JP3077673B2 - Manufacturing method of wiring board inspection contact pin and wiring board inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a contact pin used in a wiring board inspection apparatus and a wiring board inspection apparatus, and more particularly to a fine wiring pad made of a conductive polymer capable of forming a pattern with high conductivity. The present invention relates to a method of manufacturing a contact pin having high flexibility and a wiring board inspection apparatus used for electrical inspection of a wiring board.

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic devices, the density of wiring has been increasing on printed wiring boards. For this reason, there is an increased risk of disconnection of fine wiring, poor connection, and the like, and a demand for a simple and reliable printed wiring inspection method is increasing. As an inspection method that meets such a demand, a method of directly connecting a contact pin to an electrode pad of a wiring pattern and performing a failure analysis can be considered.
It is one of the important technical elements to use contact pins that can be stably connected to electrode pads having a connection surface height of not more than 00 μm. That is, there is a need for a conductive contact pin that can be finely processed and has high flexibility, and a simple manufacturing method thereof.

However, it is difficult to form a stable electrical connection with electrode pads having different heights because a contact pin mainly made of a conductive metal or ceramic is rigid and poor in flexibility. Also, in order to solve this problem, in a contact pin in which fine particles of conductive metal, ceramic, carbon, or the like are dispersed in a flexible polymer material, a conductive path (conductive path) is formed throughout the pin. In order to form the conductive powder, at least 20% by weight or more of the conductive powder is required, depending on the particle size of the fine powder. In such a case, flexibility is lost. Furthermore, even if a material having sufficient conductivity and flexibility including a conductive powder is obtained, these conductive powders usually have a particle size of several tens of μm or more. It is difficult to process the substrate into a shape that can be connected to an electrode pad with a spacing of 100 μm or less used for the substrate.

For this reason, inspection of a high-density printed wiring board employs a method such as visual observation or image analysis.
However, in this method, since only the electrical connection is indirectly observed, it is difficult to reliably detect a minute disconnection or a defect. For this reason, at present, highly reliable electrical inspection has not been performed on electrode pads having an interval of 100 μm or less used for high-density printed wiring boards.

On the other hand, conductive polymers such as polypyrrole and polyaniline have been developed as polymers themselves having electrical conductivity, and are used for electrodes and the like of electronic parts.
Known methods for polymerizing conductive polymers such as polypyrrole include oxidative cationic polymerization using an expensive number of transition metal salts as an oxidizing agent, and electrolytic polymerization in which aromatic monomers are electrochemically oxidized and polymerized. .

For example, Japanese Patent Application Laid-Open No. 3-46214 discloses a conductive polypyrrole which is prepared by mixing ferric dodecylbenzenesulfonate and a methanol solution of pyrrole at -30.degree. C. or lower and heating to -20.degree. Is disclosed. In addition, Japanese Unexamined Patent Publication
Japanese Patent Application Laid-Open No. 1-209225 discloses that a 1-V battery is prepared using an electrolyte containing a 5-membered heterocyclic compound and a sulfonate having a molecular weight of 300 or less.
A method of forming a highly conductive polymer on the electrode surface by performing an electrolytic polymerization reaction at the following potential is disclosed. Further, Japanese Patent Application Laid-Open No. 2-224316 discloses a method in which the surface of a porous molded body is wetted with an electrolytic solution, and electrolytic polymerization is performed using a working electrode provided in contact with the porous molded body to form a dendritic or mesh-like conductive polymer on the surface. There is disclosed a method for producing a solid electrolytic capacitor in which a compound is formed and then an electrolyte is formed by electrolytic polymerization using the dendritic or mesh-like conductive polymer as an anode.

Japanese Patent No. 2657956 discloses a method for producing a conductive polymer having an arbitrary pattern shape.
In the publication, a conductive polymer composition containing a polyparaphenylene vinylene, a polyaniline, a precursor that generates a dopant by exposure to energy and a polypyrrole is exposed to an energy source to decompose the dopant precursor,
A method for forming a conductive polymer structure that generates dopants to render exposed regions conductive, and exposes the conductive polymer structure to a solvent to dissolve and remove regions other than the regions exposed to the energy source. A method for forming a conductive polymer structure is disclosed.

[0008] Since these techniques are methods for forming a conductive molded body using an organic polymer, even when applied to a contact pin for inspection of a high-density printed wiring board, they are more flexible and stable than metals and ceramics. It is considered that the electrical connection has a certain effect.

