JP2969122B2 - Printing plate manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste for performing surface mounting on a printed circuit board, a resin sealant for sealing a semiconductor chip, a bump and an electric circuit for a semiconductor chip or a printed circuit board. The present invention relates to a method for manufacturing a printing plate for printing a conductive paste or the like for forming a printing plate.

[0002]

2. Description of the Related Art In recent years, wiring on printed circuit boards has been required to have higher densities, and the width of conductors has been reduced accordingly. The printing plate used is also required to be finely processed in line width.

For example, in order to perform surface mounting of components on a printed circuit board, a metal mask of a printing plate used when stencil printing a solder paste on a predetermined circuit conductor on the printed circuit board has a cross-sectional dimension of the pattern. It is required that the cross-sectional shape be as smooth as possible. This is because if the cross-section has significant irregularities, the solder pattern will be distorted when the plate is separated after stencil printing, and solder balls will be generated.

For this reason, as a method of manufacturing a metal mask having a smooth cross section, there is a thick-film nickel electrolytic plating method (additive method), and the wall surface of a photoresist layer formed on a conductor is obtained by electrolytic plating. Since the transfer pattern is formed on the cross section of the metal mask pattern, a relatively good cross-sectional shape can be obtained. However, thick-film nickel electroplating requires a long plating time, and it is difficult to control the positional accuracy of the pattern due to the stress generated during plating, and it is difficult to form a pattern with a high aspect ratio due to the performance of the photoresist. There are some problems such as difficulty.

As a method for solving these problems, there has been proposed a method of manufacturing a metal mask for screen printing by irradiating a metal sheet with a laser beam (JP-A-62-90241, JP-A-6-90241, JP-A-6-90241). No. 39988, “Surface mounting technology” (Vol. 3, No. 7, P76, 1
993), a metal mask manufactured by a laser method has been put to practical use as a solder paste printing plate.

When the pitch between the wiring circuit and the electrodes is reduced, the amount of the solder paste applied according to the electrode area is also reduced. If there are minute irregularities on the wall surface of the through hole of the printing plate used for such an application, solder paste remains on the irregularities, and the amount of solder paste to be printed fluctuates, which may cause troubles such as poor soldering. Not preferred.

In order to solve such a problem, an electrochemical chemical treatment such as electrolytic polishing of a metal mask is performed (Japanese Patent Application Laid-Open Nos. 4-9059 and 6-9183).
9 and JP-A-7-32759).

On the other hand, since the metal mask produced by the above-described manufacturing method has poor flexibility, if the printing medium lacks smoothness, has irregularities, or contains foreign matter, the metal mask and the printing medium come into close contact with each other. When the printing ink is filled in the opening through-hole of the metal mask, the printing ink easily spreads around the gap when the printing ink fills the opening through hole of the metal mask. Therefore, a defect that blurs the printed pattern easily occurs. In order to prevent this defect, there has been proposed a plastic mask for solder paste printing in which a polymer material plate is irradiated with excimer laser light to form an opening through hole as a printing plate (Japanese Patent Application Laid-Open No. 7-81027). The plastic mask has a problem that the position of the opening through-hole is easily shifted due to moisture absorption and temperature change, and when the squeegee is operated by the stencil printing method, the squeegee advances while catching the opening. The problem of printing in a state where comrades are stuck together easily occurs. Further, since the plastic mask lacks abrasion resistance, there is a problem that the life of the printing plate is short.

When an opening is formed in a plastic by irradiating an excimer laser beam or the like, carbide or the like generated by thermal decomposition of the polymer adheres to the periphery of the through-hole or the inner wall surface of the through-hole, thereby making it difficult to remove the solder paste. When the amount of printed solder paste fluctuates, and when the solder paste is printed on a printed circuit board on which electronic components are mounted using a plastic mask, the plastic mask causes frictional charging and high-voltage static electricity is charged. In addition, electrostatic breakdown of the electronic component occurs, which is not preferable.

