JP2968375B2 - Manufacturing method of ceramic substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic package body, a semiconductor chip mount circuit board, and the like.
The present invention relates to a method for manufacturing a ceramic substrate.

[0002]

2. Description of the Related Art As the above-mentioned ceramic substrate, a single-layer or multilayer ceramic substrate having metallized lines and metallized layers on the upper and lower surfaces thereof is well known.

Conventionally, this ceramic substrate is generally formed by applying a metallized paste to the surface of one ceramic green sheet cut into a predetermined shape or the surface of a plurality of ceramic green sheets cut and laminated into a predetermined shape. And a ceramic substrate fired member having a metallized layer formed body formed integrally by firing in a high-temperature furnace.

[0004]

However, if the area ratio of the metallized line forming body or the metallized layer forming body formed on the surface of the ceramic green sheet is greatly different between the upper and lower surfaces of the ceramic substrate firing member, the above-mentioned problem may occur. When the ceramic substrate is formed as described above, the ceramic substrate warps upward or downward in an arc shape or the like.

The warpage of the ceramic substrate makes it difficult to manufacture a ceramic package having the ceramic substrate as a main body, makes it difficult to mount a semiconductor chip on the ceramic substrate, and makes it difficult to mount the ceramic substrate in an electronic device. And made implementation difficult.

[0006] This is because if the area ratio of the metallized line forming body or the metallized layer forming body is largely different between the upper and lower surfaces of the ceramic substrate firing member, the metallized line forming body and the metallized layer forming body are bonded to the ceramic substrate firing member. When integrally fired together with the member, due to the difference in shrinkage rate during firing between the metallized line forming body or the metallized layer forming body and the ceramic green sheet constituting the ceramic substrate firing member having different thermal expansion coefficients, the metallized line forming body or This is because the stresses applied to the upper and lower surfaces of the ceramic substrate firing member from the metallized layer forming member differ greatly.

For this reason, conventionally, a load such as a weight is applied to a part of the ceramic substrate that has warped as described above during firing, and the ceramic substrate is placed in a high-temperature furnace at a temperature slightly lower than the firing temperature. Had been refired. And
The warpage of the ceramic substrate was corrected.

However, correcting the warpage of the ceramic substrate in such a manner requires a great deal of trouble and time. In addition, if the ceramic substrate has a complicated and elaborate structure, it may not be possible to correct the warpage of the ceramic substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and a metallized paste is applied to the surface of one ceramic green sheet or the surfaces of a plurality of laminated ceramic green sheets to form a metallized line forming body or a metallized layer. Provided is a method of manufacturing a ceramic substrate (hereinafter, referred to as a manufacturing method) that can accurately prevent a ceramic substrate formed by integrally firing a ceramic substrate firing member having a formed body from warping upward or downward. It is intended to be.

[0010]

To achieve the above object, a first manufacturing method of the present invention is to apply a metallizing paste to the surface of one ceramic green sheet or to the surface of a plurality of stacked ceramic green sheets. The method for manufacturing a ceramic substrate, wherein the ceramic substrate fired member on which the metallized line forming body or the metallized layer formed body is formed is integrally fired to form one or both of the upper and lower surfaces of the fired ceramic substrate member. After applying a sub-ceramic paste to form a sub-ceramic layer forming body for preventing warpage of the ceramic substrate having a different coefficient of thermal expansion from the ceramic substrate firing member, the sub-ceramic layer forming body is coated with the ceramic substrate firing member. It is characterized by being integrally fired together.

[0011] In the first manufacturing method of the present invention, a sub-ceramic paste is applied to one or both of the upper and lower surfaces of the ceramic substrate fired member where the ceramic green sheets are exposed. Preferably form sub-ceramic layer-formed bodies having different coefficients of thermal expansion.

According to a second manufacturing method of the present invention, a metallized paste is applied to the surface of one ceramic green sheet or the surfaces of a plurality of laminated ceramic green sheets to form a metallized line forming body or a metallized layer forming body. In a method for manufacturing a ceramic substrate formed by integrally firing a substrate firing member, a sub-metallized paste is applied to a portion of one or both of the upper and lower surfaces of the ceramic substrate firing member where ceramic green sheets are exposed, After forming a sub-metallized layer forming body for preventing warpage of a ceramic substrate having a different coefficient of thermal expansion from the substrate firing member, the sub-metallizing layer forming body is integrally fired together with the ceramic substrate firing member.

