JP3120796B2 - Method of manufacturing contact probe for electrical inspection - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a contact probe for electrical inspection used in an electrical inspection apparatus for a high-density printed circuit board, and more particularly to a highly conductive and flexible method capable of responding to fine wiring pads. The present invention also relates to a method for manufacturing a contact probe for electrical inspection, which is also rich.

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic devices, the density of wiring on printed circuit boards has been increasing.
For this reason, the risk of disconnection of fine wiring, connection failure, and the like is increasing, and the demand for a printed circuit board inspection method corresponding to fine wiring is increasing. As a method of electrical inspection of a printed circuit board, a method of connecting a contact probe for electrical inspection to an electrode pad of a wiring and performing a failure analysis is appropriate. According to this method, in order to apply the method to a high-density printed circuit board, the pad interval is 100 μm.
It is necessary to use a contact probe for electrical inspection (hereinafter, sometimes referred to as a contact probe) that can stably and electrically connect to electrode pads having a connection surface height different from each other when the height is less than m. That is, there is a need for a conductive contact probe that can be finely processed and has high flexibility, and a simple manufacturing method thereof.

However, in the case of a contact pin mainly made of metal, a maximum diameter of the probe is required to be close to 100 μm. Therefore, there is a danger that crosstalk between the probes will occur in a printed circuit board having a pad interval of 100 μm or less. Yes, miniaturization is difficult. Also, in order to solve this problem, a conductive polymer and a flexible polymer material,
It is conceivable to use a contact probe in which fine powder such as carbon is dispersed. However, in materials having sufficient conductivity and flexibility, including conductive powders, since these conductive powders usually have a particle size of several tens of μm or more, the spacing used for high-density printed wiring boards is 100 μm or less. It is difficult to process it into a shape that can be connected to the electrode pad. For this reason, the inspection of the high-density printed wiring board employs a method such as visual inspection or image analysis. However,
In this method, since only the electrical connection is indirectly observed, it is difficult to reliably detect a minute disconnection or a defect. For this reason, at present, highly reliable electrical inspection has not been performed on electrode pads having an interval of 100 μm or less used for high-density printed wiring boards.

On the other hand, as a polymer having electric conductivity,
Conductive polymers such as polypyrrole and polyaniline have been developed and used for electrodes of electronic components. Japanese Patent Application No. 10-
No. 137299 discloses that a photosensitive resin is mixed with an oxidizing agent composed of an expensive number of transition metal salts and patterned, and simultaneously with development,
Alternatively, there is disclosed a method for manufacturing a flexible and conductive contact probe by forming a conductive polymer after development.

[0005]

However, in the probe disclosed in Japanese Patent Application No. 10-137299, in which a conductive polymer is formed in a photosensitive resin, oxidation is required to reduce the resistance of the probe. Since it is necessary to increase the mixing ratio of the agent, the ratio of the photosensitive resin contained in the probe is reduced, and the strength of the probe is reduced, thereby causing a problem that the development of the probe becomes difficult. Another problem is that the oxidizing agent can be uniformly mixed with the photosensitive resin, and the light absorption must be small enough to cure the photosensitive resin.

An object of the present invention is to provide a method for manufacturing a contact probe using a conductive polymer which is easy to manufacture and has low resistance and high strength.

[0007]