In a printing plate used for printing a color filter dyeing solution by a stencil printing method, when an adhesive material having an opening at a position corresponding to an opening of a metal mask is laminated, a gap between the printing material and a printing medium is formed. It has been proposed that bleeding can be prevented because no bleeding occurs (Japanese Patent Laid-Open No. 62-27).
No. 6504). In the manufacturing method proposed in the examples of this patent application specification, a photosensitive resin having tackiness is coated on both sides of a stainless steel plate, and both sides are exposed to ultraviolet light and developed through a predetermined pattern mask. After etching the stainless steel plate with an etching solution of iron chloride using the remaining photosensitive resin as a resist, the photosensitive resin on one side is peeled off, and the photosensitive resin on the other surface is left without being peeled off. Is used as a color filter staining mask. This method is a long process, requires a lot of manual labor, and from the viewpoint of the quality of the obtained mask, since the etching is performed from both sides of the metal, a convex portion is generated in the inner wall of the opening, Since the projections hinder the removability of the printing ink, there is a problem that the projections are not suitable for high-precision printing. Furthermore, when the printing plate separates from the printing medium at the end of printing, an adhesive substance having tackiness is present on the plate surface, so that smooth plate separation is inhibited,
On the contrary, there is a problem that the shape of the printed matter is easily disturbed.

Although the printing plate is not a stencil printing plate, a printing plate in which a metal pattern is formed on a screen is used. It has been proposed that printing can prevent damage to a printing medium (Japanese Patent Application Laid-Open No. 54-10011).

In the manufacturing method proposed in the embodiments of this patent application, a photoresist is coated on the surface of a metal foil, exposed to ultraviolet light through a predetermined pattern mask and developed, and the remaining resist is removed. Is used as a resist mask, the metal foil is etched with an etchant, the resist is left without being peeled off, and printing is performed so that the remaining resist film is in contact with the printing medium. In this method, since the etching is performed from one side of the metal foil, the taper of the inner wall of the opening is easily increased, the control of the opening size is difficult, and it is extremely difficult to completely bond the metal foil and the mesh. Of course, the resist does not have toughness because it is not high molecular weight,
There is a problem that chipping easily occurs during printing, and this printing plate has not been put to practical use.

[0013]

DISCLOSURE OF THE INVENTION The present invention has excellent printing durability which can be used for high-precision printing in which the printing ink has less bleeding, the inner wall of the opening is excellent in smoothness, and the printing ink is easily removed. An object of the present invention is to provide a method of manufacturing a printing plate for stencil printing and such a printing plate.

[0014]

As a result of intensive studies by the present inventors, the above object has been industrially advantageously achieved by the present invention described below. That is, one of the printing plates according to the present invention is:
As described in claim 1, a fundamental wave (wavelength: 1064 nm) of a solid-state laser and a second harmonic wave (wavelength: 532 nm) of a solid-state laser are formed on a laminate of a polymer layer and a metal layer having a thickness of 0.015 to 2.000 mm. , Third harmonic (wavelength 355n)
m) or higher order harmonics such as the fourth harmonic (wavelength 266 nm) or any of these mixing light or carbon dioxide laser light to form a plurality of through holes, and then the polymer layer can be formed. The present invention is characterized in that one or both of a chemical treatment and a chemical treatment capable of deforming a metal layer are performed.

According to another aspect of the present invention, there is provided a printing plate comprising a solid-state laser having a thickness of 0.015 to 2.000 mm comprising a polymer layer and a metal layer. After irradiating high-order harmonics or any of these mixing lights to form a plurality of opening through holes, a physical polishing treatment is performed on the opening through holes in the metal layer and the peripheral portion thereof, and an agent capable of disposing the metal layer. Ru der what and performing either or both of the processing of the processing. According to a third aspect of the present invention , in the printing plate of the first or second aspect, the polymer layer is mainly composed of an elastomer, polyester, or polyimide having a Shore hardness of 25D or more. Version. Further, according to the present invention, as described in claims 5 and 6 , the solid-state laser is:
A solid-state laser as described in claim 7, which is a YAG laser or a YLF laser.
Is the second, third or fourth harmonic.
It is characterized by the following. Further, as described in claim 8, to a printing plate obtained by any of the methods described above.

Further, the present invention provides a fundamental wave of a solid-state laser,
A laser processing apparatus for forming a plurality of opening through holes by irradiating high-order harmonics of a solid-state laser, arbitrary mixing light thereof, or carbon dioxide laser light, includes at least a galvano scanning mirror or a polygon mirror in a laser light path. It is characterized by the following.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The printing plate according to the present invention relates to a printing plate having a through-hole pattern for applying a stencil printing means to press and fill a liquid or paste-like printing ink by operating a squeegee. is there. As a printing plate material used in the present invention, a polymer layer is laminated on a surface of a metal layer facing a printing object, and has a thickness of 0.015 to 2.
A laminated body of 000 mm is used.