[0013]

In the first or second manufacturing method comprising the above steps, the ceramic substrate firing member is integrally fired together with the metallized line forming body or metallizing layer forming body formed on the surface of the ceramic green sheet to form the ceramic substrate. When formed, due to the difference in shrinkage ratio between the metallized line forming body or the metallized layer forming body and the ceramic green sheet during firing, the size of the metallized line forming body or the metallized layer forming body becomes larger or smaller on the upper and lower surfaces of the ceramic substrate fired member. When a different stress is applied to each of the ceramic substrate fired members, a ceramic substrate fired member and a sub-ceramic layer formed body or a sub-metallized layer formed body having different thermal expansion coefficients formed on one or both of the upper and lower surfaces of the ceramic substrate fired member are formed. When firing with ceramic green sheet Using the difference in shrinkage, in one or both of the upper and lower surfaces of the ceramic substrate sintered member from the sub-ceramic layers formed body or Sabumetaraizu layer forming member,
A stress that opposes the above-mentioned different stresses applied to the upper and lower surfaces of the ceramic substrate firing member from the metallized line forming body or the metallized layer forming body can be applied.

Then, when the ceramic substrate is fired,
It is possible to prevent the ceramic substrate from warping upward or downward due to stress applied to the upper and lower surfaces of the ceramic substrate firing member from the metallized line forming body or the metallized layer forming body.

Further, in the first manufacturing method of forming a sub-ceramic layer forming body at a position where one or both of the ceramic green sheets are exposed on the upper and lower surfaces of the ceramic substrate firing member, Can be prevented from overlapping on the metallized line forming body or the metallized layer forming body formed on the surface of one or both of the ceramic green sheets on the upper and lower surfaces of the ceramic substrate firing member. Then, when the sub-ceramic layer formed body is integrally fired together with the ceramic substrate firing member to form a ceramic substrate, one or both of the upper and lower surfaces of the ceramic substrate, a part of the metallized line or part of the metallized layer, It is possible to prevent the sub-ceramic layer forming body from being covered with the sub-ceramic layer formed by firing. Then, when plating such as gold plating on the surface of one or both metallized lines or metallized layers on the upper and lower surfaces of the ceramic substrate, the surface portion of the metallized line or metallized layer covered by the sub-ceramic layer is It is possible to prevent the conductor resistance value of the metallized line surface portion or the metallized layer surface portion covered with the sub-ceramic layer from being increased without plating.

[0016]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 3 show a package called a frit cap type, FIG. 1 is a perspective view thereof, FIG. 2 is a plan view thereof, and FIG. 3 is a bottom view thereof. Hereinafter, the package in this figure will be described.

Here, the frit cap type package refers to a type of package in which a cap for covering the upper surface of a cavity for accommodating a semiconductor chip is hermetically sealed to the body of the package using glass.

In this package, a cavity 12 having a circular blind hole shape for accommodating a semiconductor chip is provided at the center of the surface of a rectangular ceramic substrate A constituting the main body.

At the center of the bottom surface in the cavity 12 of the ceramic substrate A, there is provided a stage 32 made of a metallized layer for semiconductor chip die bonding.

Connection lines 34 formed of metallized lines for connecting electrodes of a semiconductor chip are provided on four sides of the bottom surface in the cavity 12 of the ceramic substrate A, respectively.

As shown in FIG. 3, pads 30 made of a metallized layer for connecting the leads 20 are provided at the center of the four sides of the lower surface of the ceramic substrate A, respectively.

The pad 30 is connected to a connection line 34 on the bottom surface of the cavity 12 via an internal line (not shown) made of a metallized line provided inside the ceramic substrate A.

In this frit cap type package, the ceramic substrate A constituting the main body can be formed without warping by using the first or second manufacturing method of the present invention.

Next, a preferred embodiment in the case where the ceramic substrate A is formed without warping by using the first or second manufacturing method of the present invention will be described. FIG. 4 shows the manufacturing method. Hereinafter, the manufacturing method in this figure will be described.