According to the present invention, a pattern is formed using a resin, and an oxidizing agent is absorbed in the pattern, and a monomer of a conductive polymer is polymerized to form a conductive layer on the pattern. This is a method for manufacturing an electrical inspection contact probe for forming a contact probe. Further, the present invention forms a pattern having a composite composed of a resin and a conductive polymer, absorbs an oxidizing agent into the pattern, and then polymerizes a monomer of the conductive polymer to form a conductive layer on the pattern. This is a method for manufacturing a contact probe for electrical inspection to be formed. Further, the present invention provides a step of forming a mixture layer containing a resin and an oxidant on a wiring board having an electrode pad, a step of patterning the mixture layer, a step of developing a pattern, and And forming a conductive layer on the pattern by polymerizing a monomer of a conductive polymer. In the method for producing a contact probe, the resin is a photosensitive resin, the photosensitive resin is an acrylic compound, the acrylic compound has a urethane bond, and the acrylic compound has 4 to 22 carbon atoms. Having an alkylene group and a urethane bond, the monomer of the conductive polymer is at least one selected from pyrrole, ethylenedioxythiophene, and aniline, and the resin has a urethane bond,
It is preferable that the resin has a hydroxyl group or a carboxyl group, and that the step of absorbing the oxidizing agent into the pattern and the step of polymerizing a monomer of the conductive polymer to form a conductive layer on the pattern are repeated a plurality of times.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a resin is a polymer other than a conductive polymer, which forms a pattern by itself or by polymerization. In the present invention, it is particularly preferable to use a photosensitive resin as the resin. The photosensitive resin is a resin that can form a corrosion-resistant pattern by a normal photochemical reaction method, and a resin obtained by polymerization by a photochemical reaction method.For example, various negative photoresists, positive photoresists, and dry photoresists are used. Although a film resist can be applied, an ultraviolet-curable photosensitive resin containing an acrylic compound as a main component is preferable from the viewpoint of ease of production, and particularly, from the viewpoint of flexibility of the obtained resin, has a urethane bond. Acrylic compounds are preferred, and among them, acrylic compounds having a linear alkylene group having 4 to 22 carbon atoms and a urethane bond are preferred. When the number of carbon atoms of the straight-chain alkylene group is 4 or less, the formed acrylic compound becomes rigid and poor in flexibility. On the other hand, when the number of carbon atoms is 22 or more, it is too soft to obtain elasticity and strength required as a contact pin. Absent. In addition, the photosensitive resin containing an acrylic compound as a main component means that the acrylic compound is about 70% by weight in the photosensitive resin.

In the present invention, the photosensitive resin may contain at least a polyfunctional acrylate monomer or oligomer for the purpose of introducing a crosslinked structure into a part of the molecular structure. As such a polyfunctional acrylate compound,
Examples thereof include bifunctional acrylates such as ethylene glycol diacrylate and their methacrylate compounds, and polyfunctional acrylates such as trimethylolpropane triacrylate and their methacrylate compounds.

In the present invention, at least a monofunctional acrylate monomer or oligomer may be contained for the purpose of adjusting the viscosity of the photosensitive resin. Examples of such a monofunctional acrylate compound include 2-hydroxyethyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and methyl methacrylate having an alcoholic hydroxyl group.

Further, a polymerization initiator can be added to the photosensitive resin as required. Examples of the polymerization initiator include:
Examples include acetophenone compounds such as diethoxyacetophenone, benzoin compounds such as benzoin methyl ether and benzoin isobutyl ether, benzophenone compounds, and thioxanthone compounds.

In the present invention, a thermoplastic resin or a thermosetting resin other than the photosensitive resin can be used as the resin. When a resin other than the photosensitive resin is used, it is easy to control the physical properties of the probe. As the resin other than the photosensitive resin used here, polyurethane, polyvinyl alcohol, a resin having a urethane bond, a resin having a hydroxyl group, a resin having a carboxyl group, and the like are suitable. As a method for patterning these resins, a method such as wet etching, electron beam, laser, and reactive ion etching can be applied.

The conductive polymer is used to form a conductive layer. The polymer itself is a conductive polymer compound, and a π-electron conjugated system such as polyacetylene or polyparaphenylene containing a dopant. Although a polymer is mentioned, at least one selected from polypyrrole, polyethylenedioxythiophene, and polyaniline from the viewpoint of easy formation of a complex with a photosensitive resin and stability of a conductive state.
Those containing seeds are preferred. Examples of the conductive polymer monomer include pyrrole, ethylenedioxythiophene, and aniline. A solution of these conductive polymer monomers in a solvent such as an alcohol solvent can be used as the conductive polymer monomer liquid. When the conductive polymer monomer liquid is used, the resin (pattern) is easily absorbed by the conductive polymer monomer by impregnation or the like. When the conductive polymer monomer absorbed in the pattern is polymerized, a pattern having a composite of a resin and a conductive polymer is obtained.

