JP2008155554A - Manufacturing method of screen printing mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To offer, as the object of this invention, a manufacturing process of a screen printing mask which has a uniform resin layer free of projections of resin layer, partitions or filling-in on the inner wall of the opening. <P>SOLUTION: In the manufacturing process of the screen printing mask by at least forming the resin layer on the inner wall of the opening, the manufacturing process of the screen printing mask of this invention is characterized to form the resin layer by electro-depositing the resin particles dispersed in the highly insulated medium onto the screen printing mask with the opening. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a mask for screen printing used in the field of manufacturing printed wiring boards and the like. Further, the present invention relates to a method for manufacturing a screen printing mask formed by forming a resin layer on at least the inner wall of the opening.

  With recent miniaturization and multi-functionalization of electronic devices, the density of printed wiring boards and the miniaturization of wiring patterns have been promoted, and high-density mounting of electronic components on printed wiring boards has been widely performed. Yes. In high density mounting of electronic components on this printed wiring board, cream solder is printed to mount the electronic components on the surface of the printed wiring board, and the electronic components are mounted on the solder terminals, and then heated in a reflow furnace for soldering. To do. As the cream solder printing method, a screen printing process is widely used. In general, screen printing is performed by setting a screen printing mask having a pattern-shaped opening formed on the upper surface of a substrate to be printed and supplying paste material such as cream solder to the squeegee surface of the screen printing mask. In this method, the paste material is transferred and printed onto the pattern through the opening by scraping with a squeegee.

  However, when cream solder is printed using a screen printing mask, if the pattern becomes high density and high definition, the ability of the cream solder to be removed from the screen printing mask deteriorates. In recent years, the trend of lead-free cream solder materials has been increasing due to environmental problems, and as part of the countermeasures, lead-free solders that do not contain lead have been used as cream solder materials. . Lead-free cream solder tends to be inferior in transferability compared to conventional cream solder. Deterioration of the cream solder from the screen printing mask deteriorated, causing defects such as protrusions, chips, cracks, and disconnection of the solder terminals, which was a major cause of yield reduction.

In order to solve such a problem, a screen printing mask in which a resin layer is formed on at least the inner wall of the opening of the screen printing mask has been proposed. According to this, a resin layer is formed on the inner wall of the opening by applying resin, and the unevenness of the inner wall is smoothed, so that the friction between the cream solder and the inner wall is reduced and the cream solder can be easily removed. ing. In addition, by forming a compound (for example, polysiloxane, fluorine resin, silicon resin, etc.) having good repellent property or slipperiness with cream solder on the inner wall of the opening, the cream solder can be removed easily. However, as a means for forming the resin layer on the inner wall, dipping, spraying, brushing, spin coating, etc. are adopted, and in these methods, the resin layer can be uniformly formed on the inner wall of the opening. It is difficult, and defects such as protrusions 9, partition walls 10, fillings 11, etc. of the resin layer as shown in FIG. (For example, patent documents 1-6).
Japanese Utility Model Publication No. 63-37256 JP-A-1-299088 Japanese Patent Laid-Open No. 4-357093 JP-A-6-219070 JP-A-8-290686 JP 2002-192850 A

  An object of the present invention is to provide a method for producing a mask for screen printing having a uniform resin layer on the inner wall of an opening without defects such as protrusions, partition walls, and filling of the resin layer.

  As a result of investigations, the present inventors have found that in a method for producing a resin-coated screen printing mask in which a resin layer is formed on the inner wall of the opening, the screen printing mask having the opening is dispersed in a highly insulating medium. It has been found that the above-mentioned problems can be solved by a method for producing a mask for screen printing, wherein the resin layer is formed by electrodeposition of the formed resin particles.

  In addition, a masking sheet is attached to the squeegee surface of the screen printing mask having the opening, and then the resin particles dispersed in the highly insulating medium are electrodeposited to contact the inner wall of the opening and the printed substrate contact surface. It has been found that the above-mentioned problems can be solved by the method for producing a mask for screen printing described above, wherein a resin layer is formed on the substrate, and then the masking sheet is removed.

