JP5255224B2 - Screen printing mask and method for producing screen printing mask - Google Patents

Description

  The present invention relates to a screen printing mask and a method for producing a screen printing mask used in the field of producing printed wiring boards and the like, and for screen printing in which a resin layer is formed on at least the inner wall of the opening and the substrate contact surface. The present invention relates to a mask and a manufacturing method thereof.

  With recent miniaturization and multi-functionalization of electronic devices, the density of printed wiring boards and the miniaturization of wiring patterns have been promoted, and high-density mounting of electronic components on printed wiring boards has been widely performed. Yes. In high-density mounting of electronic components on this printed circuit board, cream solder is printed to mount the electronic components on the surface of the printed circuit board, and the electronic components are mounted on the solder terminals, and then heated in a reflow furnace. Perform soldering. As the cream solder printing method, a screen printing process is widely used. In general, screen printing is performed by setting a screen printing mask having a pattern-shaped opening formed on the upper surface of a substrate to be printed and supplying paste material such as cream solder to the squeegee surface of the screen printing mask. In this method, the paste material is transferred and printed on the pattern through the opening by scraping with a squeegee.

  As the pattern to be printed becomes high density and high definition, the adhesion with the substrate to be printed becomes important. In general, a mask for screen printing is made of a metal material, and has less elasticity than a resin material. If the surface of the substrate to be printed is not smooth, bleeding occurs due to poor adhesion due to unevenness. When bleeding occurs, there is an increased possibility that defects such as a bridge short-circuit will occur between adjacent patterns, and printing with good quality will not be possible. For the purpose of improving these adhesion problems, a screen printing mask in which a resin layer is formed on a printed substrate contact surface of a screen printing mask made of a metal material has been proposed. According to this, since the resin layer is provided on the surface of the screen printing mask in contact with the substrate to be printed, it adheres even to the substrate to be printed with poor surface smoothness, and the paste material does not exude ( For example, Patent Documents 1 to 5). However, it has been difficult to form the opening of the resin layer without displacement in the opening of the screen printing mask. Further, simply forming a resin layer on the printed substrate contact surface of the screen printing mask has a problem that the detachability of the paste material from the screen printing mask is insufficient.

  The screen printing mask made of a metal material deteriorates the ability of the paste material to be removed from the screen printing mask due to the unevenness of the inner wall of the opening formed by laser or etching. In order to solve this problem, a screen printing mask in which a resin layer is formed on the inner wall of the opening of the screen printing mask has been proposed. According to this, the resin layer is formed on the inner wall of the opening by applying the resin liquid, and the unevenness of the inner wall is smoothed, so that the friction between the paste material and the inner wall is reduced and the detachability of the paste material is improved. I am letting. Further, by forming a compound (for example, polysiloxane, fluororesin, silicon resin, etc.) having good repellent or lubricating properties with the paste material on the inner wall of the opening, the detachability of the paste material is improved. However, as a means for forming the resin layer on the inner wall, dipping method, spraying method, brushing, spin coating, etc. are adopted, but in these methods, the resin layer is uniformly formed on the inner wall of the opening. Is difficult. For example, as shown in FIG. 16, defects such as protrusions 9, partition walls 10, or fillings 11 of the resin layer may occur, which is a big problem (for example, Patent Documents 6 to 11).

Screen printing consisting entirely of resin material without using metal material to solve the problem of paste material oozing out and poor paste material omission at the same time even on printed substrates with poor surface smoothness Masks have been proposed (for example, Patent Document 12). According to this, the smoothness and water repellency of the inner wall of the opening are good, and the adhesion to the substrate to be printed is good. However, when the expansion and contraction peculiar to the resin material occurs, the position of the opening is displaced, the opening is deformed, and the like. Therefore, pattern misalignment frequently occurs when the paste material is printed. In addition, when pressed by a squeegee, there has been a problem that scratches are mixed into the screen printing mask.
JP-A-3-57697 Japanese Patent Laid-Open No. 9-315026 Japanese Patent Laid-Open No. 54-10011 JP 2001-113667 A Japanese Patent Laid-Open No. 2005-1441973 Japanese Utility Model Publication No. 63-37256 JP-A-1-299088 JP-A-4-357093 Japanese Patent Laid-Open No. 6-219070 JP-A-8-290686 JP 2002-192850 A Japanese Patent Laid-Open No. 7-81027

  An object of the present invention is to provide a screen printing mask capable of good printing without bleeding or omission of paste material even with a high-density and high-definition pattern, and no defects such as protrusions, partition walls, and embedding. Provided is a method for producing a mask for screen printing, which can form a uniform resin layer on the inner wall of the opening, and can form a resin layer on the printed substrate contact surface of the mask for screen printing without any positional displacement of the opening. It is to be.

  As a result of the study, the present inventors have found that the first resin layer is formed on the inner wall of the opening portion of the screen printing mask made of a metal material, and the non-opening portion of the contact surface of the substrate to be printed of the screen printing mask. It has been found that the above problems can be solved by a screen printing mask characterized in that the first resin layer and the second resin layer are laminated.

  Moreover, it discovered that the said subject was solved with the mask for screen printing whose thickness of the said 1st resin layer is 0.2-10 micrometers and whose thickness of the said 2nd resin layer is 5-200 micrometers.

  A method for producing a screen printing mask made of a metal material having a resin layer at least in an opening and a printed substrate contact surface, the resin dispersed in a highly insulating medium in the screen printing mask made of a metal material A step of forming a first resin layer on the inner wall of the opening and the printed substrate contact surface by electrodepositing the particles, and a step of forming a second resin layer on the first resin layer on the printed substrate contact surface by lamination And a method for producing a mask for screen printing characterized by including a step of removing the second resin layer in the opening by supplying a second resin layer removing liquid from the squeegee surface. .

  A method for producing a screen printing mask made of a metal material having a resin layer on at least an opening and a substrate contact surface, wherein the second resin layer is formed on the substrate contact surface of the screen printing mask made of a metal material. The step of forming by laminating, the step of supplying the second resin layer removing liquid from the squeegee surface to remove the second resin layer of the opening, and the electrodeposition by electrodeposition of the resin particles dispersed in the highly insulating medium It has been found that the above problem can be solved by a method for producing a mask for screen printing, which includes a step of forming a first resin layer on the inner wall of the part and the second resin layer on the printed substrate contact surface.