[0009]

As described above, the inspection of a high-density printed wiring board has conventionally been carried out by visual inspection or image analysis. It is difficult to detect the electric current at a time, and at present the electric inspection with high reliability has not been performed.

Various methods of polymerizing a conductive polymer with an organic polymer and forming a molded body have been developed. However, a conductive material applicable to a contact pin for inspection of a high-density printed wiring board capable of forming a pattern with high conductivity. A method for producing a conductive polymer has not been developed. That is, in a method in which a solution in which the reaction is suppressed at a low temperature is polymerized by raising the temperature or a method in which the conductive polymer is polymerized at a temperature lower than the melting temperature of the solvent, a conductive polymer is formed on the entire surface of the substrate, and It is not a shape and it can not cope with a fine electrode pad. In addition, a composition containing a conductive polymer and a precursor that generates a dopant by exposure to energy is exposed to an energy source to decompose the dopant precursor to generate a dopant, and to make the exposed region conductive. In the method of forming a conductive polymer structure and dissolving and removing the region other than the region exposed to the energy source by exposing to a solvent, the compound that can be used as a dopant is limited to a special molecular structure such as an onium salt, Since the number of conductive polymers dissolved by the method is small, it is difficult to manufacture a polymer having arbitrarily controlled properties such as conductivity and flexibility. Furthermore, it is difficult to grow the conductive polymer to a sufficient height by suppressing the spread in the electrode surface direction by the electrolytic polymerization method.

In addition, considering the application of a conductive polymer to a contact pin for inspection of a high-density printed wiring board, a conductive polymer generally has a conjugated system that extends in the main chain direction of the polymer, so that it is rigid. However, there are many insoluble and infusible materials, and when used alone, there arises a problem that it is difficult to form a stable electrical connection by being in close contact with electrode pads having poor flexibility and different heights.

A main object of the present invention is to provide a high-conductivity and highly flexible wiring board inspection which can cope with fine wiring pads of a wiring board inspection apparatus used for electrical inspection of a printed wiring board. It is an object of the present invention to provide a method of manufacturing contact pins for wiring and a wiring board inspection device.

[0013]

According to the present invention, there is provided a method of manufacturing a contact pin for inspecting a wiring board, comprising the steps of: forming a fine particle layer made of an organic polymer; A liquid, and electrolytically polymerizing the monomer. The wiring board inspection apparatus according to the present invention includes a contact pin having a rod-shaped contact pin formed by forming a conductive path by continuously forming a conductive path while a conductive polymer surrounds fine particles made of an organic polymer. It is.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing an example of a wiring board inspection apparatus and its use. The wiring board inspection apparatus 10 shown in FIG. 1 can be manufactured by forming an electrode pad 2 on a support plate 3 and providing a wiring board inspection contact pin 1 connected to the electrode pad 2. This contact pin 1 is manufactured by the manufacturing method of the present invention. Then, the contact pins 1 are pressed against a wiring board 14 to be inspected, for example, a printed wiring board to
Test 4 is performed.

As shown in FIGS. 2 and 3, an example of a method for manufacturing a contact pin for inspecting a wiring board according to the present invention is shown in FIG.
Fine particles 4 made of an organic polymer on a support plate 3 provided with
a) forming a layer (particle layer 4);
a) providing an electrolytic solution 6 containing a monomer of a conductive polymer around a, and subjecting the monomer in the electrolytic solution 6 to electrolytic polymerization.

The above-mentioned electrode pad 2 is used as a lead electrode of a contact pin for inspection, and its shape,
The material is not particularly limited, and it can be configured by using a conductive material such as copper, gold, titanium, indium, or various alloys in a shape corresponding to a wiring board such as a printed wiring board to be inspected.

The support plate 3 supports electrode pads, and can be formed of a conventionally known electric insulating material as a wiring substrate such as a glass-epoxy composite film substrate, a polyimide substrate, or a ceramic substrate. It is used by providing wiring from to the electrode pad.

The fine particles 4a made of an organic polymer include fine particles of a thermoplastic polymer such as polyethylene, polypropylene, polyvinylene chloride, and polyvinylidene fluoride; thermosetting resins such as polyurethane, epoxy resin, and phenol resin; Fine particles consisting of organic polymers containing engineering plastics such as fluoroethylene and polyimide as the main components. Fine particles as components are preferred.