  Also, the inner wall of the opening and the substrate to be printed are obtained by attaching an alkali-soluble resin sheet to the squeegee surface of the screen printing mask having the opening, and subsequently electrodepositing resin particles dispersed in the highly insulating medium. It has been found that the above-mentioned problems can be solved by the method for producing a mask for screen printing described above, wherein a resin layer is formed on the contact surface, and then the alkali-soluble resin sheet is removed with an alkaline aqueous solution.

  According to the present invention, a uniform resin layer can be formed on the inner wall of the opening portion of the screen printing mask having the opening portion without defects such as protrusions, partition walls, and filling of the resin layer. Accordingly, the cream solder can be easily removed.

  The mask for screen printing having an opening according to the present invention can transfer a paste material such as cream solder onto a substrate to be printed by placing the paste material on the squeegee surface and scraping it with the squeegee. For example, a screen printing mask produced by any method can be used. For example, any of a solid mask, a suspend mask, a metal mask (etching method, laser method, additive method, machining method) or the like can be used. The material is preferably a conductive material because it can be electrodeposited. Specifically, general materials such as stainless steel and nickel can be applied. Also, there is no particular limitation on the opening pattern of the screen printing mask. For example, a round shape, an oval shape, a square shape, a rectangular shape, a rectangular shape, a rhombus shape, a trapezoidal shape, a polygonal shape such as a hexagonal shape and an octagonal shape, a gourd shape, and a dumbbell. Examples include irregular shapes such as shapes.

  Examples of a mask for screen printing in which a resin layer is formed on at least the inner wall of the opening according to the present invention are shown in FIGS. 1-3 are examples in which a metal mask is applied as a mask for screen printing. In FIG. 1, the resin layer 2 is formed only on the inner wall of the opening 5. FIG. 2 is formed on the inner wall of the opening 5 and the printed substrate contact surface 4. FIG. 3 shows the resin layer 2 formed on the entire surface. When the resin layer 2 is not formed on the squeegee surface 3 as shown in FIGS. 1 and 2, when the squeegee is contacted many times with a high indentation pressure, the resin layer 2 is peeled off if the durability of the resin layer 2 is insufficient. Sometimes. Since the peeled resin layer 2 is mixed with the paste material, the squeegee surface 3 preferably has no resin layer 2. 4 to 7 are examples of screen printing plate masks in which a mesh 6 is formed on the squeegee surface 3 such as a solid mask and a suspend mask. FIG. 4 shows the resin layer 2 formed around the inner wall of the opening 5 and the mesh 6 of the opening. FIG. 5 shows the resin layer 2 formed on the entire surface of the mesh 6 other than the squeegee surface 3. 6 and 7 show the resin layer 2 formed on the entire surface. In order to reduce the difference in opening area of the opening 5 before and after forming the resin layer 2, the thickness of the resin layer 2 is preferably 0.1 μm to 5 μm. When the thickness of the resin layer is less than 0.1 μm, the adhesion between the screen printing mask 1 and the resin layer 2 may be lowered. On the other hand, if the thickness exceeds 5 μm, it may be difficult to form a uniform film.

  The method for producing a mask for screen printing according to the present invention will be described in detail with reference to FIGS. 9 to 12 in the order of steps, taking as an example a metal mask in which the resin layer 2 is formed on the inner wall of the opening 5 and the printed substrate contact surface 4. First, a masking sheet 7 is attached to a screen printing mask (FIG. 9) having an opening 5 (FIG. 10). Next, the electrode 12 is placed so as to face the printed substrate contact surface 4 in a liquid in which the resin particles 13 used for the resin layer 2 are dispersed in a highly insulating medium (FIG. 11). Next, an appropriate potential difference is generated between the screen printing mask 1 and the electrode 12, and the resin particles 13 are electrophoresed in the direction of the screen printing mask 1 to the inner wall of the opening 5 and the printed substrate contact surface 4. Resin particles 13 are adhered. Next, the screen printing mask 1 is taken out of the liquid and the highly insulating medium is evaporated. Next, the resin particles 13 attached by the electrodeposition method are formed into a film and fixed by heating, pressure, light, water, solvent, etc. (FIG. 12). Subsequently, by peeling off the masking sheet 7, a metal mask in which the resin layer 2 is formed on the inner wall of the opening and the printed substrate contact surface 4 can be produced (FIG. 2). After peeling off the masking sheet, treatments such as heating, pressure, and light can be performed again.

