insulating material as a wiring substrate such as a glass-epoxy composite film substrate, a polyimide substrate, or a ceramic substrate. It is used by providing a wiring from an external terminal to an electrode pad.

As a method for forming a mixture layer containing a photosensitive resin and an oxidizing agent, there can be mentioned a usual coating film forming method such as a dip coater, a spin coater, a bar coater and a roll coater after mixing these.

The method of forming a pattern of a corrosion-resistant image on a mixture layer comprising a photosensitive resin and an oxidizing agent by a photochemical reaction is not particularly limited as long as it is based on a usual photochemical reaction. , Visible light, ultraviolet light, argon laser, Kr-F laser, or the like.

Further, in the manufacturing method of the present invention, after irradiation with light, development is performed with various developing solutions according to the photosensitive resin layer to form a predetermined pattern. In the manufacturing method of the present invention, after the development, the conductive polymer is polymerized by contact with the conductive polymer monomer, or after forming a corrosion-resistant pattern by a photochemical reaction method, the conductive polymer monomer is included. The development of the photosensitive resin and the polymerization of the conductive polymer can be simultaneously performed using an organic solvent. In the latter case, the organic solvent is not particularly limited, but alcohol solvents such as ethyl alcohol, butyl alcohol, and isopropyl alcohol are preferable because of the ease of polymerization reaction.

In the method for manufacturing a contact pin according to the present invention,
After the formation of the conductive polymer, doping can be performed to increase conductivity, or a new function such as heat resistance can be provided. As such a doping method, a molded body containing a conductive polymer is brought into contact with a gas such as iodine, immersed in a solution of various sulfonic acids, carboxylic acids, phosphoric acids, or the like, or oxidized with ferric chloride or the like. For example, a method of immersing the composition in an agent solution. At this time, the doping temperature, time, and the like are not particularly limited, and are appropriately selected depending on the material to be used.

In order to clarify the above and other objects, features and advantages of the present invention, embodiments will be described in more detail below with reference to the accompanying drawings. FIG. 1 shows the production of the present invention.
Is a perspective view showing an example and a use of the wiring substrate inspection device provided with a contact pin according to the method. In a wiring board inspection apparatus 10 shown in FIG. 1, an electrode pad 2 is formed on a support plate 3 provided with a wiring 12, and is electrically connected to and electrically connected to the electrode pad 2 for wiring board inspection. 1 is provided. This contact pin 1 is manufactured by the manufacturing method of the present invention. Then, the contact pins 1 are pressed against a wiring board 14 to be inspected, for example, a printed wiring board, and the wiring board 14 is inspected.

The co Ntakutopin is produced by a method shown in FIGS. 2-5. That is, in the method of manufacturing a contact pin according to the present invention, as shown in FIG. 2, a step of forming a mixture layer 4 made of a photosensitive resin and an oxidant on a support plate 3 provided with an electrode pad 2 and provided with a wiring 12. And masking the mixture layer 4 with a photomask 6 as shown in FIG. 3 and then irradiating the mixture layer 4 with light to form a pattern of a corrosion-resistant image by a photochemical reaction, and a step of forming a corrosion-resistant image using a developing solution such as an organic solvent. Developing a substrate having a corrosion-resistant image composed of a photosensitive resin layer 7 as shown in FIG. 4; and immersing the corrosion-resistant image in a monomer solution 8 of a conductive polymer as shown in FIG. Polymerizing a high molecular monomer. The contact pin 1 obtained by this manufacturing method is shown in FIG.
As shown in the figure, the protrusions have a structure in which a conductive polymer layer 9 is formed as a surface layer on a rod-shaped photosensitive resin layer 7. Since the conductive polymer layer 9 exists as a surface layer and continuously forms a conductive path, the contact pin 1 is highly conductive. Further, since the contact pin 1 has a resin such as a cured photosensitive resin as a core, the contact pin 1 is excellent in flexibility.

In the manufacturing method according to the present invention, a step of patterning the mixture layer 4 containing the photosensitive resin by a photochemical reaction is adopted. Therefore, the contact pins 1 having an arbitrary shape are spaced by a photomask 6 at intervals of about several μm. It can be formed with high density. Further, in the present invention, since the oxidizing agent has a molar extinction coefficient of 100 or more and 2000 or less at a wavelength of 360 nm, the photochemical reaction of the photosensitive resin can be uniformly performed. Furthermore, since the molecule itself is not a particulate material such as carbon or metal powder but a conductive polymer as the conductive material of the contact pin 1, the formation interval of the contact pin 1 is substantially the same as that of the photosensitive resin. It is possible to reduce the pattern forming accuracy. Further, the height of the contact pins 1 can be controlled by the height of the photosensitive resin layer 7. Therefore, there is an advantage that contact pins having different heights can be formed by combining a plurality of photochemical reactions.