  The screen printing mask of the present invention is different from the screen printing mask made entirely of a resin material, and has a metal material as a main component, and therefore does not cause expansion and contraction peculiar to a resin due to storage conditions. For this reason, no deformation or the like of the opening portion occurs, so that no positional deviation occurs during printing. In addition, there is an effect that even if pressed by a squeegee with a strong pressure, scratches that cause printing are not generated. Further, since the first resin layer is formed on the inner wall of the opening, the unevenness of the inner wall of the opening caused by laser, etching, or the like can be smoothed, and the detachability of the paste material is significantly improved. Furthermore, by forming the first resin layer having good repellent property and lubricity with the paste material, similarly, the removability of the paste material is remarkably improved.

  In the screen printing mask of the present invention, the second resin layer is formed on the surface of the substrate to be printed, so that the cushioning property of the screen printing mask is improved and the paste material does not ooze out. When forming the first resin layer, it is easy to form the first resin layer on the printed substrate surface at the same time as forming the first resin layer on the inner wall of the opening. However, if the first resin layer is too thick, the area of the opening becomes small, and the transfer amount of the paste material may be insufficient. If the first resin layer is thinned, the unevenness of the inner wall of the opening can be smoothed, but the cushioning property of the non-printed substrate surface may not be sufficiently obtained. Since the first resin layer and the second resin layer are formed by being laminated, sufficient cushioning properties are exhibited, and the adhesion between the substrate to be printed and the screen printing mask is improved.

  Even if the first resin layer is formed by making the thickness of the first resin layer formed on the inner wall of the opening within a range of 0.2 to 10 μm, the mask for screen printing before forming the first resin layer The change in the size and shape of the opening can be made minute. In addition, since the first resin layer and the second resin layer are formed on the substrate contact surface, the cushioning property is improved, and the paste material is less likely to ooze out. By setting the thickness of the second resin layer in the range of 5 to 200 μm, sufficient adhesion with the substrate to be printed can be expressed.

  In the method for producing a screen printing mask according to the present invention, the first resin layer is formed on the inner wall of the opening by electrodepositing resin particles dispersed in a highly insulating medium on the screen printing mask made of a metal material. Forming. The resin particles dispersed in the highly insulating medium are positively or negatively charged. A screen printing mask made of a metal material has conductivity and the surface has the same potential. As shown in FIG. 5, when the electrode 12 is placed so as to face the screen printing mask 1, the screen printing mask 1 is grounded and an appropriate bias voltage is applied, the resin particles 13 charged according to the electric field are screened. Electrophoresis in the direction of the printing mask 1. The resin particles 13 approaching in the direction of the screen printing mask 1 by electrophoresis are attached from a place where the potential is close to 0. Therefore, the resin particles 13 are attached so as to cover the surface of the grounded screen printing mask 1. . Therefore, when the resin particles 13 are attached by the electrodeposition method, defects such as protrusions, partition walls, and filling of the first resin layer do not occur.

  The method for producing a mask for screen printing of the present invention includes a step of forming a second resin layer on the printed substrate contact surface by lamination. By forming the second resin layer by lamination, the thickness of the resin layer can be formed accurately and uniformly. In addition, when a screen printing mask once used for printing is reprinted with further improved adhesion, or when it becomes necessary to change the transfer amount of the paste material, a new screen made of a metal material is used. There is no need to recreate the printing mask. In other words, by removing the second resin layer and re-forming it, or by sequentially applying the second resin layer and changing the film thickness, it is possible to improve adhesion and post-adjustment of the transfer amount. To express.

  The method for producing a mask for screen printing of the present invention includes a step of removing the second resin layer in the opening by supplying the second resin layer removing liquid from the squeegee surface. By including this step, the second resin layer can be opened easily and without misalignment by the wet process without deteriorating the quality of the mask for screen printing having the already prepared opening.

  Examples of the screen printing mask of the present invention are shown in FIGS. In FIG. 1, a first resin layer 2 is formed on the inner wall of an opening 5 of a screen printing mask 1 made of a metal material, and the non-opening of the printed substrate contact surface 4 of the screen printing mask 1 is shown. The screen printing mask is formed by laminating the first resin layer 2 and the second resin layer 6 in this order. In FIG. 2, the first resin layer 2 is formed on the inner wall of the opening 5 of the screen printing mask 1 made of a metal material, and in the non-opening of the substrate contact surface 4 of the screen printing mask 1, The screen printing mask is formed by laminating the second resin layer 6 and the first resin layer 2 in this order. Regardless of the stacking order of the first resin layer and the second resin layer in the non-opening portion of the substrate contact surface 4, good printing characteristics are exhibited. After the first resin layer is formed on the inner wall of the opening and the printed substrate surface, the second resin layer is formed on the non-opened portion of the printed substrate contact surface, whereby the screen printing mask of FIG. 1 can be manufactured. After forming the second resin layer on the printed substrate contact surface, the first resin layer is formed on the inner wall of the opening and the non-opened portion of the printed substrate surface, whereby the screen printing mask of FIG. 2 can be manufactured.

  In the screen printing mask of the present invention, the width L2 of the opening 5 of the second resin layer 6 may be larger than the width L1 of the opening 5 of the screen printing mask 1, as shown in FIG. 18, even if the width L3 of the opening 5 of the second resin layer 6 covered with the first resin layer 2 is made larger than the width L1 of the opening 5 of the screen printing mask 1, as shown in FIG. Good. A value (d) which is a half of the difference between L2 (L3) and L1 is preferably 0 to 200 μm, and more preferably 0 to 30 μm. If d is a negative value and the second resin layer 6 protrudes into the opening 5 of the screen printing mask, an appropriate amount of paste material cannot be transferred, or the paste material and the screen printing mask can be removed. In some cases, sufficient effects cannot be obtained. On the other hand, when d is larger than 200 μm, not only is it difficult to form a high-definition transfer pattern, but more paste material than the proper amount may be transferred.

