JP3168983B2 - Contact pin for printed circuit board inspection and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin used in an electrical inspection device for a high-density printed wiring board and a method of manufacturing the same, and more particularly, to a high conductivity and a high flexibility which can cope with fine wiring pads. The contact pin and its manufacturing method.

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic devices, the density of wiring has been increasing on printed wiring boards. For this reason, the danger of disconnection of fine wiring, connection failure, etc. is increasing, and the demand for a simple and reliable printed wiring inspection method is increasing. As an inspection method that meets such a demand, a method of directly connecting a contact pin to an electrode pad of a wiring pattern and performing a failure analysis can be considered.
It is one of the important technical elements to use contact pins that can be stably connected to electrode pads having a connection surface height of not more than 00 μm. In other words, there is a demand for a conductive contact pin that can be finely processed and has high flexibility, and a simple manufacturing method thereof.

However, it is difficult to form a stable electrical connection with electrode pads having different heights because a contact pin mainly made of a conductive metal or ceramic is rigid and poor in flexibility. In order to solve this problem, in the case of a contact pin in which fine particles such as conductive metals, ceramics, and carbon are dispersed in a flexible polymer material, a conductive path is formed throughout the pin. Although it depends on the particle size of the fine powder, at least 20% by weight or more of the conductive powder is required, and in such a case, flexibility is lost. Furthermore, even if a material having sufficient conductivity and flexibility including a conductive powder is obtained, these conductive powders usually have a particle size of several tens of μm or more. 100μ spacing used for substrate
It is difficult to process into a shape that can be connected to an electrode pad of m or less.

For this reason, inspection of a high-density printed wiring board employs a method such as visual observation or image analysis.
However, in this method, since only the electrical connection is indirectly observed, it is difficult to reliably detect a minute disconnection or a defect. For this reason, at present, highly reliable electrical inspection has not been performed on electrode pads having an interval of 100 μm or less used for high-density printed wiring boards.

On the other hand, conductive polymers such as polypyrrole and polyaniline have been developed as polymers themselves having electrical conductivity, and are used for electrodes and the like of electronic parts.
For example, JP-A-3-46214 discloses that a methanol solution of dodecylbenzenesulfonic acid and pyrrole is -30%.
There is disclosed a method for producing a solid electrolytic capacitor using conductive polypyrrole as an electrode, which is mixed at a temperature of -20 ° C. or lower and heated to -20 ° C. or higher to polymerize.

[0006] Japanese Patent No. 2601207 discloses a sponge-like solution in which a solution containing aniline, pyrrole and the like and an oxidizing agent is cooled to freeze the solvent, and the conductive polymer is polymerized below the melting temperature of the solvent. A method for producing a conductive polymer molded article is disclosed. Further, Japanese Patent No. 2657
No. 956 discloses a conductive polymer composition containing polyparaphenylenevinylene, polyaniline, polypyrrole, and the like, and a precursor that generates a dopant by exposure to energy, and a dopant precursor obtained by exposing the composition to an energy source. A method for forming a conductive polymer structure that decomposes to generate a dopant and makes the exposed region conductive,
Also disclosed is a method for forming a conductive polymer structure in which the conductive polymer structure is exposed to a solvent, and a region other than a region exposed to an energy source is dissolved and removed.

Japanese Patent Application Laid-Open No. 61-209225 discloses that an electrolytic polymerization reaction is carried out at an electric potential of 1 V or less using an electrolyte containing a 5-membered heterocyclic compound and a sulfonate having a molecular weight of 300 or less. A method of forming a conductive polymer having high conductivity on an electrode surface is disclosed.

[0008] Since these techniques are methods for forming a conductive molded body using an organic polymer, even when applied to a contact pin for inspection of a high-density printed wiring board, they are more flexible and stable than metals and ceramics. It is considered that the electrical connection has a certain effect.

[0009]

As described above, the inspection of a high-density printed wiring board has conventionally been carried out by visual inspection or image analysis. It is difficult to detect the electric current at a time, and at present the electric inspection with high reliability has not been performed.