On the lower ceramic green sheet 10b cut into a square, an upper ceramic green sheet 10c cut into a square with a circular hole 12a for forming a cavity formed in the center is laminated on the lower ceramic green sheet 10b. A member 10a is formed.

A metallized paste is applied in layers at the center of the four sides of the lower surface of the lower ceramic green sheet 10b to form a metallized layer forming body 30a for baking pads in a square shape or the like.

Hole 12a of ceramic substrate firing member 10a
At the center of the upper surface of the lower ceramic green sheet 10b exposed inside, a metallized paste is applied in a layer shape to form a metallized layer forming body 32a for stage firing in a square shape.

Hole 12a of ceramic substrate firing member 10a
A metallized paste is applied in a band shape on each of the upper surfaces of the lower ceramic green sheet 10b exposed inside, thereby forming a metallized line forming body 34a for firing the connection line in a band shape.

On the lower ceramic green sheet 10b, a conductor via-formed body (not shown) formed by filling a metallized paste for firing an internal line connected to the metallized layer formed body 30a for firing the pad is formed. Is provided up and down. On the upper surface of the lower ceramic green sheet 10b, a metallized paste is applied in a strip shape, and a metallized line forming body for firing an internal line (shown in the drawing) is connected to the conductor via forming body and the metallized line forming body 34a for connecting line firing. Is formed in a belt shape. The metallized layer forming body 30a for pad firing is connected to the metallized line forming body 34a for connecting line firing via the conductor via forming body for internal line firing and the metallized line forming body.

The above steps are the same as those of the conventional method of manufacturing the ceramic substrate A. However, in the first manufacturing method shown in the figure, the entire upper surface of the upper ceramic green sheet 10c, which is the upper surface of the ceramic substrate firing member 10a, is covered with alumina. Alternatively, a sub-ceramic paste mixed with aluminum nitride is applied in layers to form a sub-ceramic layer forming body 40a having a different coefficient of thermal expansion from the ceramic substrate firing member 10a.

On the other hand, in the second manufacturing method shown in the figure, a sub-metallized paste containing tungsten or molybdenum is applied in a layer on the entire upper surface of the upper ceramic green sheet 10c which is the upper surface of the ceramic substrate firing member 10a. A submetallized layer forming body 50a having a different coefficient of thermal expansion from the member 10a is formed.

Next, the sub-ceramic layer forming body 40a
Alternatively, the sub-metallized layer forming body 50a is integrally fired in a high-temperature furnace together with the ceramic substrate firing member 10a on which the metallized layer forming bodies 30a, 32a and the metallized line forming body 34a for firing pads, stages, connection lines, and internal lines are formed. ing.

At this time, the difference in the shrinkage rate between the sub-ceramic layer forming body 40a or the sub-metallized layer forming body 50a and the upper ceramic green sheet 10c having different thermal expansion coefficients during firing is used to calculate the sub-ceramic layer formation. A predetermined amount of stress is applied from the body 40a or the sub-metallized layer forming body 50a to the upper surface of the ceramic substrate firing member 10a.

The stress applied from the sub-ceramic layer forming body 40a or the sub-metallized layer forming body 50a to the upper surface of the ceramic substrate firing member 10a depends on the magnitude of the alumina or aluminum nitride mixed in the sub-ceramic layer forming body 40a, or Metallized layer forming body 50a
The particle size of tungsten or molybdenum mixed in the material is changed to be large or small, thereby finely adjusting the size.

Alumina or aluminum nitride having a particle size of 0.5 to 50 μm is generally widely used, and the particle size of alumina or aluminum nitride to be added to the sub-ceramic layer forming body 40a is finely adjusted. Is easy. Also, tungsten or molybdenum generally has a particle size of 0.4 to 40 μm, and it is easy to finely or finely adjust the particle size of tungsten or molybdenum added to the sub-metallized layer forming body 50a. is there.