  The mask for screen printing made of a metal material according to the present invention is a mask that can transfer paste material such as cream solder onto a substrate to be printed by placing the paste material on the squeegee surface and scraping it with the squeegee. A screen printing mask produced by either method can also be used. For example, any of a solid mask, a suspend mask, a metal mask (etching method, laser method, additive method, machining method) or the like can be used. As the material, a metal mainly composed of nickel, copper, chromium, zinc, iron or the like, an alloy, stainless steel (SUS), or the like can be applied. Also, there is no particular limitation on the opening pattern of the mask for screen printing, for example, a circle, an ellipse, a square, a rectangle, a diamond, a square such as a trapezoid, a polygon such as a hexagon and an octagon, a gourd, a dumbbell, etc. Examples include irregular shapes such as shapes. The thickness of the screen printing mask made of a metal material is usually 30 to 500 μm, and the thickness is determined by the transfer amount of the paste material. When the shape of the opening pattern is circular, the diameter of the opening is several hundred to several tens of mm in general surface mounting, and the size is 50 to 300 μm and the pitch interval is 50 to 500 μm in high-density mounting. Furthermore, the cross-sectional shape of the opening of the screen printing mask may have a taper.

  The first resin layer according to the present invention is a resin having adhesion, chemical strength, and mechanical strength with a screen printing mask, and is used as a solvent for a paste material to be used and a cleaning agent for a screen printing mask. Any resin may be used as long as it does not swell. Specifically, polyimide, polyamide, polyester resin, epoxy resin, polycarbonate, polystyrene, polyethylene, polypropylene, polyacetal, polytetrafluoroethylene, fluororesin, silicone resin, acrylic resin, vinyl acetate resin, vinyl chloride resin, vinylidene chloride resin , Phenol resin, polyvinyl butyral, gelatin, carboxymethyl cellulose and the like. In order to give durability and mechanical strength to the paste material and the cleaning agent, ultraviolet curable properties, electron beam curable properties, heat curable properties, and the like can be imparted. When the first resin layer is formed by an electrodeposition method using a highly insulating medium, an acrylic resin or a vinyl acetate resin can be suitably used. Further, in order to improve the detachability of the paste material, it is preferable to use a resin having a good repelling property with the paste material and a large contact angle. For example, when a solder paste is used as the paste material, polytetrafluoroethylene or fluororesin can be preferably used.

  The method for forming the first resin layer according to the present invention may be any method, and examples thereof include a dipping method, a spray method, a brush coating, a spin coating, an electrostatic coating method, a vapor deposition method, and an electrodeposition method. In the dip method and spray method, there is a problem that the coating liquid accumulates at the edge of the opening due to surface tension, a problem that the coating liquid accumulates at an acute angle portion when the opening shape is acute, or a dripping or uneven drying of the coating liquid. There may be a problem that the film thickness becomes non-uniform. In the method of forming the first resin layer by the water-based electrodeposition method, there may be a problem that air mixed in the opening is difficult to escape. In addition, a large amount of current is consumed to form a predetermined film thickness, which may cause problems in terms of productivity and energy saving. As a method for forming the first resin layer according to the present invention, an electrodeposition method using a highly insulating medium can be used particularly suitably because the first resin layer can be formed uniformly and with high productivity.

  In the electrodeposition method using a highly insulating medium, the resin component to be the first resin layer is dispersed in the highly insulating medium in the form of particles, and the resin particles are adhered on the screen printing mask by electrophoresis. A method of forming a film by heat or the like can be preferably used. In order to electrodeposit resin particles, an appropriate bias voltage is applied between the screen printing mask 1 and the electrode 12 as shown in FIG. For example, a horizontal and horizontal transfer device (for example, Japanese Patent Laid-Open No. 6-224541, which is inserted between electrodes arranged in parallel so as to face a screen printing mask and supplies a liquid from above and below the electrodes to perform electrodeposition) No. 2004-163605, etc.), and after the screen printing mask is held almost vertically and immersed in a bath containing liquid, the electrodes are arranged substantially oppositely on both sides of the screen printing mask. Thus, an apparatus (for example, Japanese Patent Application Laid-Open No. 2002-132049) that fixes the screen printing mask substantially vertically and performs an electrodeposition process can be used as the electrodeposition apparatus.

  When the first resin layer is formed by an electrodeposition method using a highly insulating medium, an acrylic resin or a vinyl acetate resin can be suitably used as described above. In that case, it is preferable to use a resin in the form of particles and dispersed in a highly insulating medium. In the case of resin particles, the average particle diameter measured by the Coulter counter method is preferably in the range of 0.05 to 1.0 μm from the viewpoint of securing the thickness as the first resin layer and maintaining the dispersion state, Further, it is preferably in the range of 0.1 to 0.6 μm. The method for producing the resin particles may be either a pulverization method or a polymerization method. The pulverization method is a method in which resin particle components and other desired additives (for example, colorants) are mixed and kneaded, and the obtained kneaded product is pulverized to a desired particle size.

  The polymerization method is a method obtained by polymerizing a monomer that is soluble in a highly insulating medium to form a polymer that is insoluble in the highly insulating medium. The resin particles obtained by the polymerization method are composed of a dispersant and a core component. The dispersant is a polymer having a molecular weight of 1000 or more that is soluble in the highly insulating medium, and serves to disperse the resin particles in the highly insulating medium. The core component is a polymer that is insoluble in a highly insulating medium. Examples of core components include vinyl esters of aliphatic carboxylic acids having 1 to 6 carbon atoms, such as vinyl acetate, vinyl propionate, and vinyl chloroacetate, vinyl esters of benzoic acid, or acrylic acid, methacrylic acid, and crotonic acid. Alkyl esters or amides having 1 to 6 carbon atoms such as maleic acid and itaconic acid, ethylene glycol di (meth) acrylate, methylenebisacrylamide, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl ( (Meth) acrylate, 2- (meth) acryloyloxyethyl isocyanate, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, styrene and its derivatives, divinylbenzene, or N-vinyl-2-pyrrolidone, N-Vini Examples thereof include polymers comprising nitrogen-containing vinyl monomers such as rupyridine, N-vinylimidazole, and N, N-dialkylaminoethyl (meth) acrylate. For example, resin particles dispersed in a highly insulating medium described in JP-A Nos. 60-252367 and 61-116364 can be used.