The metal layer has a thickness of 0.25 mm or less,
It is preferably of various metals and alloy materials in the range of 0.012 to 0.2 mm, and particularly, nickel alloy, copper alloy galvanized steel or stainless steel is preferable.

The polymer layer may be formed of a thermosetting resin such as an epoxy resin, a thermoplastic polymer having a molecular weight of 10,000 or more, preferably 50,000 or more, such as polyimide, polyester, polycarbonate, acrylic polymer, and fluorine. A film can be used, but a Shore hardness of 25D
A molecular weight of 10,000 selected from any of nylon thermoplastic elastomer, polyester thermoplastic elastomer, polyurethane thermoplastic elastomer, styrene thermoplastic elastomer, olefin thermoplastic elastomer of 90 D or less, or a mixture or composition thereof; Above, preferably a thermoplastic elastomer having a molecular weight of 50,000 or more, or silicone rubber, butadiene rubber, butyl rubber, isoprene rubber, epichlorohydrin rubber, styrene / butadiene rubber, nitrile / butadiene rubber, ethylene / Elastomers containing a rubber elastomer selected from propylene rubber, chloroprene rubber, propylene oxide rubber, and fluororubber as a main component, and those elastomers or the above-mentioned elastomers other than those listed above It can be used in mixture or composition of the polymer. For example, a thermoplastic elastomer obtained by dispersing acrylic rubber fine particles in a polyester-based thermoplastic elastomer can be used. If necessary, carbon black, an ultraviolet absorber and a dye / pigment may be added to these polymers. The polymer layer has a total thickness of 0.015 to 2.000 mm.
It is formed by laminating a polymer film-like material on the surface of the metal layer facing the print object through heat bonding or an adhesive so that the polymer is melted by heat and the metal is formed by esclusion coating. The layers may be laminated. Elastomers having a Shore hardness of 25D or less are not preferable because the deformation amount during printing becomes large and it becomes difficult to control the thickness of the polymer layer.

An elastomer having a Shore hardness of 25 D or more used as the polymer layer does not have tackiness, but has flexibility and excellent elastic recovery. Therefore, the polymer layer is disposed on the printing medium side. Since the printing plate can be in close contact with the printing medium, the printed pattern is hardly blurred. Furthermore, since the metal layer of the printing plate is disposed on the side where the liquid or paste-like printing ink is pushed and filled by the operation of the squeegee, compared with the printing plate made of a single polymer material plate, the moisture absorption and The problem that the position of the opening through-hole easily shifts due to a temperature change or wear due to the operation of the squeegee is solved, and high-precision printing and excellent printing durability are obtained.

For processing the printing plate, a fundamental wave of a solid-state laser,
Higher harmonics of a solid-state laser, any mixing light thereof, or carbon dioxide laser light is used. YAG lasers (yttrium containing neodymium)
Aluminum garnet) is used, but YLF laser (yttrium lithium containing neodymium)
Is preferred in terms of high induced cross-sectional area, long life, and good spectral characteristics.

For a solid-state laser, the fundamental wave (wavelength
64 nm), second harmonic (wavelength 532 nm), third harmonic (wavelength 355 nm) and fourth harmonic (wavelength 266 nm)
Higher-order harmonics such as these can be used, but any of these mixing lights can be used, but in order to process the laminate of the plastic layer and the metal layer of the present invention, the polymer is heated around the through-holes and the inner wall surfaces of the polymer layer. The third harmonic is particularly desirable from the viewpoint of the generation of carbides generated by decomposition and the long-term stability of laser oscillation.

The laser according to the present invention, which irradiates a fundamental wave of a solid-state laser, a higher-order harmonic of a solid-state laser, arbitrary mixing light thereof, or carbon dioxide laser light to form several thousand or more opening through holes per plate. In the processing device, at least, not only the plate material to be processed is mechanically moved under the laser beam to form a through hole, but also a galvano scanning mirror or a polygon mirror is installed in the laser light path, and the laser is used. Shaking light is preferable because the processing speed can be increased.