Although various methods for forming a conductive molded body using an organic polymer have been developed, these methods cannot be directly applied to a contact pin for inspection of a high-density printed wiring board.
In other words, a method of polymerizing a solution in which the reaction is suppressed at a low temperature and raising the temperature or a method of polymerizing a conductive polymer at a temperature equal to or lower than the melting temperature of the solvent forms a conductive polymer on the entire substrate,
It is not possible to have an arbitrary shape and to be able to cope with a fine electrode pad. In addition, a composition containing a conductive polymer and a precursor that generates a dopant by exposure to energy is exposed to an energy source to decompose the dopant precursor to generate a dopant, and to make the exposed region conductive. In the method of forming a conductive polymer structure and dissolving and removing a region other than a region exposed to an energy source by exposing to a solvent, a compound that can be used as a dopant is limited to a special molecular structure such as an onium salt, Since the number of conductive polymers soluble in a solvent is small, it is difficult to manufacture a polymer in which performance such as conductivity and flexibility is arbitrarily controlled.

Further, in the electrolytic polymerization method, it is difficult to suppress the spread in the electrode surface direction and grow the conductive polymer to a sufficient height. In addition, considering the application of conductive polymers to the contact pins for inspection of high-density printed wiring boards, conductive polymers are generally rigid and insoluble because they have a conjugated system that extends in the main chain direction of the polymer. Many are infusible,
When used alone, there arises a problem that it is difficult to form a stable electrical connection by being in close contact with electrode pads having poor flexibility and different heights.

SUMMARY OF THE INVENTION An object of the present invention is to provide a highly conductive and flexible contact pin capable of coping with fine wiring pads used in an electrical inspection device for a high-density printed wiring board, and a method of manufacturing the same. It is to be.

[0013]

According to the present invention, there is provided a contact pin for inspecting a printed wiring board, comprising a mixed composition of a photosensitive resin and a conductive polymer, or a mixed composition of a reaction product of a photosensitive resin and a conductive polymer. It is characterized by consisting of things.
For this reason, the contact pin for printed circuit board inspection of the present invention can be made highly conductive and flexible by selecting a combination of a photosensitive resin and a conductive polymer.

Further, the method of manufacturing a contact pin for inspecting a printed wiring board according to the present invention is a method of manufacturing a contact pin which is connected to an electrode pad of a wiring pattern and performs failure analysis. Forming a mixture layer containing an oxidizing agent comprising an expensive transition metal salt having Fe3 +, Cu2 +, Cr6 +, Mn7 + or Sn4 + as a cation, and patterning a corrosion-resistant image by a photochemical reaction method; The method is characterized by including a step of developing a corrosion-resistant image and a step of polymerizing a monomer of a conductive polymer. According to the manufacturing method of the present invention, a lithography method using a photochemical reaction can be applied.
An electrode pad of μm or less can also be manufactured.

As described above, by implementing the present invention, a highly conductive and highly flexible contact pin can be formed.
It can be manufactured with a high-definition pattern of μm or less, and an electrical inspection of a high-density printed wiring board can be reliably performed.

In the present invention, the photosensitive resin is a resin capable of forming a corrosion-resistant image by a usual photochemical reaction method and a resin obtained by a photochemical reaction method, and includes various negative photoresists, positive photoresists and dry photoresists. Film resist, a multi-layer resist is used, a photosensitive resin having an acrylic compound as a main component is preferable from the viewpoint of ease of production, and in particular, an acrylic compound having a urethane bond is preferable from the viewpoint of flexibility of the obtained resin, Among them, an acrylic compound having a linear alkylene group having 4 to 22 carbon atoms and a urethane bond is preferable. When the number of carbon atoms of the straight-chain alkylene group is 4 or less, the resulting acrylic compound becomes rigid and poor in flexibility.
Above, on the contrary, it is too soft, and the elasticity required as a contact pin cannot be obtained.

In the present invention, at least a polyfunctional acrylate monomer or oligomer may be included for the purpose of introducing a crosslinked structure into a part of the molecular structure. Such polyfunctional acrylate compounds include, for example, bifunctional acrylates such as ethylene glycol diacrylate and their methacrylate compounds, polyfunctional acrylates such as trimethylolpropane triacrylate and their methacrylate compounds.

In the present invention, a polymerization initiator can be added to the photocurable resin as required. Examples of the polymerization initiator include, for example, acetophenone compounds such as diethoxyacetophenone, benzoin compounds such as benzoin methyl ether and benzoin isobutyl ether, benzophenone compounds, and thioxanthone compounds.