  The first resin layer according to the present invention preferably has a thickness in the range of 0.2 to 10 μm. If it is less than 0.2 μm, smoothing of the inner wall of the opening may be insufficient. If the thickness exceeds 10 μm, cracks may occur in the first resin layer, or defects such as protrusions 9, partition walls 10, or burrs 11 of the first resin layer as shown in FIG. 16 may occur. In addition, the size and shape of the opening of the screen printing mask made of the metal material before the first resin layer is formed may change, which may cause a problem that good printing cannot be performed.

  The second resin layer according to the present invention is a resin having adhesion, chemical strength, and mechanical strength with a screen printing mask, and is used as a solvent for the paste material to be used and a cleaning agent for the screen printing mask. Any resin may be used as long as it does not swell. Also, the same resin as the first resin layer can be used, but the first resin layer contributes to the detachability of the paste material, and the second resin layer contributes to the adhesion to the substrate to be printed. Since the functions are different, the first resin layer and the second resin layer may be different resins. Specific examples of resins that can be used as the second resin layer include polyimide, polyamide, polyester resin, epoxy resin, polycarbonate, polystyrene, polyethylene, polypropylene, polyacetal, polytetrafluoroethylene, fluorine resin, silicon resin, acrylic resin, and vinyl acetate resin. , Vinyl chloride resin, vinylidene chloride resin, phenol resin, polyvinyl butyral, gelatin, carboxymethyl cellulose and the like. Further, in order to provide durability and mechanical strength to the paste material and the screen printing mask cleaning agent, ultraviolet curable properties, electron beam curable properties, heat curable properties, and the like can be imparted.

  In the method for forming the second resin layer according to the present invention, a photosensitive resin layer is formed on the printed substrate contact surface by a technique such as coating, and then a photomask having a pattern corresponding to the opening is overlapped for exposure. By performing phenomenon processing, a method of forming an opening in the photosensitive resin layer to form a second resin layer, a method of forming the second resin layer by screen printing, and screen printing made of a metal material having an opening For example, a method of transferring a resin film having openings with the same pattern to a mask to form a second resin layer may be used. However, in these methods, misalignment may occur between the opening of the screen printing mask and the opening of the second resin layer.

  As another method for forming the second resin layer according to the present invention, the photosensitive resin layer used as an etching resist is not peeled off when an opening is formed in a metal material by an etching method to produce a mask for screen printing. A method of forming a second resin layer as it is, a method of laminating a metal material and a second resin layer having no opening, and then simultaneously opening the second resin layer and the metal material by a laser method, a metal material and a second resin Etching from one side of the metal plate surface using a photosensitive resist using a laminate with a layer, and then removing the opening of the second resin layer, photodegradable resin as the second resin layer And after the exposure through the opening from the squeegee surface side, development processing is performed, the photodegradable resin layer in the opening is removed, and the remaining photodegradable resin layer is used as the second resin layer. It is done. In addition, the second resin layer and the masking layer are provided on the printed substrate contact surface by lamination so as to close the opening, and then the second resin layer removing liquid is supplied from the squeegee surface by spraying or the like. A method of removing the second resin layer of the portion. In the method in which the second resin layer is provided as a laminate and the second resin layer removing liquid is supplied from the squeegee surface through the opening, there is no positional deviation between the opening of the screen printing mask and the opening of the second resin layer. When the second resin layer portion is damaged, it is possible to correct only the resin layer portion, which is most preferable in the method for forming the second resin layer.

  In the method for producing a mask for screen printing including the step of supplying the second resin layer removing liquid from the squeegee surface and removing the second resin layer in the opening, the second resin layer is made alkali-soluble so that the second resin Since an aqueous alkali solution can be used for the layer removing solution, it is preferable. In this case, the 2nd resin layer whose acid value is 1 mgKOH / g or more, More preferably, 10 mgKOH / g or more can be used conveniently.

  The second resin layer according to the present invention preferably has a thickness in the range of 5 to 200 μm. If it is less than 5 μm, sufficient cushioning properties cannot be obtained, and the paste material may ooze out. On the other hand, when the thickness exceeds 200 μm, the volume change of the second resin layer may cause a large change in the shape of the opening, which may cause a problem that the transfer amount of the paste material changes.

  In the method for producing a screen printing mask according to the present invention, as illustrated in FIG. 1, the first resin layer 2 is formed on the inner wall of the opening 5 of the screen printing mask 1 made of a metal material. A method for producing a screen printing mask in which the first resin layer 2 and the second resin layer 6 are laminated in this order on the non-opening portion of the printed substrate contact surface 4 of the screen printing mask is illustrated in the order of steps. 3-9 will be used to explain in detail. First, a protective sheet 7 is attached to the squeegee surface 3 of the screen printing mask 1 (FIG. 3) made of a metal material (FIG. 4). Next, the electrode 12 is installed in the highly insulating medium in which the resin particles 13 are dispersed so as to face the printed substrate contact surface 4 (FIG. 5). Next, an appropriate potential difference is generated between the screen printing mask 1 and the electrode 12, and the resin particles 13 are electrophoresed in the direction of the screen printing mask 1, so that the inner wall of the opening 5 and the printed substrate contact surface 4 are moved. Resin particles 13 are adhered. Next, the screen printing mask 1 is taken out from the highly insulating medium, and the highly insulating medium is evaporated. Next, the resin particles 13 attached by the electrodeposition method are formed into a film by heating or the like to form the first resin layer 2 (FIG. 6). Subsequently, the protective sheet 7 is removed (FIG. 7). The first resin layer 2 may be cured by heating, ultraviolet irradiation, electron beam irradiation, or the like. Next, the second resin layer 6 and the masking layer 14 are provided on the printed substrate contact surface 4 by lamination so as to close the opening 5 (FIG. 8). Thereafter, the second resin layer removing liquid is supplied from the squeegee surface 3 by spraying or the like, thereby removing the second resin layer in the opening 5 (FIG. 9). Next, the second resin layer removing liquid is removed by washing with water and dried with cold air, and then the masking layer 14 is removed. The second resin layer 6 may be cured by heating, ultraviolet irradiation, or electron beam irradiation. In this way, the screen printing mask illustrated in FIG. 1 can be manufactured.