Then, the sub-ceramic layer forming body 40
When the ceramic substrate A is fired by using the metallized layer forming body 50a or the sub-metallized layer forming body 50a, the metallized layer forming bodies 30a, 32a and the metallized line forming for firing pads, stages, connection lines, and internal lines having different thermal expansion coefficients from each other. Body 34a etc. and upper and lower ceramic green sheets 10
Due to the difference in the shrinkage rate during firing between the ceramic substrate firing members 10a and 32b, the stress against the stress applied to the ceramic substrate firing member 10a from the metallized layer forming members 30a and 32a, the metallized line forming member 34a, and the like is increased.
In addition to the top surface.

Then, as shown in FIG. 5 or FIG.
The upper surface is formed of the sub-ceramic layer 40 or the sub-metallized layer 5
0, a warped ceramic substrate A1 or A constituting a body of a frit cap type package
2 are formed.

The first or second manufacturing method shown in FIG. 4 comprises the above steps.

Next, another preferred embodiment in which the above-mentioned ceramic substrate A is formed without warpage using the first or second manufacturing method of the present invention will be described. FIG. 7 shows the manufacturing method. Hereinafter, the manufacturing method in this figure will be described.

In the first or second manufacturing method shown in the drawings, a sub-ceramic paste or a sub-metallized paste is applied in a layer on the entire upper surface of the ceramic substrate fired member 10a, and the ceramic substrate fired member 10a has a thermal expansion coefficient. In addition to forming a different sub-ceramic layer forming body 40a or a sub-metallizing layer forming body 50a, a metallizing layer forming body 30a for firing pads is formed on the lower surface of the lower ceramic green sheet 10b which is the lower surface of the ceramic substrate firing member 10a. As shown in FIG. 7, a sub-ceramic paste or a sub-metallized paste is widely applied in layers to portions other than the formed portion and its peripheral portion. And the lower ceramic green sheet 10b
The sub-ceramic layer forming body 42a or the sub-metallizing layer forming body 52a having a different coefficient of thermal expansion from the ceramic substrate firing member 10a is formed in a wide layer also on the lower surface portion of the substrate.

Otherwise, the ceramic substrate A is formed in the same manner as the above-described first or second manufacturing method. In the first or second manufacturing method shown in FIG. The difference between the shrinkage rates of the sub-ceramic layer forming bodies 40a and 42a or the sub-metallized layer forming bodies 50a and 52a and the upper and lower ceramic green sheets 10c and 10b at the time of firing, which are different from each other. A predetermined amount of stress is applied to the upper and lower surfaces of the ceramic substrate firing member 10a from the layer forming bodies 40a and 42a or the sub-metallized layer forming bodies 50a and 52a, respectively.

The magnitude of the stress applied to the upper and lower surfaces of the ceramic substrate firing member 10a is, as described above, the alumina or aluminum nitride mixed in the sub-ceramic layer forming bodies 40a and 42a, or the sub-metallized layer forming body 50a. , 52a are finely adjusted by changing the particle size of tungsten or molybdenum mixed therein.

Then, the above-mentioned sub-ceramic layer forming body 4
0a, 42a or sub-metallized layer formed bodies 50a, 5
When the ceramic substrate A is fired using 2a, the upper and lower layers include pads, stages, connection lines, metallized layer forming bodies 30a and 32a for firing internal lines, metallized line forming bodies 34a, etc., having different coefficients of thermal expansion. Due to the difference in shrinkage during firing with the ceramic green sheets 10c and 10b, the metallized layer formed bodies 30a and 32a
A stress that opposes a stress applied to the ceramic substrate fired member 10a from the metallized line forming body 34a or the like is applied to the upper and lower surfaces of the ceramic substrate fired member 10a.

As shown in FIGS. 8 to 11, the upper and lower surfaces are covered with the sub-ceramic layers 40 and 42 or the sub-metallized layers 50 and 52, respectively. Ceramic substrates A3, A4, A5 or A6 are formed respectively.

The first or second manufacturing method shown in FIG. 7 comprises the above steps.

12 to 14 show a ceramic substrate constituting a semiconductor chip mount circuit board, FIG. 12 is a perspective view thereof, FIG. 13 is a plan view thereof, and FIG. 14 is a bottom view thereof. Hereinafter, the ceramic substrate in this figure will be described.

In the figure, B is a two-layer ceramic substrate formed by laminating and firing two ceramic green sheets cut into a square shape.