  In the method for producing a screen printing mask when an alkali-soluble resin sheet is used, first, the alkali-soluble resin sheet is attached to a screen printing mask having an opening. Next, an electrode is placed so as to face the printed substrate contact surface in a liquid in which resin particles used for the resin layer are dispersed in a highly insulating medium. Next, an appropriate potential difference is generated between the screen printing mask and the electrode, the resin particles are electrophoresed in the direction of the screen printing mask, and the resin particles are adhered to the inner wall of the opening and the printed substrate contact surface. Subsequently, the screen printing mask is taken out of the liquid, and the highly insulating medium is evaporated. The resin particles adhered by the electrodeposition method are fixed by forming a film by heating, pressure, light, water, solvent, etc., and then dissolving and removing the alkali-soluble resin sheet with an alkaline aqueous solution, thereby removing the resin layer from the opening. A metal mask formed on the inner wall and the printed substrate contact surface can be produced. After the alkali-soluble resin sheet is dissolved and removed, treatments such as heating, pressure, and light can be performed again.

  In the method for producing a screen printing mask of the present invention, in the method for producing a screen printing mask (FIG. 1) in which the resin layer 2 is formed only on the inner wall of the opening 5, as shown in FIG. A masking sheet or an alkali-soluble resin sheet (hereinafter referred to as a non-opening protective layer 8) having an opening at the same position is formed on the printed substrate contact surface 4 of the screen printing mask 1, and thereafter, in the same manner as described above, It can be produced by attaching resin particles by a deposition method. Such a method for forming the non-opening protective layer 8 includes a method of forming an opening by a laser, a pattern of the opening using a photomass having the same pattern as the screen printing mask by making the non-opening protective layer 8 photosensitive. The method of exposing the film to the developing process, the method of opening through the opening of the screen printing mask through an alkaline developer, etc. can be applied, but the non-opening protection is opened at the same position as the opening of the mask for the screen printing plate Any layer can be applied (for example, Japanese Patent Application Laid-Open Nos. 2004-31867, 3-57697, and 2006-173597).

  In the method for producing a screen printing mask of the present invention, the method for producing a screen printing mask (FIGS. 3, 6, and 7) in which the resin layer 2 is formed on the entire surface includes a masking sheet or an alkali-soluble resin. This is achieved by performing an electrodeposition process without attaching a sheet. When electrodeposition is performed, the electrode facing the screen printing mask may be disposed only on the printed substrate contact surface side, or may be disposed on both the printed substrate contact surface side and the squeegee surface side.

  Examples of the highly insulating medium according to the present invention include linear or branched aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons, and halogen-substituted products thereof. Examples include octane, isooctane, decane, isodecane, decalin, nonane, dodecane, isododecane, cyclohexane, cyclooctane, cyclodecane, benzene, toluene, xylene, mesitylene and the like. Product names include Isopar E, Isopar G, Isopar H, Isopar L (EXXON), IP Solvent 1620 (Idemitsu Petrochemical Co., Ltd.), and the like. These highly insulating media can be used alone or in combination.