The oxidizing agent is a Lewis acid. As the oxidizing agent, an expensive metal salt is preferable, and particularly, an expensive transition metal salt is preferable. Expensive transition metal salts include Fe ³⁺ , C
A mixed layer containing a resin such as a photosensitive resin and an oxidizing agent composed of a high number of transition metal salts, which is a salt having a polyvalent metal such as u ²⁺ , Cr ⁶⁺ , Mn ⁷⁺ or Sn ⁴⁺ as a cation. As a method for forming a film, a usual coating film forming method such as a dip coater, a spin coater, a bar coater, and a roll coater can be used. Examples of the oxidizing agent comprising an expensive number of transition metal salts include ferric butylnaphthalenesulfonate, ferric p-toluenesulfonate, iron salts such as ferric chloride, and cupric butylnaphthalenesulfonate. It is a copper salt. A solution obtained by dissolving the oxidizing agent in a solvent such as an alcohol solvent can be used as the oxidizing agent solution. When an oxidizing agent solution is used, the resin (pattern) can be easily absorbed by impregnating the oxidizing agent or the like.

The electrode pad is used as a lead electrode of a contact pin for inspection, and its shape and material are not particularly limited. The electrode pad has a shape corresponding to a printed wiring board to be inspected, and is made of conductive copper, gold or titanium. , Indium and various alloys are used.

The wiring board supports the electrode pads, and is conventionally known as a wiring board such as a glass-epoxy composite board, a flexi board, a polyimide board, or a ceramic board. It is used by providing wiring up to.

The method of patterning a corrosion-resistant image on a mixture layer containing a photosensitive resin and an oxidizing agent by a photochemical reaction method is not particularly limited as long as it is a normal photochemical reaction, and a metal mask, a photomask or the like is used. ,visible light,
Irradiation with ultraviolet light, argon laser, Kr-F laser, or the like is performed. Further, after light irradiation, development is performed with various developing solutions according to the photosensitive resin layer to form a predetermined pattern. After development, the conductive polymer is polymerized by contact with a monomer that forms a conductive polymer, or after forming a corrosion-resistant pattern by a photochemical reaction method, an organic solvent containing a conductive polymer monomer is used. Thus, the development of the photosensitive resin and the polymerization of the conductive polymer can be performed simultaneously. In the latter case, the organic solvent is not particularly limited, but alcohol solvents such as ethyl alcohol, butyl alcohol, and isopropyl alcohol are preferable because of the ease of polymerization reaction.

After the formation of the conductive polymer, doping can be performed to increase the conductivity or to provide new functions such as heat resistance. As such a doping method, a molded body containing a conductive polymer is brought into contact with a gas such as iodine, immersed in a solution of various sulfonic acids, carboxylic acids, phosphoric acids, or the like, or oxidized with ferric chloride or the like. For example, a method of immersing the composition in an agent solution. At this time, the doping temperature, time, and the like are not particularly limited, and are appropriately selected depending on the material to be used.

For the purpose of increasing the contact strength of the printed circuit board to the electrode surface, a coupling agent can be added to a resin such as a photosensitive resin. As the coupling agent, a silicon-based coupling agent, a titanate-based coupling agent, an aluminate-based coupling agent, or the like can be used.

Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a view showing an example of a method for producing a contact probe of the present invention, in which a step of absorbing an oxidizing agent into a pattern by impregnation, and forming a conductive layer on the pattern by polymerizing a monomer of a conductive polymer. FIG. 5 is a diagram showing an example of a method of manufacturing a contact probe by repeating the steps a plurality of times.

In the substrate shown in FIG. 1A, a conductive polymer and a photosensitive polymer are formed on the electrode pad 2 of the wiring substrate 1 on the photosensitive resin layer 3 formed in a probe shape (protruding shape). A composite made of a resin is formed as the conductive layer 4 to form a probe (protrusion), that is, a pattern 12. When this probe is brought into contact with an oxidizing agent solution 5 containing an expensive number of transition metal salts as shown in FIG. 1B, the oxidizing agent penetrates into the pattern 12 together with the solvent. As shown in FIG. 1 (c), the probe absorbed by the impregnation of the oxidizing agent is brought into contact with a conductive polymer monomer liquid 7 to react the conductive polymer monomer with the oxidizing agent. A conductive polymer is newly formed in the photosensitive resin, and as shown in FIG. 1D, a thicker conductive layer 4 made of the conductive polymer and the photosensitive resin is formed on the photosensitive resin layer 3. Formed. Therefore,
Until saturation is reached, the step of impregnating the oxidizing agent as shown in FIG. 1 (b) and the step of contacting with the monomer liquid 7 as shown in FIG. 1 (c) are repeated to form the conductive polymer. It can be performed repeatedly. In the present invention, since the oxidant is supplied from the outside, that is, from the oxidant solution 5, into the probe, the amount of the conductive polymer formed can be increased.
Therefore, a low-resistance probe 12 is obtained. In addition, since the oxidizing agent can be added from the outside after the formation of the probe, the effect of selecting the type of the oxidizing agent can be obtained.