As shown in FIG. 1, an example of a wiring board inspection apparatus according to the present invention is an electrically insulating support plate 3 provided with wiring 12.
A plurality of conductive electrode pads 2 are provided on the wiring board 14, and on each of the plurality of electrode pads 2, a bar-shaped contact pin 1 electrically contacted with the wiring board 14 is provided. Inspection device 1 for conducting electrical inspection
As shown in FIG. 6, the rod-shaped contact pin 1 has a structure in which an organic polymer rod-shaped resin layer 7 is used as a core and a conductive polymer layer 9 is coated thereon as a surface layer. It is an inspection device having. The inspection device 10 and the contact pins 1 can be manufactured by, for example, the above-described manufacturing method.
The rod-shaped resin layer 7 is preferably made of the above-mentioned photosensitive resin. With this wiring board inspection device,
Inspection of high-density printed wiring boards is easy.

As an example of a method of inspecting a wiring board, as shown in FIG. 1, a wiring board inspection apparatus 10 is pressed against a wiring board 14 so that the contact pins 1 are brought into contact with a circuit formed on the wiring board 14, and the wiring 12, An electric signal for inspection is given to the circuit through the electrode pad 2 connected to the wiring 12 and the contact pin 1 connected to the electrode pad 2, and the electric signal passing through the circuit is transmitted through another contact pin 1. This is a method of extracting and analyzing as an output signal.

[0032]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples, and each Example may be appropriately modified within the scope of the technical idea of the present invention. Can be done. Reference Example 1 Cupric butylnaphthalenesulfonate, cupric salt of a high-condensate of naphthalenesulfonic acid formaldehyde, and each salt in a methanol solution (concentration, 10% by weight each) in which cupric α-naphthalenesulfonic acid was dissolved. Was added dropwise and stirred at room temperature for 2 hours to obtain conductive polypyrrole. After washing and drying, the samples obtained by compression molding had a conductivity of 23 S / cm, 8 S / cm and 6 S / cm, respectively, and were usable as conductive materials for electronic components. When the molar extinction coefficient was measured based on the sulfonic acid group at 360 nm of the salt solution before the addition of pyrrole, they were 710, 500, and 410, respectively.
Even at 10% by weight, a photochemical reaction was possible.

[0033] Except to use ethylenedioxythiophene instead pyrrole Reference Example 2 Reference Example 1 was obtained in the same manner as three in the method of the conductive polyethylene dioxythiophene as in Reference Example 1. After washing and drying, the conductivity of the sample obtained by compression molding is 8S each.
/ Cm, 2.5 S / cm, and 4.8 S / cm, and could be used as a conductive material for electronic components.

Comparative Example 1 Cupric butyl naphthalenesulfonate and cupric salt of a high condensate of naphthalenesulfonic acid formaldehyde of Reference Example 1,
In the same manner as in Reference Example 1, except that cupric paratoluenesulfonate, cupric dodecylbenzenesulfonate, and ferric butylnaphthalenesulfonate were used instead of and cupric α-naphthalenesulfonate, respectively. Various kinds of conductive polypyrrole were obtained. After washing and drying, the conductivity of the sample obtained by compression molding was 10 ⁻⁵ S / cm, 5 × 10 5
^-6 S / cm and 5.8 S / cm, and could not be used as a conductive material for electronic components except for those using ferric butylnaphthalenesulfonate. The molar extinction coefficients of the salt solution before the addition of pyrrole were measured at 490, 550, and 3800, respectively, based on the sulfonic acid group at 360 nm of the salt solution, and were found to be cupric paratoluenesulfonate and copper dodecylbenzenesulfonate. Those using copper were capable of photochemical reaction even at 10% by weight, while those using ferric butylnaphthalenesulfonate were not capable of photochemical reaction.

The following first to fifth embodiments are examples in which the wiring board inspection apparatus 10 having the contact pins 1 shown in FIGS. 1 and 6 is manufactured by the steps shown in FIGS.