  The average particle diameter measured by the Coulter Counter method of the resin particles according to the present invention is preferably in the range of 0.05 to 1.0 μm from the viewpoint of ensuring the thickness as the resin layer and maintaining the dispersed state, Is preferably in the range of 0.1 to 0.6 μm. The method for producing the resin particles may be either a pulverization method or a polymerization method. The pulverization method is a method in which resin particle components and other desired additives (for example, colorants) are mixed and kneaded, and the obtained kneaded product is pulverized to a desired particle size. The polymerization method is a method obtained by polymerizing a monomer that is soluble in a highly insulating medium to form a polymer that is insoluble in the highly insulating medium. The resin particles obtained by the polymerization method are composed of a dispersant and a core component. The dispersant is a polymer having a molecular weight of 1000 or more that is soluble in the highly insulating medium, and functions as a role of dispersing the resin particles in the highly insulating medium. The core component is a polymer that is insoluble in a highly insulating medium. Examples of such core components include vinyl esters of aliphatic carboxylic acids having 1 to 6 carbon atoms, such as vinyl acetate, vinyl propionate, and vinyl chloroacetate, vinyl esters of benzoate, acrylic acid, and methacrylic acid. Alkyl esters or amides having 1 to 6 carbon atoms such as crotonic acid, maleic acid, itaconic acid, ethylene glycol di (meth) acrylate, methylenebisacrylamide, hydroxyethyl (meth) acrylate, hydroxypropyl (meta ) Acrylate, methacryloyloxyethyl isocyanate, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, styrene and its derivatives, divinylbenzene, N-vinyl-2-pyrrolidone, N-vinylpyridy And polymers comprising nitrogen-containing vinyl monomers such as N, N-vinylimidazole and N, N-dialkylaminoethyl (meth) acrylate. For example, resin particles dispersed in a highly insulating medium described in JP-A Nos. 60-252367 and 61-116364 can be used.

  The resin particles according to the present invention form a resin layer by electrodeposition. In this case, the particles are made positive or negative charged particles, and the resin particles are electrodeposited while applying an appropriate electric field. . Therefore, a charge is imparted to the resin particles by adding an appropriate charge control agent to the liquid of the resin particles. As the charge control agent, for example, a compound shown in JP-A-6-51567 or a polycarboxylic acid type polymer surfactant such as homogenol L18 (trade name, manufactured by Kao Corporation) can be used. . Further, an additive such as a colorant may be contained within a range that does not adversely affect the electrodeposition characteristics.

  In the method of electrodepositing resin particles, an appropriate bias voltage is applied between the screen printing mask 1 and the electrode 12 as shown in FIG. For example, a horizontal / horizontal transfer device (for example, a special technique) that is inserted between electrodes arranged in parallel so as to face the screen printing mask and supplies the liquid onto both sides of the screen printing mask from the upper and lower sides of the electrode for electrodeposition. (Kaihei 6-224541, JP-A-2004-163605, etc.) and a screen printing mask held substantially vertically and immersed in a bath containing liquid, and then substantially vertically on both sides of the screen printing mask. An apparatus (for example, Japanese Patent Application Laid-Open No. 2002-132049) or the like that performs electrodeposition processing by fixing the screen printing mask substantially vertically with electrodes arranged opposite to each other is applicable as the electrodeposition apparatus.

  The masking sheet according to the present invention has at least an adhesive layer and a support layer, and can be attached to a screen printing mask, and the adhesive layer and the support layer are dissolved even when touching a highly insulating medium. In addition, even after being exposed to heat treatment, pressurization, light, water, etc. by electrodeposition treatment and resin particle fixing treatment, it can be easily peeled off from the screen printing mask, and part of the adhesive layer even after peeling. As long as it does not remain in the mask for screen printing. For example, ELEP Masking N-380 (trade name, Nitto Denko Corporation), Paint Ace 720A (trade name, Nitto Denko Corporation), SPV-K100 (trade name, Nitto Denko Corporation), Scotch plating masking tape 851A (Trade name, Sumitomo 3M Co., Ltd.), Scotch heat resistant masking tape 214-3MNE (trade name, Sumitomo 3M Co., Ltd.), masking tape NO2311 (trade name, Nichiban Co., Ltd.), etc. Absent.