In the present invention, the conductive polymer is a polymer itself which is a conductive polymer, and includes π-electron conjugated polymers such as polyacetylene and polyparaphenylene containing a dopant. From the viewpoints of easy formation of a complex with a resin and stability of a conductive state, those containing at least one of polypyrrole, polyethylenedioxythiophene, and polyaniline are preferable.

In the manufacturing method of the present invention, the electrode pad is used as a lead electrode of a contact pin for inspection, and its shape and material are not particularly limited. Copper, gold, titanium, indium, and various alloys are used. The wiring board supports the electrode pads, and is conventionally known as a wiring board such as a glass-epoxy composite film substrate, a polyimide substrate, a ceramic substrate, and the like. It is used with wiring.

In the production method of the present invention, the expensive transition metal salt is a salt having a cation of Fe3 +, Cu2 +, Cr6 +, Mn7 +, Sn4 +, or the like, and is an oxidizing agent comprising a photosensitive resin and an expensive transition metal salt. As a method for forming a mixture layer containing the same, a general coating film forming method such as a dip coater, a spin coater, a bar coater, and a roll coater can be used.

In the production method of the present invention, a method of patterning a corrosion-resistant image by a photochemical reaction method on a mixture layer containing an oxidizing agent composed of a photosensitive resin and an expensive number of transition metal salts may be a conventional photochemical reaction. There is no particular limitation, and irradiation is performed with visible light, ultraviolet light, an argon laser, a Kr-F laser, or the like using a metal mask, a photomask, or the like.

Further, in the manufacturing method of the present invention, after irradiation with light, development is performed with various developing solutions corresponding to the photosensitive resin layer to form a predetermined pattern. In the manufacturing method of the present invention, after the development, the conductive polymer is polymerized by contact with the conductive polymer monomer, or after forming a corrosion-resistant pattern by a photochemical reaction method, the conductive polymer monomer is included. The development of the photosensitive resin and the polymerization of the conductive polymer can be simultaneously performed using an organic solvent. In the latter case, the organic solvent is not particularly limited, but alcohol solvents such as ethyl alcohol, butyl alcohol, and isopropyl alcohol are preferable because of the ease of polymerization reaction.

In the manufacturing method of the present invention, after the conductive polymer is formed, doping is performed to increase the conductivity, and a new function such as heat resistance can be provided. As such a doping method, a molded body containing a conductive polymer is brought into contact with a gas such as iodine, immersed in a solution of various sulfonic acids, carboxylic acids, phosphoric acids, or the like, or oxidized with ferric chloride or the like. For example, a method of immersing the composition in an agent solution. On this occasion,
The doping temperature, time, and the like are not particularly limited, and are appropriately selected depending on the material used.

[0025]

BRIEF DESCRIPTION OF THE DRAWINGS In order to clarify the above and other objects, features and advantages of the present invention, embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 shows the structure of a contact pin for inspecting a printed wiring board to be manufactured by the manufacturing method of the present invention. An electrode pad 2 is formed on a wiring board 3 for printed wiring board inspection, and a contact pin 1 is provided in connection with the electrode pad 2. This is pressed against the printed wiring board 6 to be inspected to perform the inspection.

The contact pin for inspecting a printed wiring board of the present invention is manufactured by the method shown in FIGS.
That is, a mixture layer 4 containing an oxidizing agent composed of a photosensitive resin and an expensive number of transition metal salts is formed on a wiring substrate 3 provided with an electrode pad 2 (FIG. 2), and a photochemical reaction method is performed using a photomask 5. To form a corrosion resistant image (FIG. 3). Next, the corrosion-resistant image is developed, and a conductive polymer monomer is polymerized to form a protrusion made of a molded product of a mixed composition of a photosensitive resin and a conductive polymer. Pins (FIG. 4).

In the manufacturing method according to the present invention, since a step of patterning the photosensitive resin layer by a photochemical reaction method is employed, contact pins of an arbitrary shape are densely arranged at intervals of about several μm by a photomask. Can be formed. Further, in the present invention, since the molecule itself is not a particulate material such as carbon or metal powder as the conductive material of the contact pin, but the molecule itself is a conductive polymer, the formation interval is substantially the same as the pattern formation of the photosensitive resin. It is possible to reduce to the accuracy. Further, the height of the contact pin can be controlled by the thickness of the photosensitive resin layer. Therefore,
Another advantage is that a plurality of photochemical reactions can be combined to form contact pins of different heights.