Example 1 A copper foil was adhered on a glass epoxy substrate to form a wiring pattern 12, and the electrode pad portion 2 was blackened. A urethane acrylate photosensitive resin containing 30% by weight of an ethanol solution (concentration of 30% by weight) in which cupric butylnaphthalenesulfonate is dissolved (KAYARAD UX-3204, hexamethylene (Diisocyanate) was heated and dropped at 60 ° C., and a 100 μm mixture layer 4 was formed using a bar coater, and dried under reduced pressure at room temperature for 24 hours. Next, a metal mask 6 having a circular opening having a diameter of 50 μm and having an interval of 100 μm was closely adhered thereto, and irradiated with ultraviolet light at an irradiation intensity of 5 mW / cm ² for 5 seconds to form a corrosion-resistant image. Thereafter, the obtained substrate was immersed in butyl alcohol to develop a corrosion-resistant image. Next, the obtained substrate is immersed in methyl alcohol containing 5% by weight of pyrrole and reacted at room temperature for 2 hours to have a urethane acrylate-based photosensitive resin molded body on which conductive polypyrrole is formed as a contact pin 1. The wiring board inspection device 10 was obtained. This molded product has a diameter of 50 μm and a height of 1.
It was a cylinder having a diameter of 00 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board. Since the obtained contact pin 1 can be elastically deformed up to 15% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 15Ω, not only the open / short inspection of the printed wiring board 14 but also the operation test can be performed.

[0037] Example 2 sticking a copper foil on a glass epoxy substrate of Example 1 to form a wiring pattern 12, after the electrode pad portion 2 was blackened, butyl naphthalene sulfonate second by the method of Example 1 A substrate on which a corrosion-resistant image was formed by forming a urethane acrylate-based photosensitive resin layer containing copper was obtained. The substrate is immersed in butyl alcohol containing 5% by weight of pyrrole, and held at room temperature for 30 minutes to simultaneously develop a corrosion-resistant image and polymerize polypyrrole, thereby forming a urethane acrylate-based photosensitive resin molded article on which conductive polypyrrole is formed. I got This molded product was a column having a diameter of 50 μm and a height of 90 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board. The obtained contact pin 1 can be elastically deformed up to 15% of its height, so that it can be in close contact with wiring pads of different heights, and since the electrical resistance is 10Ω, the printed wiring board The operation test as well as the 14 open / short inspections were possible.

Example 3 A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern 12, and the electrode pad portion 2 was subjected to blackening treatment. A urethane acrylate-based photosensitive mixture layer 4 was formed in the same manner as in Example 1 except that a high formaldehyde condensate of cupric β-naphthalenesulfonic acid was used instead to obtain a substrate on which a corrosion-resistant image was formed. . The substrate was immersed in isopropyl alcohol containing 5% by weight of pyrrole, and held at room temperature for 15 minutes to simultaneously develop a corrosion-resistant image and polymerize polypyrrole, thereby forming a urethane acrylate-based photosensitive resin molded article having conductive polypyrrole formed thereon. I got This molded product was a column having a diameter of 50 μm and a height of 100 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board. The obtained contact pin 1 can be elastically deformed up to 20% of its height, so that it can be in close contact with wiring pads of different heights, and since the electrical resistance is 6Ω, the printed wiring board The operation test as well as the 14 open / short inspections were possible.

Example 4 A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern 12, and the electrode pad portion 2 was subjected to blackening treatment.
Example 1 Example 1 was repeated except that Aronix M-5700 manufactured by Toagosei Co., Ltd. was used instead of AYARAD UX-3204.
The mixture layer 4 was formed by the method described above. Next, an interval of 100 μm
Then, a metal mask 6 having a circular opening having a diameter of 50 μm was adhered to the substrate and irradiated with ultraviolet light at an irradiation intensity of 5 mW / cm ² for 5 seconds to obtain a substrate on which a corrosion-resistant image was formed. This substrate is immersed in butyl alcohol containing 5% by weight of pyrrole,
The development of the corrosion-resistant image and the polymerization of polypyrrole were carried out simultaneously at a room temperature for 30 minutes to obtain a urethane acrylate-based photosensitive resin molded product on which conductive polypyrrole was formed. This molded body is a cylinder having a diameter of 50 μm and a height of 90 μm,
The shape was suitable for a contact pin for printed wiring board inspection. The resulting contact pin 1 is 15% of its height
Since it can be elastically deformed up to a maximum, it can be in close contact with wiring pads of different heights, and has an electric resistance of 12
Since it is Ω, not only the open / short inspection of the printed wiring board 14 but also the operation test can be performed.

Fifth Embodiment A copper foil is adhered on the glass epoxy substrate of the first embodiment to form a wiring pattern 12, and the electrode pad portion 2 is blackened. Then, butylnaphthalenesulfonic acid is produced in the same manner as in the first embodiment. A urethane acrylate-based photosensitive mixture layer 4 containing cupric was formed to obtain a substrate on which a corrosion-resistant image was formed. This substrate was immersed in butyl alcohol containing 5% by weight of ethylenedioxythiophene, and kept at room temperature for 15 minutes to simultaneously develop a corrosion-resistant image and polymerize ethylenedioxythiophene, thereby forming conductive polyethylenedioxythiophene. A urethane acrylate-based photosensitive resin molded product was obtained. This molded product was a column having a diameter of 50 μm and a height of 100 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board. The obtained contact pin 1 can be elastically deformed up to 20% of its height, so that it can be in close contact with wiring pads of different heights, and since the electrical resistance is 6Ω, the printed wiring board The operation test as well as the 14 open / short inspections were possible.