  The alkali-soluble resin sheet according to the present invention comprises a component that dissolves in an alkaline aqueous solution, can be attached to a screen printing mask, and does not dissolve even if it touches a highly insulating medium. Even after being exposed to heat treatment, pressure treatment, light treatment, water treatment, etc. due to the treatment and resin particle fixing treatment, it can be removed from the screen printing mask with an aqueous alkaline solution and does not cause residue in the screen printing mask. Any one is acceptable. The components of the alkali-soluble resin sheet include a copolymer formed by polymerizing monomers having a carboxylic acid group, a carboxylic acid amide group, a phenolic hydroxyl group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, and a phosphonic acid group. A polymer, a phenol resin, a xylene resin, etc. are mentioned. Copolymers of monomers having carboxylic acid groups include copolymers of styrene and maleic acid monoesters, and copolymers of two or more of acrylic acid or methacrylic acid and their alkyl esters, aryl esters or aralkyl esters. A polymer is mentioned. In addition, a copolymer of vinyl acetate or vinyl benzoate and crotonic acid can be used. Particularly preferable among the phenol resins include phenol, o-cresol, m-cresol, or novolak resin obtained by condensing p-cresol and formaldehyde or acetaldehyde under acidic conditions. In addition, these may contain a plasticizer, a colorant and the like. By laminating the components of these alkali-soluble resin sheets on a carrier film to form a sheet, it becomes easy to attach using a laminator or the like. Examples of the carrier film include polypropylene, polyethylene, polyester, and polyvinyl alcohol. Also, a negative dry film photoresist for manufacturing a circuit board can be applied. Specifically, for example, Liston from DuPont MRC Dry Film Co., Ltd., Fotec from Hitachi Chemical Co., Ltd., Sunfort from Asahi Kasei Electronics Co., Ltd. can be used.

  The method for attaching the masking sheet or the alkali-soluble resin sheet to the screen printing mask may be any method as long as it does not cause unevenness or undulation on the attachment surface and does not contain air or dust. For example, an apparatus is used in which a hot rubber roll for a printed circuit board is pressed with pressure to perform thermocompression bonding.

  The method for removing the alkali-soluble resin sheet with an alkaline aqueous solution according to the present invention is removed by a method such as spraying or dipping. Examples of the alkaline aqueous solution include aqueous solutions of inorganic basic compounds such as alkali metal silicates, alkali metal hydroxides, phosphoric acid and alkali metal carbonates, phosphoric acid and ammonium carbonates, ethanolamines, ethylenediamine, and propanediamine. And organic basic compounds such as triethylenetetramine and morpholine diluted in water.

  Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to these examples.

Example 1
In a four-necked flask equipped with a stirrer, thermometer, reflux condenser, and dropping funnel, 720 parts by mass of IP solvent 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.), 475.2 parts by mass of dodecyl methacrylate and 2- After mixing 4.8 parts by mass of hydroxyethyl methacrylate and purging with nitrogen, the mixture was heated to 80 ° C. and 4.8 parts by mass of 2,2′-azobis (2-methylbutyronitrile) was added to perform radical polymerization. The reaction was terminated by heating at 85 ° C. for 7 hours to obtain a polymer mixture (A1) having a concentration of 40% by mass.

  12 parts by mass of the resulting polymer mixture (A1), 0.0573 parts by mass of methacryloyloxyethyl isocyanate, and 0.0006 parts by mass of 1,8-diazabicyclo [5.4.0] undec-7-ene as a catalyst were used as IIP solvent. 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) was mixed with 24 parts by mass and reacted at 60 ° C. for 5 hours to obtain a polymer mixture (A2).

  In a four-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, 516 parts by mass of IP solvent 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.), 36 parts by mass of polymer mixture (A2) 24 parts by mass of methyl acrylate and 24 parts by mass of methyl methacrylate were mixed and heated to 85 ° C. in a nitrogen atmosphere. To this, 0.48 mass addition of 2,2′-azobis (2-methylbutyronitrile) was added and heated for 10 hours to obtain a polymer mixture (A3).