[0029]

EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.

Example 1 A copper foil was adhered on a glass epoxy substrate to form a wiring pattern, and an electrode pad portion was blackened. An ethanol solution (concentration: 30% by weight) in which ferric dodecylbenzenesulfonate was dissolved was placed on this substrate.
UX-320, a urethane acrylate-based photosensitive resin containing 50% by weight of
4, hexamethylene diisocyanate) was heated and dropped at 60 ° C., a 100 μm resin layer was formed using a bar coater, and dried under reduced pressure at room temperature for 24 hours. Next, interval 1
A metal mask having a circular opening of 50 μm in diameter and having a diameter of 50 μm was brought into close contact with the mask and irradiated with ultraviolet light at an irradiation intensity of 5 mW / cm 2 for 5 seconds to form a corrosion-resistant image. Thereafter, the obtained substrate was immersed in butyl alcohol to develop a corrosion-resistant image.

Next, the obtained substrate is immersed in methanol containing 5% by weight of pyrrole and reacted at room temperature for 6 hours.
A urethane acrylate-based photosensitive resin molded product on which conductive polypyrrole was formed was obtained. This compact has a diameter of 50μ
m, a column having a height of 100 μm and a shape suitable for a contact pin for inspection of a printed wiring board. Since the obtained contact pin can be elastically deformed up to 15% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 15Ω, not only the open / short inspection but also the operation test of the printed wiring board can be performed.

(Example 2) A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern, and the electrode pad was blackened. A substrate having a corrosion-resistant image formed by forming a urethane acrylate-based photosensitive resin layer containing iron was obtained. The substrate is immersed in butyl alcohol containing 5% by weight of pyrrole, and held at room temperature for 30 minutes to simultaneously develop a corrosion-resistant image and polymerize polypyrrole, thereby forming a urethane acrylate-based photosensitive resin molded article on which conductive polypyrrole is formed. I got This molded product has a diameter of 50 μm and a height of 90 μ
m and a shape suitable for a contact pin for inspection of a printed wiring board.

The obtained contact pin has a height of 15
%, It can be closely attached to wiring pads of different heights, and has an electric resistance of 1%.
Since the resistance is 2Ω, not only the open / short inspection of the printed wiring board but also the operation test can be performed.

Example 3 A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern, and the electrode pads were blackened. Then, the ferric dodecylbenzenesulfonate of Example 1 was applied. A substrate having a corrosion-resistant image formed by forming a urethane acrylate-based photosensitive resin layer in the same manner as in Example 1 except that ferric paratoluenesulfonate was used instead was obtained. The substrate was immersed in isopropyl alcohol containing 5% by weight of pyrrole, and kept at room temperature for 15 minutes to simultaneously develop a corrosion-resistant image and polymerize polypyrrole, thereby forming a urethane acrylate-based photosensitive resin molded article having conductive polypyrrole formed thereon. I got This compact has a diameter of 50
It was a cylinder having a height of 100 μm and a height of 100 μm, and had a shape suitable for a contact pin for inspection of a printed wiring board.

The obtained contact pin has a height of 20.
%, It can be adhered to wiring pads of different heights, and has an electric resistance of 5%.
Because of Ω, not only open / short inspection of the printed wiring board but also operation test was possible.

Example 4 A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern, and the electrode pads were blackened. An ethanol solution (concentration 2) in which ferric butylnaphthalenesulfonate was dissolved was placed on this substrate.
Urethane acrylate-based photosensitive resin containing 50% by weight (KAYARAD UX, manufactured by Nippon Kayaku Co., Ltd.)
-3204) was added dropwise by heating to 60 ° C., and a 100 μm resin layer was formed using a bar coater.