In the processing method using a laser according to the present invention, the processing is performed near the focal point of the beam. On the other hand, a processing method using an excimer laser generally uses a mask for defining a processing shape, and uses a mask image method of reducing and projecting the shape of the mask. Therefore, the lamination of the plastic layer and the metal layer of the present invention is performed. It is difficult to cut a metal layer having a thickness used for a body. For this reason, the excimer laser is unsuitable for processing the laminate of the present invention, and is not preferable in that the beam is unstable and maintenance thereof requires a large amount of maintenance.

A wall of an opening through hole obtained by irradiating the above-mentioned laminated body composed of a polymer layer and a metal layer with a fundamental wave of a solid-state laser, higher harmonics of the solid-state laser, or any mixing light or carbon dioxide laser light thereof. In some cases, fine irregularities may remain. In order to cope with such unevenness, in addition to electrochemical chemical treatment such as electropolishing that damages the metal layer, physical polishing such as sandblasting or high-pressure water jetting is also effective. By such a treatment, a smooth surface is obtained, and the removability and quantitativeness of the solder paste are greatly improved.

Depending on the conditions, carbides and the like generated by thermal decomposition of the polymer may remain on the periphery and the inner wall surface of the opening through hole of the polymer layer. These deposits dissolve or oxidize the polymer. It can be completely removed by treatment with a chemical. For polyester and polyimide, a chemical treatment with a strong inorganic alkali and hydrazine or ethanolamine is effective, and the plate may be treated with a chemical such as an aqueous alkali permanganate solution.
Depending on the polymer, it may be treated with a solvent such as N-methyl-pyrrolidone, dimethylacetamide, dimethylsulfoxide, esters such as meta-cresol and ethyl acetate, and halogenated hydrocarbons such as chloroform. Such a treatment is carried out singly or in combination, depending on the presence or absence and the degree of irregularities and attachments present on the polymer layer and the metal layer of the printing plate.

The printing plate obtained in this manner has a substantially vertical cross-section by selecting the optimum processing conditions without any unevenness in which the printing ink accumulates in the cross-section of the opening through-hole. Therefore, the removability of the printing ink is good, and this effect is particularly remarkable when stencil printing is performed on a fine shape having a printing width of 0.2 mm or less. Compared to a conventional printing plate having a through hole formed by using a photosensitive resin, the printing plate of the present invention using a solid-state laser or a carbon dioxide laser processing method has a process derived from using a photosensitive resin. Since there are no defects caused by the complexity, resolution, shape of the opening through hole, or the fragility of the polymer, excellent quality, printing durability and low cost can be realized.

[0028]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited to these Examples.

FIG. 1 shows an embodiment of the printing plate of the present invention. The outer periphery of a polymer layer 2 is supported by an adhesive on a printing frame 1 of an aluminum square pipe. In FIG. 1, a metal layer 3, which is a main component of the printing plate, is disposed on the surface of the polymer layer 2, and a plurality of opening through holes 7 are formed.

FIG. 3 shows a cross-sectional shape of one opening of the printing plate according to the first embodiment of the present invention. As a printing plate material, a 100 μm-thick polyester film (Lumirror, trade name, manufactured by Toray Industries, Inc.) dyed red was coated with a polymer layer 2 and a thickness of 30 μm.
And a metal layer 3 made of 42 nickel and a 15 μm-thick adhesive (the main component of the adhesive is a polyester-based thermoplastic adhesive (Vylon 30P, a trade name of Toyobo Co., Ltd.)) and an epoxy adhesive (a product of Shell Co., Ltd.) (A mixture of No. Epicoat 152)). This printing plate material is fixed to a frame of a processing stage of a YAG laser processing machine, and the frame is moved according to a plurality of patterns to be punched, and a YAG fundamental wave (a semiconductor excitation YAG manufactured by Lumonix Co., Ltd.) is taken from the polymer side. A printing plate for a solder paste having an opening through hole with a minimum opening width of 0.15 mm was obtained by irradiating a pulse at 3 kHz using a laser oscillator. An opening having a predetermined dimension and a good shape is formed in the metal layer 3 made of 42 nickel of the obtained printing plate, the cut surface is smooth, and an opening almost the same as or slightly larger than the predetermined dimension is formed in the polymer layer 2. A width was formed.

This plate was prepared at 80 ° C. in a treatment solution of pH 13.5 containing 50 g of potassium permanganate per liter at 1 ° C.
After the treatment for 0 minutes, washing with water and drying were performed to remove carbides adhered to the inner wall of the through hole of the polymer layer.