The shape and size of the fine particles are not particularly limited, and particles having various shapes and sizes including spherical ones can be used as needed. In order to obtain a pin, it is preferable that the particle size is small, and particularly, from the viewpoint of obtaining stable performance, those having the same shape and particle size are preferable. As a method for obtaining the fine particles composed of these organic polymers, a method for producing polymer fine particles and then classifying them, or a method for producing ordinary monodispersed polyparticles such as seed polymerization can be used.

As a method of forming the fine particle layer 4 made of an organic polymer, fine particles made of an organic polymer are directly scattered on a substrate, a solution containing fine particles is prepared and then spray-dried on the substrate, or And a method in which the solution is used with a usual coating film forming apparatus such as a dip coater, a spin coater, a bar coater, and a roll coater.
In particular, in the method using a solution, a binder may be used for the purpose of strengthening the adhesion between the fine particles, or a photosensitive resin may be mixed and partially insolubilized using a photochemical reaction technique. It is also possible to form an arbitrary opening by using a method such as photolithography before forming a fine particle layer made of an organic polymer, and to form a fine particle layer only in that portion. Furthermore, it is also possible to form an organic polymer layer composed of fine particles of polymer by performing a photochemical reaction using a photosensitive monomer solution or the like capable of forming an acrylic resin.

In the present invention, the conductive polymer is a polymer itself which is a conductive polymer, and includes a π-electron conjugated polymer such as polyacetylene or polyparaphenylene containing a dopant. Polypyrrole, polythiophene, polyethylenedioxythiophene and polyaniline are preferred from the viewpoint of easiness and stability of the conductive state. The conductive polymer monomer is not particularly limited as long as it becomes a conductive polymer by electrolytic polymerization, and is preferably pyrrole, thiophene, ethylenedioxythiophene, or aniline. In the present invention,
These conductive polymer monomers may include, in addition to pyrrole, thiophene, and the like, derivatives thereof as long as they do not prevent electrolytic polymerization. That is, in the case of pyrrole or thiophene, the bond is formed at the 2-position and the 5-position, so that the compound in which the 3- or 4-position is substituted with an alkyl group or the like can be electrolytically polymerized. It can be used for a method of manufacturing a pin.

The method of electrolytically polymerizing the monomer of the conductive polymer is not particularly limited as long as it is ordinary electrolytic polymerization.
Specifically, a method in which two electrodes are brought into contact with an electrolytic solution containing a monomer of a conductive polymer, a voltage is applied, and the monomer is subjected to anodic oxidation polymerization is used. In the manufacturing method of the present invention, since the conductive polymer is formed in the voids of the fine particles made of the organic polymer, from the viewpoint of growing the contact pins in the vertical direction and improving the adhesion to the electrode pad, the electrolytic polymerization is performed. Is preferably performed at least at two or more different potentials.
It is preferable to carry out the reaction at a potential of at least twice the oxidation potential of the monomer of the conductive polymer and at a potential of 1 to 1.5 times the oxidation potential of the monomer of the conductive polymer.

As the electrolyte, an acetonitrile solution containing, as an electrolyte salt, an inorganic salt such as lithium perchlorate or lithium borofluoride, or an organic salt such as tetrabutylammonium paratoluenesulfonate as an electrolyte salt in addition to the conductive polymer monomer. And a benzonitrile solution.

In the present invention, the contact pin is produced by allowing a monomer of a conductive polymer to exist around fine particles made of an organic polymer and polymerizing the monomer. Therefore, the contact pin is formed by forming a conductive polymer in a void portion of fine particles made of an organic polymer, and is characterized by being capable of large elastic deformation and having high conductivity.

Hereinafter, the present invention will be described in more detail with reference to FIGS. A preferred method of manufacturing the contact pin will be described below with reference to FIGS. As shown in FIG. 2, a layer of fine particles 4a made of an organic polymer (fine particle layer 4) is previously formed on a support plate 3 provided with electrode pads 2.
Next, as shown in FIG. 3, an electrolytic solution 6 containing a conductive polymer monomer is supplied around the fine particle layer 4. As a result, the electrolytic solution 6 covers the fine particle layer 4, and a part of the electrolytic solution 6 covers the fine particles 4a.
Penetrate into the voids around. Next, when the monomer in the electrolytic solution 6 on the electrode pad 2 is electrolytically polymerized, the conductive polymer 5 is formed on the electrode pad 2 so as to surround the fine particles 4a. Next, unnecessary portions, that is, the fine particles 4a and the unpolymerized monomer existing between the electrode pads 2 are removed. As a result, as shown in FIG. 4, a projection made of organic polymer fine particles 4a and conductive polymer 5 is formed. This projection is used as the contact pin 1. In the contact pin 1, as shown in FIG.
Since the conductive polymer 5 is continuous, a conductive path is formed. Therefore, the contact pin 1 is conductive. Also,
Since the fine particles 4a are present in the continuous layer made of the conductive polymer 5, the contact pin 1 is rich in flexibility. The fine particles 4a are preferably crosslinked.