  In the screen printing mask manufacturing method of the present invention, as illustrated in FIG. 2, the first resin layer 2 is formed on the inner wall of the opening 5 of the screen printing mask 1 made of a metal material. A method for producing a screen printing mask in which the second resin layer 6 and the first resin layer 2 are laminated in this order in the non-opening portion of the substrate contact surface 4 of the screen printing mask is shown in FIG. And it explains in full detail using FIGS. First, the second resin layer 6 and the masking layer 14 are provided on the substrate contact surface 4 of the screen printing mask 1 (FIG. 3) made of a metal material by lamination so as to close the opening 5 (FIG. 10). Next, the second resin layer removing liquid is supplied from the squeegee surface 3 by spraying or the like, thereby removing the second resin layer in the opening 5 (FIG. 11). Next, the second resin layer removing liquid is removed by washing with water and dried with cold air, and then the masking layer 14 is removed (FIG. 12). The second resin layer may be cured by heating, ultraviolet irradiation, electron beam irradiation, or the like. Then, the protective sheet 7 is affixed on the squeegee surface 3 (FIG. 13). Next, the electrode 12 is placed so as to face the printed substrate contact surface 4 in a highly insulating medium in which the resin particles 13 are dispersed (FIG. 14). Next, an appropriate potential difference is generated between the screen printing mask 1 and the electrode 12, and the resin particles 13 are electrophoresed in the direction of the screen printing mask 1, and on the inner wall of the opening 5 and the printed substrate contact surface 4. Resin particles 13 are adhered on the second resin layer 6. Subsequently, the screen printing mask 1 is taken out from the photo-insulating medium, and the highly insulating medium is evaporated. Thereafter, the resin particles 13 attached by the electrodeposition method are formed into a film by heating or the like to form the first resin layer 2 (FIG. 15). Subsequently, the protective sheet 7 is removed. The first resin layer 2 may be cured by heating, ultraviolet irradiation, electron beam irradiation, or the like. In this manner, the screen printing mask illustrated in FIG. 2 can be manufactured.

  Examples of the highly insulating medium according to the present invention include linear or branched aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons, and halogen-substituted products thereof. Examples include octane, isooctane, decane, isodecane, decalin, nonane, dodecane, isododecane, cyclohexane, cyclooctane, cyclodecane, benzene, toluene, xylene, mesitylene and the like. As product names, there are Isopar E, Isopar G, Isopar H, Isopar L (EXXON), IP Solvent 1620 (Idemitsu Kosan Co., Ltd.), and the like. These highly insulating media can be used alone or in combination.

  The resin particles according to the present invention form a first resin layer by electrodeposition. The resin particles are made positive or negative charged particles, and the resin particles are electrodeposited while applying an appropriate electric field. Therefore, an electric charge is imparted to the resin particles by adding an appropriate charge control agent to the liquid in which the resin particles are dispersed. As the charge control agent, for example, a compound shown in JP-A-6-51567 or a polycarboxylic acid type polymer surfactant such as homogenol L18 (trade name, manufactured by Kao Corporation) can be used. is there. Further, an additive such as a colorant may be contained within a range that does not adversely affect the electrodeposition characteristics.

  The protective sheet that can be used in the present invention can be attached to a screen printing mask and does not dissolve even if it touches a highly insulating medium in which resin particles are dispersed. Even after being exposed to heat, pressure, light, water, etc. due to particle fixing treatment, it can be easily peeled off from the screen printing mask, and even after peeling, no adhesive remains on the screen printing mask. Any one is acceptable. For example, ELEP Masking N-380 (trade name, Nitto Denko Corporation), Paint Ace 720A (trade name, Nitto Denko Corporation), SPV-K100 (trade name, Nitto Denko Corporation), Scotch plating masking tape 851A (Trade name, Sumitomo 3M Co., Ltd.), Scotch heat resistant masking tape 214-3MNE (trade name, Sumitomo 3M Co., Ltd.), masking tape NO2311 (trade name, Nichiban Co., Ltd.), etc. Absent. Further, the protective sheet may have a property of being dissolved in an alkaline aqueous solution.

  The components of the alkali-soluble protective sheet include a copolymer formed by polymerizing monomers having a carboxylic acid group, a carboxylic acid amide group, a phenolic hydroxyl group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, and a phosphonic acid group. A coalescence, a phenol resin, a xylene resin, etc. are mentioned. Copolymers of monomers having carboxylic acid groups include copolymers of styrene and maleic acid monoesters, and copolymers of two or more of acrylic acid or methacrylic acid and their alkyl esters, aryl esters or aralkyl esters. A polymer is mentioned. In addition, a copolymer of vinyl acetate or vinyl benzoate and crotonic acid can be used. Particularly preferred among the phenol resins are novolak resins obtained by condensing phenol, o-cresol, m-cresol, or p-cresol with formaldehyde or acetaldehyde under acidic conditions. Moreover, you may make these contain a plasticizer, a coloring agent, etc. By laminating these components on a carrier film to form a sheet, it becomes easy to attach using a laminator or the like. Examples of the carrier film include polypropylene, polyethylene, polyester, and polyvinyl alcohol. A negative dry film photoresist for manufacturing a circuit board can also be used as an alkali-soluble protective sheet. Specifically, for example, Liston (trade name) of DuPont MRC Dry Film Co., Ltd., Fotec (trade name) of Hitachi Chemical Co., Ltd., Sunfort (trade name) of Asahi Kasei Electronics Co., Ltd. can be used.

  When an alkali-soluble protective sheet is used, a method such as spraying or dipping can be applied as a method of removing the resin sheet with an alkaline aqueous solution. Examples of the alkaline aqueous solution include aqueous solutions of inorganic basic compounds such as alkali metal silicates, alkali metal hydroxides, phosphoric acid and alkali metal carbonates, phosphoric acid and ammonium carbonates, ethanolamines, ethylenediamine, and propanediamine. And organic basic compounds such as triethylenetetramine and morpholine diluted in water.

  The method of attaching the protective sheet to the screen printing mask may be any method as long as air and dust are not mixed without causing unevenness or undulation on the attachment surface. For example, an apparatus (laminator) that presses a hot rubber roll for a printed circuit board with pressure to perform thermocompression bonding is used.

