JP2964730B2 - Plasma display panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly to a terminal structure of a plasma display panel having a large number of terminals, a fine terminal pitch, and a high definition and a large display capacity.

[0002]

2. Description of the Related Art In recent years, plasma display panels (hereinafter, referred to as PDPs) have become larger and larger, taking advantage of their characteristics.
We are steadily moving on the road to increasing capacity. Furthermore, research aimed at the practical application of colorization is steadily progressing, and as a technology for connecting panel terminals and external circuits, it is important to connect high-density terminals and external circuits with high reliability. It has become.

For this reason, as a method of connecting a terminal portion of the PDP to an external circuit, as shown in FIG. A method of crimping and covering the terminal portion with the resin 2 has been proposed. Here, 7 is a rear substrate, 4 is a metal conductor on the FPC, and 10 is Ni particles present in the anisotropic conductive film. The protective glass plate 9 is provided for the purpose of preventing intrusion of moisture into the silver terminal portion and preventing migration of the silver terminal.

[0004]

The above-mentioned PDP has the following characteristics.
PC3 is thermocompression-bonded to silver terminal 5 by anisotropic conductive film 6,
After that, the terminal portion is protected by the resin 2. For example, when a humidity resistance test in which a DC voltage is applied between adjacent terminals in an environment of an ambient temperature of 70 ° C. and a relative humidity of 95% is performed, the silver terminal 5
It has been found that the problem of insulation deterioration due to migration of the metal becomes a problem. As a result of analyzing the deterioration mode, it was found that the gap between the adjacent silver terminals was not sufficiently filled with the thermosetting binder constituting the anisotropic conductive film, and the gap was present. That is, it has been clarified that the migration of the silver terminal passing through the gap causes a decrease in insulation between the adjacent terminals.

[0005]

According to the present invention, a terminal group for applying a voltage to an electrode group inside a panel from an external circuit is provided at an end of a front substrate and a rear substrate, and the terminal group is connected to the terminal group from an external circuit. In a PDP for connecting a metal conductor for supplying a voltage and a terminal group of a panel via an anisotropic conductive film,
An insulating layer barrier is provided in the gap between the terminal groups, and the thickness of the insulating layer barrier is formed to be equal to or less than the total thickness of the terminal group and the metal conductor.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a side view showing a first embodiment of the present invention,
FIG. 2 is a sectional view thereof. A silver terminal 5 is formed on the rear substrate 7 by, for example, screen printing to a thickness of, for example, 10 μm, and an insulating layer barrier 11 is formed in a gap between the silver terminals 5 by screen printing as well. Assuming that the thickness of the metal conductor 4 on the FPC 3 side is, for example, 30 μm, the insulating layer barrier 1
1 is formed to be at least 40 μm (thickness of silver terminal 5 + thickness of metal conductor 4).

When the metal conductor 4 on the FPC 3 side and the silver terminal 5 are aligned and thermocompression bonded via the anisotropic conductive film 6 containing the Ni particles 10, the metal conductor 4 and the silver terminal 5 are bonded by the Ni particles 10. Connected. At this time, since the thickness of the insulating layer barrier 11 is equal to or less than the total thickness of the metal conductor 4 and the thickness of the silver terminal 5, the connection between the metal conductor 4 and the silver terminal 5 is not hindered during thermocompression bonding. High connection can be realized. Further, unlike the conventional example without the insulating layer barrier 11,
The space between the silver terminals is sufficiently filled with a thermosetting binder having high moisture resistance, and at the same time, the insulating layer barrier 11 has a function of preventing migration of silver, so that extremely excellent migration resistance can be realized. It is.

After thermocompression bonding of the FPC 3 to the silver terminal 5 via the anisotropic conductive film 6, the resin 2 is applied from above the FPC 3,
Further, a protective glass plate 9 for preventing invasion of moisture is placed on the resin 2 and the resin 2 is cured, thereby realizing a PDP having high connection reliability and excellent migration resistance. it can. In this embodiment, the silver terminal formed on the rear substrate is described. However, the same applies to the silver terminal formed on the front substrate.

FIG. 3 is a sectional view of a terminal portion showing a second embodiment of the present invention. The difference between FIG. 3 and FIG. 2 is that F
That is, a metal lead wire 4 'is used instead of the PC. If the thickness of the metal lead wire 4 'is, for example, 150 μm, the thickness of the insulating layer barrier 11 is formed by screen printing so as to be 160 μm or less (thickness of the metal lead wire + thickness of the silver terminal). The effect obtained by such a structure is the same as that of the first embodiment. However, in the case of a metal lead wire conventionally connected to the silver terminal 5 by a soldering method, the present embodiment employs a soldering method. Because we do not use the attached
The organic solvent at the time of removing the flux, which was conventionally required, was not required at all, and the pollution problem caused by the organic solvent could be completely solved.

[0010]

As described above, the present invention relates to a connection method for thermocompression bonding a silver terminal portion of a panel and a metal conductor for supplying a driving voltage from an external circuit via an anisotropic conductive film. In the above, an insulating layer barrier is provided in the gap between the silver terminals, and the reliability of the connection is impaired by setting the thickness of the insulating layer barrier to be equal to or less than the total thickness of the thickness of the silver terminal and the thickness of the metal conductor. Since the thermosetting binder constituting the anisotropic conductive film can be filled between the silver terminals without any gap, there is an effect of exhibiting extremely excellent migration resistance. Incidentally, the insulation resistance between the silver terminals could be improved by one digit or more compared to the conventional structure. Therefore, by applying the present invention to a color PDP or the like having a large-capacity terminal group with a fine pitch, an extremely reliable connection can be realized.

[Brief description of the drawings]

FIG. 1 is a side view of a PDP terminal unit according to a first embodiment of the present invention.

FIG. 2 is a sectional view of FIG. 1 showing the first embodiment.

FIG. 3 is a sectional view of a terminal portion according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a terminal portion of a conventional PDP.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 front substrate 2 resin 3 FPC 4 metal conductor 4 ′ metal lead wire 5 silver terminal 6 anisotropic conductive film 7 rear substrate 8 sealing material 9 protective glass plate 10 Ni particles 11 insulating layer barrier

Claims (1)

(57) [Claims] 1. A front substrate on which an electrode group is formed and a rear substrate on which an electrode group is formed are opposed to each other, hermetically sealed, and a terminal group for externally applying a voltage to the internal electrode group is provided on the front substrate. A plasma display panel, which is provided at an end of a substrate and the rear substrate, and connects a metal conductor for supplying a voltage from an external circuit to the terminal group to the terminal via an anisotropic conductive film, wherein the terminal An insulating layer barrier is provided in a gap between groups, and the thickness of the insulating layer barrier is formed to be equal to or less than the sum of the thickness of the terminal group and the thickness of the metal conductor.