FIG. 2 is a diagram showing a method of manufacturing the substrate shown in FIG. 1A and an example of a method of manufacturing the contact probe of the present invention. The substrate shown in FIG. 2A can be manufactured by a step of forming a layer made of a photosensitive resin on the wiring board 1 provided with the electrode pads 2, a step of patterning the layer, and a step of developing the pattern. . The thus manufactured pattern 12 shown in FIG.
As shown in FIG. 2B, the pattern 12 is made to absorb the oxidizing agent by contacting with the oxidizing agent solution 5 to form the oxidizing agent-containing photosensitive resin layer 6, and then, as shown in FIG. The contact probe shown in FIG. 2D, that is, the substrate shown in FIG. 1A is manufactured by bringing the resin layer 6 into contact with the conductive polymer monomer liquid 7 and polymerizing the conductive polymer monomer. it can.

The photosensitive resin layer 3 of the substrate shown in FIG. 2A may contain an oxidizing agent or may not contain an oxidizing agent. The photosensitive resin layer 3 of the substrate shown in FIG.
When an oxidizing agent is included in the electrode pad 2, a mixture layer containing a resin and an oxidizing agent is formed on the electrode pad 2. When the photosensitive resin layer 3 shown in FIG. 2A does not contain an oxidizing agent, FIG.
As shown in (1), the photosensitive resin layer 3, that is, the pattern 12, is immersed in the oxidizing agent solution 5 to absorb the oxidizing agent by impregnation. In this case, since a material having high light absorption is not used at the time of photopolymerization, the time of photopolymerization can be shortened. Further, since the content of the oxidizing agent in the photosensitive resin layer 3 can be reduced, deterioration of the probe due to aging is reduced.

FIG. 3 is a view showing another method of manufacturing the substrate shown in FIG. 1A and an example of a method of manufacturing the contact probe of the present invention. The method of manufacturing the contact probe shown in FIG. 3 is different from the method of manufacturing the contact probe shown in FIG. 2 in that the pattern 12 made of the photosensitive resin layer 3 is made of a conductive polymer as shown in FIG. The pattern 12 is brought into contact with the monomer liquid 7 to absorb the monomer of the conductive polymer into the pattern 12 by absorption, thereby forming a monomer-containing photosensitive resin layer 8.
As shown in (c), the conductive layer 4 is formed by bringing the monomer-containing photosensitive resin layer 8 into contact with the oxidizing agent solution 5 to absorb the oxidizing agent and polymerizing the conductive polymer monomer. Is a point. In this example, since the oxidizing agent does not remain on the probe, there is an effect that deterioration due to a change with time in the physical properties of the probe is reduced.

FIG. 4 shows an example in which a resin layer other than the photosensitive resin is used instead of the photosensitive resin layer 3 in FIGS. 4 differs from the embodiment shown in FIG. 1 in that a resin layer 9 other than a photosensitive resin is used instead of the photosensitive resin layer 3. When the resin layer 9 other than the photosensitive resin is used, control of the physical properties of the probe is easy. As the resin forming the resin layer 9 other than the photosensitive resin, a resin other than the above-described photosensitive resin such as polyurethane can be used.