Next, a metal mask having a circular opening having a diameter of 50 μm and having an interval of 100 μm is brought into close contact with the mask, and ultraviolet light is irradiated for 5 μm.
Irradiation was performed at an irradiation intensity of mW / cm 2 for 5 seconds to obtain a substrate on which a corrosion-resistant image was formed. The substrate was immersed in butyl alcohol containing 5% by weight of pyrrole, and kept at room temperature for 30 minutes to simultaneously develop the corrosion-resistant image and polymerize the polypyrrole to obtain an acrylate-based photosensitive resin molded article on which conductive polypyrrole was formed. Obtained. This molded product was a column having a diameter of 50 μm and a height of 90 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board.

The obtained contact pin has a height of 15
%, It can be closely attached to wiring pads of different heights, and has an electric resistance of 8%.
Since the resistance is 0Ω, not only the open / short inspection of the printed wiring board but also the operation test can be performed.

Fifth Embodiment A copper foil is adhered on the glass epoxy substrate of the first embodiment to form a wiring pattern, and the electrode pad portion is blackened. Then, as a urethane acrylate resin, the KAYARAD UX- of the first embodiment is used. A resin layer was formed by the method of Example 1 except that Aronix M-5700 manufactured by Toa Gosei Co., Ltd. was used instead of 3204.

Next, a metal mask having a circular opening with a diameter of 50 μm and an interval of 100 μm is brought into close contact with each other, and ultraviolet light is irradiated for 5 minutes.
Irradiation was performed at an irradiation intensity of mW / cm 2 for 5 seconds to obtain a substrate on which a corrosion-resistant image was formed. The substrate is immersed in butyl alcohol containing 5% by weight of pyrrole, and held at room temperature for 30 minutes to simultaneously develop a corrosion-resistant image and polymerize polypyrrole, thereby forming a urethane acrylate-based photosensitive resin molded article on which conductive polypyrrole is formed. I got This compact has a diameter of 50
It was a cylinder having a height of 90 μm and a height of 90 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board.

The obtained contact pin has a height of 15
%, It can be closely attached to wiring pads of different heights, and has an electric resistance of 2%.
Since the resistance is 5Ω, not only the open / short inspection of the printed wiring board but also the operation test can be performed.

Example 6 A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern, and the electrode pad portion was blackened. A substrate having a corrosion-resistant image formed by forming a urethane acrylate-based photosensitive resin layer containing iron was obtained. This substrate is immersed in butyl alcohol, and
After holding for 0 minute, development of the corrosion resistant image was performed.

Next, the obtained substrate was immersed in methanol containing 5% by weight of aniline and reacted at room temperature for 6 hours.
A urethane acrylate-based photosensitive resin molded product on which conductive polyaniline was formed was obtained. This compact has a diameter of 50μ
m, a column having a height of 100 μm and a shape suitable for a contact pin for inspection of a printed wiring board.

The obtained contact pin has a height of 15
% Can be elastically deformed, and thus can be closely attached to wiring pads of different heights. Further, since the electric resistance is 300Ω, not only the open / short inspection but also the operation test of the printed wiring board can be performed.

(Example 7) A copper foil was adhered on the glass epoxy substrate of Example 1 to form a wiring pattern, and the electrode pad portion was blackened. Then, the ferric dodecylbenzenesulfonate of Example 1 was added. A substrate having a corrosion-resistant image formed by forming a urethane acrylate-based photosensitive resin layer in the same manner as in Example 1 except that ferric paratoluenesulfonate was used instead was obtained. This substrate was immersed in butyl alcohol containing 5% by weight of ethylenedioxythiophene, and
The development of the corrosion-resistant image and the polymerization of ethylenedioxythiophene were carried out simultaneously for 5 minutes to obtain a urethane acrylate-based photosensitive resin molded article on which conductive polyethylenedioxythiophene was formed. This molded product was a column having a diameter of 50 μm and a height of 100 μm, and had a shape suitable for a contact pin for inspecting a printed wiring board.

The obtained contact pin has a height of 20.
%, It can be adhered to wiring pads of different heights, and the electric resistance is 6%.
Because of Ω, not only open / short inspection of the printed wiring board but also operation test was possible.

It should be noted that the present invention is not limited to the above-described embodiments, and it is apparent that the embodiments can be appropriately modified within the scope of the technical idea of the present invention.