  As a 2nd resin layer removal liquid concerning this invention, it is a liquid which can melt | dissolve or disperse | distribute a 2nd resin layer, and uses the liquid suitable for the composition of the 2nd resin layer to be used. The second resin layer removing liquid removes the second resin layer in the opening, thereby forming a region where the second resin layer does not exist in the opening. As the second resin layer removing liquid, a liquid that does not dissolve the masking layer is used. Also, a liquid that does not cause dissolution, swelling, shape change, or the like is used for the screen printing mask. Specific examples include aqueous resin layer removing liquids such as alkaline aqueous solutions and acid aqueous solutions, and solvent-based resin layer removing liquids such as ketones, alcohols, and glycols. In particular, an alkaline aqueous solution is usefully used. For example, alkali metal silicates, alkali metal hydroxides, phosphoric acid or alkali metal carbonates, aqueous solutions of inorganic basic compounds such as phosphoric acid or ammonium carbonate, ethanolamine, ethylenediamine, propanediamine, triethylenetetramine, morpholine An aqueous solution of an organic basic compound such as can be used. These aqueous solutions need to be adjusted in concentration, temperature, spray pressure, treatment time, etc. for the purpose of controlling solubility in the second resin layer.

  As the masking layer that can be used in the present invention, any masking layer may be used as long as it is insoluble in the second resin layer removing liquid to be used and can be laminated. Resins and metals having different solubility from the second resin layer to be used can be used. Specifically, polyimide, polyamide, polyester resin, epoxy resin, polycarbonate, polystyrene, polyethylene, polypropylene, polyacetal, polytetrafluoroethylene, fluororesin, silicone resin, acrylic resin, vinyl acetate resin, vinyl chloride resin, vinylidene chloride resin , Phenol resin, polyvinyl butyral, gelatin, carboxymethyl cellulose and the like. In order to give a difference in solubility with the second resin layer, the acid value of the masking layer can be set to 1/10 or less, preferably 1/100 or less, of the acid value of the second resin layer. From the viewpoint of versatility, polyester and polyethylene can be preferably used. As the metal, copper, nickel, stainless steel (SUS), aluminum or the like can be used.

  As a method of providing the second resin layer and the masking layer by laminating so as to block the opening on the substrate contact surface of the screen printing mask made of a metal material, air or corrugation is not generated on the attachment surface without causing unevenness or undulation. Any method may be used as long as dust is not mixed. For example, an apparatus (laminator) that presses a hot rubber roll for a printed circuit board with pressure to perform thermocompression bonding is used. The second resin layer and the masking layer may be attached at the same time, or the masking layer may be attached after the second resin layer is attached.

  As a method for supplying the second resin layer removal liquid from the squeegee surface according to the present invention, there are a dipping method, a paddle method, a spray method, brushing, scraping, etc., but a high pressure spray method is most suitable for removing the second resin layer. ing. In this case, the processing conditions (temperature, spray pressure, time) are 10 to 50 ° C., more preferably 15 to 40 ° C., and further preferably 15 to 35 ° C. The spray pressure is preferably 0.05 to 0.5 MPa, more preferably 0.1 to 0.3 MPa.

  Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to these examples.

Example 1
In a four-necked flask equipped with a resin particle synthesis stirrer, thermometer, and reflux condenser, 720 parts by mass of IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.), 475.2 parts by mass of dodecyl methacrylate, 2-hydroxyethyl methacrylate After adding 4.8 parts by mass and replacing with nitrogen, the mixture was heated to 80 ° C., and 4.8 parts by mass of 2,2′-azobis (2-methylbutyronitrile) was added. The temperature was kept at 80 ° C. and reacted for 7 hours. Next, the temperature is lowered to 65 ° C., 240 parts by mass of IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.), 5.7 parts by mass of 2-methacryloyloxyethyl isocyanate, 1,8-diazabicyclo [5.4.0] undece. 0.06 parts by mass of -7-ene was added, the temperature was kept at 65 ° C., and the mixture was reacted for 3 hours to obtain a dispersant solution having a concentration of 33.5% by mass.

  Next, in a four-necked flask equipped with a stirrer, a thermometer, and a reflux condenser, 40 parts by mass of the dispersant solution synthesized above, 516 parts by mass of IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.), methyl acrylate 20 Parts by weight, 1 part by weight of methyl methacrylate, 8 parts by weight of 2-hydroxyethyl methacrylate, 4 parts by weight of 2-dimethylaminoethyl methacrylate, 15 parts by weight of 2- (O- [1'-methylpropylideneamino] carboxyamino) ethyl methacrylate The mixture was purged with nitrogen, heated to 70 ° C., and 0.4 part by mass of 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile) was added. The temperature was kept at 70 ° C. and reacted for 8 hours to obtain resin particles. In the resultant resin particle composite, 0.02 parts by mass of charge control agent (octadecyl vinyl ether / maleic anhydride copolymer; mass composition ratio 3/1, maleic anhydride hydrolysis with respect to 1 part by mass of solid content IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.) so that the solid content concentration becomes 1% by mass after adding a positive charge to the resin particles. The resin particles were diluted with, and dispersed in a highly insulating medium.

Formation of the first resin layer on a screen printing mask made of a metal material A large number of openings (circular, diameter 200 μm) are formed on a stainless steel plate (SUS304) with a thickness of 80 μm using a YAG laser, and the screen printing is made of a metal material. A mask was prepared. Next, a commercially available negative-type dry film photoresist (trade name: Sunfort AQ2575, manufactured by Asahi Kasei Electronics Co., Ltd.) is applied to a squeegee surface of a screen printing mask made of a metal material at 80 ° C., 0. Affixed at a pressure of 1 MPa to form a protective sheet composed of a dry film photoresist layer and a polyethylene terephthalate layer. Next, using the electrodeposition apparatus having the structure shown in FIG. 5, the high insulation produced as described above was formed on the inner wall of the opening of the screen printing mask made of a metal material and the contact surface of the substrate to be printed under the condition of a bias voltage of 30V. The resin particles dispersed in the conductive medium were electrodeposited. Subsequently, IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.) was dried with cold air, and then the resin particles were formed into a film and fixed under a heating condition of 80 ° C. for 3 minutes to form a first resin layer. It was 0.1 micrometer when the thickness of the 1st resin layer was measured. Next, the polyethylene terephthalate layer of the negative dry film photoresist used as a protective sheet was peeled off by hand, and then dried using a 1% by weight aqueous sodium carbonate solution (30 ° C.) under a spray pressure of 0.1 MPa. The film photoresist layer was eluted and removed. Subsequently, after washing with water, the moisture was removed with cold air, and the first resin layer was cured by heating under conditions of 180 ° C. for 2 hours.