FIG. 5 is a view showing a printed circuit board inspection apparatus using a contact probe manufactured by the manufacturing method of the present invention. In the printed board inspection apparatus, a probe board 16 having a large number of electrode pads 2 formed on a wiring board 1 corresponding to the electrode pads of a printed board 14 to be inspected is prepared. The probe 12 is formed on each of the electrode pads 2 of the probe substrate 16 by the manufacturing method of the present invention. The probe board 16 is provided with the mediating pins 15 on the conversion board 17.
The probe 12 is connected to the tester 13 via the wiring 18. By pressing the probe board 16 against the printed board 14 to be inspected, the electrode pads of the printed board 14 to be inspected and the corresponding electrode pads 2 of the probe board 16 are in a one-to-one relationship via the probe 12. Contact by correspondence. The tester 13 supplies a current to a certain pad and detects a current in another pad to determine whether the pad to which the current is supplied is electrically connected to or separated from the other pad. it can. As a result, it is possible to detect a disconnection or short circuit of the wiring connected to the pad to be inspected, and perform an electrical inspection such as insulation.

In the above, it is possible to perform an electrical inspection in a state where components such as an LSI are mounted on a printed circuit board to be inspected. In this electrical inspection, since the inspection can be performed up to the state where the circuit component is mounted, there is an effect that the operation test of the component can also be performed.

In the above description, the object to be inspected can be changed to a semiconductor wafer instead of a printed circuit board. This inspection method has an effect that it can be used for a burn-in test of a wafer in a semiconductor manufacturing process.

[0029]

Next, a preferred embodiment of the present invention will be described. (Example 1) A contact probe was manufactured by the method shown in FIG. 1 as follows. A wiring pattern was formed on the glass epoxy substrate using Cu to obtain a wiring substrate 1. The electrode pads on the wiring board 1 were plated with Au to form the electrode pads 2. On this electrode pad 2,
A urethane acrylate photosensitive resin (manufactured by Nippon Kayaku Co., Ltd., KAYARAD UX-3204, hexamethylene diisocyanate) and cupric butylnaphthalenesulfonate (oxidizing agent) are mixed at a weight ratio of 80:20,
10 wt. % (% By weight) of α-hydroxycyclohexyl phenyl ketone was applied to a thickness of 100 μm using a bar coater to form a mixture layer. Then, the mixture layer was vacuumed at 60 ° C. for 1 hour.
Heating and drying were performed for hours. This is masked under ultraviolet light and exposed to light to cure the photosensitive resin to form a pattern,
After the pattern was developed, 30 parts of pyrrole and butyl alcohol were added at a normal temperature to a pyrrole solution containing 20:80.
Pyrrole was polymerized by absorbing the pyrrole into the pattern by immersion for a minute. As a result, a cylindrical probe having a diameter of 60 μm and a height of 80 μm, that is, a substrate having the pattern 12 was obtained. As shown in FIG. 1A, the probe 12 is composed of a polypyrrole (conductive polymer) and a polyurethane acrylate resin (photosensitive resin) on a polyurethane acrylate resin (photosensitive resin layer 3). The composite was formed as the conductive layer 4. The probe 12 was capable of elastic deformation up to 50% of its height. When the resistance of this probe was measured, it was 5 kΩ.

As shown in FIG. 1B, the probe was immersed in an oxidizing agent solution 5 containing cupric butylnaphthalenesulfonate and ethyl alcohol at a weight ratio of 40:60 at room temperature for 5 minutes. Then, it was dried in a vacuum at 50 ° C. for 1 hour. After drying, this was placed in a pyrrole solution (monomer liquid 7 of a conductive polymer) containing pyrrole and ethyl alcohol at a weight ratio of 20:80 as shown in FIG. The polypyrrole was formed by immersing and polymerizing pyrrole. This step was repeated five times to obtain a contact probe having the probe 12. As shown in FIG. 1D, the contact probe had a conductive layer 4 made of a conductive polymer and a photosensitive resin formed on the photosensitive resin layer 3. When the resistance of the probe 12 was measured, it was as low as 700Ω. When the elasticity of the probe 12 was measured, elastic deformation up to 40% of its height was possible. Therefore, the present probe was applicable to disconnection detection of a printed circuit board.