  0.02 part by mass of charge control agent (octadecyl vinyl ether / maleic anhydride copolymer; mass composition ratio 3/1, maleic anhydride hydrolysis with respect to 1 part by mass of the solid content of the obtained polymer mixture (A3) After adding a 45% ratio and a mass average molecular weight of 13,000), it is diluted with IP solvent 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) so that the solid content concentration becomes 1% by mass, and has high insulation properties. Resin particles dispersed in the medium were obtained. As a result of measuring the average particle diameter of the obtained resin particles by a Coulter counter method, it was 0.28 μm.

  A large number of openings were formed with a YAG laser on a stainless steel plate (SUS304) having a thickness of 80 μm to produce a mask for screen printing. Next, using the electrodeposition apparatus having the structure shown in FIG. 11, the resin particles dispersed in the high-insulating medium prepared above are applied to the entire surface of the screen printing mask at an applied voltage of 120 V for 20 seconds. Depending on the conditions, electrodeposition was performed. Next, IP solvent 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) was dried with cold air. Next, the resin particles were fixed in the form of a film at 70 ° C. for 2 minutes, and then exposed to 180 ° C. for 30 minutes. The thickness of the resin layer was 1.0 μm. When the opening was observed with a microscope, it was possible to produce a screen printing mask in which the resin layer was formed on the entire surface without protrusions, partition walls, and filling of the resin layer.

  Using the completed screen printing mask, cream solder was repeatedly screen-printed 20 times as a paste material with a squeegee. As a result, the solder solder did not fail to be formed, and a solder terminal pattern with a good shape could be formed.

Example 2
A large number of openings were formed with a YAG laser on a stainless steel plate (SUS304) having a thickness of 80 μm to produce a mask for screen printing. Next, using a laminator, a masking sheet (trade name, SPV-K100, Nitto Denko Corporation) was attached at 25 ° C. and a pressure of 0.1 MPa. Next, using the electrodeposition apparatus having the structure shown in FIG. 11, the resin particles dispersed in the highly insulating medium produced in Example 1 are formed on the inner wall of the opening of the screen printing mask and the printed substrate contact surface. Was electrodeposited under the conditions of an applied voltage of 60 V and 20 seconds. Next, IP solvent 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) was dried with cold air, and then the resin particles were fixed as a film under conditions of 70 ° C. for 2 minutes. The thickness of the resin layer on the inner wall of the opening and the printed substrate contact surface was 1.0 μm. Next, the masking sheet was peeled off by hand. Next, after exposing to 180 ° C. for 30 minutes and observing the opening with a microscope, a resin layer is formed on the inner wall of the opening and the contact surface of the substrate to be printed, which is free from protrusions, partition walls and filling of the resin layer. Thus, a screen printing mask was prepared.

  Using the completed screen printing mask, cream solder was repeatedly screen-printed 20 times as a paste material with a squeegee. As a result, the solder solder did not fail to be formed, and a solder terminal pattern with a good shape could be formed.

Example 3
A large number of openings were formed with a YAG laser on a stainless steel plate (SUS304) having a thickness of 80 μm to produce a mask for screen printing. Next, using a laminator, a commercially available dry film photoresist (trade name, Sunfort AQ2575, manufactured by Asahi Kasei Electronics Co., Ltd.) was attached at 80 ° C. and a pressure of 0.1 MPa. Next, using the electrodeposition apparatus having the structure shown in FIG. 11, the resin particles dispersed in the highly insulating medium produced in Example 1 are formed on the inner wall of the opening of the screen printing mask and the printed substrate contact surface. Was electrodeposited under the conditions of an applied voltage of 60 V and 20 seconds. Next, IP solvent 1620 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) was dried with cold air, and the particles were fixed as a film under conditions of 70 ° C. for 2 minutes. The thickness of the resin layer on the inner wall of the opening and the printed substrate contact surface was 1.0 μm. Next, after the polyethylene terephthalate layer of the dry film photoresist was peeled off by hand, the dry film photoresist was eluted and removed with 1 mass part of sodium carbonate aqueous solution (30 ° C.) under a spray pressure of 0.1 MPa. After removing the water with cold air, it was exposed to 180 ° C. for 30 minutes. When the opening was observed with a microscope, it was possible to produce a mask for screen printing in which the resin layer was formed on the inner wall of the opening and the contact surface of the substrate to be printed, without the protrusions, partition walls, and filling of the resin layer. .