Formation of Second Resin Layer on Screen Printing Mask Made of Metal Material A coating solution comprising the components shown in Table 1 is applied to a masking layer (thickness 25 μm, material polyester) and dried to give a second resin 3 μm thick. A layer was made. Next, the second resin layer and the masking layer are placed on the printing substrate contact surface of the screen printing mask made of the metal material formed with the first resin layer, using a laminator at 100 ° C. and 0.1 MPa. Thermocompression bonding was performed under the following conditions.

  Next, using a 1% by mass sodium carbonate aqueous solution as the second resin layer removing liquid, shower spray (spray pressure 0.1 MPa) is applied from the squeegee surface side of the screen printing mask, and the second resin layer in the opening portion. Was dissolved and removed. After washing with water, the water was dried with cold air. The masking layer was removed, and then irradiated with ultraviolet rays for 500 seconds using a high pressure mercury lamp light source device for baking (trade name: UNIREC URM300, manufactured by USHIO INC.) Having a suction adhesion mechanism. Furthermore, the second resin layer was cured by heating in an oven at 120 ° C. for 30 minutes. As described above, the first resin layer is formed on the inner wall of the opening of the screen printing mask made of the metal material illustrated in FIG. 1, and the non-opening of the contact surface of the substrate to be printed of this screen printing mask A screen printing mask having a first resin layer and a second resin layer laminated in this order on the part was produced. When the opening of the second resin layer was observed with an optical microscope, there was no displacement from the opening of the screen printing mask made of a metal material. Further, d shown in FIG. 17 was 0 μm.

Examples 2-10
Screen printing masks of Examples 2 to 10 were produced in the same manner as in Example 1 except that the thickness of the first resin layer, the bias voltage, and the thickness of the second resin layer were changed as shown in Table 2. In the screen printing masks of Examples 2 to 10, when the opening of the second resin layer was observed with an optical microscope, there was no positional deviation from the opening of the screen printing mask made of a metal material. Further, d shown in FIG. 17 is shown in Table 2.

Example 11
Formation of second resin layer on screen printing mask made of metal material A large number of openings (circular, diameter 200 μm) are formed with a YAG laser on an 80 μm thick stainless steel plate (SUS304) for screen printing made of metal material A mask was prepared. A coating solution comprising the components shown in Table 1 was applied to a masking layer (thickness 25 μm, material polyester) and dried to prepare a second resin layer having a thickness of 3 μm. The second resin layer and the masking layer were thermocompression bonded to the printed substrate contact surface of the screen printing mask made of a metal material using a laminator at 100 ° C. and 0.1 MPa.

  Next, using a 1% by mass sodium carbonate aqueous solution as the second resin layer removing liquid, shower spray (spray pressure 0.1 MPa) is applied from the squeegee surface side of the screen printing mask, and the second resin layer in the opening portion. Was dissolved and removed. After washing with water, the water was dried with cold air. After removing the masking layer, ultraviolet rays were irradiated for 500 seconds using a high pressure mercury lamp light source device for baking (Unirec URM300, manufactured by USHIO INC.) Having a suction adhesion mechanism. Furthermore, the second resin layer was cured by heating in an oven at 120 ° C. for 30 minutes. When the opening of the second resin layer was observed with an optical microscope, there was no displacement from the opening of the screen printing mask made of a metal material.

Formation of first resin layer on screen printing mask made of metal material Commercially available negative dry film photoresist on the squeegee surface of the screen printing mask made of metal material on which the second resin layer prepared above is formed (Product name: Sunfort AQ2575, manufactured by Asahi Kasei Electronics Co., Ltd.) is applied to a squeegee surface of a mask for screen printing made of a metal material using a laminator at a pressure of 80 ° C. and 0.1 MPa, and a dry film photoresist. A protective sheet comprising a layer and a polyethylene terephthalate layer was formed. Next, using the electrodeposition apparatus having the structure shown in FIG. 5, the highly insulating medium produced in Example 1 was formed on the inner wall of the opening of the screen printing mask and the second resin layer on the printed substrate contact surface. The resin particles dispersed therein were electrodeposited under the condition of a bias voltage of 30V. Subsequently, IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.) was dried with cold air, and then the resin particles were formed into a film under conditions of 80 ° C. for 3 minutes to form a first resin layer. It was 0.1 micrometer when the thickness of the 1st resin layer was measured. Next, the polyethylene terephthalate layer of the negative type dry film photoresist used as a protective sheet was peeled off by hand, and then dry film photo was applied with a 1% by weight aqueous sodium carbonate solution (30 ° C.) under a spray pressure of 0.1 MPa. The resist layer was eluted and removed. Subsequently, after washing with water, the moisture was removed with cold air, and the first resin layer was cured by heating under conditions of 180 ° C. for 2 hours. Thereby, the first resin layer is formed on the inner wall of the opening portion of the screen printing mask made of the metal material illustrated in FIG. 2, and the second resin layer is formed on the non-opening portion of the contact surface of the substrate for the screen printing mask. A screen printing mask in which the resin layer and the first resin layer were laminated in this order was produced. When d shown in FIG. 18 was measured, it was 0 μm.

Examples 12-20
Screen printing masks of Examples 12 to 20 were produced in the same manner as Example 11 except that the thickness of the first resin layer, the bias voltage, and the thickness of the second resin layer were changed as shown in Table 3. In the screen printing masks of Examples 12 to 20, when the opening of the second resin layer was observed with an optical microscope, there was no positional deviation from the opening of the screen printing mask made of a metal material. Further, d shown in FIG. 18 is shown in Table 3.