Example 2 A contact probe was manufactured by the method shown in FIG. 1 as follows. A wiring pattern was formed on the glass epoxy substrate using Cu, and the portion of the electrode pad 2 was blackened. A urethane acrylate photosensitive resin (Aronix M-1310, manufactured by Toagosei Chemical Co., Ltd.) and cupric butylnaphthalenesulfonate (oxidizing agent) were mixed with the substrate in a weight ratio of 60:40, and photopolymerization was performed. 7 wt. % Benzophenone and 4 wt. % P-dimethylaminobenzoic acid ethyl ester was mixed with a spin coater to a thickness of 70 μm.
m. It was dried by heating at 60 ° C. for 1 hour in a vacuum. This is exposed by masking it under ultraviolet light, and is impregnated with an ethylenedioxythiophene solution in which ethylenedioxythiophene and isopropyl alcohol are mixed at a weight ratio of 10:90 for 15 minutes at room temperature.
A 0 μm square pillar probe was obtained. This probe was capable of elastic deformation up to 40% of its height. When the resistance of this probe was measured, it was 3.5 kΩ.

This probe was impregnated with an oxidizing agent solution 5 in which ferric p-toluenesulfonate and methyl alcohol were mixed at a weight ratio of 60:40 for 10 minutes, and dried in a vacuum at 60 ° C. for 1 hour. . After drying, this was mixed with ethylenedioxythiophene and ethyl alcohol at a weight ratio of 20:80.
The mixture was impregnated in an ethylene-oxythiophene solution (conductive polymer monomer solution 7) mixed at 30 ° C. for 5 minutes at 30 ° C. to polymerize ethylene-oxythiophene to form polyethylene-oxythiophene. This process was repeated seven times to obtain the probe 12. When the resistance of the probe 12 was measured, it was 200Ω, and when the elasticity was measured,
Elastic deformation up to 25% of its height was possible. Therefore, the present probe 12 can be applied to not only the detection of the disconnection of the printed circuit board but also the operation test.

(Example 3) A contact probe was manufactured by the method shown in FIG. 1 as follows. A wiring pattern was formed on a ceramic substrate using Cu, and an electrode pad portion was plated with Au to form an electrode pad 2. On this substrate, a urethane acrylate photosensitive resin (KAYARAD UX-4101 manufactured by Nippon Kayaku Co., Ltd.) and a bifunctional acrylic monomer (KAYAR manufactured by Nippon Kayaku Co., Ltd.)
AD MANDA) and ferric p-toluenesulfonate (oxidizing agent) at a weight ratio of 50:20:30, and 10 wt. % Of α-hydroxycyclohexylphenyl ketone was applied with a bar coater to a thickness of 80 μm. This is exposed by masking it under ultraviolet light, and impregnated in a pyrrole solution in which pyrrole, methyl alcohol and butyl alcohol are mixed at a weight ratio of 20:20:60 at room temperature for 10 minutes, and has a diameter of 60 μm and a height of 70 μm. A cylindrical probe was obtained.
This probe is capable of elastic deformation up to 30% of its height, and its resistance was measured, and a resistance of 2 kΩ was obtained.

The probe was immersed in an oxidizing agent solution 5 in which ferric chloride and methyl alcohol were mixed at a weight ratio of 60:40 for 10 minutes, and dried in a vacuum at 50 ° C. for 1 hour. After drying, 30 parts of this were added to a pyrrole solution in which pyrrole and ethyl alcohol were mixed at a weight ratio of 10:90.
Impregnation at 5 ° C. for 5 minutes to form polypyrrole. This step was repeated five times to obtain the probe 12. This probe 1
When the resistance of No. 2 was measured, it was 100Ω, and when the elasticity was measured, elastic deformation up to 20% of its height was possible. Therefore, the present probe 12 can be applied to not only the detection of the disconnection of the printed circuit board but also the operation test.

(Example 4) A contact probe was manufactured by the method shown in FIG. 2 as follows. A wiring pattern was formed on a glass epoxy substrate using Cu to produce a wiring substrate 1, and a portion of the electrode pad 2 on the wiring substrate 1 was plated with Au. A urethane acrylate-based photosensitive resin (KAYARAD UX-3 manufactured by Nippon Kayaku) is provided on this substrate.
204) and 2-hydroxypropyl acrylate were mixed at a weight ratio of 60:40, and a mixture of α-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator was applied with a bar coater to a thickness of 150 μm. This was dried in a vacuum at 60 ° C. for 30 minutes, exposed by masking under ultraviolet light, and developed with a solvent in which tetrahydrofuran and butyl alcohol were mixed at a weight ratio of 10:90. As a result, as shown in FIG. 2A, a substrate having the photosensitive resin layer 3 as the probe 12 was obtained.
The probe 12 was a column having a diameter of 40 μm and a height of 130 μm, and was capable of elastic deformation up to 50% of its height.