The printing plate is mounted on a screen printing machine, and as shown in FIG. 2, a squeegee 5 moves on the printing plate while rubbing the solder paste ink 6 against the metal layer 3 of the printing plate. Solder paste ink was printed on required pad portions on the printed circuit board, which is the printed body 4. Adhesion between the printed circuit board and the printing plate during printing is good, no bleeding of the solder paste ink is observed, and even after continuous printing for 100 times, it is related to solder balls, poor pattern shapes and blurring caused by bleeding of the solder paste ink No defects were seen.

As a comparative example, when the printing plate of Example 1 was not treated with an aqueous solution of potassium permanganate, there was no problem due to bleeding of the paste ink. Unevenness was caused in the amount of adhesion, and blurring occurred after continuous printing of 20 times.

As a comparative example, a printing plate for a solder paste having an opening through hole of 0.15 mm was obtained in the same manner as in Example 1 using a metal sheet made of only 42 nickel having a thickness of 145 μm. An opening having a predetermined size and a good shape was formed in the metal layer 3 made of 42 nickel of the obtained printing plate, and the cut surface was smooth. When the solder paste ink was printed on the pad part, after 30 consecutive printings, defects such as defects in the solder balls and pattern shapes caused by the bleeding of the solder paste ink were observed, so the printing was interrupted, and the printing surface of the printing plate was changed. Needed to be cleaned.

FIG. 4 is a sectional view of one opening of the printing plate according to the second embodiment of the present invention. A polymer layer 2 made of a 75 μm-thick polyester-based thermoplastic elastomer film colored with a dye and pigment (a trade name of Hytrel (trade name: 55D) of Toray DuPont Co., Ltd. as a raw material) and a 30 μm-thick stainless steel SUS301 The metal layer 3 is bonded to the metal layer 3 in the same manner as in the first embodiment.
The second harmonic (wavelength: 532 nm) of the AG laser is processed by using the fourth harmonic (wavelength: 266 nm) obtained by being incident on a fourth harmonic generation unit (comprising a nonlinear optical crystal element). An electrode was attached to the metal layer made of stainless steel, and the surface of the metal layer was smoothed by electropolishing while applying a jet at 50 ° C. to an electrolytic aqueous solution consisting of phosphoric acid and sulfuric acid to smooth the unevenness of the inner wall of the through hole of the metal layer. Since this plate uses a resin having rubber elasticity as the polymer layer, it has good adhesion to the printing medium, and no blurring of the printing ink was observed on the printing medium even after continuous printing 300 times.

FIG. 5 shows a cross-sectional shape of one opening of the printing plate according to the third embodiment of the present invention. As a printing plate material, thickness 30
A 1 mm thick chloroprene rubber (Shore hardness: 50D) in which a rubber-based adhesive (trade name: Cemedine 575 of Cemedine Co., Ltd.) is coated on a metal layer 3 of SUS301 having a thickness of 1 μm, and carbon black and an ultraviolet absorber are blended. The printing plate material on which the polymer layer 2 was laminated was used. This printing plate material was processed using a carbon dioxide laser beam irradiated with a pulse at 2 kHz. The chemical treatment of the polymer layer used in Example 1 and the chemical treatment of the metal layer used in Example 2 were performed. The cross-sectional shape of this printing plate is good, and an epoxy-based sealant (trade name Chip Coat 8304 of Hokuriku Paint Co., Ltd.) is used as a printing ink on a semiconductor substrate mounted on a TAB tape.
Printed using. No bleeding of the printing ink was observed on the printing medium even after continuous printing for 500 times or more.

FIG. 6 shows a cross-sectional shape of one opening of the printing plate according to the fourth embodiment of the present invention. As a laser processing machine, a laser processing machine having a galvano scanning mirror (manufactured by Galvano Scan) and an Ftheta lens with a focal length of 100 mm installed in a laser beam path of a YLF laser oscillator of third harmonic (manufactured by Photonics) is used. A printing plate for solder paste having a through hole with a minimum opening width of 0.15 mm was obtained in the same manner as in Example 1 except that pulse irradiation was performed at 4 kHz.

By using the galvano-scanning mirror, the production time of the plate is reduced to 1/4 of the production time of the first embodiment.
It was able to be shortened to the extent.

The plate was wet-sand-brased using an abrasive containing alumina fine particles of 250 mesh pass to remove dross on the inner wall of the metal layer, and then washed and dried.