Moreover, in the manufacturing method according to the present invention, since the contact pins 1 having a columnar shape (pin-shaped thin rods) corresponding to the shape of the electrode pads 2 can be formed, the spacing of 100 μm or less used for a high-density printed wiring board can be obtained. Electrode pads can also be made. Therefore, if the contact pins 1 according to the manufacturing method of the present invention are used, the electrical inspection of the high-density printed wiring board can be reliably performed. In addition, since the conductive material of the contact pin 1 is not a particulate material such as carbon or metal powder, but a molecule itself is used as a conductive polymer, the formation interval of the contact pin 1 is substantially the same as that of the electrode pad 2. It is possible to reduce the pattern forming accuracy. Also, the height of the contact pin 1 depends on the electrolytic polymerization conditions,
It can be controlled mainly by voltage and polymerization time.

As shown in FIG. 1, in the example of the wiring board inspection apparatus of the present invention, a plurality of conductive electrode pads 2 are provided on an electrically insulating support plate 3 on which wirings 12 are provided. A rod-shaped contact pin 1 to be brought into contact with the wiring board 14 is provided on each of the electrode pads 2 for electrically testing the wiring board 14; The rod-shaped contact pin 1
As shown in FIG. 4, an inspection apparatus 10 includes a conductive polymer 5 surrounding fine particles 4a made of an organic polymer, and the conductive polymer 5 continuously forming a conductive path. The inspection device 10 can be manufactured by the manufacturing method, and the contact pin 1 can be formed by, for example, the manufacturing method. The fine particles 4a are preferably crosslinked.
With this wiring board inspection apparatus, it is possible to perform an electrical inspection of a high-density printed wiring board.

As an example of a method of inspecting a wiring board, as shown in FIG. 1, a wiring board inspection apparatus 10 is pressed against a wiring board 14 so that the contact pins 1 are brought into contact with a circuit formed on the wiring board 14, and the wiring 12, An electric signal for inspection is given to the circuit through the electrode pad 2 connected to the wiring 12 and the contact pin 1 connected to the electrode pad 2, and the electric signal passing through the circuit is transmitted through another contact pin 1. This is a method of extracting and analyzing as an output signal.

[0029]

EXAMPLES Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to these Examples, and within the scope of the technical idea of the present invention,
Obviously, each embodiment can be appropriately changed. The wiring board inspection apparatus 10 shown in FIGS. 1 and 4 having the contact pins 1 according to the manufacturing method shown in FIGS. Example 1 A copper foil was adhered on a glass epoxy substrate to form a wiring pattern 12, and an electrode pad portion having a diameter of 50 μm was blackened. This support plate 3 has a particle diameter of 6 μm obtained by seed polymerization.
Of divinylbenzene-based cross-linked polymer (Lunapearl LC600, manufactured by Kao Corporation) of 1 kg / cm ²
To form a fine particle layer 4 made of an organic polymer having a thickness of 80 μm. Next, this substrate was immersed in an electrolytic solution 6 consisting of an acetonitrile solution containing 0.1 mol / l of pyrrole and 0.25 mol / l of tetraethylammonium paratoluenesulfonate.
A voltage of V was applied. Two minutes later, the voltage was reduced to 3.6 V and 6
The reaction was continued for 0 minutes. As a result, conductive polypyrrole was formed in the voids of the fine particle layer 4 made of an organic polymer in contact with the electrode pad 2. The substrate is immersed in methanol, and the portion of the fine particles 4a where the conductive polypyrrole is not formed is removed using an ultrasonic cleaner. And a wiring board inspection apparatus 10 having the columnar contact pins 1 having a height of 100 μm. Since the obtained contact pin 1 can be elastically deformed up to 25% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 15Ω, not only the open / short inspection but also the operation test of the printed wiring board can be performed.