As shown in FIG. 2B, this was impregnated with an oxidizing agent solution 5 in which ferric dodecylbenzenesulfonate and ethyl alcohol were mixed at a weight ratio of 40:60 at room temperature for 20 minutes. Drying was performed at 80 ° C. in a vacuum for 30 minutes. As shown in FIG. 2C, the probe was immersed in a pyrrole solution in which pyrrole and ethyl alcohol were mixed at a weight ratio of 10:90 at 30 ° C. for 5 minutes to impregnate the probe with pyrrole. Was formed. This step is repeated ten times, and as shown in FIG. 2D, the photosensitive resin layer 3 (polyurethane acrylate resin) formed on the electrode pad 2 and the photosensitive resin layer 3 formed on the photosensitive resin layer 3 are formed. In addition, a contact probe having a conductive layer 4 made of a conductive polymer (polypyrrole) and a resin (polyurethane acrylate resin) as a probe 12 was obtained. When the resistance of the probe 12 was measured, it was 1 kΩ,
When the elasticity of the probe 12 was measured,
Elastic deformation up to 0% was possible. Therefore, this probe was applicable to detection of disconnection of a printed circuit board.

(Example 5) Cu on a glass epoxy substrate
Was used to form a wiring pattern to obtain a wiring board, and the electrode pads were plated with Au. This substrate is coated with a thermoplastic polyurethane resin (PANDEX T, manufactured by Dainippon Ink and Chemicals, Ltd.).
-5205), methyl ethyl ketone, and ferric p-toluenesulfonate (oxidizing agent) in a weight ratio of 18: 74: 8, using a bar coater,
It was dried in a vacuum at 60 ° C. for 2 hours. This is patterned by reactive ion etching to have a diameter of 20 μm.
m and a probe having a height of 80 μm were obtained. When the elasticity of this probe was measured, elastic deformation up to 60% of its height was possible.

This was immersed in an ethylenedioxythiophene solution in which ethylenedioxythiophene and methyl alcohol were mixed at a weight ratio of 20:80, and the probe was made to absorb ethylenedioxythiophene. Was formed. The above step of immersing in the ethylenedioxythiophene solution was repeated five times to obtain a contact probe having a probe. When the resistance of the probe was measured, it was 300Ω. Therefore, this probe was applicable to detection of disconnection of a printed circuit board. As shown in FIG. 4 (d), the obtained contact probe has a resin layer 9 (polyurethane resin) formed on the electrode pad 2 and a conductive layer 9 formed on the resin layer 9. Conductive layer 11 composed of molecules (polyethylenedioxythiophene) and resin (polyurethane resin)
And as a probe 12.

[0039]

As described above, according to the present invention,
A contact probe having a probe having low resistance and high strength can be easily manufactured. According to the present invention,
Since the oxidizing agent can be added not only at the time of the initial mixing as in the conventional case but also later, the resistance of the probe can be reduced. In addition, since the oxidizing agent can be added to the probe after the probe is formed, an oxidizing agent that is difficult to mix with the unreacted photosensitive resin or an oxidizing agent having a large light absorption can be used.

[Brief description of the drawings]

1A and 1B are cross-sectional views illustrating an example of a method for manufacturing a contact probe according to the present invention. FIG. 1A is a view illustrating a substrate on which a pattern having a complex is formed, and FIG. FIG. 1 (c) is a view showing a state in which a pattern absorbing an oxidant is brought into contact with a monomer solution of a conductive polymer, and FIG. 1 (d) is a view showing a state of the present invention. It is a figure showing a contact probe by a manufacturing method.

2A and 2B are cross-sectional views illustrating another example of a method for manufacturing a contact probe according to the present invention, wherein FIG. 2A illustrates a substrate on which a pattern is formed, and FIG. FIG. 2 (c) is a diagram showing a state in which a pattern absorbing an oxidizing agent is brought into contact with a conductive polymer monomer solution, and FIG. 2 (d) is a manufacturing method of the present invention. It is a figure which shows the contact pattern by.