  Using the completed screen printing mask, cream solder was repeatedly screen-printed 20 times as a paste material with a squeegee. As a result, the solder solder did not fail to be formed, and a solder terminal pattern with a good shape could be formed.

(Comparative Example 1)
A large number of openings were formed with a YAG laser on a stainless steel plate (SUS304) having a thickness of 80 μm to produce a mask for screen printing. Next, a silicone liquid (trade name, Silicone SE9145, manufactured by Toray Industries, Inc.) was diluted to a solid content of 5%, and dip coating was performed. After drying at 100 ° C., the opening was observed with a microscope. As a result, protrusions, partition walls, and filling of the resin layer were generated. Therefore, good screen printing could not be performed.

(Comparative Example 2)
A large number of openings were formed with a YAG laser on a stainless steel plate (SUS304) having a thickness of 80 μm to produce a mask for screen printing. Next, the silicone liquid (trade name, Silicone SE9145, manufactured by Toray Industries, Inc.) was diluted to a solid content of 5%, and spray coating was performed. After drying at 100 ° C., the opening was observed with a microscope. As a result, protrusions, partition walls, and filling of the resin layer were generated. Therefore, good screen printing could not be performed.

  The method for producing a screen printing mask of the present invention is widely applicable to screen printing applications. For example, as a paste material, a conductive material, an insulating material, a color material, a sealing material, an adhesive material, a resist material In addition, it is possible to apply a treatment chemical or the like to a pattern formation on an arbitrary substrate by screen printing.

Sectional drawing of the metal mask which formed the resin layer only in the inner wall of an opening part. Sectional drawing of the metal mask formed in the inner wall of an opening part, and a to-be-printed substrate contact surface. Sectional drawing of the metal mask which formed the resin layer in the whole surface. Sectional drawing of the solid mask which formed the resin layer only in the inner wall of an opening part. Sectional drawing of the solid mask formed in the inner wall of an opening part, and a to-be-printed substrate contact surface. Sectional drawing of the solid mask which formed the resin layer in the whole surface. Sectional drawing of the suspend mask which formed the resin layer in the whole surface. The conceptual diagram of the protrusion of a resin layer, a partition, and filling. Sectional drawing of the mask for screen printing which has an opening part. Sectional drawing of the mask for screen printing which affixed the masking sheet. The conceptual diagram of an electrodeposition apparatus. Sectional drawing showing 1 process in the preparation methods of the mask for screen printing of this invention. Sectional drawing which formed the non-opening protective layer in the to-be-printed substrate contact surface of the mask for screen printing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Screen printing mask 2 Resin layer 3 Squeegee surface 4 Printed substrate contact surface 5 Opening part 6 Mesh 7 Masking sheet 8 Non-opening protective layer 9 Protrusion of resin layer 10 Partition 11 Filled 12 Electrode 13 Resin particle

Claims (3)

  In a method for producing a mask for screen printing formed by forming a resin layer on at least an inner wall of an opening, the resin particles dispersed in a highly insulating medium are electrodeposited on a screen printing mask having an opening. A method for producing a mask for screen printing, comprising forming a resin layer.   A masking sheet is attached to the squeegee surface of a screen printing mask having an opening, and then resin particles dispersed in a highly insulating medium are electrodeposited to form a resin on the inner wall of the opening and the printed substrate contact surface. The method for producing a screen printing mask according to claim 1, wherein the layer is formed and then the masking sheet is removed.   By attaching an alkali-soluble resin sheet to the squeegee surface of a screen printing mask having an opening, and subsequently electrodepositing resin particles dispersed in a highly insulating medium, the inner wall of the opening and the printed substrate contact surface A method for producing a mask for screen printing according to claim 1, wherein a resin layer is formed on the substrate, and then the alkali-soluble resin sheet is removed with an alkaline aqueous solution.

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