On the upper left side of the upper surface of the ceramic substrate B, a stage 320 made of a square metalized layer for semiconductor chip die bonding and a plurality of connection lines 340 made of metalized lines for connecting electrodes of the semiconductor chip. And

On the entire lower surface of the ceramic substrate B, a ground plane 360 composed of a metallized layer is provided in a layered manner.

In the ceramic substrate B, a connection line 34 is provided.
0 is provided with an internal line (not shown) composed of a metallized line connected in series.

The ceramic substrate B shown in FIGS. 12 to 14 is configured as described above.

The ceramic substrate B constituting the semiconductor chip mount circuit board can be formed without warping by using the first or second manufacturing method of the present invention.

Next, a preferred embodiment in which the ceramic substrate B is formed without warpage by using the first or second manufacturing method of the present invention will be described. FIG. 15 shows the manufacturing method. Hereinafter, the manufacturing method in this figure will be described.

Two ceramic green sheets 100b and 100c cut into a square shape are laminated to form a ceramic substrate firing member 100a.

On the upper left side of the upper surface of the upper ceramic green sheet 100c, a metallized paste is applied in a square shape to form a metallized layer forming body 320a for stage firing, or a plurality of metallized pastes are applied in a strip shape. Plurality of metallized line forming bodies 3 for firing connection lines
40a.

The upper ceramic green sheet 100c is provided with a conductor via forming body (not shown) formed by filling a metallizing paste for firing the internal line connected to the metallizing line forming body 340a for firing the connection line. 100c is provided vertically.
On the upper surface of the lower ceramic green sheet 100b, a metallized paste is applied in a strip shape to form a metallized line forming body (not shown) for firing the internal line connected to the conductor via forming body. Then, a predetermined metallized line forming body 3 for connecting line firing is interposed via the conductor via forming body for internal line firing and the metallized line forming body.
40a are connected in series.

A metallizing paste is applied in a layer on the entire lower surface of the lower ceramic green sheet 100b.
Metallized layer forming body 360a for firing ground plane
Is formed.

The above steps are the same as the conventional method for manufacturing a ceramic substrate. However, in the first or second manufacturing method shown in FIG. 15, as shown in FIG. The sub-ceramic paste or the sub-metallized paste is applied to the portion where the upper ceramic green sheet 100c is exposed from the lower part to the lower left part of the metallized line forming body 340 for firing the connection line.
The layer is widely applied in a layered manner, avoiding the portion where a is formed and its peripheral portion. Then, a sub-ceramic layer forming body 400a or a sub-metallizing layer forming body 500a having a different coefficient of thermal expansion from the ceramic substrate firing member 100a is formed in a wide layer at a portion where the upper ceramic green sheet 100c is exposed.

Then, the sub-ceramic layer forming body 40
0a or the sub-metallized layer forming body 500a is used as a ceramic substrate firing member 1 on which a stage, a connection line, a ground plane, internal line firing metallizing layer forming bodies 320a and 360a and a metallized line forming body 340a are formed.
00a together with a high temperature furnace.

At this time, the sub-ceramic layer forming body 400a or the sub-metallizing layer forming body 500a and the upper ceramic green sheet formed in the portion from the right side to the lower left side of the upper surface of the ceramic substrate firing member 100a having different thermal expansion coefficients from each other. Using the difference in the shrinkage ratio during firing with the sub-ceramic layer forming body 400a
Alternatively, a predetermined amount of stress is applied from the sub-metallized layer forming body 500a to the upper surface of the ceramic substrate firing member 100a.

The magnitude of the stress applied to the upper surface of the ceramic substrate firing member 100a is, as described above, the alumina or aluminum nitride mixed in the sub-ceramic layer forming member 400a or the sub-metallizing layer forming member 5a.
The particle size of tungsten or molybdenum mixed in 00a is finely adjusted by changing the particle size.

Then, the sub-ceramic layer forming body 40
0a or the sub-metallized layer forming body 500a,
When the ceramic substrate B is fired, stages, connection lines, ground planes, metallized layer forming bodies 320a and 360a for firing internal lines, metallized line forming bodies 340a, etc., and upper and lower ceramic green sheets 100c having different thermal expansion coefficients from each other. , 100b, the difference in the shrinkage ratio during firing is caused by the metallized layer formed body 320.
a, 360a, the metallized line forming body 340a, and the like, a stress against the stress applied to the ceramic substrate fired member 100a is applied to the upper surface of the ceramic substrate fired member 100a.