3A and 3B are cross-sectional views illustrating an example of a method of manufacturing a contact pattern according to the present invention, wherein FIG. 3A illustrates a substrate on which a pattern is formed, and FIG. FIG.
FIG. 3C is a diagram showing a step of absorbing an oxidizing agent in a pattern that has absorbed the monomer of the conductive polymer, and FIG. 3D is a diagram showing a contact probe according to the manufacturing method of the present invention.

4A and 4B are cross-sectional views illustrating another example of a method for manufacturing a contact pattern according to the present invention. FIG. 4A is a view illustrating a substrate on which a pattern having a composite is formed, and FIG. The figure showing the step of absorbing the oxidizing agent by impregnating the pattern,
FIG. 4C shows a state in which the pattern absorbing the oxidizing agent is brought into contact with the conductive polymer monomer solution, and FIG.
FIG. 3 is a view showing a contact probe according to the manufacturing method of the present invention.

FIG. 5 is a configuration diagram showing a configuration of a printed circuit board inspection apparatus provided with a contact probe according to the manufacturing method of the present invention.

[Explanation of symbols]

1. Wiring board, 2. Electrode pad, 3. Photosensitive resin layer, 4. Conductive layer, 5. Oxidant solution, 6. Photosensitive resin layer containing oxidizer, 7. High conductivity Molecular monomer solution, 8
..Monomer-containing photosensitive resin layer, 9 ... Resin layer other than photosensitive resin, 10 ... Oxidant-containing resin layer, 11 ... Conductive layer, 12 ... Probe (pattern), 13 ... Tester, 14.・ Substrate to be inspected (printed circuit board), 15 ・ ・ Media pin, 16 ・ ・ Probe board, 17 ・ ・ Conversion board,
18. Wiring

────────────────────────────────────────────────── ─── Continued on the front page (72) Daisaku Nakata, Inventor 5-7-1 Shiba, Minato-ku, Tokyo Within NEC Corporation (58) Field surveyed (Int. Cl. ⁷ , DB name) G01R 1/06 -1/073 G01R 31/26 H01L 21/66

Claims (11)

(57) [Claims] 1. A pattern is formed using a resin,
Next, a method for manufacturing a contact probe for electrical inspection, characterized in that an oxidizing agent is absorbed in the pattern and a monomer of a conductive polymer is polymerized to form a conductive layer on the pattern. 2. A pattern having a composite comprising a resin and a conductive polymer is formed, an oxidizing agent is absorbed in the pattern, and then a monomer of the conductive polymer is polymerized to form a conductive layer on the pattern. A method for manufacturing a contact probe for electrical inspection, characterized in that: 3. A step of forming a mixture layer containing a resin and an oxidizing agent on a wiring board having electrode pads, a step of patterning the mixture layer, and a step of developing a pattern.
A method for manufacturing a contact probe for electrical inspection, comprising: a step of absorbing an oxidizing agent into a pattern; and a step of polymerizing a monomer of a conductive polymer to form a conductive layer on the pattern. 4. The method for manufacturing a contact probe for electrical inspection according to claim 1, wherein said resin is a photosensitive resin. 5. The method according to claim 4, wherein the photosensitive resin is an acrylic compound. 6. The method for producing a contact probe for electrical inspection according to claim 5, wherein the acrylic compound has a urethane bond. 7. The method for producing a contact probe for electrical inspection according to claim 5, wherein the acrylic compound has an alkylene group having 4 to 22 carbon atoms and a urethane bond. 8. The conductive polymer monomer is pyrrole,
The ethylenedioxythiophene is at least one member selected from the group consisting of aniline and ethylenedioxythiophene.
8. The method for manufacturing a contact probe for electrical inspection according to any one of 7. 9. The method according to claim 1, wherein the resin has a urethane bond. 10. The method for producing a contact probe for electrical inspection according to claim 1, wherein the resin has a hydroxyl group or a carboxyl group. 11. The method according to claim 1, wherein the step of absorbing the oxidizing agent into the pattern and the step of polymerizing a monomer of the conductive polymer to form a conductive layer on the pattern are repeated a plurality of times. A method for manufacturing a contact probe for electrical inspection according to any one of the above.