Screen printing mask printing test Using the screen printing masks of Examples 1 to 20, cream solder was used as a paste material with a squeegee, and screen printing was repeated on a printed wiring board. In the screen printing masks of Examples 2 to 8 and Examples 12 to 18, no defects in cream solder occurred even after 200 repetitions, and a solder terminal pattern having a good shape could be formed. The screen printing masks of Examples 1, 9, 10, 11, 19, and 20 were good up to 100 repetitions, but some paste material omissions and bleeding occurred between 101 and 120th. Began to do.

(Comparative Example 1)
A large number of openings (circular, diameter 200 μm) were formed on a stainless steel plate (SUS304) having a thickness of 80 μm with a YAG laser, and a screen printing mask made of a metal material was produced. Next, using a laminator, a commercially available negative-type dry film photoresist (trade name: Sunfort AQ2575, manufactured by Asahi Kasei Electronics Co., Ltd.) is used on the squeegee surface of a mask for screen printing made of a metal material, using a laminator, The protective sheet which consists of a dry film photoresist layer and a polyethylene terephthalate layer was affixed on 80 degreeC and the pressure of 0.1 Mpa. Next, using the electrodeposition apparatus having the structure shown in FIG. 5, the resin dispersed in the highly insulating medium produced above on the inner wall of the opening of the screen printing mask made of a metal material and the contact surface of the substrate to be printed The particles were electrodeposited. Subsequently, IP1620 (trade name, manufactured by Idemitsu Kosan Co., Ltd.) was dried with cold air, and then the resin particles were formed into a film under conditions of 80 ° C. for 3 minutes. It was 4 micrometers when the thickness of the 1st resin layer used as the film form was measured. Next, after removing the polyethylene terephthalate layer of the negative dry film photoresist by hand, the dry film photoresist layer is eluted and removed with 1 mass part of sodium carbonate aqueous solution (30 ° C.) under a spray pressure of 0.1 MPa. did. Subsequently, after washing with water, the water was removed with cold air, and exposed to conditions of 180 ° C. for 2 hours to heat and cure the first resin layer. Thereby, although the 1st resin layer was formed in the opening part and the to-be-printed substrate contact surface, the mask for screen printing of the comparative example 1 by which the 2nd resin layer was not formed in the to-be-printed substrate contact surface was obtained. .

  Using the screen printing mask of Comparative Example 1, cream solder as a paste material was repeatedly screen-printed on a printed wiring board with a squeegee. Material bleeding began to occur.

(Comparative Example 2)
A coating solution comprising the components shown in Table 2 was applied to a masking layer (thickness 25 μm, material polyester) and dried to prepare a second resin layer having a thickness of 10 μm. Next, a large number of openings (circular, diameter: 200 μm) were formed on a stainless steel plate (SUS304) having a thickness of 80 μm with a YAG laser, thereby producing a screen printing mask made of a metal material. Next, the second resin layer was thermocompression bonded to the printed substrate contact surface using a laminator. Next, shower spray was applied from the squeegee surface side of the screen printing mask using a second resin layer removing liquid of 1% by mass aqueous sodium carbonate (30 ° C.) to dissolve and remove the second resin layer in the opening. . After washing with water, the washing water was dried with cold air, and then the masking layer was removed. Subsequently, ultraviolet rays were irradiated for 500 seconds using a baking high-pressure mercury lamp light source device (Unirec URM300, manufactured by USHIO INC.) Having a suction adhesion mechanism. Furthermore, the second resin layer was cured by heating in an oven at 120 ° C. for 30 minutes. When the opening of the second resin layer was observed with an optical microscope, there was no displacement from the opening of the screen printing mask made of a metal material. The size of the opening of the second resin layer and the opening of the screen printing mask made of a metal material were the same. Thereby, although the 2nd resin layer was formed in the to-be-printed substrate contact surface, the screen printing mask of the comparative example 2 by which the 1st resin layer was not formed in the opening part and the to-be-printed substrate contact surface was produced.

  When the screen solder was repeatedly screen-printed as paste material using a screen printing mask of Comparative Example 2 with a squeegee, no bleeding of the paste material occurred. Began to do.

  The screen printing mask and the method for producing the screen printing mask of the present invention are widely applicable to screen printing applications. For example, as a paste material, a conductive material, an insulating material, a color material, a sealing material, An adhesive material, a resist material, a processing agent, and the like can be applied to a use for forming a pattern on an arbitrary substrate to be printed by screen printing.

Sectional drawing of the mask for screen printing of this invention. Sectional drawing of the mask for screen printing of this invention. Sectional drawing of the mask for screen printing which consists of metal materials. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. The conceptual diagram of an electrodeposition apparatus. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. The conceptual diagram of an electrodeposition apparatus. FIG. 6 is a process diagram of a method for manufacturing a screen printing mask of the present invention. The conceptual diagram of the protrusion of a resin layer, a partition, and filling. Sectional drawing of the opening part of the mask for screen printing of this invention. Sectional drawing of the opening part of the mask for screen printing of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Screen printing mask 2 1st resin layer 3 Squeegee surface 4 Printed substrate contact surface 5 Opening 6 Second resin layer 7 Protective sheet 9 Protrusion of resin layer 10 Partition 11 Filled 12 Electrode 13 Resin particle 14 Masking layer

Claims (2)

A method for producing a screen printing mask made of a metal material having a resin layer at least in an opening and a printed substrate contact surface, wherein the resin particles dispersed in a highly insulating medium are applied to the screen printing mask made of a metal material. A step of forming a first resin layer on the inner wall of the opening and the printed substrate contact surface by electrodeposition, and a second resin layer and a masking layer are formed on the first resin layer on the printed substrate contact surface by lamination. A method for producing a mask for screen printing, comprising a step of supplying a second resin layer removing liquid from a squeegee surface and removing the second resin layer in the opening. A method for producing a screen printing mask made of a metal material having a resin layer at least in an opening and a substrate contact surface, wherein the second resin layer and the masking layer are formed on the substrate contact surface of the screen printing mask made of a metal material. Forming a layer by laminating, supplying a second resin layer removing liquid from the squeegee surface to remove the second resin layer in the opening, and electrodepositing the resin particles dispersed in the highly insulating medium, A method for producing a mask for screen printing, comprising a step of forming a first resin layer on an inner wall of an opening and a second resin layer on a printed substrate contact surface.

Images