Then, as shown in FIG. 16 or FIG. 17, the portion from the upper right side to the lower left side is formed by the sub-ceramic layer 400 or the sub-metallized layer 500.
, A warped ceramic substrate B1 or B2 constituting a semiconductor chip mount circuit board is formed.

The first or second manufacturing method shown in FIG. 15 comprises the above steps.

The sub-ceramic layer forming members 40a and 400a, which are insulators, are bonded to the ceramic substrate firing members 10a and
100a formed on one or both of the upper and lower surfaces
In the manufacturing method of
a, 400a are metallized layer forming bodies 30a, 320a and metallizing line forming body 3 for pad, connection line, stage firing, for directly connecting leads and electrodes of a semiconductor chip, and for directly die bonding the semiconductor chip.
The pad, the connection line, the metallized layer forming bodies 30a, 320a for firing the stage, and the metallized line forming body 340a except for the portion where the 40a is formed may be formed so as to overlap. Then, when firing the ceramic substrate A or B, the metallized layer forming bodies 30a, 30
20a, the metallized line forming body 340a, and the like, the stress opposing the stress applied to the ceramic substrate firing members 10a, 100a is applied to the above-described sub-ceramic layer forming bodies 40a, 40a.
0a, the ceramic substrate firing members 10a, 100
It may be added to one or both of the upper and lower surfaces of a.

However, in such a case, the sub-ceramic layer forming bodies 40a and 400a are
When the ceramic substrates A and B are formed by integrally firing the ceramic substrate firing members 10a and 100a and the ceramic substrate firing members 10a and 100a together, the pad 3
0, the connection line 340, a part of the surface of the stage 320, and the like are covered with a sub-ceramic layer (not shown). The pads 30 and the connection lines 340 provided on one or both of the upper and lower surfaces of the ceramic substrates A and B,
When plating such as gold plating is performed on the surface of the stage 320, the pad 3 covered with the sub-ceramic layers 40 and 400
Care must be taken because the surface portions of the connection line 340, the connection line 340, and the stage 320 are not plated, and the conductor resistance value of those surface portions increases.

[0067]

As described above, by using the first or second manufacturing method of the present invention to form a ceramic substrate constituting a body of a frit cap type package, a semiconductor chip mount circuit board, and the like, The substrate can be accurately and easily formed on a flat ceramic substrate suitable for the purpose without warpage.

After the firing of the ceramic substrate, the ceramic substrate is re-baked by applying a load to a part of the ceramic substrate, thereby eliminating the need for a large amount of trouble and time to correct the warpage of the ceramic substrate. It is possible to do.

[Brief description of the drawings]

FIG. 1 is a perspective view of a frit cap type package.

FIG. 2 is a plan view of a frit cap type package.

FIG. 3 is a bottom view of the frit cap type package.

FIG. 4 shows an example of the first or second manufacturing method of the present invention.
It is a perspective view which shows the process of forming the ceramic substrate which comprises the main body of a frit cap type package.

FIG. 5 is a perspective view of a ceramic substrate constituting a main body of the frit cap type package formed by using the first manufacturing method of the present invention.

FIG. 6 is a perspective view of a ceramic substrate constituting a main body of a frit cap type package formed by using the second manufacturing method of the present invention.

FIG. 7 shows an example of the first or second manufacturing method of the present invention.
It is a perspective view which shows the process of forming the ceramic substrate which comprises the main body of a frit cap type package.

FIG. 8 is a perspective view of a ceramic substrate constituting a main body of the frit cap type package formed by using the first manufacturing method of the present invention.

FIG. 9 is a perspective view of a ceramic substrate constituting a body of a frit cap type package formed by using the first or second manufacturing method of the present invention.

FIG. 10 is formed by using the second manufacturing method of the present invention;
It is a perspective view of the ceramic substrate which comprises the main body of a frit cap type package.