[0041]

As described above, according to the present invention ,
Since the acid agent is of the molar extinction coefficient 100 to 2,000 at a wavelength of 360 nm, a manufacturing method of the contact pin rich in flexibility adaptable high conductivity even fine wiring pad is provided. In addition, the use of the wiring board inspection apparatus of the present invention makes it easy to inspect a high-density printed wiring board.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a wiring board inspection apparatus provided with contact pins according to a manufacturing method of the present invention, and an outline of a method of using the same.

FIG. 2 is a cross-sectional view illustrating a method for manufacturing a contact pin for inspecting a wiring board according to the present invention, showing a step of forming a mixture layer containing an oxidizing agent and a photosensitive resin on a support plate.

FIG. 3 is a cross-sectional view illustrating a method for manufacturing a contact pin for inspecting a wiring board according to the present invention, illustrating a step of forming a pattern of a corrosion-resistant image by a photochemical reaction using a photomask.

FIG. 4 is a cross-sectional view illustrating a method of manufacturing a contact pin for inspecting a wiring board according to the present invention, showing a substrate obtained by a process of developing a corrosion-resistant image.

FIG. 5 is a cross-sectional view illustrating the method of manufacturing the contact pin for inspecting a wiring board according to the present invention, showing a step of polymerizing a conductive polymer monomer.

FIG. 6 is a cross-sectional view illustrating an example of a wiring board inspection apparatus according to the present invention.

[Explanation of symbols]

1. Conductive contact pins, 2. Electrode pads, 3
..Support plate, 4..Mixed layer, 6..Photomask, 7
..Photosensitive resin layer, 8 monomer liquid, 9 conductive polymer layer, 10 wiring board inspection device, 12 wiring, 1
4. Wiring board (printed wiring board)

Continuation of front page (56) References JP-A-8-45790 (JP, A) JP-A-4-48710 (JP, A) JP-A-7-235739 (JP, A) JP-A-6-300782 (JP) , A) JP-A-6-112472 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01R 1/073 C08G 73/02 C08G 61/12 G01R 31/02

Claims (11)

(57) [Claims] A step of forming a mixture layer comprising a photosensitive resin and an oxidizing agent on a support plate having electrode pads; and a step of patterning a corrosion-resistant image by a photochemical reaction.
A method for producing a contact pin for inspecting a wiring board, comprising a step of developing a corrosion-resistant image and a step of polymerizing a monomer of a conductive polymer, wherein the oxidizing agent has a molar extinction coefficient of 100 or more and 2000 or less at a wavelength of 360 nm. Manufacturing method of a contact pin for wiring board inspection. Wherein said photosensitive resin, method of manufacturing a wiring circuit board inspection contact pin according to claim 1, characterized in that the acrylic compound as a main component. 3. The method according to claim 2, wherein the acrylic compound has a urethane bond. Wherein said acrylic compound, an alkylene group having 4 to 22 carbon atoms, and claim 2 method of manufacturing a wiring circuit board inspection contact pin, wherein a is one having a urethane bond. 5. A step of developing the corrosion image, and a step of polymerizing the monomer of the conductive polymer, according to claim characterized by being carried out simultaneously by using an organic solvent containing a monomer of the conductive polymer 1 5. The method for producing a contact pin for wiring board inspection according to any one of the above-described items. Wherein said organic solvent is, wiring method of manufacturing a circuit board inspection contact pin according to claim 5, characterized in that the alcoholic solvent as a main component. 7. A method of manufacturing a wiring circuit board inspection contact pin according to claim 1, wherein the oxidizing agent is a salt comprising a second copper cation and an anion. Wherein said anion is a manufacturing method of claim 7 wiring board inspection contact pin, wherein the naphthalenesulfonic acid anion or a derivative thereof. Wherein said naphthalenesulfonic acid anion or a derivative thereof alkylnaphthalene sulfonate anion or method of manufacturing a wiring circuit board inspection contact pin according to claim 8, wherein the formaldehyde condensate of naphthalenesulfonic acid. 10. A solution comprising monomers of the conductive polymer, pyrrole, claims 1-9 Neu Zureka, characterized in that an alcohol solution containing at least one ethylene dioxythiophene, and aniline 2. The method for manufacturing a contact pin for inspecting a wiring board according to claim 1. 11. A wiring board inspection apparatus for providing an electrical inspection of a wiring board by providing a plurality of rod-shaped contact pins on a support plate, wherein the rod-shaped contact pins are provided. Produced by the manufacturing method described in any one of
A wiring board inspection apparatus, characterized in that it has been manufactured.