Example 2 An acrylate-based photosensitive resin (M5700, manufactured by Toagosei Co., Ltd.) heated to 80 ° C. was dropped on the surface of the support plate 3 of Example 1, in which the electrode pad portion was blackened. A 100 μm resin layer was formed using a bar coater. This resin layer was irradiated with ultraviolet light at an irradiation intensity of 5 mW / cm ² for 5 seconds. Then, it was immersed in butyl alcohol to remove unreacted substances and reaction by-products. Observation with a scanning electron microscope revealed that this resin layer was composed of fine particles 4a having an average particle size of 4 μm connected in a network. This substrate was immersed in the electrolytic solution 6 of Example 1 and subjected to electrolytic polymerization in the same manner as in Example 1. As a result, conductive polypyrrole was formed in the voids of the fine particle layer 4 made of an organic polymer in contact with the electrode pad 2. The substrate was immersed in n-hexane, and the portion of the fine particle layer 4a where the conductive polypyrrole was not formed was removed using an ultrasonic cleaner, and the diameter of the conductive polymer 5 and the organic polymer fine particles 4a was 50 μm.
The wiring board inspection apparatus 10 having the columnar contact pins 1 having a height of 110 μm was manufactured. Since the obtained contact pin 1 can be elastically deformed up to 15% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 85Ω, not only the open / short inspection but also the operation test of the printed wiring board can be performed.

Example 3 A fine particle layer 4 made of a divinylbenzene-based crosslinked polymer was formed by the method of Example 1 using the support plate 3 of Example 1 in which the electrode pad portion was blackened. Next, this substrate is
It was immersed in an electrolytic solution 6 composed of a benzonitrile solution containing mol / l thiophene and 0.25 mol / l lithium borofluoride, and a voltage of 30 V was applied using a nickel plate as a counter electrode. Two minutes later, the voltage was lowered to 4.1 V, and the reaction was continued for 60 minutes. As a result, conductive polythiophene was formed in the voids of the fine particle layer 4 made of an organic polymer in contact with the electrode pad 2. This substrate is immersed in methanol, and the portion of the fine particles 4a where the conductive polythiophene is not formed is removed using an ultrasonic cleaner. The diameter of the conductive polymer 5 and the fine particles 4a of the organic polymer is 50 μm and the height is 100 μm.
The wiring board inspection apparatus 10 having the m-shaped cylindrical contact pins 1 was manufactured. Since the obtained contact pin 1 can be elastically deformed up to 20% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 150Ω, not only the open / short inspection but also the operation test of the printed wiring board can be performed.

Example 4 A fine particle layer 4 made of a divinylbenzene-based crosslinked polymer was formed by the method of Example 1 using the support plate 3 of Example 1 in which the electrode pad portion was blackened. Next, this substrate is
mol / l ethylenedioxythiophene and 0.25m
It was immersed in an electrolytic solution 6 consisting of a benzonitrile solution containing ol / l lithium borofluoride, and a voltage of 20 V was applied using a nickel plate as a counter electrode. Two minutes later, the voltage was lowered to 3.9 V, and the reaction was continued for 60 minutes. As a result, conductive polyethylene dioxythiophene was formed in the voids of the fine particle layer 4 made of an organic polymer in contact with the electrode pad 2. This substrate was immersed in methanol, and the portion of the fine particles 4a where the conductive polyethylene dioxythiophene was not formed was removed using an ultrasonic cleaner, and the diameter of the conductive polymer 5 and the fine particles 4a of the organic polymer was 50 μm. Height 100μm
Was obtained. Since the obtained contact pin 1 can be elastically deformed up to 20% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 75Ω, not only the open / short inspection but also the operation test of the printed wiring board can be performed.

Example 5 A fine particle layer 4 made of a divinylbenzene-based crosslinked polymer was formed by the method of Example 1 using the support plate of Example 1 in which the electrode pad portion was blackened. Next, this substrate is
mol / l octylthiophene and 0.25 mol / l
Of benzonitrile solution containing lithium borofluoride, and a voltage of 20 V was applied using a nickel plate as a counter electrode. Two minutes later, the voltage was lowered to 3.9 V, and the reaction was continued for 60 minutes. As a result, conductive polyoctylthiophene was formed in the voids of the fine particle layer 4 made of an organic polymer in contact with the electrode pad 2. This substrate is immersed in methanol, and the portion of the conductive polyoctylthiophene where no conductive polyoctylthiophene is formed is removed using an ultrasonic cleaner,
A cylindrical contact pin 1 having a diameter of 50 μm and a height of 100 μm, comprising a conductive polymer 5 and organic polymer fine particles 4 a.
I got The obtained contact pin 1 has a height of 28%
Since the elastic deformation up to the maximum was possible, it was possible to adhere to wiring pads of different heights. The electric resistance is 2
Since it is 00Ω, not only an open / short inspection of the printed wiring board but also an operation test can be performed.