[0048]

As described above, according to the present invention,
A contact pin for inspection of a printed wiring board made of a mixed composition of a photosensitive resin and a conductive polymer, or a mixed composition of a reaction product of a photosensitive resin and a conductive polymer is exposed to a wiring board having electrode pads. Forming a mixture layer containing an oxidizing agent comprising a conductive resin and an expensive number of transition metal salts, patterning a corrosion-resistant image by a photochemical reaction method, developing the corrosion-resistant image, and a monomer of a conductive polymer And a method for manufacturing a highly conductive and highly flexible contact pin that can cope with fine wiring pads.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a printed wiring board inspection board having contact pins according to the present invention and a method of using the same.

FIG. 2 is a cross-sectional view of a method for manufacturing a contact pin for inspecting a printed wiring board, in which a photosensitive resin layer containing an oxidizing agent composed of an expensive number of transition metal salts is formed on an inspection substrate having electrode pads.

FIG. 3 is a cross-sectional view of a method of manufacturing a contact pin for inspecting a printed wiring board, in which a corrosion-resistant image is formed on a test substrate provided with electrode pads using a photomask.

FIG. 4 is a cross-sectional view of the method for manufacturing a contact pin for inspecting a printed wiring board in which the photosensitive resin layer is developed to provide a protrusion of a molded body of a conductive polymer and a photosensitive resin from FIG. It is.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductive contact pin 2 Electrode pad 3 Substrate of printed wiring board inspection device 4 Mixed composition layer of photosensitive resin and conductive polymer 5 Photomask 6 Printed wiring board to be inspected

Continuation of the front page (72) Inventor Toyoichi Nakamura 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (72) Inventor Hajime Kusumi 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (56) References JP-A-5-55314 (JP, A) JP-A-7-235739 (JP, A) JP-A-3-179760 (JP, A) JP-A-5-175484 (JP, A) Japanese Unexamined Patent Publication No. Hei 1-209734 (JP, A) Japanese Unexamined Patent Publication No. Hei 4-62837 (JP, A) Japanese Unexamined Patent Publication No. 2-101461 (JP, A) Japanese Unexamined Patent Publication No. Hei 4-17956 (JP, A) (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01R 1/06-1/073 G01R 31/26 H01L 21/66 H05K 3/00

Claims (12)

(57) [Claims] 1. A contact pin for inspecting a printed wiring board, comprising a mixed composition of a photosensitive resin and a conductive polymer, or a mixed composition of a reaction product of a photosensitive resin and a conductive polymer. 2. The contact pin according to claim 1, wherein the photosensitive resin contains an acrylic compound as a main component. 3. The contact pin according to claim 2, wherein the acrylic compound has a urethane bond. 4. The acrylic compound has 4 to 22 carbon atoms.
The printed circuit board inspection contact pin according to claim 2, wherein the contact pin has the following alkylene group and urethane bond. Wherein said conductive polymer is polypyrrole, polyethylene dioxythiophene and the printed wiring board inspection contact according to any one of claims 1-3, wherein the polyaniline is those containing at least one, pin. 6. A photosensitive resin and Fe3 +, Cu2 +, Cr6 +, Mn7 +, or Sn4
Forming a mixture layer containing an oxidizing agent comprising an expensive number of transition metal salts having + as a cation, forming a corrosion-resistant image by a photochemical reaction method, developing the corrosion-resistant image, And c. Polymerizing a monomer of a molecule. 7. The method according to claim 1, wherein the step of developing the corrosion-resistant image and the step of polymerizing the monomer of the conductive polymer are performed simultaneously using an organic solvent containing a monomer of the conductive polymer. Item 7. The method for manufacturing a contact pin for printed circuit board inspection according to Item 6. 8. The method according to claim 7, wherein the organic solvent contains an alcohol-based solvent as a main component. Wherein said photosensitive resin according to claim 6-8 method of manufacturing a printed wiring board inspection contact pin according to any one characterized by including acrylic compound. 10. The method according to claim 9, wherein the acrylic compound has a urethane bond. 11. The method according to claim 9, wherein said acrylic compound has an alkylene group having 4 to 22 carbon atoms and a urethane bond. 12. A solution comprising monomers of the conductive polymer pyrrole, ethylenedioxythiophene printing according to any one of claims 6 to 11, characterized in that, and an alcohol solution containing at least one aniline Manufacturing method of contact pins for wiring board inspection.