FIG. 11 is a perspective view of a ceramic substrate constituting a main body of a frit cap type package formed by using the first or second manufacturing method of the present invention.

FIG. 12 is a perspective view of a ceramic substrate constituting the semiconductor chip mount circuit board.

FIG. 13 is a plan view of a ceramic substrate constituting a semiconductor chip mount circuit board.

FIG. 14 is a bottom view of a ceramic substrate constituting the semiconductor chip mount circuit board.

FIG. 15 is a perspective view showing a step of forming a ceramic substrate constituting a semiconductor chip mounted circuit board by using the first or second manufacturing method of the present invention.

FIG. 16 is a cross-sectional view of a semiconductor device manufactured using the first manufacturing method of the present invention;
It is a perspective view of the ceramic substrate which comprises a semiconductor chip mount circuit board.

FIG. 17 is a cross-sectional view of a semiconductor device formed using the second manufacturing method of the present invention.
It is a perspective view of the ceramic substrate which comprises a semiconductor chip mount circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 12 Cavity 20 Lead 30 Pad 32 Stage 34 Connection line 40 Subceramic layer 50 Submetallized layer 42 Subceramic layer 52 Submetallized layer 10a Ceramic substrate firing member 10b Lower ceramic green sheet 10c Upper ceramic green sheet 12a Hole 30a Metallization for pad firing Layer forming body 32a Metallized layer forming body for stage firing 34a Metallized line forming body for connecting line firing 40a Sub-ceramic layer forming body for sub-ceramic layer firing 42a Sub-ceramic layer forming body for sub-ceramic layer firing 50a Sub-metallized layer Sub-metallized layer forming body for firing 52a Sub-metallized layer forming body for firing sub-metallized layer A Ceramic substrate A1 Ceramic substrate A2 Ceramic substrate A3 Ceramic Substrate A4 Ceramic substrate A5 Ceramic substrate A6 Ceramic substrate 320 Stage 340 Connection line 360 Ground plane 400 Sub-ceramic layer 500 Sub-metallized layer 100a Ceramic substrate firing member 100b Lower ceramic green sheet 100c Upper ceramic green sheet 320a Metallized layer forming body for stage firing 340a Metallized line forming body for connection line firing 360a Metallized layer forming body for ground plane firing 400a Sub-ceramic layer forming body for sub-ceramic layer firing 500a Sub-metallized layer forming body for sub-metallizing layer firing B Ceramic substrate B1 Ceramic substrate B2 Ceramic substrate

Claims (3)

(57) [Claims] 1. A ceramic green sheet having a surface
Or on the surface of multiple stacked ceramic green sheets.
Apply metallizing paste to form metallized line
Other in the production method <br/> ceramic substrate to form a ceramic substrate sintered member formed metallized layer forming member by firing one body, in one or both of the upper and lower surfaces of the ceramic substrate firing member, sub ceramic The paste is applied, and the ceramic substrate fired member has a different thermal expansion coefficient.
Of sub-ceramic layer to prevent warpage of ceramic substrate
After forming the body, the sub-ceramic layers formed body, prior to Symbol
Features and to Rousset ceramic substrate manufacturing method that integrally sintered together with the ceramic substrate the firing member. Wherein the site of one or the ceramic green sheets of both the upper and lower surfaces of the ceramic substrate firing member is exposed, by applying a sub ceramic paste, the Serra
Sub-ceramics with different thermal expansion coefficients
Claim 1 ceramic substrate manufacturing method according to form the click layer forming member. 3. The surface of one ceramic green sheet
Or on the surface of multiple stacked ceramic green sheets.
Apply metallizing paste to form metallized line
Other in the production method <br/> of ceramic substrate formed by sintering one body ceramic substrate sintered member formed metallized layer forming member, the one or the ceramic green sheets of both the upper and lower surfaces of the ceramic substrate firing member the exposed region, by applying a sub metallizing paste, the Serra
Ceramics with a different coefficient of thermal expansion from the baked substrate
Sub-metallized layer formed body to prevent substrate warpage
After, it features and to Rousset Lami <br/> click substrate manufacturing method that integrally firing the Sabumetaraizu layer forming member, with pre-xenon ceramic substrate firing member.