Example 6 A fine particle layer 4 made of a divinylbenzene-based crosslinked polymer was formed by the method of Example 1 using the support plate 3 of Example 1 in which the electrode pad portion was blackened. Next, this substrate is
It was immersed in an electrolytic solution 6 composed of an aqueous solution containing mol / l aniline and 0.2 mol / l sulfuric acid, and a voltage of 1.9 V was applied using a platinum plate as a counter electrode. After 30 seconds, increase the voltage to 0.3V
And the reaction was continued for 60 minutes. As a result, the electrode pad 2
A conductive polyaniline was formed in the voids of the fine particle layer 4 made of an organic polymer in contact with the polymer. This substrate was immersed in methanol, and the portion of the fine particles 4a where the conductive polyaniline was not formed was removed using an ultrasonic cleaner.
m, a cylindrical contact pin 1 having a height of 90 μm was obtained. Since the obtained contact pin 1 can be elastically deformed up to 10% of its height, it can be brought into close contact with wiring pads of different heights. Further, since the electric resistance is 35Ω, not only the open / short inspection of the printed wiring board but also the operation test can be performed.

[0035]

According to the present invention, there is provided a method of manufacturing a highly conductive and highly flexible contact pin which can cope with fine wiring pads. Further, according to the wiring board inspection apparatus of the present invention, an electrical inspection of a high-density printed wiring board can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a wiring board inspection apparatus and its use.

FIG. 2 is a cross-sectional view illustrating an example of the method of manufacturing a contact pin for wiring board inspection according to the present invention, showing a state in which a fine particle layer made of an organic polymer is formed on a support plate.

FIG. 3 is a cross-sectional view illustrating an example of a method of manufacturing a contact pin for wiring board inspection according to the present invention, showing a state where a conductive polymer is formed around fine particles.

FIG. 4 is a cross-sectional view illustrating an example of a wiring board inspection apparatus according to the present invention.

[Explanation of symbols]

1. Contact pins, 2. Electrode pads, 3. Support plate, 4. Fine particle layer, 4a Fine particles, 5. Conductive polymer, 6. Electrolyte, 10. Wiring board inspection device , 12
..Wiring, 14..Wiring boards (printed wiring boards)

Continuation of the front page (72) Inventor Daisaku Nakata 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation (56) References JP-A-5-55314 (JP, A) JP-A-7-235739 ( JP, A) JP-A-3-179760 (JP, A) JP-A-5-175484 (JP, A) JP-A-1-209734 (JP, A) JP-A-4-62837 (JP, A) JP JP-A-2-101461 (JP, A) JP-A-4-179956 (JP, A) JP-A-2-17672 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01R 1 / 06-1/073 G01R 31/26 H01L 21/66 H05K 3/00

Claims (6)

(57) [Claims] 1. A method comprising: forming a fine particle layer made of an organic polymer; and providing an electrolytic solution containing a conductive polymer monomer around the fine particles, and electrolytically polymerizing the monomer. Manufacturing method of a contact pin for wiring board inspection. 2. The method according to claim 1, wherein the fine particle layer made of an organic polymer is a fine particle layer containing a crosslinked polymer compound as a main component. 3. The method according to claim 1, wherein the step of electrolytically polymerizing the monomer of the conductive polymer is performed at at least two different potentials. 4. The two different potentials are a potential at least twice the oxidation potential of the monomer of the conductive polymer and a potential of 1 to 1.5 times the oxidation potential of the monomer of the conductive polymer. 4. The method for manufacturing a contact pin for inspecting a wiring board according to claim 3, wherein: 5. The wiring according to claim 1, wherein the conductive polymer monomer contains at least one of pyrrole, thiophene, ethylenedioxythiophene, and aniline. Manufacturing method of contact pins for board inspection. 6. A wiring board inspection apparatus for providing an electrical inspection of a wiring board by providing a plurality of rod-shaped contact pins on a support plate, wherein the rod-shaped contact pins are made of an organic polymer. A wiring board inspection apparatus characterized in that the conductive polymer surrounds the fine particles and the conductive polymer continuously forms a conductive path.