The cross-sectional shape of this plate was smooth and good. When printing was performed in the same manner as in Example 3, good results were obtained without any trouble even when printing was performed continuously 500 times or more.

[0041]

According to the present invention, a solder paste for performing surface mounting on a printed circuit board, a resin sealant for sealing a semiconductor chip, a bump and an electric circuit are formed on a semiconductor chip and a printed circuit board. Printing plate for printing a conductive paste or the like with a screen printing machine for forming a conductive paste or the like, the thickness of the polymer layer and the metal layer being 0.015 to 2.000 m.
irradiating the fundamental light of the solid-state laser, the higher-order harmonics of the solid-state laser, any mixing light thereof or the laser light path of the carbon dioxide gas laser light via the galvano-scanning mirror or the polygon mirror to the laminated body of m. After forming a plurality of opening through holes by using a chemical treatment that can destroy the polymer layer and / or a physical polishing treatment of the metal layer and / or a chemical treatment that can destroy the metal layer. And a method of manufacturing a printing plate characterized by the following. By arranging the polymer layer of the printing plate on the side in contact with the printing medium, the adhesion to the printing medium is improved, so that bleeding of the printing ink during printing hardly occurs, and the squeegee during printing is also reduced. Since the metal layer is provided on the side to which the printing ink is rubbed, there is no shift in the printing position and no change in dimensions, and the abrasion resistance is significantly improved.
Further, in particular, since a plurality of opening through-holes are formed by higher-order harmonics of a YAG laser, a high-quality printing plate having an excellent sectional shape at low cost can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of the entire printing plate.

FIG. 2 is a sectional view showing a state where printing ink is printed using the printing plate of FIG. 1;

FIG. 3 is a cross-sectional shape of one opening of the printing plate of Example 1.

FIG. 4 is a cross-sectional shape of one opening of the printing plate of Example 2.

FIG. 5 is a cross-sectional shape of one opening of the printing plate of Example 3.

FIG. 6 is a cross-sectional shape of one opening of the printing plate of Example 4.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printing frame 2 Polymer layer 3 Metal layer 4 Printed object 5 Squeegee 6 Printing ink 7 Opening hole

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B41C 1/05 B41C 1/14 B41N 1/24 B23K 26/00

Claims (9)

(57) [Claims] 1. A thickness of 0.01 comprising a polymer layer and a metal layer
A fundamental wave of a solid-state laser on a laminate of 5 to 2.000 mm,
After irradiating high-order harmonics of a solid-state laser, arbitrary mixing light or carbon dioxide laser light to form a plurality of opening through-holes, treating a drug capable of forming a polymer layer and forming a metal layer. A method for producing a printing plate, comprising performing one or both of chemical treatments that can be performed. 2. A thickness of 0.01 comprising a polymer layer and a metal layer.
After irradiating a high-order harmonic of a solid-state laser and arbitrary mixing light thereof to a laminated body of 5 to 2.000 mm to form a plurality of opening through-holes, the opening through-hole of the metal layer and its peripheral portion are physically formed. A method for producing a printing plate, comprising performing either or both of a chemical polishing treatment and a chemical treatment capable of deforming a metal layer. 3. The method according to claim 1, wherein the polymer layer is mainly composed of an elastomer having a Shore hardness of 25 D or more.
Or a method for producing a printing plate according to item 2. 4. The method according to claim 1, wherein the polymer layer is made of polyester or polyester.
The method according to claim 1, wherein the main component is polyimide.
3. The method for producing a printing plate according to item 2. Wherein said solid-state laser, the printing plate producing method according to claim 1 or 2, characterized in that a YAG laser. 6. A printing plate manufacturing method according to claim 1 or 2, wherein said solid-state laser is a YLF laser. 7. The method of claim 1, wherein the higher harmonic wave of the solid laser is second, the third or fourth harmonic
Or a method for producing a printing plate according to item 2. 8. A printing plate obtained by the method according to any one of claims 1 to 7. 9. A laser for irradiating a fundamental wave of a solid-state laser according to claim 1 or 2 , a higher-order harmonic of the solid-state laser, an arbitrary mixing light thereof, or a carbon dioxide laser light to form a plurality of through holes. A printing plate, characterized in that at least a galvano scanning mirror or a polygon mirror is provided in the laser beam path in the processing apparatus.
Laser processing equipment for manufacturing .